JPH0728366B2 - Reader - Google Patents

Reader

Info

Publication number
JPH0728366B2
JPH0728366B2 JP61129829A JP12982986A JPH0728366B2 JP H0728366 B2 JPH0728366 B2 JP H0728366B2 JP 61129829 A JP61129829 A JP 61129829A JP 12982986 A JP12982986 A JP 12982986A JP H0728366 B2 JPH0728366 B2 JP H0728366B2
Authority
JP
Japan
Prior art keywords
light
substrate
reading device
led chip
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61129829A
Other languages
Japanese (ja)
Other versions
JPS62285569A (en
Inventor
千秋 松山
啓徳 森田
泰夫 西口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP61129829A priority Critical patent/JPH0728366B2/en
Publication of JPS62285569A publication Critical patent/JPS62285569A/en
Publication of JPH0728366B2 publication Critical patent/JPH0728366B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
  • Facsimile Scanning Arrangements (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えばファクシミリ装置の小型化を目指した
もので、実質上原稿と寸法的に1:1に対応させた光電変
換素子アレイを配置して成る密着型イメージセンサなど
の読取り装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is aimed at, for example, miniaturization of a facsimile apparatus, and a photoelectric conversion element array substantially corresponding to an original in a size of 1: 1 is arranged. The present invention relates to a reading device such as a contact image sensor.

〔先行技術及びその問題点〕[Prior art and its problems]

近似、密着型イメージセンサの開発が活発化しており、
このセンサは原稿からの反射光を集束性ロッド・レンズ
・アレイを介して検知する型式や、このアレイを用いな
いでも優れた光量伝達率、小型化を達成した型式なども
開発されている。
The development of approximation and contact type image sensors has been activated,
This sensor has been developed into a type that detects reflected light from a document through a converging rod lens array, and a type that achieves excellent light transmission rate and miniaturization without using this array.

第4図は集束性ロッド・レンズ・アレイを用いない密着
型読取り系を示した概略図であり、原稿1と寸法的に実
質上1:1に対応させた光検知部2が原稿1に密着し、発
光ダイオード3が原稿1を投光し、その反射光を光検知
部2で受光する。
FIG. 4 is a schematic diagram showing a close contact type reading system which does not use a converging rod lens array, in which the light detecting section 2 which is substantially 1: 1 in size with the original 1 comes into close contact with the original 1. Then, the light emitting diode 3 projects the original 1 and the reflected light is received by the photodetector 2.

第5図及び第6図は光検知部2に相当する読取り装置で
あり、第6図は第5図中切断面線X-Xから見た断面図で
ある。
5 and 6 show a reading device corresponding to the light detecting section 2, and FIG. 6 is a sectional view taken along the section line XX in FIG.

即ち、ガラスなどから成る透光性基板4が金属フレーム
などで構成された基板支持体5に付設されており、基板
4上にはCr、Alなどを蒸着して共通電極6a,6b・・・が
形成され、共通電極6a、6b上にはアモルファスシリコン
などから成る光電変換部7が形成され、そして、この光
電変換部7上にはITOなどの透明材料から成る透明電極
8がスパッタリングまたは蒸着によって各々の光電変換
部7に形成される。更に、この透明電極8の一部を覆う
ようにCr、Alなどを蒸着させて引出し電極9が個別的に
接続され、最上部にはガラスなどから成る透明な保護層
10が形成され、また、共通電極6a、6b、光電変換部7及
び透明電極8には光通過孔11が形成される。基板支持体
5の背後には発光ダイオード3が配置される。そして、
保護層10の上方には原稿1が配置され、発光ダイオード
3から投光される光は基板4、光通過孔11及び保護層10
を介して原稿1を照射し、その反射光は光通過孔11付近
の透明電極8を透過し、光電変換部によって受光され
る。また、光通過孔11は原稿1の幅方向(主走査方
向)、即ち、発光ダイオード3の軸線方向に沿って間隔
をあけて配置され、基板4上にはシフトレジスタなどの
駆動回路12が搭載される。
That is, a transparent substrate 4 made of glass or the like is attached to a substrate support 5 made of a metal frame or the like, and Cr, Al, etc. are vapor-deposited on the substrate 4 to form common electrodes 6a, 6b ... Is formed, a photoelectric conversion part 7 made of amorphous silicon or the like is formed on the common electrodes 6a, 6b, and a transparent electrode 8 made of a transparent material such as ITO is formed on the photoelectric conversion part 7 by sputtering or vapor deposition. It is formed in each photoelectric conversion part 7. Further, the extraction electrodes 9 are individually connected by vapor-depositing Cr, Al, etc. so as to cover a part of the transparent electrode 8, and a transparent protective layer made of glass or the like is provided on the uppermost part.
10 is formed, and a light passage hole 11 is formed in the common electrodes 6a and 6b, the photoelectric conversion section 7 and the transparent electrode 8. The light emitting diode 3 is arranged behind the substrate support 5. And
The original 1 is arranged above the protective layer 10, and the light emitted from the light emitting diode 3 is transmitted through the substrate 4, the light passage hole 11 and the protective layer 10.
The original 1 is illuminated via the transparent electrode 8 and the reflected light is transmitted through the transparent electrode 8 near the light passage hole 11 and is received by the photoelectric conversion unit. Further, the light passage holes 11 are arranged at intervals along the width direction (main scanning direction) of the original 1, that is, along the axial direction of the light emitting diode 3, and a drive circuit 12 such as a shift register is mounted on the substrate 4. To be done.

