JPH0729423A - Electrode terminal mounting structure on conductor encapsulation plate - Google Patents

Abstract

PURPOSE:To eliminate the limitation of the mounting position of an electrode terminal, provide a good electrically connected state with high reliability, and enhance the appearance. CONSTITUTION:Lower holes 21, 22 are formed by machining in a transparent resin plate base material 11 in a conductor sealing plate 10 10 in which a number of conductor fine lines 12 are sealed, a thin base material part 11a is removed by laser working to form a through-hole 27, and a conductor fine line part 12a is exposed without being cut. A conductive paste 25 is charged in the through-hole 27 in the state covering the whole exposed conductor fine line part 12a, the top end of an electrode terminal 26 is buried in the conductive paste 25 from the reverse side. An ornamental plate 23 is fitted into the through- hole 27 from the surface side, and a transparent resin 24 is further charged thereon and finished.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode terminal mounting structure for a conductor enclosing plate.

[0002]

2. Description of the Related Art As shown in FIG.
Is a state in which a woven thin wire assembly 14 in which a plurality of conductor thin wires 12 and a plurality of non-conductor thin wires 13 are woven so as to be orthogonal to each other is enclosed inside a resin plate base material 11 typified by a transparent acrylic plate, The whole is integrally molded. Fine conductor wire 12
Are parallel, and the non-conductor thin wire 13 is also parallel. In particular, the conductor thin wires 12 do not contact each other. When enclosing the conductor thin wires 12 in the resin plate base material 11, the non-conductor thin wires 13 are made orthogonal to each other to form a woven fine wire assembly 14 in order to prevent them from contacting each other. It is insert molded. Since the conductor thin wires 12 and the non-conductor thin wires 13 have a diameter of at most several tens of microns, their existence is hardly seen by the naked eye, and there is a sense of transparency as a whole.

An electric component or an electric device body is supported by such a conductor encapsulation plate 10, and power is supplied or signals are supplied through the thin conductor wire 12. That is, the conductor encapsulation plate 10 is used as a part of an electric product. Therefore, it is necessary to lead the lead wire from the thin conductor wire 12 in the conductor encapsulation plate 10, and various methods have conventionally been proposed for how to attach the electrode terminals at the ends of the lead wire.

Since the fine conductor wire 12 is thin, it is necessary to pay close attention when attaching the electrode terminals. Moreover, it is necessary to improve the electrical connection state with the electrode terminals. Since the resin plate base material 11 is a resin material such as acrylic resin, it has a low heat resistance temperature, and it is necessary to take utmost care not to cause abnormal deformation or deformation during processing or processing at high temperature such as soldering. is there. Also,
The resin plate base material 11 does not necessarily need to be transparent, but the fact that the resin plate base material 11 is transparent is also part of the commercial value. Must not spoil the appearance of the.

Conventionally, the electrode terminal mounting structure in the electric conductor enclosing plate which has been conventionally proposed is as follows.

(1) In the first method (not shown), through holes are formed in the conductor enclosing plate 10 by machining. At this time, the conductor thin wire 12 and the nonconductor thin wire 13 are cut, and the cut end faces thereof are exposed on the inner peripheral surface of the through hole. The conductive paste is inserted into the through hole, the tip of the electrode terminal is embedded in the conductive paste, and the electrode terminal is fixed by curing the conductive paste. The electrode terminal and the cut end face of the conductor thin wire are electrically connected via a conductive paste.

(2) The second method is as shown in FIG.
When the through hole 15 is formed in the resin plate base material 11 by machining similarly to the above, the conductor thin wire 12 and the non-conductor thin wire 13 are cut, and the cut end faces thereof are exposed in the through hole 15. Plating 16 is applied to the inner peripheral surface of the through hole 15. The cut end surface of the fine conductor wire 12 exposed on the inner peripheral surface of the through hole 15 is electrically connected to the plating 16. Electrode terminals are soldered to the plating 16 or connector pins are inserted.

(3) The third method is as shown in FIG.
A part of the resin plate base material 11 is melted at the end face of the conductor enclosing plate 10 to expose the end portion of the conductor fine wire 12 in the longitudinal direction. Electrode terminals are soldered to the exposed conductor thin wires 12a.

[0009]

However, in the first method described above, only the cut end face of the fine conductor wire is exposed in the through hole, and the conductive particle in the conductive paste is applied to the cut end face. However, since the diameter of the conductive particles is about the same as the diameter of the fine conductor wire, the contact ratio and the contact area tend to be insufficient, and it is difficult to obtain a good electrical connection state.

Further, in the second method, it is difficult to apply the plating 16 to the inner peripheral surface of the through hole 15, and as a result, it is difficult to obtain a good electrical connection state, and it is inevitable to raise the cost.

In the third method, the electrode terminals are attached only to the end face of the conductor enclosing plate 10, and it is impossible to attach the electrode terminals to any place other than the end face. In addition, since the resin plate base material 11 is melted, the appearance is apt to deteriorate.

