JPH07287149A - Optical semiconductor module and manufacturing method thereof - Google Patents

Abstract

(57) [Summary] [Objective] To provide an optical semiconductor module capable of obtaining a high optical coupling rate. [Structure] The semiconductor laser device 101 is fixed to the bottom of a light emitting device base 104. Light emitting element base 1
The wall portion 105 of 04 has an opening portion 106 through which the light emitted from the semiconductor laser element 101 passes, and
A smooth surface is formed on the side opposite to the semiconductor laser element 101. The end surface of the first holder 110 can be brought into sliding contact with the smooth surface of the wall portion 105. A second holder 119 is axially slidably inserted into the first holder 110. The aspherical lens 1 is provided inside the second holder 119.
07 is fixed. The light emitted from the semiconductor laser device 101 is condensed by the aspherical lens 107 and coupled to the incident portion of the mounting optical fiber 113. The light emitting element base 104, the first holder 110, and the second holder 119 are fixed so that the coupling efficiency of the light emitted from the semiconductor laser element 101 at the incident portion of the mounting optical fiber 113 is maximized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor module having a light emitting element such as a semiconductor laser or a light emitting diode and a method for manufacturing the same.

[0002]

2. Description of the Related Art A technique for coupling the light of a light emitting element to an optical fiber through a lens is very important in the fields of optical communication and laser therapy. Particularly in the case of optical communication, the core diameter of a single mode optical fiber is as small as about 8 μm, and it is a difficult problem to efficiently couple the light emitted from the light emitting element to the incident portion of the optical fiber. Less than,
A conventional optical semiconductor module will be described.

FIGS. 6 (a) and 6 (b) show, for example, Japanese Patent Laid-Open No.
3 shows a conventional first optical semiconductor module disclosed in Japanese Patent No. 355706, and FIG. 6A is a side sectional view thereof,
FIG. 6B is a sectional view taken along line VI-VI of FIG.

In FIGS. 6A and 6B, 601 is a semiconductor laser element, 602 is a submount made of SiC, and 603 is a stem made of copper. The semiconductor laser device 601 is mounted on the submount 60 by the die bonder.
2 and the submount 602 is fixed on the stem 603 by solder. The stem 603 is fixed to the first base 604 made of copper by soldering. A gold wire (not shown) extends between the semiconductor laser 601 and the package 605 so that a current is supplied to the semiconductor laser element 601 from the outside.

In FIGS. 6A and 6B, reference numeral 606 is an aspherical lens having a numerical aperture of about 0.5 and an object-image distance of about 13 mm, and the aspherical lens 606 has a cylindrical shape made of stainless steel. It is fitted to the lens holder 607. Also, 608 is a second base made of stainless steel, 60
Reference numeral 9 denotes an electronic cooler composed of a Peltier element, and the electronic cooler 608 is fixed in advance inside the package 605 by soldering. The first base 604 and the second base 608 are fixed on the electronic cooler 609 by solder.

The lens holder 607 is fixed on the second base 608 by laser welding, but before being fixed, the aspherical lens 606 and the semiconductor laser element 601 are fixed.
The positions of the aspherical lens 606 are adjusted so that the semiconductor laser element 601 is at the focal position of the aspherical lens 606 while monitoring and with a television camera. At this time, the position can be adjusted only in the X and Z directions shown in FIGS. 6A and 6B. The positioning accuracy in the Y direction depends on the processing accuracy of each component and the accuracy of the solder thickness. The optical isolator 610 is fixed inside the package 605 in advance.

In FIGS. 6 (a) and 6 (b), 611 is a single mode optical fiber for optical communication, and the single mode optical fiber 611 has a cylindrical ferrule 612 made of zirconia and stainless steel whose central axes match each other. It is fixed with high accuracy. The ferrule holder 613 has a rubbing surface between the ferrule holder 613 and the package 605, and also has a hole having a circular cross section so that the ferrule 612 can be inserted while being rubbed. The position of the single mode optical fiber 611 is determined so that the semiconductor laser element 601 is oscillated and the incident amount of the light is maximized. The ferrule holder 613, the package 605, and the ferrule 612 are fixed to each other by laser welding. In addition, 614 is a package 605
, 615 is a light receiving element, and 616 is a light receiving element mount.

FIG. 7 shows, for example, Anritsu Technical, N.
o. FIG. 65 is a side sectional view of a second conventional optical semiconductor module shown in pages 65 and 48-54.

In FIG. 7, 701 is a semiconductor laser device, 702 is a stem made of copper, and the semiconductor laser device 701 has a stem 702 by a die bonder.
The stems 702 are fixed to the copper base 703 by soldering.

In FIG. 7, 704 is an aspherical lens having a numerical aperture of about 0.6 and a focal length on the laser side of about 1 mm, and the aspherical lens 704 is fitted in a lens holder 705. The optical isolator 706 is fixed to the lens holder 705 with its optical axis aligned with the lens holder 705. Butting block 707
Are provided in order to match the distance between the semiconductor laser element 701 and the aspherical lens 704 with the focal length of the aspherical lens 704. The butting block 707 has a front surface (see FIG. 7).
When viewed from the left side), it has a U-shape, and is in contact with the rubbing surface 708 of the lens holder 705 on both the left and right sides and the lower surface.

Therefore, regarding the positioning accuracy in the Z direction, the processing accuracy of the length of the butting block 707, the fitting accuracy of the aspherical lens 704 and the lens holder 705, and the positioning accuracy of the semiconductor laser element 701 and the stem 702 are considered. Determined by the sum. On the other hand, the X and Y directions are adjusted by moving the lens holder 705 while rubbing it against the butting block 707, and then,
The lens holder 705 and the butting block 707 are fixed by laser welding.

The electronic cooler 710 is fixed to the package 709 by solder, and the copper base 703 is fixed to the electronic cooler 710 by solder.

In FIG. 7, reference numeral 711 is a single mode optical fiber for optical communication, and the method for adjusting the position of the single mode optical fiber 711 is the same as that of the conventional first optical semiconductor module. 712 is a cylindrical ferrule made of zirconia and stainless steel, 713
Is a ferrule holder, and 714 is a lid of the package 709.

FIG. 8 is a side sectional view of a conventional third optical semiconductor module disclosed in, for example, Japanese Patent Application Laid-Open No. 3-61927 or Japanese Patent Application Laid-Open No. 55-22968. Unlike the first or second optical semiconductor module described above, the third optical semiconductor module has a cylindrical outer shape, and the electronic cooler is not located immediately below the semiconductor laser device.

In FIG. 8, 801 is a semiconductor laser element, 820 is a stem made of copper, and 821 is a base made of copper or iron. A current is supplied to the semiconductor laser element 801 from a lead wire 803. Reference numeral 805 denotes a spherical lens, and the spherical lens 805 is fixed to a glass plate 826 with a resin, and the glass plate 826 is fixed to the bottom of a cylindrical cap 823 having a bottom. A ring-shaped metal fitting 822 is arranged between the cap 823 and the base 821 so as to rub against both the cap 823 and the base 821, and the metal fitting 822 allows the semiconductor laser element 801 and the ball lens 805 to move relative to each other. Position is X, Y,
Can be adjusted in the Z direction. Reference numeral 824 is a rubbing surface.

A holder 827 is arranged between the optical fiber 814 and the cap 823.
With 27, the relative position of the optical fiber 814 and the cap 823 can be adjusted in the X, Y, and Z directions. In addition, 81
Reference numeral 3 is an optical fiber cover, and 828 is an optical fiber holding base.

[0017]

However, the above-mentioned first to third conventional optical semiconductor modules do not satisfy the required positioning accuracy and the high optical coupling efficiency is stable for the following reasons. Is not enough to get.

A semiconductor laser device 90 as shown in FIG.
1. When the lens 902 and the optical fiber 903 are optically coupled, the relationship between the coupling efficiency of the lens and the amount of displacement when the mutual positions deviate from the optimum position will be described. Incidentally, FIG.
904 is a ferrule.