また、第7図は前記発光ダイオード3を示す。即ち、LE
D搭載用基板13上に複数のLEDチップ14が所定の間隔をと
りながらライン状に配列されており、このLEDチップア
レイの上には円柱形状の棒状レンズ15がその円柱の中心
軸がLEDチップアレイと平行に成るようにレンズ支持部
材16によって設置される。この棒状レンズ15はLEDチッ
プ14の照射光を集光させることができるので、原稿1を
その焦点距離付近に位置させると原稿1に対する照度を
著しく高めることができる。
Further, FIG. 7 shows the light emitting diode 3. That is, LE
A plurality of LED chips 14 are arranged in a line on a D mounting substrate 13 with a predetermined interval, and a cylindrical rod lens 15 is located on the LED chip array and the central axis of the cylinder is an LED chip. The lens support member 16 is installed so as to be parallel to the array. Since the rod-shaped lens 15 can collect the irradiation light of the LED chip 14, the illuminance on the original 1 can be remarkably increased when the original 1 is positioned near its focal length.

しかしながら、この読取り装置によれば、原稿1と棒状
レンズ15の間隔を棒状レンズ15のもつ焦点距離(通常約
6mm)の大きさにする必要があり、また、発光ダイオー
ド3の高さは約10mmあり、これにより、光検知部2及び
発光ダイオード3により構成された読取り装置の厚みを
最低約16mmの大きさにする必要があり、その結果、読取
り装置を更に一層小型化することが難しくなっている。
However, according to this reading device, the distance between the original 1 and the rod-shaped lens 15 is equal to the focal length of the rod-shaped lens 15 (usually about
6 mm), and the height of the light emitting diode 3 is about 10 mm, so that the thickness of the reading device composed of the light detecting section 2 and the light emitting diode 3 is at least about 16 mm. As a result, making it even more difficult to miniaturize the reader.

〔発明の目的〕[Object of the Invention]

従って本発明の目的は、LED光源の集光用レンズを用い
ないことによって小型化を達成した読取り装置を提供す
ることにある。
Therefore, it is an object of the present invention to provide a reading device which is downsized by not using a condenser lens of an LED light source.

本発明の他の目的はLED光源の集光用レンズを不要とし
たことによって低コスト化を達成した読取り装置を提供
することにある。
Another object of the present invention is to provide a reading device which achieves cost reduction by eliminating the condenser lens of the LED light source.

〔問題点を解決するための手段〕[Means for solving problems]

本発明によれば、基板の第1板面上に光電変換素子アレ
イを形成し、該基板の第2板面側の該素子アレイと対応
する部位に光源を備え、この光源が第1板面側の被検知
体を投光し、その反射光を光電変換素子アレイが受光
し、この素子アレイから順次時系列に読取り信号が得ら
れるようにした読取り装置において、基板の第2板面側
に長尺状凹部を有する光源支持部材を備えてこの凹部内
に前記光源を配置したことを特徴とする読取り装置が提
供さる。
According to the present invention, a photoelectric conversion element array is formed on a first plate surface of a substrate, and a light source is provided on a portion of the substrate corresponding to the element array on the second plate surface side. In the reading device in which the object to be detected is projected, the reflected light is received by the photoelectric conversion element array, and read signals are sequentially obtained from this element array in time series, on the second plate surface side of the substrate. A reading device is provided, which comprises a light source support member having an elongated recess, and the light source is disposed in the recess.

