JPH07272811A - Ic socket - Google Patents

Abstract

PURPOSE:To provide an IC socket having a small tallness by locating the folded part of each connection terminal, in which the ends of two pieces folded into U-shape are used as a contacting part and a connection part, in a position outside of the side edge of a socket table. CONSTITUTION:A socket table 2 is mounted on a printed circuit board by soldering the connection part 32a of each connection terminal 3 to a conductive circuit pattern. An IC 1 is mounted on the socket table by coupling a frame 4 with a coupling member 2b in the condition that a lead 1a is contacted with the contacting part 31a of the terminal 3. Therein the lead 1a is pressed by the frame 4, contacted with the contacting part 31a with a certain contact pressure which is generated by deflection of one of the pieces 31 of the terminal 3, and mounted while electric connection is generated with the conductive circuit pattern on the printed circuit board. Because the folded part 30 of the terminal 3 in which the ends of two pieces 31, 32 folded into a U-form are used as contacting part 31a and connection part 32a, respectively, is positioned outside of the side edge of the socket table 2, it is practicable to change the folded part 30 to inside and outside to ensure that the tallness is lessened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket surface-mounted on a conductive circuit pattern provided on the surface of a printed circuit board.

[0002]

2. Description of the Related Art As a first conventional example of this type of IC socket, there is one having a structure shown in FIGS. This is a substantially flat socket base 11 and each lead of the IC 13.
13a has a contact portion 12a which is pressed by the frame 14 attached to the socket base 11 and comes into contact therewith, and a connection portion 12b which is connected to the conductive circuit pattern provided on the printed circuit board surface and is provided on the side edge portion of the socket base 11. And a plurality of connecting terminals 12 having a spring property arranged in a row.

More specifically, this IC 13 has leads 13a from the respective sides of a flat quadrilateral package 13b.
Is projected.

As shown in FIG. 8, the socket base 11 is formed of a substantially flat plate and has a quadrangular shape, and a large number of connection terminals 12 are arranged in a row on each of the four sides as will be described later. Coupling members 11a are fixed to the four corners.

The connection terminal 12 is formed by bending a substantially L-shaped conductive plate having a spring property, as shown in FIG.
The one piece 12A is the other piece 12A having a connecting portion 12b at the tip.
In addition to extending in the same direction as B, a contact portion 12a is provided at the tip end thereof, and a press-fitting projection 12c is projected at the base portion of the piece 12A in both directions of the width.

The connection terminal 12 is connected to the lead 13a of the IC 13
The press-fitting projections 12c are press-fitted and supported in the press-fitting grooves 11b provided on the four side edges of the socket base 11 according to the pitch of
Are arranged in a row so as to be located inside the press-fitting groove 11b.

In this IC socket, the socket base 11 is mounted on the printed circuit board surface by soldering the connection portion 12b of the connection terminal 12 to the conductive circuit pattern. Then, as shown in FIG. 6, the IC 13 connects the lead 13a to the contact portion 12 of the connection terminal 12.
When the frame 14 is coupled to the coupling member 11a and attached to the socket base 11 while being in contact with a, the lead 13a is pressed by the frame 14 and at the same time one of the connecting terminal 12
The bending of 12A makes contact with the contact portion 12a with a contact pressure, electrically connects to the conductive circuit pattern on the printed circuit board surface, and is mounted in the socket for this IC.

As a second conventional example, there is a configuration shown in FIGS. 10 to 13. The members having substantially the same functions as those of the first conventional example are designated by the same reference numerals, and the connection terminal 12 having a different configuration from the first conventional example will be described.

While the connection terminal 12 is formed by bending a conductive plate in the thickness direction in the first conventional example,
In this conventional example, the conductive plate is formed by punching in the plate thickness direction. The shape of the contact part is as shown in Fig. 12.
One piece 12A having 12a and the other piece having connecting portion 12b
A support portion 12d having a press-fitting projection 12c is provided at the tip of the other piece 12B toward the one piece 12A side. The pair of connecting terminals 12 and 12 formed to extend the supporting portion 12d to one side of the elongated carrier plate 12e so as to be symmetrical to each other is the carrier plate 12e.
Is continuously formed along the longitudinal direction, and a notch 12f along the longitudinal direction is provided in the middle of the supporting portion 12d.

