JPH032652U - - Google Patents

Info

Publication number
JPH032652U
JPH032652U JP1989061963U JP6196389U JPH032652U JP H032652 U JPH032652 U JP H032652U JP 1989061963 U JP1989061963 U JP 1989061963U JP 6196389 U JP6196389 U JP 6196389U JP H032652 U JPH032652 U JP H032652U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
cold air
nozzle
cooling structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989061963U
Other languages
Japanese (ja)
Other versions
JPH0727638Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989061963U priority Critical patent/JPH0727638Y2/en
Publication of JPH032652U publication Critical patent/JPH032652U/ja
Application granted granted Critical
Publication of JPH0727638Y2 publication Critical patent/JPH0727638Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す図、第２図は
第１図における作用を説明する、岐点から距離と
その時の壁噴流の流速との関係を示す図、第３図
は従来の冷却構造を示す図、第４図は従来の岐点
からの距離とその時の壁噴流の流速との関係を示
す図である。 図において、１は基板、２は集積回路素子、３
はチヤンバ、３ａは冷媒通路、３ｂはノズル、３
ｃは方向板、Ｆ１は冷風、Ｆ２は壁噴流、Ｆ３は
帰還冷風をそれぞれ示す。 Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a diagram illustrating the effect shown in Fig. 1, and is a diagram showing the relationship between the distance from the turning point and the flow velocity of the wall jet at that time, and Fig. 3 is a diagram of the conventional method. FIG. 4 is a diagram showing the relationship between the distance from the conventional turning point and the flow velocity of the wall jet at that time. In the figure, 1 is a substrate, 2 is an integrated circuit element, and 3 is a substrate.
is a chamber, 3a is a refrigerant passage, 3b is a nozzle, 3
c indicates the direction plate, F1 indicates the cold air, F2 indicates the wall jet, and F3 indicates the return cold air.

Claims (1)

【実用新案登録請求の範囲】 基板１上に実装された集積回路素子２に対して
、ノズル３ｂより冷風を噴射させて該集積回路素
子２を冷却してなる集積回路素子の冷却構造にお
いて、 前記集積回路素子２に衝突した冷風の反射を抑
止する方向板３ｃを前記ノズル３ｂの該集積回路
素子２側一端に形成してなることを特徴とする集
積回路素子の冷却構造。[Claims for Utility Model Registration] A cooling structure for an integrated circuit device in which the integrated circuit device 2 mounted on the substrate 1 is cooled by jetting cold air from a nozzle 3b, comprising: A cooling structure for an integrated circuit device, characterized in that a direction plate 3c for suppressing reflection of cold air that impinges on the integrated circuit device 2 is formed at one end of the nozzle 3b on the integrated circuit device 2 side.
JP1989061963U 1989-05-30 1989-05-30 Cooling structure for integrated circuit devices Expired - Lifetime JPH0727638Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989061963U JPH0727638Y2 (en) 1989-05-30 1989-05-30 Cooling structure for integrated circuit devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989061963U JPH0727638Y2 (en) 1989-05-30 1989-05-30 Cooling structure for integrated circuit devices

Publications (2)

Publication Number Publication Date
JPH032652U true JPH032652U (en) 1991-01-11
JPH0727638Y2 JPH0727638Y2 (en) 1995-06-21

Family

ID=31590687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989061963U Expired - Lifetime JPH0727638Y2 (en) 1989-05-30 1989-05-30 Cooling structure for integrated circuit devices

Country Status (1)

Country Link
JP (1) JPH0727638Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119395A (en) * 2009-12-02 2011-06-16 Fujitsu Telecom Networks Ltd Cooling structure of electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119395A (en) * 2009-12-02 2011-06-16 Fujitsu Telecom Networks Ltd Cooling structure of electronic component

Also Published As

Publication number Publication date
JPH0727638Y2 (en) 1995-06-21

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