The full width at half maximum of the emitted light of the semiconductor laser device 901 is about 30 degrees in the Y direction and about 25 degrees in the X direction. The lens 902 is an aspherical lens, and in the lens 902, the numerical aperture on the laser side is about 0.45, the numerical aperture on the fiber side is about 0.1, and the object-image distance at which the highest coupling efficiency is obtained is about. It is 13 mm. If the ideal coupling can be obtained, the coupling efficiency is about 75%. The optical fiber 903 is equivalent to that shown in the conventional first optical semiconductor module.

FIG. 9 shows a state in which the semiconductor laser element 901, the lens 902, and the optical fiber 903 are adjusted to have a positional relationship that maximizes the coupling efficiency.

If the lens 902 is moved from this state, the coupling efficiency is drastically reduced. Maximum coupling efficiency 9
In the case of a standard that is determined to be defective when it drops to 0% (degradation of 0.1 dB), the non-defective product range is about ± 0.3 μm in the X and Y directions and about ± 3 μm in the Z direction. Hereinafter, this non-defective product range is referred to as "original non-defective product range". No matter how highly efficient the lens is, if the above-mentioned positioning accuracy cannot be achieved, the performance cannot be exhibited.

In the conventional first to third optical semiconductor modules, about ± 15 μm in the X and Y directions and ± 15 μm in the Z direction.
Even if the range of non-defective products is relaxed to about 30 μm, the accuracy of the range of non-defective products cannot be satisfied. Hereinafter, the reason will be sequentially described.

First, in the conventional first optical semiconductor module, the positioning accuracy in the Y direction is determined by the semiconductor laser element 601, the submount 602, the stem 603, the first base 604, the lens holder 607 and the second base 6.
08 dimensional tolerance in the thickness direction, center axis alignment accuracy between the aspherical lens 606 and the lens holder 607, the amount of deviation between the external center axis of the aspherical lens 606 and the optical optical axis, and the thickness of the solder material. Depends on. The processing accuracy of copper and stainless steel is generally limited to ± 20 μm. If a processing accuracy higher than this is required, the processing cost will be too high, resulting in a large cost increase of the optical semiconductor module. In addition, the aspherical lens 6
The accuracy of center axis alignment between 06 and lens holder 607 is ±
The limit is about 5 μm. The thickness of the solder material is ± 3
Inevitable variation of about μm. Therefore, when all these dimensional errors are summed, the allowable range of about ± 15 μm in the Y direction is greatly deviated.

Next, according to the second conventional optical semiconductor module, the positioning accuracy in the Z direction is determined by the component tolerance. Specifically, the processing accuracy of the length of the butting block 707 is ± 20 μm at the minimum, and the Z-direction fitting accuracy of the aspherical lens 704 and the lens holder 705 is ± 30.
μm, and the alignment accuracy of the semiconductor laser device 701 and the stem 702 is ± 10 μm. The sum of these dimensional errors is ± 60 μm, which is far outside the allowable range of ± 30 μm in the Z direction.

Next, in the literature showing the third conventional optical semiconductor module, the position of the spherical lens 805 can be adjusted in all X, Y, and Z directions with respect to the semiconductor laser element 801, and the optimum position is determined. Describes that the light output is monitored. Ball lens 805 and semiconductor laser device 801
For precise alignment with the light receiving element for the monitor, the light receiving element with a narrow opening or the optical fiber 8
A monitoring optical fiber having a core diameter equal to or smaller than 14 core diameters should be used.

However, as a result of verification by the present inventors, the positions of the optical fiber for monitoring and the spherical lens 805 are within ± 15 μm in the X and Y directions with respect to the optimum value (ideal focus position), and in the Z direction. If the deviation is within ± 30 μm, how much is the spherical lens 805?
Even if the semiconductor laser element 801 and the semiconductor laser element 801 are precisely aligned, the quality value “90% or more of the maximum coupling efficiency” cannot be satisfied.

However, there is no description related to this in the above document. Further, since the cap 823 is molded by pressing, sufficient processing accuracy cannot be obtained. Therefore, the tolerance of the cap 823 becomes large, and the gap between the cap 823 and the metal fitting 822 becomes about ± 50 μm or more. Therefore, the spherical lens 805 moves when it is fixed by laser welding or the like, and the allowable range of about ± 15 μm in the X and Y directions also largely deviates.

Further, in the case of the above-mentioned component shape, it is difficult to bring the electronic cooler directly below the semiconductor laser element like the conventional first or second optical semiconductor module, so that the temperature is precise. It cannot be used when control is required or when cooling a device that generates a large amount of heat.

To summarize and explain the above problems, according to the lens positioning method that depends on the dimensional accuracy of the parts, as in the conventional first or second optical semiconductor module,
It is extremely difficult to satisfy the required position accuracy. Further, in the method of monitoring the coupling efficiency as in the conventional third optical semiconductor module, according to the verification by the present inventors, the positional relationship between the lens and the monitor light receiving component must be precisely determined in advance. However, in the conventional third optical semiconductor module described above, such a device is not made, and high optical coupling efficiency cannot be obtained.

In view of the above, an object of the present invention is to provide an optical semiconductor module which can obtain a high optical coupling rate and a manufacturing method thereof.

[0031]

According to a first aspect of the present invention, there is provided an optical semiconductor module comprising a light emitting element, a bottom portion and a wall portion perpendicular to the bottom portion. An opening for holding the light emitting element, an opening through which light emitted from the light emitting element passes is formed in the wall portion, and a light emitting element base having a smooth surface on the opposite side of the wall portion from the light emitting element; A tubular first holder having an end face slidable with the smooth surface of the wall portion; a tubular second holder inserted axially slidably into the first holder; A lens that is held inside the second holder and that collects the light that has passed through the opening, and an optical fiber that has an incident portion at a position where the light collected by the lens is combined, The light emitting element base and the first ho And the first holder and the second holder are fixed in such a manner that the coupling efficiency of the light emitted from the light emitting element at the incident portion of the optical fiber is maximized. .

According to a second aspect of the present invention, in addition to the structure of the first aspect, the bottom surface of the bottom of the light emitting element base is formed to be flat so as to come into contact with the electronic cooler in a large area. .

According to a third aspect of the present invention, in addition to the configuration of the first aspect, the gap between the inner surface of the first holder and the outer surface of the second holder is about 10 μm.

According to a fourth aspect of the present invention, in the structure of the first aspect, a cylindrical optical fiber holder holding the end portion of the optical fiber therein and an optical axis of light emitted from the light emitting element are provided. The optical fiber base further has an opening through which the light emitted from the light emitting element passes and which is fixed to the optical fiber holder, and the optical fiber base is fixed to the light emitting element base. It adds a configuration that is.

According to a fifth aspect of the present invention, in the structure of the fourth aspect, the optical fiber base includes a bottom portion on which an optical isolator can be placed and a wall portion perpendicular to the bottom portion, and the opening of the optical fiber base. The part is formed on the wall of the optical fiber base, and the bottom surface of the optical fiber base is flattened so as to contact the electronic cooler in a large area.

According to a sixth aspect of the present invention, there is provided a solution means, in which an optical semiconductor module includes a light emitting element, a bottom portion and a wall portion perpendicular to the bottom portion, and the light emitting element is held on the surface of the bottom portion. An opening through which the light emitted from the light emitting element passes is formed in the wall portion, a light emitting element base having a smooth surface on the opposite side of the wall portion from the light emitting element, and light passing through the opening portion A lens that collects light, a cylindrical portion that holds the lens inside and is inserted into the opening, and a slidable contact with the smooth surface of the wall that is provided so as to project from the outer surface of the cylindrical portion. A lens holder including a jaw having a possible smooth surface, and an optical fiber having an incident portion at a position where light condensed by the lens is combined, and the light emitting element base and the lens holder are , The above It is an arrangement that the coupling efficiency at the incident portion of the optical fiber of the light emitted from the optical device is fixed in a state of maximum.

According to a seventh aspect of the present invention, in addition to the configuration of the sixth aspect, the bottom surface of the bottom of the light emitting element base is formed flat so as to come into contact with the electronic cooler in a wide area. .

