JPH0726833Y2 - Mold capacitor - Google Patents
Mold capacitorInfo
- Publication number
- JPH0726833Y2 JPH0726833Y2 JP1989106930U JP10693089U JPH0726833Y2 JP H0726833 Y2 JPH0726833 Y2 JP H0726833Y2 JP 1989106930 U JP1989106930 U JP 1989106930U JP 10693089 U JP10693089 U JP 10693089U JP H0726833 Y2 JPH0726833 Y2 JP H0726833Y2
- Authority
- JP
- Japan
- Prior art keywords
- container
- tube
- gas
- synthetic resin
- insulating gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】 [産業上の利用分野] この考案は内部に絶縁ガスを充填したモールドコンデン
サに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a molded capacitor whose inside is filled with an insulating gas.
[従来技術およびその問題点] 誘電体層にプラスチックフイルムを用いこのプラスチッ
クフイルムに金属を蒸着して電極層を形成した金属化フ
イルムを積み重ねながら巻き取った巻回型コンデンサ素
子は、無極性であり誘電損失が少ない等々の長所を有す
るが巻回両端面部等に絶縁体力弱点部が生じコロナ放電
を生じ易い欠点がある。この欠点を解消することを狙っ
て、巻回型コンデンサ素子を容器に収容しこの容器内に
絶縁ガスを充填して容器のまわりを合成樹脂でモールド
し密封して、巻回型コンデンサ素子のまわりの特に巻回
両端面部を絶縁ガス雰囲気にして絶縁耐力の向上を計る
と云う考え方がある。[Prior Art and Problems Thereof] A wound-type capacitor element in which a plastic film is used as a dielectric layer and a metallized film having an electrode layer formed by vapor-depositing a metal on the plastic film is stacked and rolled up is non-polar. Although it has advantages such as low dielectric loss, it has a drawback that weak points of the insulator are easily generated on both end faces of the winding and corona discharge is likely to occur. In order to eliminate this drawback, the winding type capacitor element is housed in a container, the container is filled with an insulating gas, the circumference of the container is molded with a synthetic resin, and the container is sealed. In particular, there is an idea that the insulating gas atmosphere is applied to both end faces of the winding to improve the dielectric strength.
この考え方を実現するためには、先ず容器内のコンデン
サ素子のまわりの空気を真空引き等により脱気して次に
絶縁ガスに置き換える必要があるので容器に空気や絶縁
ガスの通気孔を形成しておく必要がある。この通気孔は
空気や絶縁ガスを流通させる際には大きい程よく、また
容器のまわりを合成樹脂によりモールドして密封する際
には容器の中に合成樹脂液を浸入させないために小さい
程よいと云う相反する条件を備えなければならないた
め、絶縁ガスの濃度を充分に高めることができないと云
った問題点や容器内にモールド樹脂が流れ込んで絶縁耐
力を低下させると云った問題点がある。In order to realize this idea, it is necessary to first deaerate the air around the capacitor element in the container by evacuation and then replace it with insulating gas.Therefore, form a vent hole for air or insulating gas in the container. Need to be kept. The larger the ventilation hole, the better when circulating air or insulating gas. The smaller the ventilation hole, the better when the container is molded and sealed with synthetic resin to prevent the synthetic resin liquid from entering the container. Therefore, there is a problem that the concentration of the insulating gas cannot be sufficiently increased and that the mold resin flows into the container to reduce the dielectric strength.
また樹脂モールドの際に、容器のまわりに合成樹脂液を
満たした段階で容器内の絶縁ガスの浮力により一部は通
気孔より合成樹脂液中を気泡となって出て行き、次の合
成樹脂液を加熱硬化させる段階でも容器内の絶縁ガスの
熱膨張による浮力の増大により更に通気孔より合成樹脂
液中を気泡となって外に出て行くので、容器内の絶縁ガ
スが希薄になるという問題点がある。During resin molding, when the synthetic resin liquid is filled around the container, a part of the synthetic resin liquid comes out as air bubbles from the vent due to the buoyancy of the insulating gas in the container, and the next synthetic resin Even when the liquid is heated and hardened, the buoyancy increases due to the thermal expansion of the insulating gas in the container, and the synthetic resin liquid is further bubbled out of the vent holes, causing the insulating gas in the container to be diluted. There is a problem.
