JPH0727638Y2 - Cooling structure for integrated circuit devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Overview] The present invention relates to a cooling structure for an integrated circuit element, and in particular, an integrated circuit element for injecting cooled air from a nozzle onto a surface of the integrated circuit element to forcibly cool heat generated from the integrated circuit element. Regarding the cooling structure of the above, an integrated circuit device that cools the integrated circuit device mounted on the board by cooling air by blowing cold air to the integrated circuit device for the purpose of improving the cooling capacity at low cost. In the circuit element cooling structure, a direction plate that suppresses reflection of cold air that has collided with the integrated circuit element is formed at one end of the nozzle on the integrated circuit element side.

[Industrial application field]

The present invention relates to a cooling structure for an integrated circuit device, and more particularly to a cooling structure for an integrated circuit device in which cooled air is jetted from a nozzle to forcibly cool the heat generated from the integrated circuit device. is there.

[Conventional technology]

FIG. 3 is a view showing a conventional cooling structure for an integrated circuit device, in which 31 is a substrate, 32 is an integrated circuit device, 33 is a chamber, and 33a.
Is a refrigerant passage, 33b is a nozzle, and F is a flow of cold air.

Conventionally, the heat generated from a large number of integrated circuit elements 32 mounted on the substrate 31 is forcibly cooled by the cold air passing through the refrigerant passage 33a in the chamber 33 being jetted through the nozzles 33b. It Further, the center of the integrated circuit element 32 and the center of the nozzle 33b are arranged on a straight line (the center of the integrated circuit element is referred to as a cross point) so that the wall jet flow after colliding with the integrated circuit element 32 is uniform. The surface of the integrated circuit element 32 is moved to prevent the cooling variations from occurring at both ends of the integrated circuit element 32.

[Problems to be solved by the device]

However, in the conventional cooling structure, the cold air jetted from the nozzle projecting toward the integrated circuit element collides with the surface of the integrated circuit element and then radially moves on the surface of the integrated circuit element as a wall jet. , Reflection at the time of collision causes separation of the flow at the end, and the flow velocity of the wall jet decreases as the distance from the crossing point increases (see Fig. 4), and eventually the thermal conductivity near both ends of the integrated circuit element. There was a problem that it decreased. Assuming that the thermal conductivity of the end portion is higher than the specified value, the problem can be solved by increasing the speed of the jet flow, but this causes problems such as enlargement of the cooling device, noise, and high cost. .

An object of the present invention is to solve such a problem and to improve the cooling capacity at a low cost.

[Means for Solving the Problems]

In the cooling structure of an integrated circuit element, which is obtained by cooling the integrated circuit element by injecting cool air from a nozzle to the integrated circuit element mounted on a substrate, the above-mentioned object is A cooling structure for an integrated circuit element, characterized in that a direction plate for suppressing reflection is formed at one end of the nozzle on the integrated circuit element side.

[Action]

With the above structure, in the present invention, the reflection of the cool air that has collided with the surface of the integrated circuit element is suppressed by the direction plate attached to the tip of the nozzle to restrict the flow of the cool air, and even in the vicinity of the end of the integrated circuit element. , Flow separation becomes difficult to occur. Therefore, the flow velocity of the wall jet flow is not attenuated even if it is separated from the branch point (see FIG. 2), so that the thermal conductivity of both ends of the integrated circuit element is improved.

〔Example〕

An embodiment of the present invention will be described in detail below with reference to FIGS. 1 and 2.

FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram for explaining the operation in FIG. 1, showing the relationship between the distance from the cross point and the flow velocity of the wall jet at that time.

Reference numeral 1 is a substrate, 2 is an integrated circuit element, 3 is a chamber, 3a is a refrigerant passage, 3b is a nozzle, 3c is a direction plate, F1 is cold air, F2 is a wall jet, and F3 is return cold air.

A plurality of integrated circuit elements 2 are mounted on the substrate 1,
The joint is electrically connected with solder or the like. on the other hand,
In order to cool the integrated circuit element by air cooling above the integrated circuit element, cold air is taken in from the intake fan provided from the left side in FIG. 1, and the cold air F1 passes through the refrigerant passage 3a in the chamber 3. Moving. A nozzle 3b is formed on one side surface of the chamber 3, that is, on the side surface on the integrated circuit element 2 side so as to correspond to the mounting position of the integrated circuit element 2 and to be perpendicular to the surface of the integrated circuit element. Integrated circuit element 2
A direction plate 3c that is substantially parallel to the surface and extends to the end of the integrated circuit element 2 is formed. Refrigerant passage 3a in chamber 3
The cold air F1 passing through is branched from a nozzle 3b provided on one side surface of the cold air F1 and jetted onto the surface of the integrated circuit element 2. At this time, the wall jet colliding with the surface of the integrated circuit element 2 tries to rise upward due to its reflection, but in the present invention, the reflection is suppressed by the direction plate 3c formed at the tip of the nozzle 3b. Therefore, as shown in the action diagram of FIG. 2, the flow velocity of the wall jet flow was abruptly attenuated at the both ends of the integrated circuit element 2 due to the flow separation as shown by the broken line in the related art. By forming a direction plate 3b at the tip of the nozzle 3,
The flow separation can be suppressed, and the attenuation of the flow velocity of the wall jet at the end of the integrated circuit element 2 can be reduced.

Although the direction plate 3c is described as being parallel to the surface of the integrated circuit element 2 in the present embodiment, the direction plate 3c is not limited to this and may be at least inclined to the chamber 3 side.

The wall jet after the collision with the integrated circuit element 2 is the return cold air F3.
Although not shown in the figure, it is exhausted to the outside of the cooling device by an exhaust fan.

[Effect of device]

As described above in detail, in the present invention, the flow velocity of the wall jet flow is not attenuated even if it is separated from the cross point, so that the heat transfer coefficient at the end of the integrated circuit element is improved and the effective heat transfer area is increased. Also, the cooling performance is improved by expanding.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram for explaining the operation in FIG. 1, and is a diagram showing the relationship between the distance from a point and the flow velocity of a wall jet at that time, and FIG. FIG. 4 is a diagram showing a conventional cooling structure, and FIG. 4 is a diagram showing a relationship between a distance from a conventional divergence point and a flow velocity of a wall jet at that time. In the figure, 1 is a substrate, 2 is an integrated circuit element, 3 is a chamber, 3a is a coolant passage, 3b is a nozzle, 3c is a direction plate, F1 is cold air, F2 is a wall jet, and F3 is return cold air.

Claims (1)

[Scope of utility model registration request] 1. An integrated circuit element (2) mounted on a substrate (1), comprising cooling the integrated circuit element (2) by injecting cool air from a nozzle (3b) to the integrated circuit element (2). In the cooling structure, a direction plate (3c) for suppressing reflection of cold air that has collided with the integrated circuit element (2) is formed at one end of the nozzle (3b) on the integrated circuit element (2) side. Cooling structure for integrated circuit devices.