According to an eighth aspect of the present invention, in the structure of the sixth aspect, a cylindrical optical fiber holder that holds the optical fiber inside and a vertical optical axis of the light emitted from the light emitting element are provided. And an optical fiber base having an opening through which the light emitted from the light emitting element passes, the optical fiber holder being fixed,
The optical fiber base is added to the light emitting element base.

According to a ninth aspect of the present invention, in the structure of the eighth aspect, the optical fiber base comprises a bottom portion on which an optical isolator can be placed and a wall portion perpendicular to the bottom portion, and the opening of the optical fiber base. The part is formed on the wall of the optical fiber base, and the bottom surface of the optical fiber base is flattened so as to contact the electronic cooler in a large area.

In the method of manufacturing an optical semiconductor module according to the present invention, it was found that if the optical fiber position is readjusted to maximize the coupling efficiency in the state where the lens is displaced, the range of non-defective products expands. It was made based on. Conventionally, the position of the optical fiber is adjusted after the lens position is determined, and the light emitting element, the lens, and the optical fiber are fixed in this state, but the present invention determines the lens position precisely and then fixes the light emitting element and the lens. After that, the optimum position of the optical fiber is searched and the optical fiber is fixed to the lens in this state.

FIG. 1 shows the relationship between the displacement of the lens and the coupling efficiency. In this case, the non-defective product range is about ± 15 μm in the X and Y directions and about ± 30 μm in the Z direction (hereinafter, this non-defective product range is referred to as “improved non-defective product range”). Of course, these values will change with different lenses and optical fibers. Generally NA (numerical aperture)
The larger the lens, the narrower the range of non-defective products.
As a recent trend, in order to obtain higher coupling efficiency, NA
However, it is becoming common knowledge to use a lens of 0.5 or more. For this reason, the range of original non-defective products is expected to gradually narrow.

However, according to the solution principle of the present invention, "after the lens position is precisely determined, the light emitting element and the lens are fixed, then the optimum position of the optical fiber is searched, and the optical fiber is fixed to the lens in this state. According to the method, the result that the improved non-defective product range is 50 times larger in the X and Y directions and 10 times larger in the Z direction than the original non-defective product range is unchanged.

Specifically, the means for solving the problems according to the tenth aspect of the invention is to use the method for manufacturing an optical semiconductor module for aligning a lens held by a lens holder in a state where the maximum optical coupling efficiency is obtained. A first step of temporarily fixing an optical fiber holder for aligning holding an optical fiber to the lens holder to obtain a composite part including the lens holder and the optical fiber holder for aligning, and the lens being held by a base. And a second step of arranging the composite component so as to face the emitting portion of the light emitting element, and emitting the light from the light emitting element and guiding the emitted light to the incident portion of the optical fiber for alignment, A third step of moving the composite component three-dimensionally with respect to the light emitting element so that the amount of light incident on the core optical fiber is maximized; A fourth step of fixing the lens holder to the base in a state in which the amount of light incident on the aver is maximum, a fifth step of removing the optical fiber holder for alignment from the lens holder, and a step of removing the light emitting element from the light emitting element. The mounting optical fiber holder is configured to emit light and guide the emitted light to the incident portion of the mounting optical fiber held by the mounting optical fiber holder so that the amount of light incident on the mounting optical fiber is maximized. A sixth step of three-dimensionally moving with respect to the light emitting element, and a seventh step of fixing the mounting optical fiber holder to the lens holder in a state where the amount of light incident on the mounting optical fiber is maximized. Is provided.

The invention of claim 11 is the addition of the structure of claim 10 in which the core diameter of the optical fiber for alignment is equal to or smaller than the core diameter of the optical fiber for mounting.

According to a twelfth aspect of the invention, in the structure of the tenth aspect, the base in the second step has a wall portion perpendicular to the optical axis of the light emitted from the light emitting element held by the base. The fourth step is to add a configuration including a step of fixing the lens holder to the wall portion of the base.

According to a thirteenth aspect of the invention, the optical semiconductor module is arranged such that the optical semiconductor module holds the optical fiber for centering while the maximum optical coupling efficiency is obtained with respect to the lens held by the lens holder. First step of temporarily fixing the optical fiber holder for the lens to the lens holder to obtain a composite component including the lens holder and the optical fiber holder for alignment, and an optical axis of light emitted from the light emitting element. And hold it on the base with a vertical wall,
A second step of arranging the composite component so that the lens faces the emitting portion of the light emitting element held by the base and the lens holder contacts the wall portion; and emitting light from the light emitting element. The emitted light is guided to the incident part of the alignment optical fiber, and the composite component is perpendicular to the optical axis of the light emitted from the light emitting element so that the amount of light incident on the alignment optical fiber is maximized. 2 in the plane
A third step of moving dimensionally, a fourth step of fixing the lens holder to the base in a state where the amount of light incident on the optical fiber for alignment is maximized, and the optical fiber holder for alignment. Fifth step of removing from the lens holder, and light to be emitted from the light emitting element and to guide the emitted light to an incident portion of the mounting optical fiber held by the mounting optical fiber holder to enter the mounting optical fiber. The third step of moving the mounting optical fiber holder three-dimensionally with respect to the light emitting element so that the amount of light of the mounting optical fiber is maximized, and the incident portion of the mounting optical fiber is positioned at the focal point of the lens. And a seventh step of fixing the mounting optical fiber holder to the lens holder.

According to a fourteenth aspect of the present invention, in addition to the configuration of the thirteenth aspect, the core diameter of the alignment optical fiber is equal to or smaller than the core diameter of the mounting optical fiber.

[0048]

According to the structure of claim 1, since the end surface of the first holder can be slidably contacted with the smooth surface of the wall portion of the light emitting element base, the first holder holding the second holder and thus the lens.
By sliding the end surface of the holder on the smooth surface of the wall of the light emitting element base, the lens can be moved two-dimensionally in a plane perpendicular to the optical axis of the light emitted from the light emitting element. . Further, since the second holder holding the lens is slidably inserted in the first holder in the axial direction, the first holder and the second holder are relatively moved in the axial direction. By moving the lens, the lens can be moved in the direction of the optical axis of the light emitted from the light emitting element. With these, the lens can be moved three-dimensionally with respect to the light emitting element.

According to the second or seventh aspect of the invention, since the bottom surface of the bottom of the light emitting element base is formed flat so as to come into contact with the electronic cooler in a large area, the light emitting element base and the electronic cooler are favorably arranged. Heat exchange is performed.

According to the structure of claim 3, since the gap between the inner surface of the first holder and the outer surface of the second holder is about 10 μm, the relative movement of the first holder and the second holder in the axial direction can be prevented. In addition to smoothing, it is possible to minimize the situation where the axes of the first holder and the second holder deviate from each other when they are fixed by welding or soldering.

According to the structure of claim 4 or 8, the optical fiber holder holding the optical fiber is fixed to the optical fiber base, so that the light emitting element, the lens and the optical fiber are integrated.

According to the fifth or ninth aspect of the invention, the optical fiber base has a bottom portion on which the optical isolator can be placed and the back surface of which is formed flat so as to come into contact with the electronic cooler in a large area. Good heat exchange between the air conditioner and the electronic cooler.

According to the structure of claim 6, the smooth surface of the jaw protruding from the outer surface of the cylindrical portion holding the lens and the smooth surface of the wall portion of the light emitting element base holding the light emitting element are provided. By relatively moving in a sliding contact state, the lens can be moved two-dimensionally in a plane perpendicular to the optical axis of the light emitted from the light emitting element.

According to the structure of claim 10, the composite component is three-dimensionally moved with respect to the light emitting element so that the amount of light emitted from the light emitting element and incident on the optical fiber for alignment becomes maximum, and in this state, When the lens holder holding the lens is fixed to the base holding the light emitting element, the optical axis shifts between the light emitting element and the lens due to welding or soldering, but the light emitted from the light emitting element is incident on the mounting optical fiber. Since the mounting optical fiber holder holding the mounting optical fiber is moved three-dimensionally with respect to the light emitting element so that the amount of light is maximized, the deviation of the optical axis between the light emitting element and the lens is corrected. If the mounting optical fiber holder is fixed to the lens holder in this state, a slight deviation of the optical axis will occur between the lens and the mounting optical fiber. However, this deviation of the optical axis causes deterioration of about 10% of the maximum coupling efficiency. It can be suppressed.