The pair of connection terminals 12 and 12 are press-fitted with the press-fitting projections 12c into the pair of press-fitting grooves 11b and 11b provided on the opposite side edges of the quadrilateral socket base 11 to support both support portions 12d and 12d.
After being simultaneously supported and fixed, the carrier plate 12e is cut in the notch 12f by rotating in the plate thickness direction. Further, the next pair of continuous connecting terminals 12, 12 is supported and fixed in the pair of press-fitting grooves 11b, 11b adjacent to the same opposite side edge portion of the socket base 11 by one pitch in the same manner as described above. The assembling work is also performed on the other side edge portion, so that the connection terminals 12 are arranged in rows at the four side edge portions of the socket base 11, as shown in FIG. At this time,
The connection terminal 12 is in a state in which a substantially U-shaped bent portion is located on the outer side of the side edge portion of the socket base 11.

The procedure for mounting the IC 13 in this IC socket is the same as in the first conventional example.

[0012]

In the IC socket of the first conventional example described above, one piece 12A and the other piece 12B are provided.
The connection terminal 12 is formed by bending it into a substantially L shape, and the one piece 12A of the connection terminal 12 is formed in the press-fitting groove 11 provided at the four side edges of the socket base 11.
Since the lead 13a of the IC 13 is pressed by the frame 14 to be in contact with the contact portion 12 since it is arranged in a row so as to be positioned inward of b.
If you want to secure the bending of the contact part 12a with respect to the IC 13 with a short lead 13a, the one piece 12A with a as the tip part is to deepen the press-fit groove 11b of the socket base 11 toward the back. Since there is a limit, it is necessary to extend in the direction orthogonal to the other piece 12B, that is, in the thickness direction of the socket base 11 to obtain a spring force, which makes it difficult to reduce the height of the IC socket.

On the other hand, in the IC socket of the second conventional example, the connection terminal 12 is in a state in which the bent portion having a substantially U shape is located on the outer side of the side edge portion of the socket base 11. Therefore, if it is desired to secure the bending of the contact portion 12a for the leads 13a of the IC 13 having different lengths, the bent portion may be changed in the direction parallel to the other piece 12B. The height of the IC socket can be reduced.

However, in the second conventional example, the pair of connection terminals 12 and 12 are formed into a symmetrical shape by extending the supporting portion 12d to one side of the carrier plate 12e by punching out the conductive plate in the plate thickness direction. After simultaneously supporting and fixing both support parts 12d, 12d in a pair of press-fitting grooves 11b, 11b provided on the opposite side edge of the quadrilateral socket base 11, the notch 12f is formed.
Therefore, the pitch between the pair of connection terminals 12 and 12 requires a dimension between the opposite side edge portions of the socket base 11, and the carrier plate 12e has a large amount of material loss in the longitudinal direction. Since it is necessary to support and fix each pair one by one, a plurality of connection terminals are provided on one side edge of the socket base 11.
It takes time and effort to support and fix 12, and the manufacturing cost increases.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an IC socket which can be manufactured at a low cost and with a low profile.

[0016]

In order to solve the above-mentioned problems, according to a first aspect of the present invention, a substantially flat socket base and each lead of an IC are pressed by a frame attached to the socket base. A plurality of connection terminals having a spring property and arranged in a row at the side edge portion of the socket base, the connection terminal having a contact portion to be in contact with and a connection portion connected to the conductive circuit pattern provided on the printed circuit board surface. In the IC socket as described above, the connection terminal has a bent portion whose end portions of both pieces bent in a substantially U shape are contact portions and connection portions, respectively, and which is outward of a side edge portion of the socket base. It is arranged to be located on the side.

