JPH0726848Y2 - Diode matrix - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a diode matrix used for setting an ID code (individual identification code) of a transmitter for a remote control of an automobile, and more particularly, to a conventional diode matrix. Also relates to a diode matrix that can realize the same function as the conventional one even if the number of arrayed diode chip components is reduced, and can simplify the matrix pattern and downsize the substrate.

[Conventional technology]

3A to 3B are for explaining a conventional diode matrix. FIG. 3A is a plan view showing a diode chip component used for this, and FIG. 3B is a matrix pattern on which the diode chip component is arranged. It is a figure which shows the arrangement location.

In a conventional diode matrix, a diode chip component K, which is formed by connecting two terminals with one diode as shown in FIG. 3A, is arranged at each location on the matrix pattern formed on the substrate (see FIG. 3B). ) Is attached or not attached.

Further, in this conventional diode matrix, it is possible to represent 1-bit information by arranging the diode chip component K in one arranging position (= "1") or not arranging it (= "0"). In addition, in the conventional example shown in FIG. 3B, a total of 8 placement points of 4 rows and 2 columns are formed, and the diode chip component K is placed or not placed in each of these placement points. This makes it possible to handle 8-bit (256 types) information. For example, when the diode chip component K is selected and mounted only at the positions indicated by reference signs a and b in FIG. 3B, the positions indicated by reference signs a and b are ON.
(= “1”) and the other parts are OFF (= “0”). Therefore, in this case, the binary code of "00100010" (= 34 ₍₁₀₎ ) can be obtained.

[Problems to be solved by the device]

However, in such a conventional diode matrix, since only one bit (two types) of information can be handled at one location, it is necessary to deal with a huge number of combinations of ID codes, etc. Will have to be formed in large quantities. As a result, the matrix pattern of the substrate becomes complicated, and it is difficult to reduce the size of the substrate.

The present invention is intended to solve the above problems, and it is possible to realize the same function as the conventional one even if the number of diode chip components arranged is smaller than that of the conventional one, and to simplify the matrix pattern. It is an object of the present invention to provide a diode matrix capable of miniaturizing a substrate.

[Means for Solving the Problems] The diode matrix according to the present invention comprises a plurality of types including three or more terminals and one or more diodes and corresponding to the number of diodes and the number of combinations in which the terminals to which the diodes are connected are different. Different diode codes are formed by selecting a plurality of types of diode chip parts, selecting their positions on the matrix pattern, and mounting them.

[Action]

According to the above means, by using at least three or more kinds of diode chip parts made up of combinations in which the number of diodes and the connection with the diode terminals are different, at least two bits (4 It is possible to handle the above information. Therefore, it is possible to reduce the number of arrangement positions and the number of diode chip components on the matrix pattern required to handle the same amount of information to less than half of the conventional number.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

1A-B are views for explaining a diode matrix according to a first embodiment of the present invention, and FIG. 1A is a plan view showing three kinds of diode chip parts used therein.
FIG. 1B is a diagram showing arrangement locations on the matrix pattern where these respective diode chip components are arranged.

In the first embodiment, as shown in FIG. 1A, a diode chip component A, B including three terminals and one diode and a diode chip component C including three terminals and two diodes are combined. Three types of diode chip parts are used. If these three types of diode chip parts A, B, C are used, 1
Only one location, nothing placed ("00"), A placed ("01"), B placed ("10"), and C placed ("11"). It is possible to handle 4 types (2 bits) of information by combining.

Further, in the matrix pattern of the first embodiment, four diode rows are arranged in a total of four rows and one column as shown in FIG. 1B. Therefore,
In this first embodiment, by arranging or not arranging the above-mentioned three kinds of diode chip parts A, B, C in combination at each of the above-mentioned four arrangement positions in total, 8 bits (256 types) It becomes possible to handle the information of. For example,
By arranging only one diode chip component C shown in FIG. 1A at the arrangement position indicated by the reference sign c among the four arrangement positions shown in FIG. 1B, the 00100010 "(34 ₍₁₀₎ ) 2
It can represent a hexadecimal code. To represent the same binary code in a conventional diode matrix,
As shown in FIG. 3B, it is necessary to form a total of 8 placement locations of 4 rows and 2 columns, and to place the diode chip component K of FIG. 3A at the placement locations of the symbols a and b.