Further, in the composite component, the optical fiber holder for alignment which holds the optical fiber for alignment is temporarily fixed to the lens holder in a state where the maximum optical coupling efficiency is obtained for the lens held by the lens holder. Since the lens and the optical fiber for alignment are moved at the same time when the composite component is moved, in the third step, the lens, that is, the lens holder is simply moved in three directions. A state in which the amount of incident light is maximized is obtained.

According to the eleventh or fourteenth aspect of the present invention, the core diameter of the alignment optical fiber is equal to or smaller than the core diameter of the mounting optical fiber. Therefore, the lens is used as the light emitting element with accuracy higher than the coupling efficiency required for the mounting optical fiber. Can be fixed against.

According to the twelfth aspect, since the base holding the light emitting element has a wall portion perpendicular to the optical axis of the light emitted from the light emitting element, the lens holder should be fixed to the wall portion of the base. With this, the lens holder can be easily fixed to the base.

According to the structure of claim 13, the composite component is arranged in a plane perpendicular to the optical axis of the light emitted from the light emitting element so that the amount of light emitted from the light emitting element and incident on the optical fiber for alignment is maximized. If the lens holder holding the lens is fixed to the base holding the light emitting element in this state after moving two-dimensionally, the optical axis shifts between the light emitting element and the lens due to welding or soldering. Since the mounting optical fiber holder holding the mounting optical fiber is moved three-dimensionally with respect to the light emitting element so that the amount of light emitted from the element and incident on the mounting optical fiber is maximized, the distance between the light emitting element and the lens is increased. The deviation of the optical axis of is corrected. If the mounting optical fiber holder is fixed to the lens holder in this state, a slight deviation of the optical axis will occur between the lens and the mounting optical fiber. However, this deviation of the optical axis causes deterioration of about 10% of the maximum coupling efficiency. It can be suppressed.

Further, in the composite part, the optical fiber holder for alignment which temporarily holds the optical fiber for alignment is temporarily fixed to the lens holder in a state where the maximum optical coupling efficiency is obtained with respect to the lens held by the lens holder. Therefore, when the composite part is moved, the lens and the optical fiber for aligning move simultaneously. Therefore, in the third step, the lens, that is, the lens holder is simply moved in two directions, and the optical fiber for aligning is incident. It is possible to obtain a state in which the amount of light emitted is maximum.

[0060]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first optical semiconductor module according to the present invention and a method of manufacturing the same will be described below with reference to FIGS.

2 and 3, 101 is a semiconductor laser element, 102 is a submount made of SiC, and 103 is a stem made of gold-plated copper.
1 is fixed on the submount 102, and the submount 102 is fixed on the stem 103 by solder.
Reference numeral 104 denotes a first base made of stainless steel.
The bottom surface of the base 104 of is formed flat and
At least the bottom surface of the first base 104 and the contact surface with the stem 103 are covered with gold. The first base 104 has a wall 105 extending vertically upward from its upper surface.
The wall 105 has an opening 106 for passing the laser light emitted from the semiconductor laser element 101.

After adjusting the angle of the stem 103 so that the optical axis of the laser light emitted from the semiconductor laser element 101 is perpendicular to the wall portion 105, the stem 103 is fixed to the first base 104. First base 1 as described above
The bottom surface of 04 is flat and covered with gold so that the bottom surface of the first base 104 contacts with an electronic cooler composed of a Peltier element or the like in a large area and good heat exchange is performed. Is.

In FIGS. 2 and 3, reference numeral 107 denotes an aspherical lens, and the aspherical lens 107 is designed so that the aberration with respect to the oscillation wavelength of the semiconductor laser element 101 is minimized. As a typical value of the aspherical lens 107, the diameter is about 3 mm, and the numerical apertures on the semiconductor laser device side and the optical fiber side are about 0.5 and about 0.
1, the focal length on the semiconductor laser device 101 side is about 1.3 mm, and the focal length on the optical fiber side is about 9 m.
m. Here, the focal length is assumed to be the distance from the end surface of the aspherical lens 107.

In FIGS. 2 and 3, 110 is a cylindrical first holder, 108 is a second holder inserted into the first holder 110, and the aspherical lens 1
07 is accurately fitted into the second holder 108. As this fitting method, the aspherical lens 107 is attached to the second holder 10 while the second holder 108 is heated.
8 and use the difference in coefficient of thermal expansion between the two to fix them when cooled, or to place the second holder 108 in a mold in advance when molding the aspherical lens 107. . By these methods, the positional relationship between the aspherical lens 107 and the second holder 108 and the optical axes of the two are accurately matched. The outer wall surface 109 of the second holder 108 is circular and smooth. Since such a circular shaving process is highly accurate, it is suitable for machining with strict tolerances. However, even if the inner and outer surfaces of the second holder 108 are subjected to planar processing and formed into a rectangular tube shape, the same accuracy can be obtained.

The inner wall surface 111 of the first holder 110 is machined into a smooth circular shape to match the outer wall surface 109 of the first holder 108. The fitting dimension margin between the inner wall surface 111 of the first holder 110 and the outer wall surface 109 of the second holder 108 is usually about ± 20 μm, but if the accuracy is further improved, the fitting dimension margin will be about ± 10 μm. It is possible to As a result, the second holder 108 slides smoothly on the first holder 110. When the second holder 108 has a rectangular tube shape, the first holder 110
If the inner wall surface 111 is formed in a flat shape by wire processing or the like, the same accuracy can be obtained. The end surface 112 of the first holder 110 is formed smoothly and is in contact with the wall portion 105 of the first base 104.

In FIG. 2, reference numeral 113 denotes an alignment optical fiber having a core diameter equal to or smaller than that of the mounting optical fiber. Reference numeral 114 is a cylindrical ferrule having a double structure of stainless steel and zirconia for reinforcing the optical fiber 113 for alignment. The ferrule 114
Since the outer diameter of is 2.5 mm, the supporting cylinder 115 having the same inner diameter as the outer diameter can be fitted into the ferrule 114. The supporting cylinder 115 is made of stainless steel, for example, and can be slightly expanded and contracted in the radial direction. As a method of expansion and contraction, there are methods such as warming and expanding, or notching a part of the circumference and pushing from the outside with a spring.
As a result, the ferrule 114 is held by the supporting cylinder 115 and the centers of the two are accurately aligned by simply inserting the ferrule 114 into the supporting cylinder 115.

A cylindrical spacer 116 having the same outer diameter as the ferrule 114 is fitted in the supporting cylinder 115. The end portion of the second holder 108 on the right side in FIG. 2 is cut so as to have the same outer diameter as the ferrule 114, and the ferrule 114, the spacer 116, and the second holder 108 have no gap between them. And is pushed into the supporting cylinder 115. In this case, the length of the spacer 116 is predetermined so that the optical fiber 116 for alignment is accurately positioned at the focal point of the aspherical lens 107. In order to improve the dimensional accuracy, it is desirable that the spacer 116 be made of ceramic such as zirconia having high processing accuracy. Second holder 108 and spacer 116
Is held only by being inserted into the supporting cylinder 115.

As shown in FIGS. 2 and 3, Z in the optical axis direction
The axis is parallel to the upper surface of the first base 104 and is orthogonal to the optical axis, the X axis, and the direction perpendicular to the upper surface of the first base 104 is the Y axis. The alignment process is performed with the Z-axis direction as the vertical direction.

The steps of aligning and fixing the optical fiber 113 for alignment, the aspherical lens 107 and the semiconductor laser element 101 will be described below with reference to FIG.

First, after fixing the first base 104 to a table (not shown), current is supplied to the semiconductor laser element 101 by the current supply lines 117 and 118. Supporting cylinder 115
Is attached to a precision 3-axis stage for alignment. At this time, the first holder 110 causes the first base 1 to move due to gravity.
It is in contact with the wall 105 of 04.