そこで、この考案は巻回型コンデンサ素子の周囲に絶縁
ガスを正圧状態に密封してコロナ放電特性の改善を計り
うるモールドコンデンサを提供しようとするものであ
る。Therefore, this invention intends to provide a molded capacitor capable of improving the corona discharge characteristics by sealing the insulating gas in a positive pressure state around the wound capacitor element.
[問題点を解決するための手段] この考案は、上記の問題点を解決するために、容器の内
底部に外空間と連通するチューブを設けた容器内に、筒
形ボビンに帯状の誘電層と電極層とを交互に重ねて巻回
してなる巻回型コンデンサ素子を筒形ボビンの孔部にチ
ューブを挿入させて収容し、容器内およびチューブ内に
絶縁ガスを充填すると共に容器のまわりを合成樹脂でモ
ールドするに際してチューブ内に合成樹脂を流入させ加
圧状態とすることにより容器内の絶縁ガスを正圧状態に
密封せしめたことを特徴とするモールドコンデンサに構
成したのである。[Means for Solving the Problems] In order to solve the above problems, the present invention provides a strip-shaped dielectric layer on a tubular bobbin in a container in which a tube communicating with an outer space is provided in an inner bottom portion of the container. And the electrode layer are alternately stacked and wound, and the wound type capacitor element is housed by inserting the tube into the hole of the cylindrical bobbin, filling the inside of the container and the tube with an insulating gas, and surrounding the container. When molding with a synthetic resin, the synthetic resin is made to flow into the tube to be in a pressurized state so that the insulating gas in the container is hermetically sealed in a positive pressure state.
[作用] 容器のまわりを合成樹脂でモールド密封するに際に、容
器のまわりに合成樹脂液を注入しチューブの下端開口部
が合成樹脂液に接した段階で容器およ筒形ボビン内に絶
縁ガスを絶縁ガス充填時のガス圧に封口できる。[Operation] When the container is molded and sealed with a synthetic resin, the synthetic resin liquid is injected around the container, and insulation is provided inside the container and the tubular bobbin when the lower end opening of the tube comes into contact with the synthetic resin liquid. The gas can be sealed at the gas pressure at the time of filling the insulating gas.
また、更に合成樹脂液を注入して行くと注入した合成樹
脂液面の高さに応じてチューブ内の下部に生じている合
成樹脂液の自由表面を上方に押し上げて中に流入し、流
入した合成樹脂液の量だけ容器内の絶縁ガスを圧縮して
ガス圧を上昇させることもできる。Further, when the synthetic resin liquid was further injected, the free surface of the synthetic resin liquid generated in the lower part of the tube was pushed upward according to the height of the injected synthetic resin liquid surface, and then flowed in and flowed in. It is also possible to increase the gas pressure by compressing the insulating gas in the container by the amount of the synthetic resin liquid.
また、必要により容器内の絶縁ガスのガス圧を高めたい
場合には、容器のまわりに注入した合成樹脂液に外力を
作用させると、チューブ内の合成樹脂液の自由表面を更
に上方に押し上げることができて容器内の絶縁体ガスの
ガス圧を更に上昇させることもできる。Also, if it is desired to increase the gas pressure of the insulating gas in the container, applying an external force to the synthetic resin liquid injected around the container pushes the free surface of the synthetic resin liquid in the tube further upward. As a result, the gas pressure of the insulating gas in the container can be further increased.
容器内およびチューブ内に充填された絶縁ガスはチュー
ブの下部開口部が合成樹脂液で覆われ封口された時点か
らチューブの中に合成樹脂液の自由表面を上方に押し上
げることにより圧縮するので絶縁ガスの漏れは防止でき
る。The insulating gas filled in the container and the tube is compressed by pushing the free surface of the synthetic resin liquid upward into the tube from the time when the lower opening of the tube is covered with the synthetic resin liquid and sealed. Can be prevented from leaking.
容器内の絶縁ガスのガス圧が所望の値になるとその加圧
状態を保ちながら注入した合成樹脂液を反応硬化させる
ことにより、容器内に絶縁ガスを所望の正の圧力に密封
することができる。When the gas pressure of the insulating gas in the container reaches a desired value, the injected synthetic resin liquid is cured by reaction while maintaining the pressurized state, whereby the insulating gas can be sealed in the container at a desired positive pressure. .
