JPH07282959A - Heater element - Google Patents
Heater elementInfo
- Publication number
- JPH07282959A JPH07282959A JP6606994A JP6606994A JPH07282959A JP H07282959 A JPH07282959 A JP H07282959A JP 6606994 A JP6606994 A JP 6606994A JP 6606994 A JP6606994 A JP 6606994A JP H07282959 A JPH07282959 A JP H07282959A
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- conductive
- grain
- heating element
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 58
- 239000002245 particle Substances 0.000 claims description 124
- 239000000919 ceramic Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 229910016006 MoSi Inorganic materials 0.000 description 16
- 230000000694 effects Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 238000013329 compounding Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910020968 MoSi2 Inorganic materials 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Landscapes
- Resistance Heating (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はセラミックヒータに関す
るものであり、例えばディーゼルエンジンのセラミック
グロープラグに適用される。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic heater and is applied to, for example, a ceramic glow plug of a diesel engine.
【0002】[0002]
【従来の技術】電気絶縁性のセラミック部材からなる棒
状の基体と、基体の一端部に埋設された電気抵抗体から
なる発熱体と、基体に埋設されるとともに発熱体の両端
に個別に接続された給電用の電極線とを備え、発熱体
が、電気絶縁性のセラミック粉末からなる絶縁性粒部
と、導電性を有する導電性粒部とが互いに分散する焼結
体からなるセラミックヒータが、従来より知られてい
る。2. Description of the Related Art A rod-shaped base made of an electrically insulating ceramic member, a heating element made of an electric resistor embedded in one end of the base, and a heating element embedded in the base and individually connected to both ends of the heating element. And a heating element, wherein the heating element is a ceramic heater made of a sintered body in which insulating particles made of electrically insulating ceramic powder and conductive particles having conductivity are dispersed. Known from the past.
【0003】例えば、本出願人の出願になる特開昭63
ー96883号公報は、絶縁性粒部(Si3 N4 )と導
電性粒部(MoSi2 )からなる混合粉末の粒径を変え
ることにより発熱体と基体とを構成している。すなわ
ち、発熱体は大粒径の絶縁性粒部と小粒径の導電性粒部
とから構成される。このようにすると、絶縁性粒部のま
わりを導電性粒部が包むようにして導電性粒部が連続す
る組織となり、所望の抵抗率が得られる。一方、基体は
ほぼ同粒径の絶縁性粒部と導電性粒部とから構成され
る。このようにすると、導電性粒部が絶縁性粒部により
相互に分断され、絶縁性となる。For example, Japanese Patent Application Laid-Open No. 63-63, filed by the present applicant.
No. 96883 discloses a heating element and a substrate by changing the particle size of a mixed powder composed of insulating particles (Si 3 N 4 ) and conductive particles (MoSi 2 ). That is, the heating element is composed of large-diameter insulating particles and small-sized conductive particles. By doing so, a structure in which the conductive particles are continuous so that the conductive particles are wrapped around the insulating particles and a desired resistivity can be obtained. On the other hand, the substrate is composed of insulating grain portions and conductive grain portions having almost the same grain size. By doing so, the conductive grain portions are separated from each other by the insulating grain portions, and become electrically insulating.
【0004】このように同一材料で発熱体と基体とを構
成することにより、最適条件で一体焼結ができ、線膨張
率差の減少、発熱体と基体との一体化により信頼性が向
上する。また、本出願人の出願になる特開昭64ー61
356号公報は、絶縁性セラミックからなる母材粒子
に、島状に凝集したセラミックからなる添加物粒子を分
散させ、かつ、母材粒子が添加物粒子を個別に囲包し
て、添加物粒子間を分断するセラミック体を提案してい
る。By thus constructing the heating element and the base with the same material, it is possible to perform integral sintering under optimum conditions, reduce the difference in linear expansion coefficient, and improve reliability by integrating the heating element and the base. . In addition, Japanese Patent Application Laid-Open No. 64-61
No. 356, additive particles composed of island-shaped aggregated ceramic additive particles dispersed in insulating ceramic matrix particles, and the matrix particles individually surrounding the additive particles, We propose a ceramic body that divides the space.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、発熱体
の特性は抵抗値と抵抗温度係数(常温時の抵抗値と高温
時の抵抗値の比)で決まるが、上記した特開昭63ー9
6883号公報の構成では、図5に示すように、導電性
粒部の混合比が多いと低抵抗値、高抵抗温度係数とな
り、導電性粒部の混合比が少ないと高抵抗値、低抵抗温
度係数となり、実現可能な発熱体の特性の範囲が限定さ
れるという問題があった。However, the characteristics of the heating element are determined by the resistance value and the resistance temperature coefficient (ratio of the resistance value at room temperature to the resistance value at high temperature).
In the configuration of the 6883 publication, as shown in FIG. 5, when the mixing ratio of the conductive particles is large, the resistance value is low and the temperature coefficient of resistance is high. When the mixing ratio of the conductive particles is small, the resistance value is high and the resistance is low. There is a problem that it becomes a temperature coefficient and limits the range of realizable heating element characteristics.
【0006】すなわち、絶縁性粒部と導電性粒部の混合
比により抵抗値と抵抗温度係数を任意の値に設定するこ
とが極めて困難であり、図5に示す線上の特定の抵抗値
と抵抗温度係数のヒータしか供給できない。ここで、導
電性粒部の配合量と抵抗値、抵抗温度係数との関係につ
いて、以下に説明する。That is, it is extremely difficult to set the resistance value and the temperature coefficient of resistance to arbitrary values depending on the mixing ratio of the insulating particles and the conductive particles, and the specific resistance value and resistance on the line shown in FIG. Only a heater with a temperature coefficient can be supplied. Here, the relationship between the compounding amount of the conductive particle portion, the resistance value, and the temperature coefficient of resistance will be described below.
