JPH0726865Y2 - Printed circuit board gold plating equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION {Industrial application field} The present invention relates to a gold plating apparatus for printed boards, and more particularly to an automated gold plating apparatus.

{Prior Art} When using the printed board pattern for the connector connection part,
It is necessary to apply gold plating to the pattern portion. For example, degreasing, washing with water, or Ni
Although it is necessary to go through various baths such as (nickel) plating,
Conventionally, a printed board to be plated is manually transferred to each tank one by one, and the operator manages the time of immersion in each tank or the plating current. But,
Since there are many tanks, there is a problem that the worker is swung around at each set processing time.

{Problems to be solved by the invention} The present invention was made in order to solve such problems.
It is an object of the present invention to provide a device capable of high-quality gold plating while saving labor.

{Means for Solving the Problems} In order to achieve the above object, the present invention is driven in the vertical direction and the front-back direction by an air cylinder provided in a member that is moved by a motor on a plating line of a printed board. A nickel plating tank in the gold plating line driven by an air cylinder, which is gripped by the printed board and carries the printed board to the tank for the next step, and a pair of wire brushes, which is driven by a cylinder. And an electrode pattern gripping portion disposed in the gold plating tank portion for gripping an electrode pattern portion on the printed board and supplying a plating current, and configured to cut an unnecessary portion including the electrode pattern on the printed board after gold plating. It was done. Hereinafter, embodiments will be described in detail with reference to the drawings.

{Example} FIG. 1 is a block diagram of an automatic plating line according to the present invention. In the figure, 1 is a tank required for gold plating of a printed board, a is a degreasing tank, b is a water washing tank, ... q is a recovery tank, and r is a water washing tank. Reference numeral 2 is a printed board to be plated with gold, which is placed on each of the pedestals 3a, ... 3d. Of the printed board 2, 2a and 2b are after plating, 2
c and 2d indicate unplated ones. The unplated printed board passes through the respective tanks by the transporter 4 shown in FIG. 2 so that its pattern portion is gold-plated. Reference numerals 31 and 32 are push switches for identifying printed boards provided corresponding to the printed boards 2c and 2d, and 33 is a rotary switch for changing the set value of the plating current. Regarding the setting of the current value, the current value is divided into eight levels corresponding to Ni and Au (gold) plating, and the rotary switch 33 is used for selection at the first stage of the line.

In the carrier 4 shown in FIG. 2, 41 is a line arranged in front of the plating tank 1 shown in FIG. 1, and 42 is a moving plate which moves on this line. Reference numeral 43 is a motor with an electromagnetic brake that is attached to the moving plate 42 and moves the moving plate on the line 41. 44 is a gripping part that grips the printed board, 45a is an air cylinder for gripping that drives the gripping part 44, 45b is a front and rear air cylinder that moves the gripping part 44 in the front-rear direction, and 45c is a vertical direction of the gripping part 44. These are vertical air cylinders to be moved. Each of these cylinders is attached to a moving plate 42 and moves on the line 41 together with the moving plate 42.
The grip portion 44 is composed of a pair of arms 44a and 44b, and is driven by a grip cylinder 45a. The arms 44a and 44b are made of vinyl chloride plates to prevent deterioration due to chemicals, and silicon rubber is stretched on the plates.

As shown in Fig. 1, there are 18 process lines for gold plating.
Although about 10 tanks are required, in the embodiment of the present invention, 11 conveyors 4 shown in FIG. 2 are provided on the line 41, and the 11 tanks are used to divide the process by linking 18 tanks. ing. That is, the arrow shown in FIG. 1 indicates the process carried by one carrier 4, and for example, the second carrier from the left in the figure is responsible for the tanks a and b, and the third carrier from the left. The machine is designed to handle tanks b to e.

Returning to FIG. 2, 2 is a printed board to be plated,
Reference numeral 21 denotes a connector portion formed as a pattern for gold plating on this printed board. Reference numeral 22 is an electrode pattern provided for supplying a plating current to the connector portion, and the electrode pattern 22 is connected to the connector portion 21 via the pattern 23. Reference numeral 51 denotes a pair of arms 51a and 51b made of a wire brush, which holds an electrode pattern 22 formed on the printed board 2 and contacts the electrode pattern 22, and 52 is a cylinder for driving the electrode pattern gripping portion. Is. The grip 51 and the cylinder 52 are shown in FIG.
They are installed in front of the Ni plating tanks g and h and the gold plating tanks o and p respectively, and the cylinder 52 is driven by the moving carrier 4 and the electrode patterns 22 formed on the printed board 2 are gripped by the arms 51a and 51b. , Is turned off after a lapse of a predetermined time. In this configuration, a plating current is supplied via the grip portion 51 → electrode pattern 22, and thus the connector portion 21 is plated. The electrode gripping portion 51 is adapted to vibrate in the gold plating baths o and p in order to make better contact with the electrode pattern 22. In FIG. 1, two Ni plating tanks and two gold plating tanks are provided, but this is for shortening the cycle time. The operation of the device of the present invention having such a configuration will be described as follows.

(1) As shown in FIG. 1, the unplated printed boards 2c, 2d are placed on the pedestals 3c, 3d.

(2) The push switch 31 or 32 is pressed while the current value is determined by the rotary switch 33.