According to a second aspect of the present invention, in the first aspect, the connection terminal is formed such that the connection portion is located between the contact portion and the printed circuit board surface.

According to a third aspect of the present invention, in the first aspect of the present invention, the connection terminal is provided on a side edge portion of the socket base in both a row direction and a direction orthogonal to the row direction. A press-fitting portion that is press-fitted and held is provided.

According to a fourth aspect of the present invention, according to the first aspect, the plurality of connection terminals are cut at the same position in the longitudinal direction of a long carrier plate in which they are connected. The socket bases are arranged side by side at the side edges.

[0020]

According to the first aspect of the present invention, in the connection terminal, the bent portions having the contact portions and the connection portions at the end portions of both pieces bent in a substantially U shape are the side edges of the socket base. Since it is located on the outer side of the part, if it is desired to secure the bending of the contact part for IC leads of different lengths, the bent part can be formed inside and outside the side edge part without raising the height. Direction, and since it is formed by bending it into a substantially U shape, a plurality of them are continuously connected in the longitudinal direction of the long carrier plate, and at the same time, on the side of the socket base. Can be supported and fixed by arranging in rows at the edge.

According to another aspect of the present invention, in the connection terminal, the connection portion connected to the conductive circuit pattern provided on the printed circuit board surface has a contact portion with which the lead of the IC abuts and the printed circuit board surface. Since it is formed so as to be located between them, the conductive circuit pattern is provided on the printed circuit board surface at the same pitch as the leads of the IC. If this IC socket is not used, the printed circuit board is used as it is. Then, the leads of the IC can be directly soldered to the printed circuit board surface.

Further, according to the third aspect of the present invention, the connection terminal is press-fitted and held on the side edge portion of the socket base in both the direction in which the press-fitting portion is arranged and the direction orthogonal to the direction in which the press-fitting portion is arranged. , The holding power becomes stronger.

According to the fourth aspect of the present invention, the plurality of connecting terminals are arranged in a row on the side edge portion of the socket base, and a long carrier plate in which the connecting terminals are connected in a longitudinal direction is formed. It can be cut and cut at the same position at the same time.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.

Reference numeral 1 denotes an IC to be used, in which a plurality of leads 1a are projected from each side of a flat quadrilateral package 1b at a predetermined pitch.

Reference numeral 2 denotes a socket base, which is made of an insulating material and is formed into a substantially flat plate in a quadrilateral shape. Each side edge portion of the four sides has a press-fitting groove 2a having a square cross-section at the same pitch as the leads 1a of the IC1. Are arranged in a row so as to penetrate in the plate thickness direction, and coupling members 2b are fixed to the four corners.

Reference numeral 3 denotes a connection terminal, which is made of a conductive plate having a spring property so that the end portions of the one piece 31 and the other piece 32 bent at the bent portion 30 in a substantially U shape are respectively formed as shown in FIG. Contact part 31a
And a connecting portion 32a, and the other piece 32 has a plurality of IC1s on one side along the longitudinal direction of a long carrier plate 34 via a press-fitting portion 33 bent in a U shape toward the one piece 31 side. The leads 1a are arranged continuously at the same pitch.

The above-mentioned contact portion 31a is a portion where each lead 1a of the IC1 is pressed by the frame 4 described later and comes into contact with it.
The connecting portion 32a is a portion to be soldered to the conductive circuit pattern provided on the printed circuit board surface, and the connecting portion 32a is the contact portion 31a.
It is formed so as to be located between a and the printed circuit board surface.

In the press-fitting portion 33, the press-fitting projections 33a are projected in both directions of the width of the bent pieces, and the dimension between the tips of the press-fitting projections 33a, 33a on both sides and the dimension between the outer sides of the bent pieces. Is formed to be larger than the space between the press-fitting grooves 2a of the socket base 2 having a square cross section, and the carrier plate 34 is formed on the outer side of the root portion connected to the one-side bent carrier plate 34.
A notch 33b is provided along the longitudinal direction of the.