【0007】発熱体の抵抗値は、導電性粒部自体の固有
抵抗値と導電性粒部間の接触抵抗値とが多数直並列構成
になった合成抵抗値と見做すことができ、導電性粒部の
配列状態の影響を大きく受ける。接触抵抗値は、ヒータ
を焼結後、常温にした時、線膨張係数の大きい導電性粒
部(MoSi2 )と線膨張係数の小さい絶縁性粒部(S
i3 N4 )とよりなる発熱体をミクロ的に見ると、導電
性粒部に引っ張り力が作用するので、常温時の接触抵抗
値はこの状態での値となる。The resistance value of the heating element can be regarded as a combined resistance value in which a large number of specific resistance values of the conductive particles themselves and contact resistance values between the conductive particles are arranged in series and parallel, and It is greatly affected by the arrangement state of the sex grain parts. The contact resistance values of the conductive particles (MoSi 2 ) having a large linear expansion coefficient and the insulating particles (S
A microscopic view of a heating element composed of i 3 N 4 ) causes a tensile force to act on the conductive particles, so that the contact resistance value at room temperature is the value in this state.
【0008】ここで、通電により発熱体が発熱するとこ
の引っ張り力が緩和され、接触性が改善されるので、発
熱時の接触抵抗値が減少すると考えられる。絶縁性粒部
の粒径が大きい程、絶縁性粒部の量が多い程、常温時の
上記引っ張り力が大きくなり、発熱による接触抵抗値の
低下度合いも顕著となると推定される。結局、この種の
発熱体の抵抗温度係数は、発熱による固有抵抗値の上昇
及び接触抵抗値の低下によって決定されることがわか
る。Here, when the heating element generates heat by energization, this tensile force is alleviated and the contact property is improved, so it is considered that the contact resistance value at the time of heat generation is reduced. It is presumed that the larger the particle size of the insulating particles and the larger the amount of the insulating particles, the greater the tensile force at room temperature and the more remarkable the decrease in contact resistance due to heat generation. After all, it can be seen that the temperature coefficient of resistance of this type of heating element is determined by the increase in specific resistance value and the decrease in contact resistance value due to heat generation.
【0009】次に、導電性粒部の量と上記抵抗値の関係
を説明する。導電性粒部の量が増加すると、導電性セラ
ミック体内の導電部の断面積が大きくなり、低抵抗値と
なると考えられる。また、導電性粒部の量が増加する
と、常温時の引っ張り力が小さく、発熱による引っ張り
力の緩和も小さく、導電性粒部自体の固有抵抗値の上昇
の影響を大きく受け、導電性粒部(MoSi2 )自体の
抵抗温度係数に近づいてゆくと考えられる。Next, the relationship between the amount of conductive particles and the resistance value will be described. It is considered that when the amount of the conductive particles increases, the cross-sectional area of the conductive part in the conductive ceramic body increases, resulting in a low resistance value. In addition, when the amount of conductive particles increases, the tensile force at room temperature is small and the relaxation of the tensile force due to heat generation is small, and it is greatly affected by the increase in the specific resistance value of the conductive particles themselves. It is considered that the temperature coefficient of resistance of (MoSi 2 ) itself approaches.
【0010】本発明は上記問題点を鑑みたものであり、
発熱体の抵抗値及び抵抗温度係数の設定が容易なセラミ
ックヒータを提供することを、その目的としている。The present invention has been made in view of the above problems,
It is an object of the present invention to provide a ceramic heater in which the resistance value and resistance temperature coefficient of a heating element can be easily set.
【0011】[0011]
【課題を解決するための手段】本発明の第1の構成は、
大粒径の電気絶縁性セラミック粒体からなる絶縁性大粒
部と、前記絶縁性大粒部よりも粒径が小さくかつ線膨張
率が大きい導電性粒体からなるとともに前記絶縁性大粒
部の間に介在して導電経路を構成する導電性粒部と、前
記絶縁性大粒部よりも小粒径の電気絶縁性セラミック粒
体からなるとともに前記導電経路の間に介在して前記導
電経路の電気抵抗を増大させる絶縁性小粒部とを含む焼
結体からなることを特徴とする発熱体である。The first structure of the present invention is as follows.
Between the insulating large-grain portion and the insulating large-grain portion composed of the large-grain size electrically insulating ceramic granules, and the conductive large-grain portion having a smaller grain diameter and a larger linear expansion coefficient than the insulating large-grain portion. An electrically conductive grain portion that intervenes to form a conductive path and an electrically insulating ceramic grain body having a particle size smaller than that of the insulating large grain portion, and that is interposed between the electrically conductive paths to increase the electrical resistance of the electrically conductive path. A heating element comprising a sintered body including an insulating small grain portion to be increased.
【0012】本発明の第2の構成は、上記第1の構成に
加えて、前記絶縁性小粒部及び前記導電性粒部が、前記
絶縁性大粒部の1/5以下の平均粒径を有する点を特徴
とする。本発明の第3の構成は、上記第1〜第3の構成
に加えて、前記絶縁性小粒部は、導電性粒部の1/3〜
3倍の平均粒径を有する点を特徴とする。In a second structure of the present invention, in addition to the first structure, the insulating small particle portion and the conductive particle portion have an average particle diameter of ⅕ or less of that of the insulating large particle portion. Characterized by points. In the third structure of the present invention, in addition to the above first to third structures, the insulating small particle portion is 1/3 to the conductive particle portion.
It is characterized by having an average particle size of 3 times.
【0013】本発明の第4の構成は、上記第1〜第4の
構成に加えて、前記絶縁性小粒部が、導電性粒部の5〜
200体積%だけ混合される点を特徴とする。本発明の
第5の構成は、上記第1〜第5の構成に加えて、前記絶
縁性大粒部及び絶縁性小粒部が同一素材からなる点を特
徴とする。本発明の第6の構成は、上記第6の構成に加
えて、前記導電性粒部及び前記絶縁性小粒部と同一素材
の導電性粒部及び絶縁性粒部からなる基体と、前記基体
に埋設される上記第1〜第5の構成の前記発熱体と、前
記基体に埋設されるとともに前記発熱体の端部に接続さ
れる高融点金属部材からなる電極線とを備えるセラミッ
クヒータである。According to a fourth structure of the present invention, in addition to the above-mentioned first to fourth structures, the insulating small particle portion is a conductive particle portion of 5 to 5.
