JPH07253665A - Photosensitive resin composition and photosensitive film using the same - Google Patents

Abstract

PURPOSE:To obtain a photosensitive resin compsn. having good workability and excellent flexibility, heat resistance against soldering, etc., and to obtain a photosensitive film using this compsn. CONSTITUTION:This photosensitive resin compsn. contains (a) an ethylene-type unsatd. group-contg. polymerizable compd. containing a polymerizable compd. expressed by formula, (b) thermoplastic polymer having carboxyl groups, (c) photopolymn. initiator to produce flee radicals by active rays. This photosensitive resin can be developed with an alkali soln. In formula, A is an alkylene group of 2-12 carbon number or vinylene group, R<1> and R<5> are independently hydrogen atoms or methyl groups, R<2>, R<3> and R<4> are independently alkyl groups of 2 to 8 carbon number, w and z are integers 1 to 20, x is an integer 2 to 200, and y is an integer 1 to 100. This compsn. is used for the photosensitive film.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive resin composition, and more specifically to a photosensitive resin composition suitable for forming a protective film (coverlay) which can be used for manufacturing flexible printed wiring boards and the like. Regarding elements.

[0002]

2. Description of the Related Art Conventionally, a liquid or film-shaped photosensitive resin composition has been used in the production of printed wiring boards. For example, it is used as a resist for etching a copper foil of a copper-clad laminate and also for forming wiring. The printed wiring board is used for the purpose of limiting the soldering position and protecting the wiring.

There is a film-like printed wiring board that can be folded and incorporated into a small device such as a camera, which is called an FPC. This FPC also needs a resist for limiting the soldering position and protecting the wiring, which is called a cover lay or a cover coat. The coverlay is formed by punching a polyimide or polyester film having an adhesive layer into a predetermined mold and then thermocompression-bonding it on the FPC. The cover coat is formed by printing and curing a thermosetting or photocurable ink.

Flexibility is a particularly important property of these resists used for the purpose of limiting the soldering position of the FPC and protecting the wiring. Therefore, a polyimide coverlay having excellent flexibility is often used. However, this cover lay requires an expensive die for die cutting, and the yield is low due to the manual laminating of die cut films and the protrusion of adhesive, resulting in high manufacturing costs and expanding the FPC market. Has become an obstacle. Further, it is difficult to cope with the recent increase in density.

Therefore, a photosensitive resin composition for forming a highly accurate and highly reliable coverlay excellent in dimensional accuracy and resolution by a photographic developing method (a method of forming an image by developing following image exposure), particularly The advent of photosensitive films has been desired. For this purpose, it has been attempted to use a photosensitive resin composition for forming a solder mask. For example, a photosensitive resin composition containing an acrylic polymer and a photopolymerizable monomer as main components (JP-A-53-56018 and JP-A-54-1).
No. 018, etc.), as a photosensitive resin composition having good heat resistance, a composition containing a photosensitive epoxy resin having a chalcone group in its main chain and an epoxy resin curing agent as main components (Japanese Patent Laid-open Publication No. Sho 5 (1999) -58242).
No. 4-82073, No. 58-62636, etc.), a composition containing an epoxy group-containing novolac type epoxy acrylate and a photopolymerization initiator as main components (JP-A-61-272, etc.), and safety. As the photosensitive resin composition for forming a solder mask, which is excellent in economic efficiency and can be developed with an alkaline aqueous solution, a composition mainly containing a carboxyl group-containing polymer, a monomer, a photopolymerization initiator and a thermosetting resin (special JP-A-48-73148, 57-1782
37, 58-42040 and 59-15.
No. 1152, etc.), but the flexibility was insufficient.

[0006]

DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned drawbacks of the prior art and provides a photosensitive resin composition having good workability, flexibility and solder heat resistance, and a photosensitive resin composition using the same. To provide a heat-resistant film.

