JPH02202056A - Close contact type image sensor - Google Patents

Abstract

PURPOSE:To further miniaturize a contact image sensor of this design by a method wherein light detecting members forming a light detecting element array and light emitting members forming a light emitting array are mounted on a primary face of a substrate substantially in parallel with each other. CONSTITUTION:A light emitting member 12 and a light detecting member 13 are mounted on a base plate 11. The light emitting member 12 is formed in such a manner that a lower electrode 15, a light emitting layer 16, and an upper electrode 17 are successively formed on an insulating board 14 of continuous length and able to emit light rays in a lengthwise direction. On the other hand, the light detective member 13 is formed in such a manner that a common electrode 19 common to light detecting elements, a photoelectric conversion film 20, and an individual electrode 21 of each element are successively formed in a lengthwise direction on an insulating board 18 of continuous length. And, a protective film 22 is formed on the members 12 and 13 to protect the elements. Light rays radiated from the light emitting member 12 are made to be incident on a manuscript through the intermediary of the protective film 22, and the light rays reflected from the manuscript are detected by the light detective member 13. By this setup, a light detective element array is formed only on one primary surface of a board, so that an image sensor of this design can be made further miniaturized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a contact type image sensor used in facsimiles and the like.

[Prior art and its problems]

When a contact type image sensor is used in a facsimile sensor instead of a conventionally well-known COD, the facsimile itself becomes smaller, and its practical use is therefore rapidly becoming widespread.

The elongated contact type image sensor is arranged in the main scanning direction of the original, and reads in the main scanning direction as well as the moving direction (sub-scanning direction) of the original, thereby reading a two-dimensional image of the original. It becomes possible.

FIG. 2 is a cross section of a known contact type image sensor.

Reference numeral 1 designates a transparent substrate such as glass. On this substrate 1, a common electrode 2 for each light receiving element, a photoelectric conversion film 3, and an individual electrode 4 for each element are sequentially formed. A light passing hole 5 is formed, thereby forming a light receiving element array in the main scanning direction. A protective film 6 is formed to protect this element array, and a document 7 to be read is placed on top of this protective film 6.

Further, a light source support member 8 in which a light source is installed is provided on the other surface of the substrate 1, and a plurality of light emitting elements 10 are arranged at appropriate intervals in the elongated recess 9 of this support member 8. As a result, the light emitted from the light emitting element 10 passes through the light passage hole 5 and is projected onto the document 7, and the reflected light is received by each light receiving element.

However, according to the contact type image sensor having the above configuration, the light emitting element and the light receiving element are arranged on both main surfaces of the transparent substrate 1, which increases the thickness of the sensor itself, which is not yet satisfactory. There was a problem that miniaturization had not been achieved.

In addition, the light passage hole 5 is formed corresponding to each light receiving element, and the manufacturing yield is reduced due to the fine shape thereof.

Therefore, an object of the present invention is to provide a contact type image sensor that is further miniaturized.

Another object of the present invention is to provide a contact image sensor with increased manufacturing yield and reduced manufacturing cost.

[Means for solving problems]

In the contact image sensor of the present invention, a light-emitting member forming a light-emitting element array and a light-receiving member forming a light-receiving element array are mounted on one main surface of a substrate so as to be substantially parallel to the light-emitting element array. It is characterized by

[Function] According to the contact type image sensor having the above configuration, the light emitting and light receiving element arrays are formed on one main surface of the substrate, resulting in further miniaturization, and furthermore, there is no light passage hole as described above. Therefore, manufacturing yield increases.

〔Example〕

The present invention will be explained in detail with reference to FIG.

FIG. 1 is a cross section of the contact type image sensor of the present invention.
Reference numeral 11 denotes a base plate made of glass, ceramics, metal, etc., and a light emitting member 12 and a light receiving member 13 are mounted on this base plate 11. The light-emitting member 12 has a lower electrode 15, a light-emitting layer 16, and an upper electrode 17 sequentially formed on a long insulating substrate 14, and can emit light in the long direction, and corresponds to, for example, an LED, an EL, or a semiconductor laser. do.

On the other hand, according to the light receiving member 13, a common electrode 19 common to each light receiving element is formed on a long insulating substrate 18, a photoelectric conversion film 20 having a PIN junction structure or a heterojunction structure made of amorphous silicon, and an individual photoelectric conversion film 20 for each element. The electrodes 21 are sequentially formed in the longitudinal direction.

The insulating substrates 14 and 18 are made of a glass substrate, a quartz substrate, or a ceramic substrate with high thermal conductivity, and when the light emitting member 12 and the light receiving member 13 are mounted on the base plate 11, each member 12 is attached using an adhesive. .13 insulating substrate 14.
Glue 18.

A protective film 22 is formed on each member 12.13 to protect the device. This protective film 22 weighs 510g.
, SiN, 5iCs resin, [resin + glass], etc.

According to the contact image sensor configured as described above, the light emitting member 1
The light irradiated from 2 is projected onto the original 23 through the protective film 22 , and the reflected light is received by the light receiving member 13 .

〔Effect of the invention〕

As is clear from the above embodiments, the contact type image sensor of the present invention can be further miniaturized because the elements are formed only on one main surface side of the mounting substrate for the light emitting/light receiving element array.

In addition, since there is no need to form light passing holes in the light receiving member, the number of manufacturing steps is reduced, and the fact that the light emitting member and the light receiving member can be formed in separate manufacturing processes eliminates unnecessary manufacturing steps. Yield and manufacturing costs were improved.

Note that the present invention is not limited to the above embodiments,
Various modifications may be made without departing from the gist of the present invention.
There is no difference in any improvements.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of the contact type image sensor of the present invention;
The figure is a cross-sectional view of a conventional contact type image sensor. 11 ・ 12 ・ 13 ・ 14.18 22 ・ 23 ・ Base plate, light emitting member, light receiving member, insulating substrate, protective film, manuscript Patent applicant (663) Kyocera Corporation Representative Kinju Anjo

Claims (1)

[Claims] A contact image sensor characterized in that a light emitting member forming a light emitting element array and a light receiving member forming a light receiving element array substantially parallel to the light emitting element array are mounted on one principal surface of a substrate. .