It is characterized in that it is mixed by 200% by volume. A fifth structure of the present invention is characterized in that, in addition to the first to fifth structures, the insulating large grain portion and the insulating small grain portion are made of the same material. A sixth structure of the present invention is, in addition to the above-mentioned sixth structure, a base made of conductive particles and insulating particles made of the same material as the conductive particles and the insulating small particles, and a base. It is a ceramic heater provided with the heating element of the said 1st-5th structure embedded, and the electrode wire which is embedded in the said base | substrate and consists of a high melting point metal member connected to the edge part of the said heating element.
【0014】本発明の第7の構成は、前記基体の線膨張
係数をA/℃、前記発熱体2の線膨張係数をB/℃、前
記電極線の線膨張係数をC/℃としたとき、A≦Bで、
かつ、0≦(C−A)≦1.5×10-6の関係を満足す
る点を特徴とする。In a seventh aspect of the present invention, when the linear expansion coefficient of the base is A / ° C., the linear expansion coefficient of the heating element 2 is B / ° C., and the linear expansion coefficient of the electrode wire is C / ° C. , A ≦ B,
Further, it is characterized in that the relation of 0 ≦ (C−A) ≦ 1.5 × 10 −6 is satisfied.
【0015】[0015]
【作用及び発明の効果】本発明の発熱体の第1の構成に
おいて、導電性粒部は電気抵抗体としての導電経路を構
成する。絶縁性大粒部は電気絶縁性であり、導電性粒部
に対するその相対的な増加は上記導電経路の抵抗値の増
加を招く。また、絶縁性大粒部は導電性粒部よりも大粒
径で線膨張率が小さいので、導電経路の抵抗値のうちの
接触抵抗値は発熱とともに減少する。このため、導電性
粒部に対するその相対的な増加は抵抗温度係数を負方向
にシフトさせる。In the first structure of the heating element of the present invention, the conductive particles form a conductive path as an electric resistor. The insulating large grain portion is electrically insulating, and its increase relative to the conductive grain portion causes an increase in the resistance value of the conductive path. Further, since the insulating large grain portion has a larger grain size and a smaller linear expansion coefficient than the conductive grain portion, the contact resistance value of the resistance value of the conductive path decreases with heat generation. Therefore, its relative increase with respect to the conductive particles causes the temperature coefficient of resistance to shift in the negative direction.
【0016】特に本発明では、絶縁性大粒部より小粒径
の絶縁性小粒部が導電性粒部間すなわち導電経路に分散
される。このようにすれば、導電性粒部に対する絶縁性
小粒部の相対的な増加により電気経路の電気抵抗値を大
幅に変化させることができる。一方、絶縁性小粒部は小
粒径であり、この絶縁性小粒部に対してそれに隣接する
導電性粒部に引っ張り応力を付与して絶縁性大粒部と同
様に導電経路の抵抗温度係数を負方向にシフトさせるも
のの、その影響の度合いは電気経路の電気抵抗値の変化
の度合いに比べて格段に小さい。In particular, in the present invention, the insulating small particle portion having a smaller particle size than the insulating large particle portion is dispersed between the conductive particle portions, that is, in the conductive path. By doing so, the electrical resistance value of the electrical path can be significantly changed by the relative increase of the insulating small grain portion with respect to the conductive grain portion. On the other hand, the insulating small-grain portion has a small particle diameter, and a tensile stress is applied to the conductive small-grain portion adjacent to the insulating small-grain portion so that the temperature coefficient of resistance of the conductive path becomes negative as in the insulating large-grain portion. Although it is shifted in the direction, the degree of its influence is much smaller than the degree of change in the electric resistance value of the electric path.
【0017】結局、導電性粒部を基準として絶縁性大粒
部の増減により抵抗温度係数の調整を実施し、更に絶縁
性小粒部の増減により抵抗値の調整を実施することがで
き、発熱体の抵抗温度係数及び抵抗値の調整の自由度が
従来より格段に増大する。図5にこの発熱体のモデル図
を示す。113は導電性粒部、114は絶縁性大粒部、
115は絶縁性小粒部である。After all, the resistance temperature coefficient can be adjusted by increasing or decreasing the insulating large grain portion with respect to the conductive particle portion, and further adjusting the resistance value by increasing or decreasing the insulating small grain portion. The degree of freedom in adjusting the temperature coefficient of resistance and the resistance value is remarkably increased as compared with the conventional one. FIG. 5 shows a model diagram of this heating element. 113 is a conductive grain part, 114 is an insulating large grain part,
Reference numeral 115 is an insulating small grain portion.
【0018】導電性粒部113が絶縁性小粒部115を
囲包し、導電性粒部113及び絶縁性小粒部115が絶
縁性大粒部114を囲包している。絶縁性大粒部の量で
導電性粒部の引っ張り力を変化させ、抵抗温度係数を設
定し、絶縁性小粒部の量で、導電経路の断面積を変化さ
せ、抵抗値の設定することができることがわかる。The conductive grain portion 113 surrounds the insulating small grain portion 115, and the conductive grain portion 113 and the insulating small grain portion 115 surround the insulating large grain portion 114. It is possible to set the resistance value by changing the tensile force of the conductive particles by setting the amount of insulating large particles, setting the temperature coefficient of resistance, and changing the cross-sectional area of the conductive path by the amount of insulating small particles. I understand.