[0007]

The present invention provides (a) general formula (1)

[Chemical 4] [In the formula, A is an alkylene group having 2 to 12 carbon atoms, a vinylene group,

[Chemical 5] (Wherein R ⁶ represents a methylene group or an imino group) or an isophorone group, R ¹ and R ⁵ each independently represent a hydrogen atom or a methyl group, and R ² , R ³ and R ⁴ each independently Represents an alkylene group having 2 to 8 carbon atoms, w and z are each independently an integer of 1 to 20, and x is 2
To an integer of 200, and y is an integer of 1 to 100]
An ethylenically unsaturated group-containing polymerizable compound containing a polymerizable compound represented by the formula (b), a thermoplastic polymer having a carboxyl group (b), and (c) a photopolymerization initiator capable of generating a free radical by active light. The present invention relates to a photosensitive resin composition developable with an alkaline aqueous solution and a photosensitive film obtained by coating a layer of the photosensitive resin composition on a support film and drying the layer.

The respective components contained in the photosensitive resin composition of the present invention will be described in detail below. The photosensitive resin composition of the present invention contains an ethylenically unsaturated group-containing polymerizable compound containing a polymerizable compound represented by the general formula (1) as an essential component (a). Examples of the alkylene group having 2 to 12 carbon atoms represented by A in the general formula (1) include an ethylene group, an n-propylene group, an isopropylene group, an n-butylene group, an isobutylene group, a pentylene group, and a neopentylene group. , Hexylene group, heptylene group, n-octylene group, 2-ethylhexylene group, nonylene group, decylene group, undecylene group, dodecylene group and the like. If the carbon number is 1 or 13 or more, it is difficult to obtain the material. An alkylene group having 2 to 12 carbon atoms represented by A,
Vinylene group,

[Chemical 6] (Wherein R ⁶ represents a methylene group or an imino group) or the isophorone group may be substituted with an alkyl group, an alkoxy group or a halogen atom, or may be hydrogenated. In the general formula (1), the alkylene group having 2 to 8 carbon atoms represented by R ² , R ³ or R ⁴ includes, for example, ethylene group, n-propylene group, isopropylene group, n-
Examples thereof include butylene group, isobutylene group, pentylene group, neopentylene group, hexylene group, heptylene group, n-octylene group, 2-ethylhexylene group and the like. If the carbon number is 1 or 9 or more, it is difficult to obtain the material. W and z in the general formula (1) are each independently an integer of 1 to 20. If w and z are 21 or more, it is difficult to obtain the material. X and y in the general formula (1) are integers of 2 to 200 and 1 to 100, respectively. When x is 1, sufficient flexibility cannot be obtained as a coverlay, and when x is 201 or more, sufficient photopolymerizability is not obtained and sensitivity is lowered. Similarly, when y is 0, the coverlay does not have sufficient flexibility, and
In the above cases, sufficient photopolymerizability cannot be obtained and the sensitivity is lowered. The weight average molecular weight of the polymerizable compound represented by the general formula (1) is 1,00 from the viewpoints of flexibility, photopolymerizability and the like.
It is preferably 0 to 50,000.

The polymerizable compound represented by the general formula (1) is
For example, polyalkyl diols (eg poly 1,4-
Butanediol, poly (1,6-hexanediol),
Compounds containing two isocyanate groups (for example, ethylene diisocyanate, propylene diisocyanate, butylene-1,3-diisocyanate, 1,6-hexamethylene diisocyanate, 2,2,4-trimethyl-1,6-hexamethylene diisocyanate , 2, 4
-Dimethyl-6-ethyloctamethylene diisocyanate, cyclohexylene diisocyanate, cyclopentylene diisocyanate, 1,4-diisocyanate methylcyclohexane, 1,3-diisocyanate cyclohexane, isophorone diisocyanate, 2,4-tolylene diisocyanate, 2, 6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate,
Of dianisidine diisocyanate, tridene diisocyanate, metaxylylene diisocyanate, 1,5-naphthalene diisocyanate, trans vinylene diisocyanate, 2,6-diisocyanate methyl caproate, hydrogenated tolylene diisocyanate, hydrogenated xylylene diisocyanate, tolylene diisocyanate 1 type of dimer, trimer of tolylene diisocyanate, etc.),
A compound having a hydroxyl group and an acryloyl group in the molecule (for example, 2-hydroxyethyl acrylate, 2-
It can be obtained by an addition reaction with 1) such as hydroxyethyl methacrylate. In addition, for example, each compound used in the reaction of a compound having a polyalkyldiol and two isocyanate groups and a compound having a hydroxyl group and an acryloyl group in the molecule may be used alone or in combination of two or more kinds. You can As a commercially available product, for example, UF-700
3, UF-8003, U2-02 (all manufactured by Kyoeisha Chemical Co., Ltd., trade name) and the like. The polymerizable compound represented by the general formula (1) is used alone or in combination of two or more kinds.