なお、この場合に注入する合成樹脂液の量は容器内に絶
縁ガスを封止できれば良く、必ずしも容器のまわりの全
面を覆わなくても良い。In this case, the amount of the synthetic resin liquid to be injected is sufficient as long as the insulating gas can be sealed in the container, and the entire surface around the container does not necessarily have to be covered.
容器内に絶縁ガスを所望の高圧に密封できることによ
り、巻回型コンデンサ素子の絶縁耐力弱点部のコロナ放
電開始電圧をパーシェン(Paschen)則に従って高くで
き、この考案のモールドコンデンサのコロナ放電開始電
圧を向上させることができる。Since the insulating gas can be sealed at a desired high pressure in the container, the corona discharge starting voltage at the weak point of the dielectric strength of the wound capacitor element can be increased according to the Paschen rule, and the corona discharge starting voltage of the molded capacitor of the present invention can be increased. Can be improved.
[実施例1〜4] 以下、本願考案を実施例により図面の第1〜3図を用い
て説明する。第1図は実施例を説明するモールドコンデ
ンサの断面図、第2図は特性図、第3図はモールドコン
デンサの製作に用いる注型金型装置の切り欠き断面図で
ある。Embodiments 1 to 4 Hereinafter, the invention of the present application will be described with reference to FIGS. 1 to 3 of the drawings. FIG. 1 is a sectional view of a molded capacitor for explaining an embodiment, FIG. 2 is a characteristic diagram, and FIG. 3 is a cutaway sectional view of a casting mold apparatus used for manufacturing the molded capacitor.
巻回型コンデンサ素子2を収容するための容器3を準備
する。容器3は上側に位置する容器本体3aと下側に位置
する蓋体3bとからなり、巻回型コンデンサ素子2の外径
寸法より少し大きめの内径を有し、巻回両端面に面して
それぞれに間隙を形成する高さの内法り寸法に設定して
あり、容器本体3aおよび蓋体3bには巻回型コンデンサ素
子2の引き出し線2a,2bを外部に引き出すためのハトメ
端子4a,4bを設け、容器3の内底部に当たる蓋体3bの内
底部に外空間と連通するチューブ3cを設けてある。A container 3 for accommodating the wound-type capacitor element 2 is prepared. The container 3 is composed of a container body 3a located on the upper side and a lid body 3b located on the lower side, has an inner diameter slightly larger than the outer diameter of the wound capacitor element 2, and faces both end faces of the winding. The inner dimension of the height that forms a gap in each is set, and the container body 3a and the lid 3b are provided with eyelet terminals 4a, 2a, 2b for pulling out the lead wires 2a, 2b of the winding type capacitor element 2 to the outside. 4b is provided, and a tube 3c communicating with the outer space is provided at the inner bottom portion of the lid 3b, which is the inner bottom portion of the container 3.
次にこの容器3に、筒型ボビン1に帯状の誘電層と電極
層とを交互に重ねて巻回してなる巻回型コンデンサ素子
2を、筒形ボビン1の孔部にチューブ3cを挿入させて収
容する。この際に巻回型コンデンサ素子2の引き出し線
2a,2bをハトメ端子4a,4bにそれぞれ半田付けし、必要に
より更に封止材により封止して外部に引き出しておく。Next, in this container 3, a winding type capacitor element 2 formed by alternately winding a band-shaped dielectric layer and an electrode layer on a cylindrical bobbin 1 is wound, and a tube 3c is inserted into a hole portion of the cylindrical bobbin 1. To accommodate. At this time, the lead wire of the winding type capacitor element 2
2a and 2b are soldered to the eyelet terminals 4a and 4b, respectively, and if necessary, further sealed with a sealing material and pulled out to the outside.