While the semiconductor laser element 101 is supplied with a constant current for laser oscillation, the optical fiber 113 for alignment is aligned.
The supporting cylinder 115 is moved in the X, Y, and Z directions by the precision triaxial stage so that the amount of incident light is maximized. At this time, the alignment accuracy of the aspherical lens 107 is determined by the accuracy of the precision triaxial stage, but the alignment can be performed within an accuracy of about ± 0.5 μm. Further, since the core diameter of the alignment optical fiber 113 is the same as or smaller than the core diameter of the mounting optical fiber, the positional deviation of the alignment optical fiber 113 with respect to the semiconductor laser element 101 appears sensitively as a change in the light amount. Alignment is possible. The feature of this alignment method is that the alignment of the three bodies including the semiconductor laser element 101, the aspherical lens 107, and the alignment optical fiber 113 is performed, but X, The point is that alignment can be performed by only one movement in the Y and Z directions. This is an optical fiber for alignment 1
This is because it is possible to preliminarily position the light-incident portion 13 at the focal point of the aspherical lens 107. If the insertion method is not adopted, the centering optical fiber 113 must also be centered independently, so that the centering of 3 axes × 3 axes = 9 axes is required, and an enormous amount of time is required.

The aspherical lens 107 and the optical fiber 1 for alignment are maintained while maintaining the above-mentioned three alignments.
If 13 and 13 can be fixed, a value exceeding 90% can be obtained as the final coupling efficiency to the mounting optical fiber. However, the first holder 110 and the second holder 1
When 08 and 08 are laser-welded at the portion 119, the second holder 108 is inclined with respect to the first holder 110 by a maximum amount of the gap between them. Therefore, the first holder 110 and the wall portion 105 of the first base 104 are
There is an inclined gap between and. In this state, the first holder 110 and the wall 105 are laser-welded at the portion 121. In this way, the method of laser welding from the side in a state where the end faces of the mating points are almost in contact with each other is the method of minimizing the deviation. However, since the absolute amount of volume change at the time of condensation at the melting point is different, the position of the aspherical lens 107 is slightly displaced from that at the time of alignment. This deviation amount is the first
The larger the gap between the holder 110 and the second holder 108, the larger the gap. As described with reference to FIG. 1, the amount of deviation in the X and Y directions must be suppressed to about ± 15 μm, so the gap must be suppressed to within about 10 μm.

After fixing the aspherical lens 107 to the semiconductor laser element 101 as described above, the supporting cylinder 115 is removed.

The steps of aligning and fixing the mounting optical fiber 133 and the aspherical lens 107 will be described below with reference to FIG.

In FIG. 3, reference numeral 130 denotes a second base made of stainless steel, and the second base 130 has an opening 131 through which laser light passes. The second base 130 is connected to the first base 1 via the second holder 110.
Laser welded to 04. An optical isolator 132 is fixed on the second base 130. The bottom surface of the second base 130 is flat and covered with gold. Therefore, the bottom surface of the second base 130 is fixed to the electronic cooler composed of a Peltier element or the like in a large area by soldering, and good heat exchange is performed, whereby the temperature of the optical isolator 132 is precisely controlled.

In FIG. 3, reference numeral 134 denotes a cylindrical ferrule for reinforcing the mounting optical fiber 133, and the ferrule 134 has a double structure of stainless steel and zirconia. Reference numeral 135 denotes an optical fiber holder, the inner wall surface 136 of which is processed into a smooth circular shape. Ferrule 134 and optical fiber holder 1
The fitting allowance with 35 is usually about ± 20 μm, but the fitting allowance can be set to about ± 10 μm if the accuracy is further improved. This allows the ferrule 134
Slides smoothly on the optical fiber holder 135.

Similar to the case of the optical fiber 113 for alignment,
Alignment is performed with the Z direction as the vertical direction. The first base 104 is fixed to a table (not shown), and supplies current to the semiconductor laser element 101 through current supply lines 117 and 118. The ferrule 134 is attached to a precision triaxial stage for centering. At this time, the optical fiber holder 135 is in contact with the wall portion 137 of the second base due to gravity.

While mounting a constant current on the semiconductor laser element 101 to cause laser oscillation, the mounting optical fiber 133 is
The precision triaxial stage moves the ferrule 134 in the X, Y, and Z directions so that the amount of incident light is maximized. At this time, the alignment accuracy of the aspherical lens 107 is determined by the accuracy of the precision triaxial stage, but the alignment can be performed within an accuracy of about ± 0.5 μm. As described above, the aspherical lens 107
Has a deviation amount within about ± 10 μm. However,
If the displacement amount is within this range, the displacement can be corrected by aligning the mounting optical fiber 134 as described above, and the position of the mounting optical fiber 133 can be adjusted by laser welding after that. Even if there is a deviation, the deterioration can be suppressed to about 10% of the maximum coupling efficiency. Specifically, a high optical coupling efficiency of about 80% can be obtained.

Even if this first optical semiconductor module is not assembled in a package, if the semiconductor laser element 101 is energized in this state, the characteristics such as the optical output and spectrum by pulse driving can be measured and it is a good product inspection. Is possible. Also, if temporarily fixed on the electronic cooler, characteristics such as optical output and spectrum when a direct current is applied, deterioration evaluation of optical coupling efficiency in a temperature cycle test, and life test can be performed. Coolers can be saved.

In the first optical semiconductor module, the mounting optical fiber 133 and the optical fiber holder 135 are fixed to the second base 131.
Instead of this, it may be attached to the outer wall of the package in which the first optical semiconductor module is installed.

Immediately after the alignment shown in FIG. 2 is completed,
In addition to measuring characteristics such as optical output and spectrum, it is also possible to input analog or digital signals to evaluate dynamic characteristics. In this case, an optical isolator can be inserted in front of the ferrule 114 or in the middle of the mounting optical fiber 113, if necessary.

The second optical semiconductor module and the method for manufacturing the same according to the present invention will be described below with reference to FIGS. 4 and 5.

In FIG. 4A, 201 is a semiconductor laser device, 202 is a SiC submount, and 203 is a gold-plated copper stem.
01 is fixed on the submount 202, and the submount 202 is fixed on the stem 203 by solder. Reference numeral 204 denotes a first base made of stainless steel, and a bottom surface of the first base 204 and a contact surface with the stem 203 are covered with gold. The first base 204 has a wall portion 205 extending vertically upward from its upper surface, and the wall portion 205 has an opening portion 208 through which a lens holder 207 holding an aspherical lens 206 is inserted.
The bottom surface of the first base 204 is flat and covered with gold. For this reason, a large area is brought into contact with the electronic cooler composed of the Peltier element or the like, and good heat exchange is performed.

The aspherical lens 206 is designed so that the aberration is minimized with respect to the oscillation wavelength of the semiconductor laser element 201. As a typical value of the aspherical lens 207, the diameter is about 1.9 mm, and the semiconductor laser device 20
The numerical apertures on the first side and the optical fiber side are about 0.6 and about 0.1, respectively, the focal length on the semiconductor laser element 201 side is about 0.4 mm, and the focal length on the optical fiber side is about 7 m.
m. Here, the focal length is assumed to be the distance from the end surface of the lens.

The aspherical lens lens 206 is fitted with high precision in a state of slightly protruding from the cylindrical lens holder 207 to the semiconductor laser element 201 side. This fitting method is similar to that of the first optical semiconductor module. As a result, the positional relationship between the aspherical lens 206 and the lens holder 207 and the optical axes of both are accurately aligned.

The lens holder 207 has a jaw 210 having a thickness (about 2 mm or more) enough to give the lens holder 207 sufficient rigidity. Therefore, the lens holder 207 is provided with a jaw 210. Does not bend or bend due to welding. Opening 20 of wall 205
There is a gap of about 0.5 mm or more between the lens 8 and the lens holder 207 for aligning in the X and Y directions. The wide smooth end surface 209 of the jaw 210 is the wall 2 of the first base 204.
I am in contact with 05.

As described above, the focal length of the aspherical lens 206 on the semiconductor laser element 201 side is about 0.4 mm.
This is a design value, and may actually be slightly different due to the limit of processing accuracy. When the processing accuracy is low, the focal position may be deviated from the geometrical optical axis of the aspherical lens 206. Therefore, a preliminary experiment can be performed using the same semiconductor laser device and optical fiber to determine the actual focal position. The coordinates of the focus position thus obtained are set to (X1, Y1, Z1).
The origin is the end surface 211 of the aspherical lens 206.