The component (a) is further represented by the general formula (2)

[Chemical 7] [Wherein, R ⁷ and R ⁸ each independently represent a hydrogen atom or a methyl group, and p and q are positive integers selected so that p + q is 4 to 30]. It is preferable to contain it.

Examples of the polymerizable compound represented by the general formula (2) include 2,2'-bis (4-methacryloxypentaethoxyphenyl) propane and 2,2'-bis (4).
-Acryloxypentaethoxyphenyl) propane, 2,
There are 2'-bis (4-methacryloxytetraethoxyphenyl) propane and the like, and commercially available products include, for example, NK.
Ester BPE-500 (manufactured by Shin Nakamura Chemical Co., Ltd.,
Product name) etc.

The polymerizable compound represented by the general formula (2) may be used alone or in combination of two or more kinds. When p + q is less than 4, flexibility decreases, and when it exceeds 30, hydrophilicity of the system increases and adhesion at development decreases. As the component (a), a polymerizable compound other than the polymerizable compound represented by the general formula (1) and the polymerizable compound represented by the general formula (2), which has a boiling point of 100 ° C. or higher at normal pressure, is contained. You may. Examples of such substances include acrylic acid, methyl acrylate, ethyl acrylate, n-
Propyl acrylate, isopropyl acrylate, n
-Butyl acrylate, isobutyl acrylate, cyclohexyl acrylate, benzyl acrylate, carbitol acrylate, methoxyethyl acrylate,
Ethoxyethyl acrylate, butoxyethyl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, butylene glycol monoacrylate, N, N-dimethylaminoethyl acrylate, N,
N-diethylaminoethyl acrylate, glycidyl acrylate, tetrahydrofurfuryl acrylate, pentaerythritol monoacrylate, trimethylolpropane monoacrylate, allyl acrylate, 1,
3-propylene glycol diacrylate, 1,4-butylene glycol diacrylate, 1,6-hexylene glycol diacrylate, neopentyl glycol diacrylate, dipropylene glycol diacrylate, 2,2-bis (4-acryloxydiethoxy) Phenyl) propane, 2,2-bis (4-acryloxypropyloxyphenyl) propane, trimethylolpropane diacrylate, pentaerythritol diacrylate,
Trimethylolpropane triacrylate, pentaerythritol triacrylate, triacrylic formal, tetramethylolmethane tetraacrylate, acrylic acid ester of tris (2-hydroxyethyl) isocyanuric acid,

[Chemical 8] (In the formula, m is a positive integer of 1 to 30), methacrylic acid, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate,
Butyl methacrylate, isobutyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, octyl methacrylate, ethylhexyl methacrylate, methoxyethyl methacrylate, ethoxyethyl methacrylate, butoxyethyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, hydroxybutyl methacrylate, hydroxypentyl methacrylate, N, N- Dimethylaminomethacrylate, N, N-diethylaminomethacrylate, glycidylmethacrylate, tetrahydrofurfurylmethacrylate, methacryloxypropyltrimethoxysilane, allylmethacrylate, trimethylolpropane monomethacrylate, pentaerythritol monomethacrylate, 1 3-butylene glycol dimethacrylate, 1,6-hexylene glycol dimethacrylate, neopentyl glycol dimethacrylate, 2,
2-bis (4-methacryloxydiethoxyphenyl) propane, trimethylolpropane trimethacrylate,
Pentaerythritol trimethacrylate, tetramethylolmethane tetramethacrylate, methacrylic acid ester of tris (2-hydroxyethyl) isocyanuric acid,