〔実施例〕〔Example〕

次に本発明の実施例を第1図により説明する。 Next, an embodiment of the present invention will be described with reference to FIG.

第1図は第4図にて示した光検知部に相当する読取り装
置であるが、第5図の切断面線X-Xから見た第6図に代
わる断面図である。尚、第6図と同一箇所には同一符号
が付してある。
1 is a reader corresponding to the photodetector shown in FIG. 4, but is a cross-sectional view taken from the section line XX of FIG. The same parts as those in FIG. 6 are designated by the same reference numerals.

即ち、透光性基板4が金属フレームなどで構成された基
板支持体17に付設されており、基板4上には共通電極6
a、6b・・・、光電変換部7、透明電極8、引出し電極
9及び保護層10が順次形成される。基板支持体17には長
尺状の凹部18が受光素子アレイと実質上平行に形成され
ており、この凹部18の底面に複数のLEDチップ19が所定
の間隔(ピッチ)をとりながら主走査方向に配列されて
いる。基板支持体17にはプリント基板20が付設されてお
り、これが凹部18の底面を成しており、このプリント基
板20にLEDチップ19を駆動するための配線パターンが形
成される。また、プリント基板20にはLEDチップ19が駆
動するのに伴って発生する熱を放出するための放熱用金
属板21が付設される。
That is, the translucent substrate 4 is attached to the substrate support 17 composed of a metal frame or the like, and the common electrode 6 is provided on the substrate 4.
The photoelectric conversion part 7, the transparent electrode 8, the extraction electrode 9, and the protective layer 10 are sequentially formed. A long recess 18 is formed in the substrate support 17 substantially in parallel with the light receiving element array, and a plurality of LED chips 19 are provided on the bottom surface of the recess 18 at a predetermined interval (pitch) in the main scanning direction. Are arranged in. A printed circuit board 20 is attached to the substrate support 17, which forms the bottom surface of the recess 18, and a wiring pattern for driving the LED chip 19 is formed on the printed circuit board 20. Further, the printed board 20 is provided with a heat-dissipating metal plate 21 for radiating heat generated as the LED chip 19 is driven.

この読取り装置によれば、第4図にて示した光検知部2
及び発光ダイオード3が一体化しており、本発明者等の
実験によれば、LEDチップ19と原稿1との間隔を約6mm位
に設定すれば原稿1を十分な明るさで投光することがで
きるのでプリント基板20や放熱用金属板21の厚みを考慮
してもこの読取り装置の全体の厚みを約10mm以下に設定
することが可能となる。
According to this reading device, the light detecting section 2 shown in FIG.
Further, the light emitting diode 3 is integrated, and according to the experiments by the present inventors, if the distance between the LED chip 19 and the manuscript 1 is set to about 6 mm, the manuscript 1 can be projected with sufficient brightness. Therefore, even if the thicknesses of the printed circuit board 20 and the heat-dissipating metal plate 21 are taken into consideration, the total thickness of the reading device can be set to about 10 mm or less.

また、この実施例に用いられた読取り装置を2〜16dot/
mmの解像能力に設定した場合、上記凹部の大きさ及びLE
Dチップのピッチを次の範囲内に設定すればよいことが
本発明者等が行った実験により判明した。
In addition, the reading device used in this embodiment is 2 to 16 dots /
When the resolution is set to mm, the size of the recess and LE
It was found from an experiment conducted by the present inventors that the pitch of the D chip should be set within the following range.

即ち、第1図にて示した凹部の幅wは0.5〜3mm、好適に
は1〜2mmの範囲内に設定するのがよく、この幅wが0.5
mm未満であればLEDチップの実装が困難になり、3mmを越
えると共通電極6a、6b・・・が完全に遮光できなくな
り,迷光が生じる。
That is, the width w of the recess shown in FIG. 1 should be set in the range of 0.5 to 3 mm, preferably 1 to 2 mm.
If it is less than 3 mm, it becomes difficult to mount the LED chip, and if it exceeds 3 mm, the common electrodes 6a, 6b ... Can not be shielded completely and stray light is generated.