【0019】本発明の第2構成によれば更に、上記効果
を一層良好とすることができる。すなわち、絶縁性小粒
部の平均粒径が上記範囲以上であると、絶縁性小粒部が
導電性粒よりなる導電経路内に分散しないため、狙いの
抵抗値と抵抗温度係数の関係が得られない。また、導電
性粒部の平均粒径が上記範囲以上であると、導電性粒部
が絶縁性大粒部を囲包しにくくなるため、導電経路が形
成されないという不具合が生じる。According to the second structure of the present invention, the above effects can be further improved. That is, when the average particle size of the insulating small particles is more than the above range, the insulating small particles do not disperse in the conductive path formed of the conductive particles, and thus the target resistance value and the temperature coefficient of resistance cannot be obtained. . Further, if the average particle diameter of the conductive particle portion is equal to or more than the above range, it becomes difficult for the conductive particle portion to surround the large insulating particle portion, so that there is a problem that the conductive path is not formed.
【0020】本発明の第3の構成によれば更に、上記効
果を一層良好とすることができる。すなわち、絶縁性小
粒部の平均粒径が上記範囲未満であれば絶縁性小粒部に
導電性粒部が囲まれるような状態となり、導電経路が断
たれてしまうという不具合が生じ、逆に上記範囲を超過
すれば絶縁性小粒部が導電経路内に分散しにくくなるた
め、狙いの抵抗値と抵抗温度係数の関係が得られないと
いう不具合が生じる。According to the third structure of the present invention, the above effects can be further improved. That is, if the average particle size of the insulating small particle portion is less than the above range, the insulating small particle portion is surrounded by the conductive particle portion, which causes a problem that the conductive path is cut off. If the value exceeds the above range, the insulating small particle portions are hard to disperse in the conductive path, so that there is a problem that the target resistance value and the temperature coefficient of resistance cannot be obtained.
【0021】本発明の第4の構成によれば更に、上記効
果を一層良好とすることができる。すなわち、絶縁性小
粒部の体積が上記範囲以上であると、絶縁性小粒部が多
すぎるため、導電経路が断たれてしまうという不具合が
生じる。本発明の第5の構成によれば、発熱体の接合性
が向上するため、信頼性の向上が図れるという作用効果
を奏することができる。According to the fourth structure of the present invention, the above effects can be further improved. That is, when the volume of the insulating small grain portion is equal to or more than the above range, the insulating small grain portion is too much, and the conductive path is broken. According to the fifth configuration of the present invention, since the bondability of the heating element is improved, the operational effect of improving reliability can be achieved.
【0022】本発明の第6の構成によれば、この発熱体
は、この発熱体の絶縁性小粒部及び導電性粒部と同一素
材の絶縁性粒部及び導電性粒部からなり、絶縁性小粒部
が導電経路を遮断する基体に埋設される。このようにす
れば、発熱体と基体との接合性が向上する他、線膨張差
により発生する熱応力の低減が可能という効果も奏する
ことができる。According to the sixth aspect of the present invention, the heating element comprises insulating particles and conductive particles made of the same material as the insulating small particles and the conductive particles of the heating element. The small particles are embedded in the substrate that blocks the conductive path. With this, not only the bondability between the heating element and the base body is improved, but also the thermal stress generated by the difference in linear expansion can be reduced.
【0023】結局、以上の構成により、抵抗値と抵抗温
度係数を広範囲に調節できる。After all, with the above configuration, the resistance value and the temperature coefficient of resistance can be adjusted in a wide range.
【0024】[0024]
【実施例】以下、本発明を具体的実施例により説明す
る。図1は本発明のセラミックヒータ1の実施例を示し
た断面図であり、図2はその要部の拡大図を示す。この
セラミックヒータ1は、円棒状の基体3と、基体3の先
端部に埋設されるU字状の発熱体2と、基体3の基端部
及び中央部に埋設される断面円形の電極線4、5とから
なる。EXAMPLES The present invention will be described below with reference to specific examples. FIG. 1 is a sectional view showing an embodiment of a ceramic heater 1 of the present invention, and FIG. 2 is an enlarged view of a main part thereof. The ceramic heater 1 includes a base 3 having a circular rod shape, a U-shaped heating element 2 embedded in the tip of the base 3, and an electrode wire 4 having a circular cross section embedded in the base end and the center of the base 3. It consists of 5 and 5.
【0025】基体3は、Si3 N4 からなる絶縁性セラ
ミック粉末に、MoSi2 からなる導電体セラミック粉
末を少量分散させた断面円形の絶縁性セラミック焼結体
からなる。発熱体2は、MoSi2 からなる導電体セラ
ミック粉末と、Si3 N4 からなる絶縁性セラミック粉
末とを含む断面円形の導電性セラミック焼結体である。The substrate 3 is made of an insulating ceramic sintered body having a circular cross section in which a small amount of a conductive ceramic powder made of MoSi 2 is dispersed in an insulating ceramic powder made of Si 3 N 4 . The heating element 2 is a conductive ceramic sintered body having a circular cross section containing a conductive ceramic powder made of MoSi 2 and an insulating ceramic powder made of Si 3 N 4 .
【0026】電極線4、5の基端部は基体1の外周に露
出して部分円筒面4c,5cとなっており、それらの先
端部4a,5aは発熱体2の両端面から発熱体2の内部
に埋設されている。電極線4、5は、タングステン、モ
リブデン等の高融点金属またはその合金からなるが、こ
こでは断面円形のタングステン線とされている。部分円
筒面4c,5cの曲率半径は基体3の半径に等しくされ
ている。The base ends of the electrode wires 4 and 5 are exposed at the outer periphery of the base body 1 to form partial cylindrical surfaces 4c and 5c, and their tip portions 4a and 5a extend from both end surfaces of the heating element 2 to the heating element 2. It is buried inside. The electrode wires 4 and 5 are made of a refractory metal such as tungsten or molybdenum or an alloy thereof, but are tungsten wires having a circular cross section here. The radii of curvature of the partial cylindrical surfaces 4c and 5c are made equal to the radius of the base body 3.