[Chemical 9] (In the formula, n is a positive integer of 1 to 30), trimethylhexamethylene diisocyanate / 2-hydroxyethyl acrylate (1/2 molar ratio) reaction product, isocyanate ethyl methacrylate / water (2/1 (Molar ratio) Reactant, butyl crotonic acid, glycerin monoclonate, vinyl butyrate, vinyl trimethyl acetate, vinyl caproate, vinyl chloroacetate, vinyl lactate, vinyl benzoate, divinyl succinate, divinyl phthalate, methacrylamide, N- Methyl methacrylamide, N-ethyl methacrylamide, N-aryl methacrylamide, N-hydroxyethyl-N-methyl methacrylamide, acrylamide, Nt-butyl acrylamide, N-methylol acrylamide, N-isobutoxymethyl amide Rylamide, N-butoxymethyl acrylamide, diacetone acrylamide, hexyl vinyl ether, ethylhexyl vinyl ether, vinyl triether, polyvinyl alcohol of polyhydric alcohol, substitution of alkyl group, alkoxy group, halogen, carboxyl group, allyl group or the like at ortho or para position A styrene derivative having a group, divinylbenzene, allyloxyethanol, a diallyl ester of dicarboxylic acid, N-vinyloxazolidone, N-vinylimidazole, N-vinylpyrrolidone, N-vinylcarbazole and the like can be used.

The amount of the ethylenically unsaturated group-containing polymerizable compound containing the polymerizable compound represented by the general formula (1) is
It is preferably 10 to 70% by weight of the total amount of the components (a) and (b). If it is less than 10% by weight, flexibility as a coverlay tends to be insufficient, and if it exceeds 70% by weight, solder heat resistance tends to be lowered. General formula (1)
From the viewpoint of flexibility, it is preferable that the compounding amount of the polymerizable compound represented by is 25% by weight or more of the component (a). The compounding amount of the polymerizable compound represented by the general formula (2) is preferably 5 to 60% by weight of the component (a) after the necessary amount of the polymerizable compound represented by the general formula (1) is compounded. 5
If it is less than 60% by weight, flexibility, solder heat resistance and the like tend to be insufficient, and if it exceeds 60% by weight, flexibility tends to decrease.

The photosensitive resin composition of the present invention contains a thermoplastic polymer having a carboxyl group as an essential component (b). Such a thermoplastic polymer preferably has a weight average molecular weight of 20,000 to 300,000. Further, those having a carboxyl group content of 15 to 50 mol% are preferable, and two or more kinds may be used in combination. Further, the thermoplastic polymer having a carboxyl group is preferably soluble or swellable in an alkaline aqueous solution,
The photosensitive resin composition may be soluble in an alkaline aqueous solution.

As the thermoplastic polymer having a carboxyl group (b), a vinyl copolymer is preferable, and examples of the copolymerizable monomer used in the vinyl copolymer include acrylic acid, methacrylic acid and methacrylic acid. Methyl acid, butyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, ethyl acrylate, methyl acrylate, styrene, α-methylstyrene, vinyltoluene, N-vinylpyrrolidone, 2-hydroxyethylmethacrylate, 2-hydroxyethyl Acrylate, acrylamide, acrylonitrile, methacrylonitrile,
Dimethylaminoethyl methacrylate, dimethylaminoethyl acrylate, etc. are used. Also, styrene /
A half ester of a maleic acid copolymer or the like is also used.

The blending amount of the component (b) is (a) and (b).
It is preferably 30 to 70% by weight of the total amount of the components. If it is less than 30% by weight, the alkali developability tends to decrease, and when it is used as a photosensitive film, the photosensitive resin composition layer becomes soft and tends to exude from the end surface of the film. If it exceeds 70% by weight, the sensitivity and the solder heat resistance tend to decrease.

