JPH0726392A - Removal equipment for conductor rolls in vertical plating equipment - Google Patents

Abstract

(57) [Summary] [Structure] The flaw detected on the strip 9 is detected by the strip flaw detection means 11, and the position of the deposit on the conductor roll 6 is calculated by the calculation / control means 13 based on the flaw detection signal. In addition, the roll polishing means 12 is moved to the polishing position to remove the deposits on the conductor roll 6. [Effect] When an object adheres to the conductor roll, the adhered object can be quickly removed to eliminate the flaw on the strip.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductor roll deposit removing device for vertical plating equipment.

[0002]

2. Description of the Related Art In a vertical plating facility for electroplating a strip (steel strip), the plating metal carried by the strip sometimes adheres to a current-carrying roll (generally referred to as a "conductor roll") on the downstream side. . Then, the adhered matter damages the strip being passed, which is unsatisfactory. Therefore, the applicant of the present invention has previously disclosed the Japanese Patent Application Laid-Open No. 3-1303.
No. 96 proposed a roll maintenance device, and a conductor roll was hit with a grindstone, and the grindstone was reciprocally moved in the roll axial direction to uniformly polish the conductor roll. In order to evenly polish, the profile of the roll is measured in advance and construction is performed based on the data. Specifically, it is characterized by adding a control to increase the pressing force of the grindstone at the place where the diameter is large due to the attached matter.

[0003]

Although the above-mentioned proposal has the effect of removing deposits, basically the roll is reduced in diameter in a relatively short period in order to constantly grind the roll with a grindstone, and at the same time the grindstone is reduced. Therefore, the life of the conductor roll and the grindstone is shortened. Therefore, an object of the present invention is to provide a technique for grinding the deposits but not shortening the life of the conductor roll.

[0004]

In order to achieve the above object, the present invention calculates the position of the deposit on the strip flaw detecting means, the roll polishing means, and the conductor roll, and moves the roll polishing means to the polishing position. A conductor roll adhering substance removing device including a control means is configured.

[0005]

The flaw detected on the roll contact side surface of the strip extracted by the strip flaw detection means by the strip flaw detection means is detected, and the deposit on the conductor roll is detected by the calculation / control means based on the flaw detection signal. Is calculated, the roll polishing means is moved to the polishing position, and the deposits on the conductor roll are removed by the roll polishing means.

[0006]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a conceptual diagram of vertical plating equipment according to the present invention. The vertical plating equipment 1 includes a plating tank 2, an anode electrode 3,
3, a sink roll 4, an entrance-side conductor roll 5, an exit-side conductor roll 6, hold-down rolls 7 and 7, seal rolls 8 and 8, and a conductor-roll deposit removing device 10.

The inlet and outlet conductor rolls 5 and 6 are cathode electrode rolls, and the strip 9 which is a conductor is bridged as shown in the figure to electroplate the strip 9 to form a plating film on the surface. It Seal roll 8,
Reference numeral 8 is for stopping the plating liquid adhering to the front and back surfaces of the strip 9.

The conductor roll deposit removing device 10
Is a strip flaw detecting means 11 for monitoring the lower surface (roll contact side surface) of the strip 9 which is installed near the exit side conductor roll 6 and extracted, and the conductor roll 6
The roll polishing means 12 disposed below the roller 6 for polishing any position of the roll 6, and the position of the deposit on the conductor roll 6 is calculated based on the flaw detection signal of the strip flaw detection means 11 to roll polishing means. And a calculation / control means 13 for moving 12 to the polishing position. These means 11, 12
Will be described in detail below.

FIG. 2 is a principle diagram of the strip defect detecting means according to the present invention. The strip defect detecting means 11 includes, for example, a laser oscillator 11a, a mirror 11b, a lens group 11c, and a lens group 11c.
A scanning unit 11A including a mirror 11d and an eight-sided mirror 11e;
Light receiving section 11 in which a plurality of light receiving element chips 11f are arranged in series
The laser beam emitted from the laser oscillator 11a is appropriately narrowed by the lens group 11c, and the narrowed laser beam is scanned at a high speed in the plate width direction of the strip 9 by the 8-sided mirror 11e to reflect the reflected light. The light receiving portion 11B detects the shape of the strip surface. The image is shown in the scope 11g, but if there is a flaw on the strip 9, the recess 11h is detected, and the signal (digital or analog signal) is sent to the arithmetic / control means 13.

FIG. 3 is a principle view of the roll polishing means according to the present invention. The roll polishing means 12 is, for example, the x-axis rail 1.
2a, an x-axis moving base 12c that is moved by the forward and reverse movements of the feed screw 12b, and y with respect to this base 12c.
It comprises a robot 12f that reciprocates along a shaft 12d in a cylinder 12e, and a grindstone 12h attached to the tip of an arm 12g of the robot 12f and rotating at high speed.
The roll polishing means 12 swings the arm 12g at a high speed in the direction of the arrow to move the conductor roll 6
The feature is that it is possible to polish only the very narrow point of. Of course, the arm 12g is fixed and the feed screw 1
It is possible to polish the entire length of the conductor roll 6 by the operation of 2b.