The present invention was devised in view of the above circumstances, and eliminates the restriction on the mounting position of the electrode terminals, makes it possible to obtain a highly reliable and excellent electrical connection state, and an appearance appearance. Also aims to be able to do well.

[0013]

The electrode terminal mounting structure in the first conductor enclosing plate according to the present invention is such that the conductor enclosing plate in which a large number of thin conductor wires are enclosed in a resin plate base material There is a hole formed by laser processing or mechanical processing and laser processing in the resin plate base material in a state where the conductor thin wire is exposed without being cut, and almost all of the conductor thin wire portion exposed in the hole is covered. In this state, the hole is filled with a conductive bonding material, and the tip portion of the electrode terminal is bonded to the conductive bonding material.

The electrode terminal mounting structure in the second conductor encapsulation plate according to the present invention is the same as the first structure described above, but in the case where the formed hole is a through hole, the side opposite to the electrode terminal take-out side is formed. A solid resin is inserted or a liquid resin is filled in the through hole.

The electrode terminal mounting structure in the third conductor enclosing plate according to the present invention is opposite to the electrode terminal lead-out side when the resin plate base material is a transparent plate in the first or second structure. On the side, a decorative plate is inserted on the back side of the solid resin or the filled liquid resin inserted in the hole.

[0016]

According to the electrode terminal mounting structure of the first conductor enclosing plate, laser processing is used to form the holes in the resin plate base material, so that the holes are formed in the state where the conductor thin wires are exposed without being cut. It is formed. Since laser cutting is performed instead of melting the resin plate base material to expose the fine conductor wires, holes can be formed at arbitrary positions. When the hole is filled with the conductive bonding material, almost all of the conductor thin wire portion exposed in the hole is covered, and the conductor thin wire portion and the conductive bonding material can be brought into contact with each other with a large contact area. Since the tip portion of the electrode terminal is bonded to the conductive bonding material, the electrical connection state between the electrode terminal and the thin conductor wire via the conductive bonding material becomes highly reliable.

According to the second electrode terminal mounting structure, when the hole is a through hole, resin is inserted or filled on the side opposite to the electrode terminal take-out side. The through holes make the laser processing simple and easy, and because the resin covers the joints, the joints are prevented from coming off and the appearance is good.

According to the third electrode terminal mounting structure, when the resin plate base material is a transparent plate, the decorative plate is inserted into the back side of the resin that seals the holes, and the joint portion is hidden by this decorative plate. Will be good.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electrode terminal mounting structure in a conductor enclosing plate according to the present invention will be described in detail below with reference to the drawings.

First Embodiment Using the conductor encapsulating plate 10 shown in FIG. 7, (a) of FIG.
The electrode terminal mounting structure is constructed by the operations shown in (d) to (d). As shown in FIG. 1A, circular pilot holes 21 and 22 are formed on the front and back sides of the transparent resin plate base material 11 by machining at the electrode terminal attachment positions of the conductor encapsulation plate 10. At this time, the depths of the prepared holes 21 and 22 are such that the conductor thin wires 12 enclosed therein are not exposed. Therefore, the thin base material portion 11a remains between the pilot holes 21 and 22.

Next, as shown in FIG. 1B, a metallic decorative plate 23 is fitted into the prepared hole 21 on the front side (lower surface) to the bottom, and a transparent resin 24 is filled from above. Let it harden. As the transparent resin 24, a thermosetting resin that cures at a temperature lower than the heat resistant temperature of the resin plate base material 11 can be used. Instead of filling and hardening the transparent resin 24, a disk-shaped material that has already been hardened may be embedded and then polished and finished.

In this case, a resin made of the same material as the resin plate base material 11 can be used.

Next, laser processing is performed through the back hole (upper surface) prepared hole 22 to remove the thin base material portion 11a as shown in FIG. 1 (c). At this time, by adjusting the output of the laser, only the thin base material portion 11a is removed, and the plurality of conductor thin wires 12 are exposed without cutting the conductor thin wires 12. This exposed part is code 1
2a. At the time of this laser processing, since the metal decorative plate 23 fitted previously serves as a barrier for the laser processing, the transparent resin 24 is not processed. Prior to laser processing, the prepared holes 21 and 22 are formed by machining,
Since the portion 11a to be laser processed is thin,
Laser processing can be performed satisfactorily in a short time.

Finally, as shown in FIG. 1D, the prepared hole 22 on the back side is filled with a conductive paste 25, which is a kind of conductive bonding material, to expose the entire exposed conductor fine wire portion 12a. And the tip portion of the electrode terminal 26 is embedded in the conductive paste 25 from the back side.
With 5 curing, make electrical connection. Conductive paste 2
Since 5 covers the entire exposed conductor fine wire portion 12a to increase the contact area between them, the electrical connection between the electrode terminal 26 and the conductor fine wire 12 through the conductive paste 25 is made highly reliable. can do.

Conductive paste 25 and electrode terminals 26
Is hidden from the front side by the decorative plate 23, and the transparent resin 24 is present on the decorative plate 23, so that the appearance can be kept in a good condition.