As described above, according to the present embodiment, the three types of diode chip components A and BC described above are arranged in combination, so that the number of arrangement positions required to handle the same number of bits of information is 2 It becomes possible to reduce from one row (see FIG. 3B) to one row (see FIG. 1B). Therefore, it is possible to save the number of places where the matrix pattern is arranged and the number of diode chip parts to be arranged, and thereby it is possible to simplify the matrix pattern formed on the substrate and downsize the substrate.

Further, when this embodiment is used in a transmitter of a remote control device of an automobile, for example, it is possible to set the same number of non-overlapping ID codes with the conventional matrix arrangement of half the diode chip parts. Therefore, the combination of the diode chip parts A to C corresponding to each ID code should be
By making a decision and making a selection in step 1, it becomes possible to realize the automation of the work of mounting the diode chip component on the substrate and the miniaturization of the transmitter.

2A to 2B are for explaining a diode matrix according to a second embodiment of the present invention, and FIG. 2A is a plan view showing seven kinds of diode chip parts used therein.
FIG. 2B is a diagram showing arrangement locations on the matrix pattern where these diode chip components are arranged.

The diode chip component used in this second embodiment is
As shown in FIG. 2A, four terminals are formed in one package. And in this package, one that contains one diode D, E and F, one that contains two diodes G, H and I, and one that contains three diodes J There are 7 types of diode chip parts.

In the second embodiment, each of these seven types of diode chip parts D to J has a total of 8 rows and 4 columns shown in FIG. 2B.
24-bit information can be handled by properly combining and mounting the individual placement locations. Therefore, by using this second embodiment as an ID code setting element, it is possible to set 2 ²⁴ = 16,777,216 ways of ID code. Thus, according to this second embodiment,
It is possible to handle a large amount of information even if the number of diode chip components arranged is significantly reduced as compared with the prior art.

The present invention is not limited to the combination of the above embodiments, and the number of terminals and the maximum number of diodes can be further increased to further increase the number of code combinations.

〔effect〕

As described above, according to the present invention, any one of a plurality of types of diode chip components is appropriately selected to be mounted or not mounted at each placement position on the matrix pattern. It becomes possible to handle information of 2 bits or more. Therefore,
Since a large amount of information can be handled even if the number of diode chip components arranged is smaller than in the past, it is possible to simplify the matrix pattern and downsize the substrate.

[Brief description of drawings]

1A-B are views for explaining a diode matrix according to a first embodiment of the present invention, and FIG. 1A is a plan view showing three kinds of diode chip parts used therein.
FIG. 1B is a diagram showing the locations on the matrix pattern where these diode chip parts are disposed, and FIGS. 2A to 2B are for explaining the diode matrix according to the second embodiment of the present invention. The figure is a plan view showing the seven types of diode chip components used for this, FIG. 2B is a diagram showing the arrangement locations on the matrix pattern where these diode chip components are arranged, and FIGS. 3A-B are conventional FIG. 3A is a plan view showing a diode chip component used for the purpose of explaining a diode matrix.
FIG. 3B is a diagram showing arrangement locations on the matrix pattern where the diode chip components are arranged. A to J ... Diode chip parts, c ... Placement of diode chip parts.

Claims (1)

[Scope of utility model registration request] 1. A plurality of types of diode chip parts corresponding to the number of combinations of three or more terminals and one or more diodes and different numbers of diodes and terminals to which the diodes are connected are used. Diode chip component of which different codes are formed by selecting and mounting the position on the matrix pattern