また、凹部の深さdは第2図から明らかな通り、その大
きさにより照度に顕著な差が生じる。つまり、図中A、
B及びCはそれぞれdを2.0mm、3.0mm及び5.0mmに設定
した場合についてLEDチップからの距離に対する照度を
示しており、d=2.0mm(A)の場合にはLEDチップの設
置付近で最高の照度を示しているが、LEDチップから離
れるにつれて照度が著しく低減する。これに対して、d
=3.0mm(B)、さらにd=5.0mm(C)とdが大きくな
るのに伴ってLEDチップの設置付近の照度は小さくなる
が、その反面、LEDチップから離れても比較的若干の照
度が維持されている。
Further, as is clear from FIG. 2, the depth d of the concave portion causes a significant difference in illuminance depending on its size. In other words, A in the figure
B and C show the illuminance with respect to the distance from the LED chip when d is set to 2.0 mm, 3.0 mm and 5.0 mm respectively, and when d = 2.0 mm (A), it is the highest near the LED chip installation. Although the illuminance is shown, the illuminance decreases remarkably as the distance from the LED chip increases. On the other hand, d
= 3.0mm (B), and d = 5.0mm (C). As d increases, the illuminance near the LED chip installation decreases, but on the other hand, the illuminance is relatively small even if the LED chip is far away. Has been maintained.

そこで、本発明者等はLEDチップのピッチPを5mmに設定
して上記の通りdを3通りに設定した場合の主走査方向
の照度分布を測定したところ、第3図に示す通りの結果
が得られた。
Then, the inventors of the present invention measured the illuminance distribution in the main scanning direction when the pitch P of the LED chips was set to 5 mm and d was set to 3 ways as described above, and the results shown in FIG. 3 were obtained. Was obtained.

第3図中a、b、cはそれぞれdを2.0mm、3.0mm及び5.
0mmに設定した場合の照度分布であり、図から明らかな
通り、dが大きくなるのに伴って照度は小さくなるが主
走査方向に亘ってムラのない照度分布となる。
In FIG. 3, a, b, and c are d = 2.0 mm, 3.0 mm, and 5.
The illuminance distribution is set to 0 mm, and as is clear from the figure, the illuminance decreases as d increases, but the illuminance distribution is uniform over the main scanning direction.

従って、本発明者等は上述した実験結果に基いて、凹部
の深さdとLEDチップのピッチPをそれぞれ3〜8mm、8m
m以下、好適には深さdを4〜5mm、ピットPを2〜6mm
に設定すればよいことを見出した。深さdが3mm未満で
は照度分布のバラツキが大きくなって受光素子毎に均等
な出力信号強度が得られなくなり、8mmを越えると照度
が小さくなるため受光素子の出力信号強度が小さくな
る。また、LEDチップのピッチPが8mmを越えるとチップ
アレイ自体が有する照度分布のバラツキが顕著になって
受光素子毎に均等な出力信号強度が得られなくなる。
Therefore, based on the above-mentioned experimental results, the present inventors set the depth d of the recess and the pitch P of the LED chip to 3 to 8 mm and 8 m, respectively.
m or less, preferably depth d is 4-5 mm, pit P is 2-6 mm
I found that it should be set to. If the depth d is less than 3 mm, the variation in the illuminance distribution becomes large and uniform output signal intensity cannot be obtained for each light receiving element. If the depth d exceeds 8 mm, the illuminance becomes small and the output signal intensity of the light receiving element becomes small. Further, when the pitch P of the LED chips exceeds 8 mm, the illuminance distribution of the chip array itself is significantly varied, and uniform output signal intensity cannot be obtained for each light receiving element.

〔発明の効果〕〔The invention's effect〕

以上の通り、本発明の読取り装置によれば、LEDアレイ
がもつ棒状レンズ(集光用レンズ)を不要とし、且つLE
Dチップのピッチをある程度の大きさに維持してチップ
の使用量を少なくし、これにより、従来よりも一層小型
化且つ低コスト化が達成された。
As described above, according to the reading device of the present invention, the rod-shaped lens (condensing lens) of the LED array is unnecessary, and
The D chip pitch was maintained at a certain size to reduce the amount of chips used, which resulted in further miniaturization and cost reduction.