The operation of the conductor roll adhering substance removing device having the above structure will be described below. FIG. 4 is an operation flow diagram of the conductor roll deposit removing device of the present invention, showing an example of the operation. In the flowchart, STn indicates step n. In ST01, the calculation / control means 13 continuously inputs the signal of the strip flaw detection means 11, compares this value with a reference level, and if a flaw is detected, S
The degree is determined at T02, and if it is a large-scale concave portion far away from the reference level, ST03 to ST immediately.
In step 05, the conductor roll 6 is polished.

That is, in ST03, the calculation / control means 13 back-calculates the location of the deposit on the roll. As shown in FIG. 1, since the distance between the conductor roll 6 and the strip defect detecting means 11 in the strip traveling direction is fixed,
The rotation angle of the conductor roll 6 can be calculated backward. Conductor roll 6 is strip 9
It may wear and shrink. Therefore, the roll diameter is measured by another means, and the data is sent to the calculation / control means 13,
If the calculation is corrected, the calculation accuracy increases. In ST04, the robot 12f is moved in the x and y directions and made to stand by under the control of the calculation / control means 13. When the relevant place comes around in the next rotation, the arm 12g is swung quickly and the grindstone 12
The roll 6 is polished with h (ST05). And arm 1
Quickly return 2g.

On the other hand, if it is determined in ST02 that the flaw is not large-scale, the route is N0 (NO) and ST0
Up to 6. Since the degree of the flaw is relatively small, it may not be possible to determine whether it is caused by the deposit on the conductor roll 6 or the uneven plating of the strip. It is not beneficial to polish the roll 6 with uneven plating. Therefore, the present invention is characterized in that a flow (circuit) for determining whether or not the medium-sized flaw is caused by the deposit on the conductor roll 6 is provided. That is, ST0
In No. 6, if medium-sized flaws are continuously generated at a pitch equivalent to one rotation of the conductor roll, it is determined that there is an adhered substance on the conductor roll 6, and the roll 6 is polished (ST03 to S
T05) decided to do. If there is no command to end in ST07 (for example, stop the plating operation), ST0
Return to 1 and repeat the loop.

According to the present invention, the flaw signal of the strip flaw detecting means 11 is divided into three stages of "none", "medium", and "large scale", and the medium degree is further divided into two stages to make it slight or transient. The flaw is characterized in that the roll is not polished, and the roll is polished only when it is recognized that an adhered matter is attached to the roll. Moreover, the roll polishing is intended to scrape off only the adhered substances and not to polish other healthy roll surfaces.

The strip defect detecting means 11 is not limited to the above embodiment, but the laser oscillator and the photodetector may be reciprocated by rails and wires. Further, the roll polishing means 12 is not limited to the above embodiment, and the grindstone rotating device may be reciprocated by rails and wires.

[0016]

As described above, the present invention detects the flaws generated on the roll contact side surface of the strip which is extracted through the outlet side conductor roll by the strip flaw detecting means,
The calculation / control means calculates the position of the deposit on the conductor roll based on the flaw detection signal, and the roll polishing means is moved to the polishing position to remove the deposit on the conductor roll by the roll polishing means. When an object adheres to the conductor roll, the adhered object can be quickly removed to eliminate the scratches on the strip.

Further, if the arithmetic / control means is provided with a circuit for recognizing that there is a deposit on the roll based on the information that the flaws on the strip are attached at a pitch equal to one rotation length of the conductor roll. Therefore, the accuracy of detecting the adhered substances is improved, and the operation efficiency of the roll polishing means can be increased.

[Brief description of drawings]

FIG. 1 is a conceptual diagram of vertical plating equipment according to the present invention.

FIG. 2 is a principle diagram of strip flaw detection means according to the present invention.

FIG. 3 is a principle diagram of a roll polishing means according to the present invention.

FIG. 4 is an operation flow chart of the conductor roll deposit removing device of the present invention.

[Explanation of symbols]

1 ... Vertical plating equipment, 2 ... Plating tank, 3 ... Anode electrode, 6
… Conductor roll (outgoing conductor roll), 9… Strip, 10… Conductor roll deposit remover, 1
1 ... Strip flaw removing means, 11A ... Scanning section, 11B ...
Light receiving part, 11a ... Laser oscillator, 12 ... Roll polishing means, 12f ... Robot, 12g ... Arm, 12h ... Grindstone, 13 ... Computation / control means.

Claims (2)

[Claims] 1. A strip flaw detecting means for monitoring a roll contact side surface of a strip extracted through an outlet side conductor roll, a roll polishing means for polishing an arbitrary position of the conductor roll, and the strip flaw detecting. A conductor roll for vertical plating equipment, comprising: a calculation / control means for calculating the position of the deposit on the conductor roll based on the flaw detection signal of the means and moving the roll polishing means to the polishing position. Adhesion remover. 2. The calculation / control means comprises a circuit for recognizing that there is a deposit on the roll based on the information that the flaws on the strip are attached at a pitch equal to one rotation length of the conductor roll. Claim 1 characterized in that
A device for removing deposits on a conductor roll of the vertical plating facility described.