【0027】本実施例のセラミックヒータ1をディーゼ
ルエンジンのグロープラグに採用した例を図3に示す。
電極線4、5の部分円筒面4c,5cが露出する基体3
の側面にはニッケルメッキが施されている。金属の中空
パイプ6がこのニッケルメッキ層を介して基体3の中央
部に嵌着、ロウ付けされており、中空パイプ6はセラミ
ックヒータ1を保持するとともに、電極線4の部分円筒
面4cと電気的に接続されている。 中空パイプ6の外
周には図示しないエンジンへの取付けネジ10aを有す
る両端開口筒状の金属ハウジング10の先端部が嵌着、
ロウ付けされている。FIG. 3 shows an example in which the ceramic heater 1 of this embodiment is used in a glow plug of a diesel engine.
Substrate 3 in which the partial cylindrical surfaces 4c and 5c of the electrode wires 4 and 5 are exposed
The sides of the are plated with nickel. A metal hollow pipe 6 is fitted and brazed to the central portion of the base body 3 through this nickel plating layer. The hollow pipe 6 holds the ceramic heater 1 and is electrically connected to the partial cylindrical surface 4c of the electrode wire 4. Connected to each other. On the outer periphery of the hollow pipe 6, a tip end portion of a metal housing 10 having a cylindrical shape with both ends having an attachment screw 10a for mounting on an engine (not shown) is fitted.
It is brazed.
【0028】一方、基体3の基端部に導出された電極線
5の部分円筒面5cには、金属キャップ7がロウ付けさ
れており、金属キャップ7には金属線8の一端が溶接さ
れ、金属線8の他端は中軸9の先端に溶接されている。
中軸9の基端部に形成された雄ネジ部91は図示しない
電源に接続されている。中軸9はハウジング10内に嵌
入されており、中軸9はハウジング10からガラスシー
ル11および絶縁ブッシュ12により電気的に絶縁さ
れ、これらガラスシール11および絶縁ブッシュ12は
雄ネジ部91に螺着されたナット13により固定されて
いる。On the other hand, a metal cap 7 is brazed to the partial cylindrical surface 5c of the electrode wire 5 led out to the base end of the base 3, and one end of the metal wire 8 is welded to the metal cap 7. The other end of the metal wire 8 is welded to the tip of the center shaft 9.
The male screw portion 91 formed at the base end of the center shaft 9 is connected to a power source (not shown). The center shaft 9 is fitted in the housing 10, the center shaft 9 is electrically insulated from the housing 10 by the glass seal 11 and the insulating bush 12, and the glass seal 11 and the insulating bush 12 are screwed to the male screw portion 91. It is fixed by a nut 13.
【0029】このような構成とすることにより、不図示
の電源から中軸9、金属線8、金属キャップ7、電極
5、発熱体2、電極4、中空パイプ6、ハウジング10
を介して図示しないエンジンブロックへ電流が通電可能
となっている。セラミックヒータ1の製造方法について
説明すると、電極線4、5を金型内の所定位置にセット
した状態で発熱体2を射出成形し、次にこの電極線4、
5及び発熱体2の一体物を金型内の所定位置にセットし
た状態で基体3を射出成形した成形品をホットプレスに
より焼結させる。しかるのち、外周を研削して形成す
る。With such a configuration, the power source (not shown), the center shaft 9, the metal wire 8, the metal cap 7, the electrode 5, the heating element 2, the electrode 4, the hollow pipe 6, and the housing 10 are provided.
A current can be passed through an engine block (not shown) via the. Explaining the method of manufacturing the ceramic heater 1, the heating element 2 is injection-molded with the electrode wires 4, 5 set at predetermined positions in the mold, and then the electrode wires 4,
A molded product obtained by injection molding of the base body 3 is sintered with the integrated body 5 and the heating element 2 set at a predetermined position in the mold by hot pressing. After that, the outer periphery is ground to form.
【0030】基体3の拡大模式断面図(モデル図)を図
4に示す。基体3は、導電性粒部111としての平均粒
径1μmのMoSi2 と絶縁性粒部112としての平均
粒径1μmのSi3 N4 との混合粉末に、添加物として
のY2 O3 、Al2 O3 をMoSi2 及びSi3 N4 の
総質量に対して各々3質量%、5質量%添加した混合物
の焼結体であり、MoSi2 粒子がSi3 N4 粒子に取
り囲まれた組織になっている。FIG. 4 shows an enlarged schematic sectional view (model diagram) of the base body 3. The base 3 is a mixed powder of MoSi 2 having an average particle diameter of 1 μm as the conductive particle portion 111 and Si 3 N 4 having an average particle diameter of 1 μm as the insulating particle portion 112, Y 2 O 3 as an additive, A sintered body of a mixture in which Al 2 O 3 is added in an amount of 3% by mass and 5% by mass with respect to the total mass of MoSi 2 and Si 3 N 4 , and a structure in which MoSi 2 particles are surrounded by Si 3 N 4 particles It has become.
【0031】発熱体2の拡大模式断面図(モデル図)を
図5に示す。発熱体2は、導電性粒部113としての平
均粒径1μmのMoSi2 と第1の絶縁性粒部(本発明
でいう絶縁性大粒部)114としての平均粒径17μm
のSi3 N4 と第2の絶縁性粒部(本発明でいう絶縁性
小粒部)115としての平均粒径1μmのSi3 N4 と
の混合粉末に、添加物としてのY2 O3 、Al2 O3を
MoSi2 とSi3 N4 の総質量に対して各々3質量
%、5質量%添加した混合物の焼結体であり、第2の絶
縁性粒部115が導電性粒部113により囲包され、第
1の絶縁性粒部114が第2の絶縁性粒部115及び導
電性粒部113により囲包された構造となっている。An enlarged schematic sectional view (model diagram) of the heating element 2 is shown in FIG. The heating element 2 has MoSi 2 having an average particle diameter of 1 μm as the conductive grain portion 113 and an average particle diameter of 17 μm as the first insulating grain portion (insulating large grain portion in the present invention) 114.