このように巻回型コンデンサ素子2を容器3に収容し
て、これを第3図に示すように容器3の外径寸法より大
きな内径寸法を有する金型8内にセットする。バルブ8,
10,11を閉じ、バルブ9を開いて真空ポンプ12を作動さ
せて、金型7内を真空脱気する。容器3内の空気は筒形
ボビン1に挿入されているチューブ3cの孔を通じて脱気
され、容器1内およびチューブ3c内を10-2mmHg程度の真
空度まで引く。In this way, the wound-type capacitor element 2 is housed in the container 3 and set in a mold 8 having an inner diameter larger than the outer diameter of the container 3, as shown in FIG. Valve 8,
The valves 10 and 11 are closed, the valve 9 is opened, the vacuum pump 12 is operated, and the inside of the mold 7 is vacuum deaerated. The air in the container 3 is degassed through the hole of the tube 3c inserted into the cylindrical bobbin 1, and the inside of the container 1 and the tube 3c are pulled to a vacuum degree of about 10 -2 mmHg.
次いで、バルブ9を閉じバルブ10を開いて真空状態の金
型7内に絶縁ガス、例えばSF6ガス5を流入させて容器
3内およびチューブ3c内にSF6ガス5を充填する。そのS
F6ガス5の充填圧をPO[atm]として、例えば、POが1.0
atm(実施例1),1.2atm(実施例2),1.5atm(実施例
3),1.8atm(実施例4)に充填する。尚、このSF6ガス
5の充填圧POは容器3内の絶縁ガス5のガス圧を設定す
る際に所望の値に定めることができる。Then, the valve 9 is closed and the valve 10 is opened to allow an insulating gas, for example, SF 6 gas 5 to flow into the vacuum mold 7 to fill the container 3 and the tube 3c with the SF 6 gas 5. That S
When the filling pressure of the F 6 gas 5 is P O [atm], for example, P O is 1.0
Atm (Example 1), 1.2 atm (Example 2), 1.5 atm (Example 3), and 1.8 atm (Example 4) are filled. The filling pressure P O of the SF 6 gas 5 can be set to a desired value when setting the gas pressure of the insulating gas 5 in the container 3.
その後に、バルブ9,10を閉じバルブ11を開いて、金型7
と容器3との間にエポキシ樹脂液6′を注入する。この
エポキシ樹脂液6′は、例えばエポキシ樹脂に無機質の
充填材を混入して密度ρが1.3ク゛ラム/ccのものを用いる。
このエポキシ樹脂液6′を金型7と容器3との間に注入
して行くと、先ず、チューブ3cの下部開口がエポキシ樹
脂液7′と接触したときに封口されて、容器3内および
チューブ3c孔内にSF6ガス6を封入でる。第3図はほぼ
この状態を描いてある。エポキシ樹脂液6′を更に注入
して行くと、筒形ボビン1の孔の下部に生じている合成
樹脂液6′の自由表面に注入した合成樹脂液6′の重力
が加わった加圧状態となる。注入したエポキシ樹脂液
6′面の高さをhcmとすると、チューブ3c内の自由表面
に加わる重力Phは、 Ph=ρgh/106[atm] となる。このPhが容器3内およびチューブ3c内の絶縁ガ
スの加圧状態の加圧力になる。After that, valves 9 and 10 are closed and valve 11 is opened, and the mold 7
The epoxy resin liquid 6 ′ is injected between the container 3 and the container 3. The epoxy resin liquid 6'uses, for example, an epoxy resin mixed with an inorganic filler and having a density ρ of 1.3 grams / cc.
When this epoxy resin liquid 6'is poured between the mold 7 and the container 3, first, the lower opening of the tube 3c is sealed when it comes into contact with the epoxy resin liquid 7 ', and the inside of the container 3 and the tube 3 are closed. SF 6 gas 6 can be enclosed in the 3c hole. FIG. 3 illustrates almost this state. When the epoxy resin liquid 6'was further injected, the synthetic resin liquid 6'injected onto the free surface of the synthetic resin liquid 6'generated in the lower portion of the hole of the cylindrical bobbin 1 was in a pressurized state to which gravity was applied. Become. Assuming that the height of the injected epoxy resin liquid 6 ′ surface is hcm, the gravity P h applied to the free surface in the tube 3c is P h = ρgh / 10 6 [atm]. The P h is the increased pressure of the pressurized insulating gas in the container 3 and the tube 3c.