As is clear from FIG. 1, the alignment accuracy between the aspherical lens 206 in the Z direction (optical axis direction) and the semiconductor laser element 201 is allowed to be about ± 30 μm. This is a value that can be sufficiently dealt with by mechanical alignment. Therefore, it becomes possible to explain next.

First, the lens holder 207 is attached to the wall 205.
It is inserted into the opening 208 of the above, and this state is observed from above with a microscope and displayed on the television monitor. Next, the stem 203 to which the semiconductor laser device 201 is fixed is sucked by the vacuum collet and brought onto the first base 204. Using a television monitor, the stem 203 is fixed to the submount 203 by soldering so that the Z coordinate of the end face of the semiconductor laser element 201 matches Z1. By this method, the alignment accuracy of about ± 10 μm can be surely obtained. At this time, at the same time, the angle can be adjusted so that the end face of the semiconductor laser device 201 becomes perpendicular to the optical axis.
Since the adjustment of the X and Y coordinate directions is performed in a later lens alignment step, it may be rough.

In FIG. 4B, reference numeral 212 denotes an optical fiber for alignment having a core diameter equal to or smaller than the core diameter of the optical fiber for mounting, and 213 has a double structure of stainless steel and zirconia to reinforce the optical fiber 212 for alignment. It is a cylindrical ferrule for doing. The ferrule 213
Since the outer diameter of is 2.5 mm, the supporting cylinder 214 having the same inner diameter as the outer diameter can be fitted into the ferrule 213. The supporting cylinder 214 is made of stainless steel, for example, and can be slightly expanded and contracted in the radial direction. As a method of expansion and contraction, there are methods such as warming and expanding, or notching a part of the circumference and pushing from the outside with a spring.
As a result, the ferrule 213 is held by the supporting cylinder 214 and the centers of both are accurately aligned by simply inserting the ferrule 213 into the supporting cylinder 214.

A cylindrical spacer 215 having the same outer diameter as the ferrule 213 is fitted in the supporting cylinder 214. The end portion on the right side of FIG. 4B in the lens holder 207 is cut so as to have the same outer diameter as the ferrule 213, and the ferrule 213, the spacer 215, and the lens holder 207 are arranged so that no gap is formed between them. Are pushed into the supporting cylinder 214. In this case, the length of the spacer 215 is determined in advance so that the alignment optical fiber 212 is accurately positioned at the focal point of the aspherical lens 206. Spacer 215 to improve dimensional accuracy
Is preferably made of ceramic, such as zirconia, which has high processing accuracy. Lens holder 207 and spacer 2
15 is retained only by being inserted into the supporting cylinder 214.

As shown in FIGS. 4A and 4B, the Z axis is in the optical axis direction, the X axis is in the direction parallel to the upper surface of the first base 204 and orthogonal to the optical axis, and the first base 204 is The Y axis is taken in the direction perpendicular to the upper surface. In this case, the alignment need not be performed with the Z-axis direction being the vertical direction.

The steps for aligning and fixing the optical fiber 212 for alignment, the aspherical lens 206, and the semiconductor laser element 201 will be described below with reference to FIG.

First, after fixing the first base 204 to a base (not shown), current is supplied to the semiconductor laser element 201 by the current supply sources 216 and 217. Supporting cylinder 214
Is attached to a precision 3-axis stage for alignment.

An optical fiber 212 for alignment is performed while a constant current is applied to the semiconductor laser element 201 to cause laser oscillation.
The collar 210 is attached to the wall 205 to maximize the amount of light entering.
Supporting cylinder 2 by a precision 3-axis stage while being pressed against
14 is moved in the X and Y directions. At this time, the aspherical lens 2
Although the centering accuracy of 06 is determined by the accuracy of the precision triaxial stage, the centering can be performed within an accuracy of about ± 0.5 μm. Further, since the core diameter of the optical fiber 212 for alignment is the same as or smaller than the core diameter of the optical fiber for mounting, the positional deviation of the optical fiber 212 for alignment with respect to the semiconductor laser element 201 is sensitive to the change of the light quantity, and therefore is precise. Alignment is possible. As with the first optical semiconductor module, despite the alignment of the three bodies including the semiconductor laser element 201, the aspherical lens 206, and the optical fiber 212 for alignment, it is possible to perform X, Y like alignment between the two bodies. Alignment can be performed by only one movement in the Z direction.

The aspherical lens 206 and the optical fiber 2 for alignment are maintained while maintaining the alignment of the above-mentioned three bodies.
If 12 and 12 can be fixed, a value exceeding 90% can be obtained as the final coupling efficiency to the mounting optical fiber. However, the lens holder 207 and the first base 20
When the wall portion 205 of No. 4 and the wall portion 205 of No. 4 are laser-welded at the portion 218, the position of the aspherical lens 206 is slightly displaced from that at the time of alignment due to the volume change at the time of condensation of the molten portion. However,
The lens holder 207 and the wall portion 20 of the first base 204
Since there is no gap between the five cities, the amount of deviation is significantly smaller than that of the first optical semiconductor module.

As described above, the aspherical lens 206
After being fixed to the semiconductor laser element 201, the supporting cylinder 214 is removed.

The steps of aligning and fixing the mounting optical fiber 233 and the aspherical lens 206 will be described below with reference to FIG.

In FIG. 5, reference numeral 230 denotes a second base made of stainless steel, and the second base 230 has an opening 231 through which laser light passes. The second base 230 is laser-welded to the jaw 210 of the lens holder 207. An optical isolator 232 is fixed inside the second base 230. The bottom surface of the second base 230 is flat and covered with gold. Therefore, the bottom surface of the second base 230 is fixed to the electronic cooler composed of a Peltier element or the like by solder in a large area, and good heat exchange is performed, whereby the temperature of the optical isolator 132 is precisely controlled.

In FIG. 5, reference numeral 234 is a cylindrical ferrule for reinforcing the mounting optical fiber 233, and the ferrule 234 has a double structure of stainless steel and zirconia. 235 is an optical fiber holder, the inner wall surface 236 of which is processed into a smooth circular shape. Ferrule 234 and optical fiber holder 23
The fitting allowance with respect to No. 5 is usually about ± 20 μm, but if the accuracy is further improved, the fitting allowance can be set to about ± 10 μm. As a result, the ferrule 234 slides smoothly on the optical fiber holder 235.

Alignment is performed with the Z direction being the vertical direction. The first base 204 is fixed to a table (not shown), and supplies a current to the semiconductor laser element 201 via current supply lines 216 and 217. The ferrule 234 is attached to a precision 3-axis stage for alignment. At this time, the optical fiber holder 235 moves the second base 230 due to gravity.
Is in contact with the end surface 237.

A mounting optical fiber 233 is produced while a constant current is applied to the semiconductor laser element 201 to cause laser oscillation.
The precision triaxial stage moves the ferrule 234 in the X, Y, and Z directions so that the amount of incident light is maximized. At this time, the alignment accuracy of the aspherical lens 206 is determined by the accuracy of the precision triaxial stage, but the alignment can be performed within an accuracy of about ± 0.5 μm. By aligning the mounting optical fiber 233 with respect to the aspherical lens 206 having a slight amount of positional deviation, even if the position of the mounting optical fiber 233 is deviated due to laser welding after that, it is almost the maximum. Coupling efficiency is maintained.

Even if this second optical semiconductor module is not incorporated in the package, if the semiconductor laser element 201 is energized in this state, the characteristics such as the optical output and spectrum by pulse driving can be measured, and the good product inspection can be performed. Is possible. Also, if temporarily fixed on the electronic cooler, characteristics such as optical output and spectrum when a direct current is applied, deterioration evaluation of optical coupling efficiency in temperature cycle test, and life test can be performed. The electronic cooler can be saved.

Although the mounting optical fiber 233 and the optical fiber holder 235 are fixed to the second base 230 in the second optical semiconductor module,
Instead of this, it may be attached to the outer wall of the package in which the first optical semiconductor module is installed.