The Si 3 N 4 and the second insulating grain portion the powder mixture the top of the Si 3 N 4 having an average particle diameter of 1μm as (insulating small portion of the present invention) 115, as an additive Y 2 O 3, This is a sintered body of a mixture in which Al 2 O 3 is added in an amount of 3% by mass and 5% by mass with respect to the total mass of MoSi 2 and Si 3 N 4 , respectively, and the second insulating particles 115 are conductive particles 113. The first insulating grain portion 114 is surrounded by the second insulating grain portion 115 and the conductive grain portion 113.
【0032】上記特開昭63ー96883号公報の発熱
体の導電性粒部の重量比率と抵抗値及び抵抗温度係数と
の関係を図6に示す。ここで、抵抗温度係数はこの発熱
体を20℃から900℃まで発熱した時の抵抗値の変化
の比で表してある。材料は図4のモデル図に示したもの
である。図6から、MoSi2 の配合量を増加すると抵
抗値は低下し、抵抗温度係数は増加することがわかる。
例えば、40wt%のMoSi2 は、抵抗値が0.1Ω
で、抵抗温度係数が4.0であり、この発熱体の要求仕
様として、抵抗値が1.0Ω、抵抗温度係数が4.0と
いったヒータは導電性粒部の材質を変更しなければ製造
することができないことが分かる。FIG. 6 shows the relationship between the weight ratio of the conductive particles of the heating element and the resistance value and the temperature coefficient of resistance of JP-A-63-96883. Here, the temperature coefficient of resistance is represented by the ratio of change in resistance value when the heating element is heated from 20 ° C to 900 ° C. The materials are shown in the model diagram of FIG. It can be seen from FIG. 6 that the resistance value decreases and the resistance temperature coefficient increases as the blending amount of MoSi 2 increases.
For example, 40 wt% MoSi 2 has a resistance value of 0.1Ω.
The resistance temperature coefficient is 4.0, and the required specifications of the heating element are such that the heater having a resistance value of 1.0Ω and a resistance temperature coefficient of 4.0 is manufactured unless the material of the conductive particles is changed. I see that I can't do it.
【0033】次に、本実施例の発熱体2について説明す
る。材料は図5のモデル図に示したもので、導電性粒部
113(MoSi2 )の配合量を40wt%一定とし、
残りの60wtを、第1の絶縁性粒部114と第2の絶
縁性粒部115との配合量(wt%)を種々変化させて
製造した発熱体2の抵抗値と抵抗温度係数の関係を図7
に示す。Next, the heating element 2 of this embodiment will be described. The material is the one shown in the model diagram of FIG. 5, and the content of the conductive particles 113 (MoSi 2 ) is kept constant at 40 wt%,
For the remaining 60 wt, the relationship between the resistance value and the resistance temperature coefficient of the heating element 2 manufactured by variously changing the compounding amount (wt%) of the first insulating grain portion 114 and the second insulating grain portion 115 is shown. Figure 7
Shown in.
【0034】図7から、第2の絶縁性粒部115の配合
量が0wt%の時は図6のMoSi 2 が40wt%の値
を示すが、第1の絶縁性粒部114の配合量を減少さ
せ、第2の絶縁性粒部115の配合量を増加させてゆく
と抵抗値は高くなり、抵抗温度係数は若干減少する。そ
して、種々のMoSi2 の配合量にて第2の絶縁性粒部
115の配合量を変えることにより、この関係が成り立
つことを確認した。また、前述の抵抗値が1.0Ωで、
抵抗温度係数が4.0の発熱体2は、MoSi2が45
wt%、第1の絶縁性粒部114が20wt%、第2の
絶縁性粒部115が35wt%で製造することができる
ことも確認できた。From FIG. 7, the composition of the second insulating grain portion 115 is shown.
When the amount is 0 wt%, MoSi in FIG. 2Is a value of 40 wt%
However, the compounding amount of the first insulating grain portion 114 is reduced.
And increase the compounding amount of the second insulating grain portion 115.
And the resistance value increases, and the temperature coefficient of resistance decreases slightly. So
And various MoSi2Second insulating grain part with the compounding amount of
This relationship is established by changing the compounding amount of 115.
I confirmed that. In addition, the resistance value is 1.0Ω,
The heating element 2 having a temperature coefficient of resistance of 4.0 is MoSi2Is 45
wt%, the first insulating grain portion 114 is 20 wt%, the second
The insulating particle portion 115 can be manufactured at 35 wt%.
I was able to confirm that.
【0035】以上、導電性粒部113が平均粒径1μm
のMoSi2 、第1の絶縁性粒部114が平均粒径17
μmのSi3 N4 、第2の絶縁性粒部115が平均粒径
1μmのSi3 N4 の例で述べたが、次に、粒径による
本実施例の効果の変化を試験した結果を表1にて示す。
試験は導電性粒部113と第1の絶縁性粒部114と第
2の絶縁性粒部115との平均粒径を変化させて、図7
に示す本実施例の効果が認められるか否かの確認をし
た。As described above, the conductive particles 113 have an average particle size of 1 μm.
MoSi 2 , the first insulating grain portion 114 has an average grain size of 17
An example in which Si 3 N 4 of μm and the second insulating grain portion 115 is Si 3 N 4 having an average particle size of 1 μm was described. It shows in Table 1.
In the test, the average grain size of the conductive grain portion 113, the first insulating grain portion 114, and the second insulating grain portion 115 was changed, and FIG.
It was confirmed whether or not the effect of this example shown in FIG.