The connecting terminals 3 are connected to the carrier plate 34 and have a square cross section which is arranged at the same pitch as the leads 1a of the IC 1 at the side edges of the four sides of the socket base 2. A press-fitting protrusion 33a is provided in each press-fitting groove 2a in the row direction.
With respect to the direction orthogonal to the row-arranging direction, the outer portions of the bent pieces are simultaneously pressed and held by a plurality of press-fitting portions 33 in both directions, and then the carrier is attached to the root portion of each press-fitting portion 33. By rotating the carrier plate 34 in the direction in which the biting portion of the notch 33b provided at the same position along the longitudinal direction of the plate 34 spreads, the carrier plate 34 is cut at the notch 33b and separated from each connection terminal 3. At this time, the bent portion 30 of the connection terminal 3 comes to be located on the outer side of the side edge portion of the socket base 2.

Reference numeral 4 denotes a frame, which is made of an insulating material and is composed of a square piece which forms a square hole larger than the quadrilateral shape of the package 1b of the IC1 in the center.

Then, this IC socket is used as follows. That is, the socket base 2 is mounted on the printed circuit board surface by soldering the connection portion 32a of the connection terminal 3 to the conductive circuit pattern. Then, as shown in FIG. 1, when the frame 1 is attached to the socket base 2 by coupling the frame 4 to the coupling member 2b with the lead 1a in contact with the contact portion 31a of the connection terminal 3, as shown in FIG. The lead 1a is pressed by the frame 4, and the one piece 31 of the connection terminal 3 bends to come into contact with the contact portion 31a with a contact pressure to electrically connect to the conductive circuit pattern on the printed circuit board surface. , Book I
It is mounted in the C socket.

In such an IC socket, the connection terminal 3 has a bent portion 30 in which the ends of both pieces 31, 32 bent in a substantially U shape are the contact portion 31a and the connection portion 32a, respectively. Since it is located on the outer side of the side edge portion of the socket base 2, if it is desired to secure the bending of the contact portion 31a with respect to the leads 1a of the IC1 having different lengths, without increasing the height,
The bent portion 30 may be changed inward and outward from the side edge portion.

A plurality of the long carrier plates 34 are provided.
The press-fitting portions 33 can be press-fitted and held in the press-fitting grooves 2a provided on the side edge portion of the socket base 2 at the same time while being continuously arranged in the longitudinal direction, and then the long carrier plate 34 in the longitudinal direction can be formed. The notches 33b provided at the same position can be cut and cut at the same time.

Further, since the press-fitting portion 33 is press-fitted and held in both the row-arranging direction and the direction orthogonal to the row-arranging direction,
The holding power becomes stronger.

The connection terminal 3 is formed so that the connection portion 32a connected to the conductive circuit pattern provided on the printed circuit board surface is located between the contact portion 31a with which the lead 1a of the IC1 abuts and the printed circuit board surface. Therefore, the conductive circuit pattern is provided on the printed circuit board surface at the same pitch as the leads 1a of the IC1. If this IC socket is not used, the printed circuit board is used as it is and the leads 1a of the IC1 are used. It is also possible to make a solder connection directly to the printed circuit board surface.

In this embodiment, the IC 1 has a plurality of leads 1a protruding from each side of the quadrilateral package 1b. However, the leads 1a protrude from only one opposing side. It may be installed, in that case,
The socket base 2 may also be one in which the connection terminals 3 are provided in rows only on the opposite sides of one side.

Further, in the present embodiment, if there is an automatic machine capable of press-fitting and holding the press-fitting portions 33 in the press-fitting grooves 2a one by one, the connection terminals 3 are separated from the carrier plate 34 and then press-fitted in the press-fitting grooves 2a. Also, in that case, the notch 33b does not necessarily have to be provided.

Further, in this embodiment, the press-fitting portion 33 has the press-fitting groove 2a.
Although it is press-fitted and held in both directions, if only a predetermined press-fitting holding force can be secured, press-fitting and holding in only one direction may be performed.