エポキシ樹脂液6′面の高さhがモールドコンデンサの
高さ、即ちh=12cmだとすると、容器3内のSF6ガス5
のガス圧PXは、 PX=PO+PH =PO+1.3×980×12÷106 ≒PO+0.015[atm] になる。Assuming that the height h of the epoxy resin liquid 6'side is the height of the molded capacitor, that is, h = 12 cm, SF 6 gas 5 in the container 3
The gas pressure P X of is P X = P O + P H = P O + 1.3 × 980 × 12 ÷ 10 6 ≈P O +0.015 [atm].
尚、第3図はエポキシ樹脂液6′がモールドコンデンサ
の高さの約60%程度に上昇している状態を示している。Incidentally, FIG. 3 shows a state in which the epoxy resin liquid 6'has risen to about 60% of the height of the molded capacitor.
容器3内のSF6ガス5のガス圧PXを所望の値に値に上昇
するとその加圧状態を保ちながら注入したエポキシ樹脂
液6′を反応硬化させ容器3のまわりに反応硬化したエ
ポキシ樹脂6のモールド層が形成する。これを金型7よ
り取り出し必要により後加工を施してこの考案のモール
ドコンデンサを得ることができる。When the gas pressure P X of the SF 6 gas 5 in the container 3 is raised to a desired value, the injected epoxy resin liquid 6 ′ is cured while maintaining the pressurized state, and the epoxy resin around the container 3 is cured. 6 mold layers are formed. This can be taken out of the mold 7 and subjected to post-processing if necessary to obtain the molded capacitor of the present invention.
POを1.0atmにして容器3内のSF6ガス5のガス圧PXが1.0
15atmのモールドコンデンサ(実施例1),POを1.2atm
にして容器3内のSF6ガス5のガス圧PXが1.215atmのモ
ールドコンデンサ(実施例2),POを1.5atmにして容器
3内のSF6ガス5のガス圧PXが1.515atmのモールドコン
デンサ(実施例3),POを1.8atmにして容器3内のSF6
ガス5のガス圧PXが1.815atmのモールドコンデンサ(実
施例4)を作成した。When P O is set to 1.0 atm, the gas pressure P X of SF 6 gas 5 in the container 3 is 1.0.
Molded capacitor of 15 atm (Example 1), P 2 O of 1.2 atm
To the gas pressure P X of SF 6 gas 5 in the container 3 is molded capacitor 1.215Atm (Example 2), the gas pressure P X of SF 6 gas 5 in the container 3 to the P O to 1.5atm is 1.515atm Molded capacitor (Example 3), P 6 O 8 atm and SF 6 in container 3
A molded capacitor (Example 4) having a gas pressure P X of gas 5 of 1.815 atm was prepared.
[比較例] 比較例として、容器の蓋体を密閉構造にし、容器本体の
上部に空気を脱気しSF6ガス5を充填するための細孔を
設ける他は実施例と同一条件にし、POが1.0atm下でモー
ルドしたモールドコンデンサ(比較例1)、POが1.2atm
下でモールドしたモールドコンデンサ(比較例2)、PO
が1.5atm下でモールドしたモールドコンデンサ(比較例
3),POが1.8atm下でモールドしたモールドコンデンサ
(比較例4)を作成した。[Comparative Example] As a comparative example, the conditions are the same as those of the example except that the lid of the container has a closed structure and pores for degassing air and filling SF 6 gas 5 are provided in the upper part of the container main body. Molded capacitor molded under O at 1.0 atm (Comparative Example 1), P O at 1.2 atm
Molded capacitor molded below (Comparative Example 2), P O
There mold capacitor (Comparative Example 3) were molded under 1.5 atm, P O creates the molded mold capacitors (Comparative Example 4) under 1.8 atm.
実施例1〜4と比較例1〜4のモールドコンデンサのコ
ロナ放電開始電圧を測定し比較例1のモールドコンデン
サのコロナ放電開始電圧を基準にして相対値を第2図に
示した。The corona discharge inception voltage of the mold capacitors of Examples 1 to 4 and Comparative Examples 1 to 4 was measured, and the relative values are shown in FIG. 2 based on the corona discharge inception voltage of the mold capacitor of Comparative Example 1.