【0036】[0036]
【表1】 [Table 1]
【0037】表1から、導電性粒部113の平均粒径が
1μmにおいて、第1の絶縁性粒部114の平均粒径が
17μmの場合、第2の絶縁性粒部115の平均粒径は
9μm以下で本実施例の効果が認められ、第1の絶縁性
粒部114の平均粒径が9μmの場合、第2の絶縁性粒
部115の平均粒径は5μm以下で本実施例の効果が認
められた。From Table 1, when the average particle size of the conductive particles 113 is 1 μm and the average particle size of the first insulating particles 114 is 17 μm, the average particle size of the second insulating particles 115 is The effect of this example is recognized when the average particle size of the first insulating particles 114 is 9 μm or less, and the average particle size of the second insulating particles 115 is 5 μm or less when the average particle size of the first insulating particles 114 is 9 μm. Was recognized.
【0038】以上の結果から、第2の絶縁性粒部115
は第1の絶縁性粒部114のほぼ1/2以下の粒径なら
ば、本発明の効果が認められることが分かる。また、導
電性粒部113の平均粒径を変化させた試験結果も示し
てあるが、本発明の効果は導電性粒部113の平均粒径
の影響を受けないことも分かる。次に、導電性粒部11
3、第1の絶縁性粒部114、第2の絶縁性粒部115
について、種々の材料で試験したが、導電性粒部113
は導電性を有するならばMoSi2 以外の部材でも本実
施例の効果が得られ、第1の絶縁性粒部114と第2の
絶縁性粒部115は絶縁性を有するならばSi3 N4 以
外の部材でも本実施例の効果が得られることも確認でき
た。From the above results, the second insulating grain portion 115
It is understood that the effect of the present invention can be recognized when the particle diameter is about 1/2 or less of the first insulating particle portion 114. Further, although the test results in which the average particle diameter of the conductive particle portion 113 is changed are also shown, it can be seen that the effect of the present invention is not affected by the average particle diameter of the conductive particle portion 113. Next, the conductive particles 11
3, first insulating grain portion 114, second insulating grain portion 115
Was tested with various materials.
Is conductive, the effect of the present embodiment can be obtained with members other than MoSi 2 , and if the first insulating grain portion 114 and the second insulating grain portion 115 have insulating properties, Si 3 N 4 It was also confirmed that the effects of the present example can be obtained with other members.
【0039】さらに、第1の絶縁性粒部114と第2の
絶縁性粒部115とは異なる素材を用いても同様の効果
が得られた。但し、上記素材選定に際し、要求されるヒ
ータ寿命に対しては、以下の留意が必要である。発熱体
2は通電により高温になるため、基体3と導電性粒部1
3と電極線4、5との間の線膨張係数の差により発生す
る大きな繰り返し熱応力のため、クラックが発生する場
合がある。即ち、基体3と発熱体2との線膨張係数の差
が大きいと、基体3または発熱体にクラックが発生し、
基体3と電極線4、5の線膨張係数の差が大きいと、基
体3にクラックが発生する。これらのクラックは、長時
間の使用において進展し、ヒータとしての機能を果たさ
なくなる。Furthermore, the same effect was obtained even if the first insulating grain portion 114 and the second insulating grain portion 115 were made of different materials. However, the following attention should be paid to the required heater life when selecting the above materials. Since the heating element 2 is heated to a high temperature by energization, the base 3 and the conductive particle portion 1
Cracks may occur due to large repeated thermal stress caused by the difference in linear expansion coefficient between the electrode 3 and the electrode wires 4, 5. That is, if the difference in the linear expansion coefficient between the base 3 and the heating element 2 is large, cracks occur in the base 3 or the heating element,
If the difference in the linear expansion coefficient between the base 3 and the electrode wires 4 and 5 is large, cracks occur in the base 3. These cracks develop during long-term use and fail to function as a heater.
【0040】そこで、基体3と発熱体2と電極線4、5
との線膨張係数を変化させて、クラックの発生状況を試
験した結果、基体3の線膨張係数をA/℃、発熱体2の
線膨張係数をB/℃、電極線4、5の線膨張係数をC/
℃としたとき、A≦Bで、かつ、0≦(C−A)≦1.
5×10-6の関係を満足する必要があることも分かっ
た。Therefore, the substrate 3, the heating element 2, the electrode wires 4, 5
The linear expansion coefficient of the base material 3 was A / ° C., the linear expansion coefficient of the heating element 2 was B / ° C., the linear expansion of the electrode wires 4 and 5 was tested by changing the linear expansion coefficient of Coefficient is C /
C, A ≦ B and 0 ≦ (C−A) ≦ 1.
It was also found that it was necessary to satisfy the relationship of 5 × 10 −6 .
【0041】以上、発熱体2として、導電性セラミック
体の例について述べたが、基体3のグリーンシートを作
成し、そのうえに発熱体2を構成する印刷パターンを形
成し、さらこのグリーンシートに電極線4、5を配し
て、前記のグリーンシートを適当量積層したのちに焼成
し、研削してセラミックヒータを形成する場合において
も、上述の効果と同様の効果が得られることは、言うま
でもない。Although an example of a conductive ceramic body has been described above as the heating element 2, a green sheet of the substrate 3 is formed, and a print pattern constituting the heating element 2 is formed on the green sheet, and the electrode wire is further formed on the green sheet. It goes without saying that the same effects as the above-mentioned effects can be obtained even when 4, 5 are arranged and the above green sheets are laminated in appropriate amounts and then fired and ground to form a ceramic heater.
【図1】本発明のセラミックヒータの一実施例を示す断
面図である。FIG. 1 is a sectional view showing an embodiment of a ceramic heater of the present invention.
【図2】図1のヒータの要部拡大断面図である。FIG. 2 is an enlarged sectional view of a main part of the heater shown in FIG.
【図3】図1のセラミックヒータをセラミックグロープ
ラグに採用した実施例を示した断面図である。FIG. 3 is a cross-sectional view showing an embodiment in which the ceramic heater of FIG. 1 is adopted in a ceramic glow plug.