Immediately after the alignment shown in FIG. 4B is finished, characteristics such as optical output and spectrum can be measured, and analog or digital signals can be input to evaluate dynamic characteristics. In this case, if necessary, ferrule 21
An optical isolator can be inserted in front of No. 3 or in the middle of the optical fiber 212 for alignment.

Further, it goes without saying that the above-described method of aligning the precise lens and the optical fiber can be applied to an optical semiconductor element such as a high-speed LED or a high-speed light-receiving element having a small light incident surface or light emitting surface.

[0107]

According to the optical semiconductor module of the first aspect of the present invention, by moving the first holder and the second holder relative to each other in the axial direction, the lens emits the light emitted from the light emitting element. The lens can be moved in the direction of the optical axis, and the end surface of the first holder is brought into sliding contact with the smooth surface of the wall portion of the light emitting element base, so that the lens is aligned with the optical axis of the light emitted from the light emitting element. On the other hand, the lens can be moved three-dimensionally with respect to the light emitting element because it can be moved two-dimensionally in a plane perpendicular to the lens, so that the lens can be moved to a position where the coupling efficiency of light emitted from the light emitting element is maximized. Can be moved. Also, the base for the light emitting device,
Since the first holder and the second holder are fixed to each other in a state where the coupling efficiency of the light emitted from the light emitting element at the incident portion of the optical fiber is maximized, the light emitted from the light emitting element is coupled to the lens. The efficiency can be improved.

According to the optical semiconductor module of the second or seventh aspect of the present invention, since good heat exchange is performed between the light emitting element base and the electronic cooler, good heat dissipation of the light emitting element can be obtained and at the same time, the light emitting element. The temperature control can be easily performed.

According to the optical semiconductor module of the third aspect of the present invention, the gap between the inner surface of the first holder and the outer surface of the second holder is about 10 μm, so that the first holder and the second holder are separated from each other. The relative movement in the axial direction can be smoothly performed, and a situation in which the axial center of the first holder and the second holder are deviated when they are fixed by welding or solder can be suppressed to the minimum.

According to the optical semiconductor module of the invention of claim 4 or 8, since the light emitting element, the lens and the optical fiber are integrated, the optical fiber base is temporarily fixed to the temperature adjusting means such as an electronic cooler, and the light emitting element. The characteristics of the optical semiconductor module, the temperature cycle test, the life test, and the like can be performed by simply energizing the device. Therefore, conventionally, the light emitting element, the lens, and the electronic cooler are housed in the package, and the above-mentioned inspection, which can be performed only after the work such as the wire bonding and the cap sealing, is performed without the above work. Can be done.

According to the optical semiconductor module of the fifth or ninth aspect of the invention, the optical fiber base has a bottom portion on which the optical isolator can be mounted and whose back surface is formed flat so as to come into contact with the electronic cooler in a large area. Therefore, good heat exchange is performed between the bottom portion and the electronic cooler, so that precise temperature control can be performed on the optical isolator mounted on the bottom portion.

According to the optical semiconductor module of the sixth aspect, the smooth surface of the jaw protruding from the outer surface of the cylindrical portion holding the lens and the wall of the light emitting element base holding the light emitting element. Since the lens can be moved two-dimensionally in a plane perpendicular to the optical axis of the light emitted from the light emitting element, the lens can be moved in a two-dimensional manner by moving the lens relative to the smooth surface of the light emitting element. It is possible to move the lens to a position where the coupling efficiency of the light is maximized. Further, since the light emitting element base, the first holder, and the second holder are fixed to each other in a state where the coupling efficiency of the light emitted from the light emitting element at the incident part of the optical fiber is maximized, the light emitting element is emitted from the light emitting element. The coupling efficiency of the collected light with respect to the lens can be improved.

According to the optical semiconductor module manufacturing method of the tenth aspect of the present invention, the mounting optical fiber holder holding the mounting optical fiber so that the amount of light emitted from the light emitting element and incident on the mounting optical fiber is maximized. Is moved three-dimensionally with respect to the light emitting element, and the mounting optical fiber holder is fixed to the lens holder in this state, so that the deviation of the optical axis between the light emitting element and the lens caused by welding or soldering is corrected. Therefore, the deviation of the optical axis is suppressed to a deterioration of about 10% of the maximum coupling efficiency, and thus high coupling efficiency can be obtained.

Further, when the composite part is moved, the lens and the optical fiber for alignment move at the same time. Therefore, in the third step, the lens, that is, the lens holder is simply moved in three directions to enter the optical fiber for alignment. Since the maximum amount of light can be obtained, it is possible to save the labor of moving the optical fiber for alignment according to the movement of the lens, and to move the lens in three directions and the optical fiber for alignment in three directions. It becomes unnecessary, and the time required for the centering process can be greatly reduced.

Further, before fixing the lens holder to the base in a state where the amount of light emitted from the light emitting element and incident on the optical fiber for alignment is maximized, characteristics such as light output and spectrum of the light emitting element, or signal transmission. By conducting an evaluation test of characteristics and the like, it is possible to save the trouble of performing a characteristic evaluation test of the light emitting element later, and when the light emitting element is found to be defective,
Since the lens can be unfixed, parts are saved.

According to the optical semiconductor module manufacturing method of the invention of claim 11 or 14, the core diameter of the optical fiber for alignment is equal to or smaller than the core diameter of the optical fiber for mounting.
Since the lens can be fixed to the light emitting element with accuracy higher than the coupling efficiency required for the mounting optical fiber, the coupling efficiency with the mounting optical fiber is further improved.

According to the optical semiconductor module manufacturing method of the twelfth aspect of the present invention, since the base holding the light emitting element has the wall portion perpendicular to the optical axis of the light emitted from the light emitting element, the lens holder. By fixing the lens holder to the wall portion of the base, the lens holder can be easily fixed to the base.

According to the optical module manufacturing method of the thirteenth aspect of the present invention, as in the tenth aspect of the present invention, the mounting optical fiber is arranged so that the amount of light emitted from the light emitting element and incident on the mounting optical fiber is maximized. The mounting optical fiber holder is moved three-dimensionally with respect to the light emitting element, and in this state the mounting optical fiber holder is fixed to the lens holder. Therefore, the optical axis generated between the light emitting element and the lens by welding or soldering. Since the deviation of is corrected, high coupling efficiency can be obtained.

Further, when the composite component is moved, the lens and the optical fiber for alignment are moved at the same time. Therefore, in the third step, the lens, that is, the lens holder is simply moved in two directions to enter the optical fiber for alignment. Since the maximum amount of light can be obtained, it is possible to save the labor of moving the optical fiber for alignment according to the movement of the lens, and to move the lens in two directions and the optical fiber for alignment in two directions. It becomes unnecessary, and the time required for the centering process can be greatly reduced.

Further, as in the tenth aspect of the invention, the light output of the light emitting element is fixed before the lens holder is fixed to the base in a state where the amount of light emitted from the light emitting element and incident on the optical fiber for alignment is maximized. It is possible to perform an evaluation test of characteristics such as spectrum and spectrum or signal transfer characteristics.

[Brief description of drawings]

FIG. 1 is a characteristic diagram showing a change in optical coupling efficiency when deterioration of optical coupling efficiency due to displacement of a lens is recovered by readjustment of a position of an optical fiber.

FIG. 2 is a cross-sectional view showing the method of manufacturing the first optical semiconductor module according to the present invention.

FIG. 3 is a cross-sectional view showing a configuration of a first optical semiconductor module according to the present invention and a manufacturing method thereof.

FIG. 4 is a cross-sectional view showing the method of manufacturing the second optical semiconductor module according to the present invention.

FIG. 5 is a cross-sectional view showing a configuration of a second optical semiconductor module according to the present invention and a manufacturing method thereof.

FIG. 6 shows a first conventional semiconductor module, (a)
Is a side sectional view, and (b) is a sectional view taken along line VI-VI in (a).

FIG. 7 is a side sectional view showing a second conventional semiconductor module.

FIG. 8 is a side sectional view showing a third conventional semiconductor module.

FIG. 9 is a schematic configuration diagram for explaining a problem of a conventional semiconductor module.