[0040]

According to the first aspect of the present invention, in the connection terminal, the bent portions having the contact portions and the connection portions at the ends of both pieces bent in a substantially U shape are the side edges of the socket base. Since it is located on the outer side of the part, if it is desired to secure the bending of the contact part for IC leads of different lengths, the bent part can be formed inside and outside the side edge part without raising the height. Direction, and since it is formed by bending it into a substantially U shape, a plurality of them are continuously connected in the longitudinal direction of the long carrier plate, and at the same time, on the side of the socket base. It can be supported and fixed by being provided in a line at the edge portion, and therefore, the cost and the height can be reduced.

According to a second aspect of the invention, in addition to the effects of the first aspect, the connection terminal has a connecting portion connected to the conductive circuit pattern provided on the printed circuit board surface, which is an IC.
Is formed so as to be positioned between the contact portion with which the leads of the above contact the printed circuit board surface and the printed circuit board surface.
Since it is provided on the printed circuit board surface at the same pitch as the C lead, when the IC socket is not used, the printed circuit board can be used as it is and the IC lead can be directly soldered to the printed circuit board surface.

Further, in addition to the effects of the first aspect, the connecting terminal of the third aspect of the present invention has a connection terminal in which the press-fitting portions of the socket stand are arranged in both the row direction and the direction orthogonal to the row direction. Since it is press-fitted and held in the side edge portion, the holding force becomes strong.

Further, in addition to the effect of the first aspect, the fourth aspect of the present invention has a plurality of connecting terminals, which are arranged in a row on the side edge portion of the socket base, and are connected to each other. It is possible to simultaneously cut and separate the lengthy carrier plate at the same position in the longitudinal direction.

[Brief description of drawings]

FIG. 1 is a partial sectional front view showing an embodiment of the present invention.

FIG. 2 is a plan view of the above.

FIG. 3 is a partial cross-sectional front view showing a state in which the above IC is not mounted.

FIG. 4 is a plan view of FIG.

5A is a front view, FIG. 5B is a plan view, and FIG. 5C is a side view.

FIG. 6 is a partial cross-sectional front view showing a first conventional example.

FIG. 7 is a partial cross-sectional front view showing a state in which the above IC is not mounted.

FIG. 8 is a plan view of FIG.

9A is a front view, FIG. 9B is a plan view, and FIG. 9C is a side view.

FIG. 10 is a partial sectional front view showing a second conventional example.

FIG. 11 is a partial cross-sectional front view showing a state in which the above IC is not mounted.

FIG. 12 is a front view of the connection terminal of the above.

FIG. 13 is a plan view of FIG. 11.

[Explanation of symbols]

 1 IC 1a Lead 2 Socket base 3 Connection terminal 30 Bent part 31 One piece 31a Contact part 32 The other piece 32a Connection part 33 Press fit part 34 Carrier plate 4 Frame

Claims (4)

[Claims] 1. A substantially flat socket base, a contact part where each lead of an IC is pressed and brought into contact with a frame attached to the socket base, and a connection part connected to a conductive circuit pattern provided on a printed circuit board surface. And a plurality of spring-equipped connection terminals that are arranged in a row on the side edge of the socket base, and the connection terminals are bent in a substantially U shape. An IC socket, characterized in that bent portions having end portions of both pieces as a contact portion and a connection portion are arranged so as to be located on the outer side of the side edge portion of the socket base. 2. The IC socket according to claim 1, wherein the connection terminal is formed such that the connection portion is located between the contact portion and the printed circuit board surface. 3. The connection terminal is provided with a press-fitting portion that is press-fitted and held by a side edge portion of the socket base in both a row direction and a direction orthogonal to the row direction. The IC socket according to claim 1. 4. A plurality of the connection terminals are formed by cutting them at the same position in the longitudinal direction of a long-sized carrier plate in which they are arranged in series and arranging them side by side on the side edge portion of the socket base. The IC socket according to claim 1.