【図4】基体の一実施例を示すモデル図である。FIG. 4 is a model diagram showing an example of a substrate.
【図5】発熱体の一実施例を示すモデル図である。FIG. 5 is a model diagram showing an example of a heating element.
【図6】特開昭63ー96883号公報の発熱体の導電
性粒部の配合比率と抵抗値、抵抗温度係数の関係を示す
図である。FIG. 6 is a diagram showing the relationship between the blending ratio of the conductive particles of the heating element of JP-A-63-96883, the resistance value, and the temperature coefficient of resistance.
【図7】本実施例の発熱体の配合比率と抵抗値、抵抗温
度係数の関係を示す図である。FIG. 7 is a diagram showing a relationship between a blending ratio of a heating element of the present embodiment, a resistance value, and a temperature coefficient of resistance.
1 セラミックグロープラグ 2 発熱体 3 基体 4 電極線 5 電極線 113 導電性粒部 114 第1の絶縁性粒部(絶縁性大粒部) 115 第2の絶縁性粒部(絶縁性小粒部) DESCRIPTION OF SYMBOLS 1 Ceramic glow plug 2 Heating element 3 Base material 4 Electrode wire 5 Electrode wire 113 Conductive grain part 114 First insulating grain part (insulating large grain part) 115 Second insulating grain part (insulating small grain part)
Claims (6)
る絶縁性大粒部と、前記絶縁性大粒部よりも粒径が小さ
くかつ線膨張率が大きい導電性粒体からなるとともに前
記絶縁性大粒部の間に介在して導電経路を構成する導電
性粒部と、前記絶縁性大粒部よりも小粒径の電気絶縁性
セラミック粒体からなるとともに前記導電経路の間に介
在して前記導電経路の電気抵抗を増大させる絶縁性小粒
部とを含む焼結体からなることを特徴とする発熱体。1. An insulating large grain part made of a large grain size electrically insulating ceramic grain body, and a conductive grain body having a smaller grain size and a larger linear expansion coefficient than the insulating large grain part, and having the insulating property. The conductive particles that are interposed between the large particles to form a conductive path, and the electrically insulating ceramic particles that have a smaller particle size than the insulating large particles, and the conductive particles that are interposed between the conductive paths A heating element comprising a sintered body including an insulating small grain portion that increases electric resistance of a path.
前記絶縁性大粒部の1/5以下の平均粒径を有する請求
項1記載の発熱体。2. The insulating small grain portion and the conductive grain portion are
The heating element according to claim 1, which has an average particle diameter of ⅕ or less of that of the insulating large grain portion.
〜3倍の平均粒径を有する請求項1〜3のいずれかに記
載の発熱体。3. The small insulating particles are 1/3 of the conductive particles.
The heating element according to any one of claims 1 to 3, which has an average particle size of 3 to 3 times.
00体積%だけ混合される請求項1〜4のいずれかに記
載の発熱体。4. The insulating small-grain portion is 5 to 2 of the conductive grain portion.
The heating element according to any one of claims 1 to 4, which is mixed in an amount of 00% by volume.
素材からなる請求項1〜5のいずれかに記載の発熱体。5. The heating element according to claim 1, wherein the insulating large grain portion and the insulating small grain portion are made of the same material.
一素材の導電性粒部及び絶縁性粒部からなる基体と、前
記基体に埋設される請求項1〜5のいずれかに記載の前
記発熱体と、前記基体に埋設されるとともに前記発熱体
の端部に接続される高融点金属部材からなる電極線とを
備えるセラミックヒータ。6. A base body comprising a conductive grain portion and an insulating grain portion made of the same material as that of the conductive grain portion and the insulating small grain portion, and embedded in the base body. 2. A ceramic heater comprising: the heat generating element; and an electrode wire that is embedded in the base body and is connected to an end of the heat generating element and is made of a high melting point metal member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06606994A JP3575624B2 (en) | 1994-04-04 | 1994-04-04 | Heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06606994A JP3575624B2 (en) | 1994-04-04 | 1994-04-04 | Heating element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07282959A true JPH07282959A (en) | 1995-10-27 |
| JP3575624B2 JP3575624B2 (en) | 2004-10-13 |
Family
ID=13305197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06606994A Expired - Lifetime JP3575624B2 (en) | 1994-04-04 | 1994-04-04 | Heating element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3575624B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041052A (en) * | 1996-07-23 | 1998-02-13 | Ube Ind Ltd | Ceramic resistance heating element and method of manufacturing the same |
| JP2008089233A (en) * | 2006-10-02 | 2008-04-17 | Denso Corp | Glow plug |
| WO2014003093A1 (en) * | 2012-06-29 | 2014-01-03 | 京セラ株式会社 | Heater and glow plug equipped with same |
| EP2479496A3 (en) * | 2011-01-25 | 2017-11-15 | NGK Spark Plug Co., Ltd. | Glow plug and method for manufacturing glow plug |
-
1994
- 1994-04-04 JP JP06606994A patent/JP3575624B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041052A (en) * | 1996-07-23 | 1998-02-13 | Ube Ind Ltd | Ceramic resistance heating element and method of manufacturing the same |
| JP2008089233A (en) * | 2006-10-02 | 2008-04-17 | Denso Corp | Glow plug |
| EP2479496A3 (en) * | 2011-01-25 | 2017-11-15 | NGK Spark Plug Co., Ltd. | Glow plug and method for manufacturing glow plug |
| WO2014003093A1 (en) * | 2012-06-29 | 2014-01-03 | 京セラ株式会社 | Heater and glow plug equipped with same |
| CN104396342A (en) * | 2012-06-29 | 2015-03-04 | 京瓷株式会社 | Heater and glow plug equipped with same |
| US10480786B2 (en) | 2012-06-29 | 2019-11-19 | Kyocera Corporation | Heater and glow plug including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3575624B2 (en) | 2004-10-13 |
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