また、棒状レンズを備えたLEDアレイを読取り装置に備
えた場合、LEDチップアレイを直線状に正確に配置して
そのチップのすべてを棒状レンズの焦点に設定すること
は現在の量産製造技術上不可能であり、これにより、主
走査方向に対して均等な照度分布が得られない。これに
対して、本発明の読取り装置によれば、棒状レンズを用
いないので正確な焦点合わせが不要となるのでLEDチッ
プアレイの製造が簡略化され、これにより、高品質且つ
高信頼性の読取り装置が提供される。
Further, when the reader is equipped with an LED array having a rod-shaped lens, it is not possible in the current mass production technology to accurately arrange the LED chip array in a straight line and set all the chips at the focus of the rod-shaped lens. It is possible, and as a result, an even illuminance distribution in the main scanning direction cannot be obtained. On the other hand, according to the reading apparatus of the present invention, since the rod-shaped lens is not used, accurate focusing is not required, so that the manufacturing of the LED chip array is simplified, and thus the reading with high quality and high reliability is achieved. A device is provided.

尚、本発明は上記の実施例に限定されるものではなく、
本発明の要旨を逸脱しない範囲において種々の変更、改
良等は何等差支えない。
The present invention is not limited to the above embodiment,
Various changes and improvements may be made without departing from the scope of the present invention.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の読取り装置を示す断面図、第2図は本
実施例に示した凹部の深さに対してLEDチップからの距
離と照度の関係を示す線図、第3図は第2図に示した結
果に基いてLEDチップのチップと照度分布を示す線図、
第4図は読取り装置に係る読取り系を示す概略図、第5
図は従来の読取り装置の斜視図、第6図は第5図中切断
面線X-Xから見た断面図、第7図は従来の読取り装置に
用いられた発光ダイオードを示す概略図である。 1……原稿、2……光検知部 3……発光ダイオード 5、17……基板支持体 14、19……LEDチップ 15……棒状レンズ、18……凹部
FIG. 1 is a cross-sectional view showing the reading device of the present invention, FIG. 2 is a diagram showing the relationship between the distance from the LED chip and the illuminance with respect to the depth of the recess shown in this embodiment, and FIG. Diagram showing LED chip and illuminance distribution based on the results shown in Fig. 2,
FIG. 4 is a schematic view showing a reading system of the reading device, FIG.
FIG. 7 is a perspective view of a conventional reader, FIG. 6 is a sectional view taken along section line XX in FIG. 5, and FIG. 7 is a schematic view showing a light emitting diode used in the conventional reader. 1 ... manuscript, 2 ... light detection part 3 ... light emitting diode 5, 17 ... substrate support 14, 19 ... LED chip 15 ... rod lens, 18 ... recess

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】基板の第1板面上に光電変換素子アレイを
形成し、該基板の第2板面側の該素子アレイと対応する
部位に光源を備え、この光源が第1板面側の被検知体を
投光し、その反射光を光電変換素子アレイが受光し、こ
の素子アレイから順次時系列に読取り信号が得られるよ
うにした読取り装置において、基板の第2板面側に長尺
状凹部を有する光源支持部材を備えてこの凹部内に前記
光源を配置したことを特徴とする読取り装置。
1. A photoelectric conversion element array is formed on a first plate surface of a substrate, and a light source is provided on a portion corresponding to the element array on the second plate surface side of the substrate, and the light source is on the first plate surface side. In the reading device in which the photoelectric conversion element array receives the reflected light and the read signals are sequentially obtained in time series from the element array, the long side is extended to the second plate surface side of the substrate. A reading device comprising a light source support member having a scale-shaped recess, wherein the light source is arranged in the recess.
JP61129829A 1986-06-03 1986-06-03 Reader Expired - Lifetime JPH0728366B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61129829A JPH0728366B2 (en) 1986-06-03 1986-06-03 Reader

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61129829A JPH0728366B2 (en) 1986-06-03 1986-06-03 Reader

Publications (2)

Publication Number Publication Date
JPS62285569A JPS62285569A (en) 1987-12-11
JPH0728366B2 true JPH0728366B2 (en) 1995-03-29

Family

ID=15019254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61129829A Expired - Lifetime JPH0728366B2 (en) 1986-06-03 1986-06-03 Reader

Country Status (1)

Country Link
JP (1) JPH0728366B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328761U (en) * 1989-07-29 1991-03-22
JPH0444759U (en) * 1990-08-22 1992-04-16

Also Published As

Publication number Publication date
JPS62285569A (en) 1987-12-11

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