The photosensitive resin composition of the present invention contains, as an essential component (c), a photopolymerization initiator which produces free radicals by active light. Examples of usable photopolymerization initiators include 2-ethylanthraquinone, 2-t-butylanthraquinone, octamethylanthraquinone, 1,
Substituted or unsubstituted polynuclear quinones such as 2-benzanthraquinone and 2,3-diphenylanthraquinone, α-ketaldonyl alcohols and ethers such as benzoin and pivalone, α-phenyl-benzoin, α, α-diethoxy Α-hydrocarbon-substituted aromatic acyloins such as acetophenone, benzophenone, aromatic ketones such as 4,4′-bisdialkylaminobenzophenone, 2-methylthioxanthone, 2,4-diethylthioxanthone, 2-
Thioxanthones such as chlorothioxanthone, 2-isopropylthioxanthone, and 2-ethylthioxanthone,
2-Methyl-1- [4- (methylthio) phenyl] -2
-Monofolino-propanone-1 may be mentioned, and these may be used alone or in combination of two or more kinds.

From the viewpoint of sensitivity, the amount of the component (c) blended is 0.01 to 20% by weight of the total amount of the components (a) and (b).
It is preferable that

The photosensitive resin composition of the present invention further comprises
A thermosetting component such as a melamine resin, a dye, a pigment, a plasticizer, a stabilizer and the like may be added if necessary.

The photosensitive resin composition of the present invention can be used as a photosensitive film by coating it on a support film and drying it. As the support, a polymer film, for example, a film made of polyethylene terephthalate, polypropylene, polyethylene or the like is used, and a polyethylene terephthalate film is preferable. Since the polymer film must be capable of being removed from the photosensitive layer later, it must not be surface-treated or made of a material that cannot be removed. The thickness of these polymer films is usually 5 to 100 μm, preferably 10 to 30 μm. One of these polymer films may be laminated on both sides of the photosensitive layer as a support film for the photosensitive layer and the other as a protective film for the photosensitive layer.

In producing the photosensitive film, first, the photosensitive resin composition containing the components (a) to (d) is uniformly dissolved in a solvent. The solvent may be any solvent that dissolves the photosensitive resin composition, for example, a ketone solvent such as acetone, methyl ethyl ketone and methyl isobutyl ketone, an ether solvent such as methyl solosolve and ethyl cellosolve, chlorine such as dichloromethane and chloroform. Chemical hydrocarbon solvents, alcohol solvents such as methyl alcohol and ethyl alcohol, etc. are used. These solvents may be used alone or in combination of two or more.

Then, the photosensitive resin composition is uniformly applied as a solution on the polymer film as the support film layer, and then the solvent is removed by heating and / or blowing with hot air to form a dry film. The thickness of the dry film is not particularly limited and is usually 10 to 100 μm, preferably 20 to 60 μm.
m.

The photosensitive film of the present invention comprising the two layers of the photosensitive layer and the polymer film thus obtained is wound in a roll form as it is or on the other surface of the photosensitive layer which is further laminated with a protective film. Stored.

In producing a photoresist image using the photosensitive film of the present invention, when the protective film is present, after removing the protective film, the photosensitive layer is heated and pressed onto the substrate. To stack.
More preferably, they are laminated under reduced pressure. The surface to be laminated is
Usually, it is an FPC in which wiring is formed by etching or the like, but there is no particular limitation. Heating and pressure bonding of the photosensitive layer is usually 90
~ 130 ° C, Crimping pressure 2.94 × 10 ⁵ Pa (3kgf / cm ² )
It is performed under reduced pressure of 4000 Pa (30 mmHg) or less.
There are no particular restrictions on these conditions. When the photosensitive film of the present invention is used, if the photosensitive layer is heated as described above, it is not necessary to preheat the substrate in advance. In order to further improve the stackability, the substrate may be preheated.

The photosensitive layer thus laminated is
It is then imagewise exposed to actinic light using a negative or positive film. At this time, when the polymer film present on the photosensitive layer is transparent, it may be exposed as it is,
If it is opaque, it is of course necessary to remove it. From the viewpoint of protecting the photosensitive layer, it is preferable that the polymer film is transparent, and the polymer film is allowed to remain and exposed through it. As the active light, light generated from a known active light source such as carbon arc, mercury vapor arc, xenon arc, etc. is used. The sensitivity of the photoinitiator contained in the photosensitive layer is usually maximum in the UV region, in which case the actinic light source should be one which emits UV radiation effectively.