[Explanation of symbols]

 Reference numeral 101 semiconductor laser device 102 submount 103 stem 104 first base 105 wall portion 106 opening 107 aspherical lens 108 second holder 109 second holder outer wall surface 110 first holder 111 inner wall surface of first holder 112 End Face of First Holder 113 Aligning Optical Fiber 114 Ferrule 115 Supporting Cylinder 116 Spacers 117, 118 Current Supply Line 130 Second Base 131 Opening 132 Optical Isolator 133 Mounting Optical Fiber 134 Ferrule 135 Optical Fiber Holder 136 Optical Fiber Holder Inner wall surface 137 Wall portion of second base 201 Semiconductor laser device 202 Submount 203 Stem 204 First base 205 Wall of first base 206 Aspherical lens 207 Lens ho Dar 208 Opening 209 End face of jaw of lens holder 210 Collar part of lens holder 211 End face of aspherical lens (coordinate origin) 212 Aligning optical fiber 213 ferrule 214 supporting cylinder 215 spacer 216, 217 current supply line 230 second Base 231 Opening 232 Optical isolator 233 Mounting optical fiber 234 Ferrule 235 Optical fiber holder 236 Inner wall surface of optical fiber holder 237 End surface of second base

Claims (14)

[Claims] 1. A light emitting element, a bottom portion and a wall portion perpendicular to the bottom portion. The light emitting element is held on a surface of the bottom portion, and light emitted from the light emitting element passes through the wall portion. A first cylindrical base having an opening formed therein and having a smooth surface on the side of the wall opposite to the light emitting element, and an end surface slidable with the smooth surface of the wall.
Holder, a cylindrical second holder that is slidably inserted in the first holder in the axial direction, and is held inside the second holder, and has passed through the opening. A lens for condensing light, and an optical fiber having an incident portion at a position where the light condensed by the lens is combined are provided, the base for the light emitting element, the first holder, and the first holder. The optical semiconductor module, wherein the second holder and the second holder are fixed in a state in which the coupling efficiency of the light emitted from the light emitting element at the incident portion of the optical fiber is maximized. 2. The back surface of the bottom of the light emitting element base is
The optical semiconductor module according to claim 1, wherein the optical semiconductor module is formed flat so as to come into contact with the electronic cooler over a wide area. 3. The optical semiconductor module according to claim 1, wherein the gap between the inner surface of the first holder and the outer surface of the second holder is about 10 μm. 4. A cylindrical optical fiber holder that holds the end of the optical fiber inside, and is provided perpendicularly to the optical axis of the light emitted from the light emitting element, and emitted from the light emitting element. The optical fiber base further having an opening through which light passes, and the optical fiber holder fixed to the optical fiber base, wherein the optical fiber base is fixed to the light emitting element base. Optical semiconductor module. 5. The optical fiber base comprises a bottom portion on which an optical isolator can be mounted and a wall portion perpendicular to the bottom portion, and the opening portion of the optical fiber base is formed in the wall portion of the optical fiber base. The optical semiconductor module according to claim 4, wherein the bottom surface of the bottom portion of the optical fiber base is formed flat so as to come into contact with the electronic cooler in a large area. 6. A light emitting element, a bottom portion and a wall portion perpendicular to the bottom portion, the light emitting element being held on a surface of the bottom portion, and light emitted from the light emitting element passing through the wall portion. A base for a light emitting element having an opening formed therein and having a smooth surface on the side opposite to the light emitting element in the wall portion, a lens for condensing light passing through the opening, and holding the lens inside A lens holder comprising a tubular portion inserted into the opening, and a jaw portion provided so as to project from the outer surface of the tubular portion and having a smooth surface capable of sliding contact with the smooth surface of the wall portion, An optical fiber having an incident part at a position where light condensed by the lens is coupled is provided, and the light emitting element base and the lens holder are incident parts of the optical fiber of the light emitted from the light emitting element. To The optical semiconductor module takes the coupling efficiency is characterized in that it is fixed in a state of maximum. 7. The bottom surface of the bottom of the light emitting element base is
The optical semiconductor module according to claim 6, wherein the optical semiconductor module is formed flat so as to come into contact with the electronic cooler over a wide area. 8. A cylindrical optical fiber holder that holds the optical fiber therein, and a light emitted from the light emitting element that is provided perpendicular to an optical axis of the light emitted from the light emitting element. The optical semiconductor according to claim 6, further comprising: an optical fiber base to which the optical fiber holder is fixed, the optical fiber base being fixed to the light emitting element base. module. 9. The optical fiber base comprises a bottom portion on which an optical isolator can be mounted and a wall portion perpendicular to the bottom portion, and the opening of the optical fiber base is formed in the wall portion of the optical fiber base. 9. The optical semiconductor module according to claim 8, wherein the bottom surface of the bottom of the optical fiber base is formed flat so as to come into contact with the electronic cooler over a wide area. 10. The optical fiber holder for alignment which holds the optical fiber for alignment is temporarily fixed to the lens holder in a state where the maximum optical coupling efficiency is obtained with respect to the lens held by the lens holder, and the lens A first step of obtaining a composite component including a holder and the optical fiber holder for alignment, and a second step of arranging the composite component so that the lens faces the emitting portion of the light emitting element held by the base. And emitting the light from the light emitting element and guiding the emitted light to the incident portion of the optical fiber for alignment, and causing the composite component to emit the light so that the amount of light incident on the optical fiber for alignment is maximized. The third step of moving the lens holder three-dimensionally with respect to the element, and the lens holder in the state where the amount of light incident on the optical fiber for alignment becomes maximum. A fourth step of fixing the optical fiber holder to the optical fiber holder, a fifth step of removing the optical fiber holder for alignment from the lens holder, and a step of emitting light from the light emitting element and holding the emitted light in a mounting optical fiber holder. A sixth step of moving the mounting optical fiber holder three-dimensionally with respect to the light emitting element so as to maximize the amount of light incident on the mounting optical fiber and entering the mounting optical fiber; A seventh step of fixing the mounting optical fiber holder to the lens holder in a state in which the amount of light incident on the mounting optical fiber is maximized, and a seventh step of manufacturing the optical semiconductor module. 11. The core diameter of the optical fiber for alignment is
The optical semiconductor module manufacturing method according to claim 10, wherein the core diameter of the mounting optical fiber is equal to or less than the core diameter. 12. The base in the second step has a wall portion perpendicular to the optical axis of the light emitted from the light emitting element held by the base, and the fourth step is the lens holder. 11. The step of fixing a to a wall portion of the base is included.
A method for manufacturing an optical semiconductor module according to item 1. 13. The optical fiber holder for alignment which holds the optical fiber for alignment is temporarily fixed to the lens holder in a state where the maximum optical coupling efficiency is obtained for the lens held by the lens holder, and the lens A first step of obtaining a composite component comprising a holder and the optical fiber holder for alignment; holding a light emitting element on a base having a wall portion perpendicular to an optical axis of light emitted from the light emitting element, A second step of arranging the composite component so that the lens holder faces the emission part of the light emitting element and is in contact with the wall part, and the light is emitted from the light emitting element and emitted. The light is guided to the incident portion of the optical fiber for alignment, and the composite component is emitted from the light emitting element so that the amount of light incident on the optical fiber for alignment is maximized. A third step of moving two-dimensionally in a plane perpendicular to the optical axis of the reflected light, and fixing the lens holder to the base in a state in which the amount of light incident on the optical fiber for alignment is maximized. A fourth step, a fifth step of removing the optical fiber holder for alignment from the lens holder, and a step of emitting light from the light emitting element and a mounting optical fiber held by the optical fiber holder for mounting. A sixth step of moving the mounting optical fiber holder three-dimensionally with respect to the light emitting element so that the amount of light guided to the incident portion and incident on the mounting optical fiber is maximized; A seventh step of fixing the mounting optical fiber holder to the lens holder in a state where the incident portion is located at the focal point of the lens. Method of manufacturing an optical semiconductor module according to claim. 14. The core diameter of the optical fiber for alignment is
14. The method for manufacturing an optical semiconductor module according to claim 13, wherein the core diameter of the mounting optical fiber is equal to or smaller than the core diameter.