[考案の効果] この考案のモールドコンデンサは 容器の内底部に設けた外空間と連通するチューブの下部
開口よりモールド用の合成樹脂液を加圧状態にして流入
させることにより、巻回型コンデンサ素子を収容する容
器内に絶縁ガスを正圧状態に密封してあるので、巻回型
コンデンサ素子の巻回両端面の絶縁耐力弱点部に絶縁ガ
スを高密度に介在させることができ、コロナ放電開始電
圧の向上を計ることができるものである。[Effect of the Invention] The molded capacitor of the present invention is a wound-type capacitor element in which a synthetic resin liquid for molding is introduced under pressure from a lower opening of a tube communicating with an outer space provided in an inner bottom portion of a container. Since the insulating gas is sealed in a positive pressure state in the container that accommodates the insulating gas, it is possible to interpose the insulating gas at high density in the weak points of the dielectric strength of both ends of the winding type capacitor element, and start corona discharge. The voltage can be improved.
第1図は実施例におけるモールドコンデンサの切り欠き
断面図、第2図は実施例および比較例の特性図、第3図
は注型金型装置の切欠き断面図であることを示す。 1…筒形ボビン、2…巻回型コンデンサ素子、2a,2b…
それぞれ引き出し線、3…容器、3a…容器本体、3b…蓋
体、3c…チューブ、4a,4b…それぞれハトメ、5…SF6ガ
ス、6…エポキシ樹脂、6′…エポキシ樹脂液、7…金
型、8,9,10,11…それぞれバルブ、12…真空ポンプ装
置、13…合成樹脂液タンク、14…SF6ガスボンベ。1 shows a cutaway sectional view of a molded capacitor in an embodiment, FIG. 2 shows a characteristic view of the embodiment and a comparative example, and FIG. 3 shows a cutaway sectional view of a casting mold apparatus. 1 ... Cylindrical bobbin, 2 ... Winding type capacitor element, 2a, 2b ...
Lead lines, 3 ... Container, 3a ... Container body, 3b ... Lid, 3c ... Tube, 4a, 4b ... Eyelets, 5 ... SF 6 gas, 6 ... Epoxy resin, 6 '... Epoxy resin liquid, 7 ... Gold Mold, 8, 9, 10, 11 ... Valve, 12 ... Vacuum pump device, 13 ... Synthetic resin liquid tank, 14 ... SF 6 gas cylinder.
Claims (1)
を設けた容器内に、筒形ボビンに帯状の誘電層と電極層
とを交互に重ねて巻回してなる巻回型コンデンサ素子を
筒形ボビンの孔部にチューブを挿入させて収容し、容器
内およびチューブ内に絶縁ガスを充填すると共に容器の
まわりを合成樹脂でモールドするに際してチューブ内に
合成樹脂を流入させ加圧状態とすることにより容器内の
絶縁ガスを正圧状態に密封せしめたことを特徴とするモ
ールドコンデンサ。1. A wound-type capacitor element comprising a cylindrical bobbin and a strip-shaped dielectric layer and an electrode layer which are alternately laminated and wound in a container having a tube communicating with the outer space at the inner bottom of the container. A tube is inserted into the hole of the cylindrical bobbin to be housed, the container and the tube are filled with insulating gas, and when the container is molded with a synthetic resin, the synthetic resin flows into the tube to be in a pressurized state. As a result, the molded capacitor is characterized in that the insulating gas in the container is sealed in a positive pressure state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106930U JPH0726833Y2 (en) | 1989-09-12 | 1989-09-12 | Mold capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106930U JPH0726833Y2 (en) | 1989-09-12 | 1989-09-12 | Mold capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0345618U JPH0345618U (en) | 1991-04-26 |
| JPH0726833Y2 true JPH0726833Y2 (en) | 1995-06-14 |
Family
ID=31655650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989106930U Expired - Lifetime JPH0726833Y2 (en) | 1989-09-12 | 1989-09-12 | Mold capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726833Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58106817A (en) * | 1981-12-18 | 1983-06-25 | マルコン電子株式会社 | Method of producing resin sheathed condenser |
-
1989
- 1989-09-12 JP JP1989106930U patent/JPH0726833Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0345618U (en) | 1991-04-26 |
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|---|---|---|---|
| R250 | Receipt of annual fees |
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| EXPY | Cancellation because of completion of term |