After the exposure, if a polymer film is present on the photosensitive layer after exposure, it is removed and then an alkaline aqueous solution is used, for example, known methods such as spraying, rocking dipping, brushing, scraping and the like. To remove the unexposed portion and develop. Examples of the base of the alkaline aqueous solution include alkali hydroxides such as lithium, sodium or potassium hydroxides, alkali carbonates such as lithium, sodium or potassium carbonates or bicarbonates, alkali metals such as potassium phosphate and sodium phosphate. Phosphates, alkali metal pyrophosphates such as sodium pyrophosphate, potassium pyrophosphate and the like are used, and an aqueous solution of sodium carbonate is particularly preferable. The pH of the aqueous alkaline solution used for development is preferably between 9 and 11, and the temperature is adjusted according to the developability of the photosensitive layer. A surface active agent, a defoaming agent, and a small amount of an organic solvent for accelerating the development may be mixed in the alkaline aqueous solution.

Further, after the development, for the purpose of improving solder heat resistance, chemical resistance and the like as the coverlay of the FPC, ultraviolet irradiation and heating by a high pressure mercury lamp are performed. The irradiation amount of ultraviolet rays is generally about 0.2 to 10 J / cm ² , and it is more preferable that the irradiation is accompanied by heat of 60 to 150 ° C.
The heating is performed in the range of about 100 to 170 ° C. for about 15 to 90 minutes. Either the irradiation of the ultraviolet rays or the heating may be performed first. After the characteristics of the coverlay have been imparted in this manner, components such as LSIs are mounted (soldered) and mounted on devices such as cameras.

[0028]

EXAMPLES Next, the present invention will be described in more detail by way of examples. "%" In the following examples means "% by weight" unless otherwise specified.

Example 1 A solution (solution A) having the composition shown in Tables 1 and 2 was uniformly coated on a polyethylene terephthalate film having a thickness of 25 μm by using the apparatus shown in FIG.
The solvent was removed by drying in a hot air circulation dryer 7 at 100 ° C. for about 5 minutes. In FIG. 1, 1 is a polyethylene terephthalate film feeding roll, 2, 3, 4, 9 and 1
Reference numeral 0 is a roll, 5 is a knife, 6 is a solution of a photosensitive resin composition, 8 is a polyethylene film feeding roll, and 11 is a photosensitive film winding roll. The thickness of the photosensitive layer after drying was about 50 μm.

[0030]

[Table 1]

[Table 2]

Then, a polyethylene film was bonded as a protective film on the photosensitive layer using the apparatus shown in FIG. 1 to obtain a photosensitive film of the present invention.

Separately, the copper surface of an FPC substrate (F30VC125RC11, manufactured by Nikkan Kogyo Co., Ltd.) in which a 35 μm thick copper foil was laminated on a polyimide substrate was polished with an abrasive grain brush, washed with water and dried. A vacuum laminator (Hitachi Chemical Co., Ltd., trade name VLM-1) is placed on this substrate (23 ° C.).
Type), heat shoe temperature 110 ° C, atmospheric pressure 400
0Pa (30mmHg) or less, lamination pressure 2.94 × 10 ⁵ Pa
The photosensitive film was laminated at (3 kgf / cm ² ).

Next, the obtained sample was mixed with a Stouffer
HMW-201B manufactured by Oak Manufacturing Co., Ltd. using a 1-step step tablet and a negative film having a linear line with 150 μm / 150 μm lines / spaces.
After exposing it to 200 mJ / cm ² for 30 minutes at room temperature with a mold exposure machine, use 1% sodium carbonate aqueous solution for 1 minute at 30 ° C.
Spray developed for 00 seconds. Here, the number of steps of the remaining step tablets is shown. Then, heat treatment was performed at 150 ° C. for 45 minutes. Furthermore, Toshiba Denshi Co., Ltd.'s Toshiba UV irradiation device (rated voltage 200V, rated power consumption 7.2kW, H
A 5600 L / 2x lamp (1) was used to irradiate with ³ J / cm ² of ultraviolet rays to obtain a coverlay corresponding to a negative film.