(3) The motor 43 is driven, and of the 11 carrier machines 4 arranged on the line 41 shown in FIG. 1, the leftmost carrier machine in the figure is pushed by the push switch 31 or 32. One of the switches is moved to the printed board 2c or 2d at the position corresponding to the other switch and stopped.

(4) The cylinder 45b in the front-rear direction is driven to move the grip portion 44 to the printed board side.

(5) Arms 44a, 44b of the grip portion 44 driven by the cylinder 45a
Grabs the printed board 2.

(6) The vertical cylinder 45c is driven, and the printed board 2 is gripped and lifted by the grip portion 44.

(7) The motor 43 is driven to move the conveyor 4 to the position of the degreasing tank a shown in FIG.

(8) The vertical cylinder 45c is turned off, and the grip portion 44 is lowered to submerge the printed board 2 in the degreasing tank 1a.

(9) Turn off the grip portion 44 and separate the arms 44a and 44b from the printed board.

(10) After that, the transport machine 4 pushes the push switch 31 or
If 32 is pressed, take the printed board again.

(11) On the other hand, 11 carrier machines that were placed on line 41
Of the 40, the second carrier from the left side in the figure goes to pick up the printed board 2 submerged in the degreasing tank 1a,
The printed board is transferred to the next washing tank 1b. The transfer means is performed by the same process as the above (3) to (9).

(12) When the process of a to f is completed and the printed board 2 is transferred to the Ni plating tank g by the carrier 4, the cylinder pattern 52 drives the electrode pattern gripping portion 51 arranged at this tank, The pair of arms 51a and 51b made of a wire brush grip the electrode pattern 22 formed on the printed board 2. A current flows from a current source (not shown) via the arms 51a and 51b and the electrode pattern 22, and the pattern 21 is plated with Ni.

(13) When a predetermined time elapses in the Ni plating tank g, the printed board is transferred to the next tank h and is subjected to Ni plating.

(14) When the process up to n is completed and the printed board 2 is transferred to the gold plating tank o by the carrier 4, the electrode pattern gripping portion 51 is driven and the arm is driven in the same manner as described in the process (13).
The electrode pattern 22 formed on the printed board 2 is gripped by 51a, 51b, and a current flows through the arms 51a, 52b, whereby the connector portion 21 is plated with gold.

(15) When the printed board 2 reaches the washing tank r and is washed with water,
Of the 11 carriers 4 arranged on the line 41, the carrier on the rightmost side in the drawing takes out the printed board from the washing tank r and places it on the receiving table 3b. The printed board 2 in this state is shown in FIG.

(16) In the printed board 2 shown in FIG. 3, X1, X2 and Y1,
The Y2 portion shows a cutting position. By cutting at this position, an extra portion including the electrode pattern 22 is cut off, and the printed board 24 having the connector portion 21 and actually used is obtained.

A sequencer is provided in the present invention,
The sequencer controls the 11 motors and cylinders described above, manages Au and Ni plating time, and rinses with water. We are in charge of time management such as soft etching and memory of plating current.

{Effect of the present invention} As described above, in the present invention, since all operations are performed automatically without manual labor, it is possible to obtain a device that saves labor and enables high-quality gold plating. Moreover, since a plurality of transporters are provided for a large number of plating tanks and the process is divided while linking the plurality of plating tanks, the time required for the gold plating process can be shortened, and a large amount of It is possible to obtain a plating apparatus capable of gold-plating a printed board in a short time. Furthermore, by forming the arm that constitutes the electrode pattern gripping portion with a wire brush, it is possible to obtain a plating current supply means that does not deteriorate due to chemicals or the like and does not cause poor contact for a long time. .

[Brief description of drawings]

FIG. 1 is a block diagram of an automatic plating line according to the present invention, and FIG.
FIG. 3 is a block diagram of the essential parts of an embodiment of the device according to the present invention,
The figure is a block diagram of a printed board. DESCRIPTION OF SYMBOLS 1 ... Gold plating tank, 2 ... Printed board, 21 ... Connector pattern, 22 ... Electrode pattern, 4 ... Conveyor, 43 ... Transfer motor, 44 ... Grasping part, 45a, 45b, 45c ... Cylinder, 51 ... Electrode pattern grip Part, 51a, 51b ... Arm made of wire brush, 52 ... Cylinder.

Claims (1)

[Scope of utility model registration request] 1. A gold plating line of a printed board in which a large number of processing baths including a nickel plating bath and a gold plating bath are connected to each other, and a plurality of adjoining baths among the plurality of processing baths in the gold plating line are divided as a unit. A plurality of moving members that move by linking each of the divided units, an air cylinder attached to each moving member, and a pair of arms that are respectively driven by the air cylinders, hold the printed board. A plurality of printed board conveyors, each of which is composed of a gripping part, and which conveys the printed board gripped by the gripping part to the tank for the next process, and fixedly arranged at positions corresponding to the nickel plating tank and the gold plating tank in the gold plating line. And a pair of cylinders attached to the transporting machine and a pair of cylinders respectively driven by the cylinders. It is composed of an ear brush and comprises a pattern gripping portion for gripping each electrode pattern portion formed on the printed board by the wire brush, and supplies a plating current to the pattern formed on the printed board via each wire brush. A gold plating device for printed boards, which consists of the electrode pattern gripping part and