This sample was bent at 180 ° for flexibility evaluation, but there was no abnormality such as cracks in the cover lay. Then, rosin-based crack MH-820V
(Tamura Kaken Co., Ltd., trade name) was used for soldering treatment at 260 ° C. for 10 seconds, and the solder heat resistance was observed, but there was no abnormality such as blister. Further, here, bending was performed at 180 ° for flexibility evaluation, but there were no abnormalities such as cracks in the coverlay. Table 3 shows the above evaluation results.
Shown in.

Examples 2 and 3 and Comparative Examples 1 to 3 The polymerizable compounds used in Example 1 were changed to the compounds shown in Table 3, and the other compounds were blended in the same manner as in Example 1 except that the copolymer was used. The amount of the copolymerizable compound was adjusted so that the total amount was 100, and a film was formed. Moreover, it processed and evaluated as a coverlay like Example 1. The results are summarized in Table 3.

The symbols in the table mean the following polymerizable compounds. UF-7003 (manufactured by Kyoeisha Chemical Co., Ltd., trade name, weight average molecular weight 13,000, R in the general formula (1))
¹ , R ⁷ is a hydrogen atom, R ² is an ethylene group, R ³ and R ⁵ are isophorone groups, R ⁴ is a mixture of a tetramethylene group and a hexamethylene group in a molar ratio of 6/4, w and z are 1, x Is 8 and y is 1
2 compound, 80% methyl ethyl ketone solution) A-TMPT (Shin-Nakamura Chemical Co., Ltd., trade name,
Trimethylolpropane triacrylate) -TMCH (2,2,4-trimethylhexamethylene-
Addition product of 1,6-diisocyanate and 2-hydroxyethyl acrylate in a molar ratio of 1: 2)

[0037]

[Table 3]

As is clear from Table 3, when the photosensitive resin composition of the present invention is used, it is possible to obtain a coverlay having good solder heat resistance and bending (flexibility).

[0039]

According to the photosensitive resin composition of the present invention and the photosensitive film using the same, it is possible to obtain a coverlay for FPC which is excellent in solder heat resistance and bendability (flexibility). As a result, it is possible to easily process a cover lay, which has been low in yield and low in productivity due to manual work or adhesive squeezing out, to achieve high yield, high productivity, and high density.

[Brief description of drawings]

FIG. 1 is a schematic diagram of an apparatus for producing a photosensitive film used in Examples.

[Explanation of symbols]

1: Polyethylene terephthalate film feeding roll 2, 3, 4, 9, 10: Roll 5: Knife 6: Solution of photosensitive resin composition 7: Dryer 8: Polyethylene film feeding roll 11: Photosensitive film winding roll

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI Technical indication location G03F 7/038 H05K 3/28 D (72) Inventor Mitsuaki Watanabe 4-13 Higashimachi, Hitachi City, Ibaraki Prefecture No. 1 Hitachi Chemical Co., Ltd. Yamazaki Factory

Claims (3)

[Claims] 1. (a) General formula (1): [In the formula, A is an alkylene group having 2 to 12 carbon atoms, a vinylene group, and (Wherein R ⁶ represents a methylene group or an imino group) or an isophorone group, R ¹ and R ⁵ each independently represent a hydrogen atom or a methyl group, and R ² , R ³ and R ⁴ each independently. And represents an alkylene group having 2 to 8 carbon atoms, w and z are each independently an integer of 1 to 20, and x is 2 to
An integer of 200 and y is an integer of 1 to 100], an ethylenically unsaturated group-containing polymerizable compound containing a polymerizable compound represented by the formula (b), a thermoplastic polymer having a carboxyl group, and (c) activity. A photosensitive resin composition developable with an alkaline aqueous solution containing a photopolymerization initiator that generates free radicals by light. 2. The (a) ethylenically unsaturated group-containing polymerizable compound further has the general formula (2): [Wherein, R ⁷ and R ⁸ each independently represent a hydrogen atom or a methyl group, and p and q are positive integers selected so that p + q is 4 to 30]. A photosensitive resin composition which is developable with an aqueous alkaline solution according to claim 1. 3. A photosensitive film obtained by laminating a layer of the photosensitive resin composition according to claim 1 or 2 on a support film.