Second Embodiment As shown in FIG. 2A, similarly to the first embodiment, a circular shape is formed on the front and back surfaces of the resin plate base material 11 by machining at the electrode terminal attachment position on the conductor enclosing plate 10. Prepared holes 21, 22
To form. At this time, the thin base material portion 11a covering the thin conductor wire 12 is left.

Next, as shown in FIG. 2B, the thin base material portion 11a is removed by laser processing, and both prepared holes 21 and 21 are formed.
2 forms a continuous through hole 27. At this time, by adjusting the output of the laser, only the thin base material portion 11a is removed, and the plurality of conductor thin wires 12 are exposed without cutting the conductor thin wires 12. 12a is an exposed conductor thin wire portion.

Then, as shown in FIG. 2C, the through hole 2
The conductive paste 25 is filled in the through hole 27 in a state of covering the entire conductor fine wire portion 12a exposed in the inside 7. At this time, by using the conductive paste 25 having high viscosity,
The conductive paste 25 is prevented from dropping downward. Then, the tip portion of the electrode terminal 26 is embedded in the conductive paste 25 from the back side, and the conductive paste 25 is hardened and electrically connected.

Finally, as shown in FIG. 2D, a metallic decorative plate 23 is fitted into the through hole 27 from the front side (lower surface), and the decorative plate 23 is pressed against the conductive paste 25. Then, the transparent resin 24 is filled from above and cured.

Third Embodiment Similar to the second embodiment, as shown in FIG. 3 (a), a circular shape is formed on the front and back surfaces of the resin plate base material 11 by machining at the electrode terminal attachment position on the conductor encapsulation plate 10. Prepared holes 21, 22
To form. At this time, the thin base material portion 11a that covers the thin conductor wire 12 is left. Then, as shown in FIG. 3B, the thin base material portion 11a is removed by laser processing to form the through hole 27. At this time, the plurality of conductor thin wires 12 are exposed without cutting the conductor thin wires 12.
12a is an exposed conductor thin wire portion.

Through hole 2 formed by laser processing
The inner peripheral surface of 7 may be contaminated, but in such a case, the contaminated part is removed by another machining as shown in FIG. 3 (c). As a result, the expanded diameter hole portion 28 having a diameter slightly larger than the original through hole 27 is formed.

Then, as shown in FIG. 3D, the through hole 2
The conductive paste 25 having a relatively high viscosity is provided in the through hole 27 in a state of covering the entire conductor fine wire portion 12a exposed in the inside 7.
To fill. Then, the tip portion of the electrode terminal 26 is embedded in the conductive paste 25 from the back side, and the electrode terminal 26 is electrically connected to the thin conductor wire portion 12a via the conductive paste 25.

Finally, as shown in FIG. 3E, the decorative plate 23 is fitted into the enlarged diameter hole portion 28 from the front side, and the conductive paste 2 is added.
Press on 5. Then, the transparent resin 24 is filled from above and cured.

Fourth Embodiment In this embodiment, as shown in FIG. 4A, the end face of the conductor encapsulation plate 10 is used as an electrode terminal attachment point. Rectangular recesses 31 and 32 are formed on the front and back surfaces of the resin plate base material 11 by machining on the end surface of the conductor enclosing plate 10. At this time, the thin base material portion 11a covering the thin conductor wire 12 is left. Then, as shown in FIG. 4B, the thin base material portion 11a is removed by laser processing,
Both recesses 31 and 32 are continuous recesses 33. At this time, only the thin base material portion 11a is removed, and the conductor thin wires 12 are not cut, and the plurality of conductor thin wires 12 are not cut.
Expose. After that, the exposed conductor thin wire portion 12a is electrically connected to the electrode terminal via the conductive paste by any one of the methods of the first to third embodiments, and the decorative plate 23 is fitted. Then, the transparent resin 24 is filled and finished.

In any of the above-described embodiments, before laser processing, a prepared hole or recess is formed in the resin plate base material by machining to leave a thin base material portion covering the thin conductor wire, and the thin base material is formed. Laser processing is performed on the portion, but this is to improve the properties of laser processing. The resin material such as transparent acrylic used as the base material of the resin plate is usually affected by the heat generated by the laser processing and may melt at a portion other than the original processed portion. The thinner one is preferable. However, when an excimer laser is used, pre-processing by machining may be unnecessary by using a gas according to the material of the work piece. Further, as the conductive bonding material for connecting the thin conductor wire and the electrode terminal, low melting point solder may be used instead of the conductive paste.

Further, in any of the above embodiments, the decorative plate is fitted and the transparent resin is filled on the decorative plate. However, the resin is not limited to the transparent one and may be designed according to the design. The color can be selected. Further, it is possible to eliminate the need for resin filling and to embed the decorative plate itself so that the through holes and the recesses are flush with the resin plate base material.

Further, in any of the above-mentioned embodiments, the transparent resin 24 is filled after the decorative plate 23, but a solid resin may be inserted therein. When the through hole is deep, the filled or inserted resin has a rod shape. Further, the resin to be filled or inserted may be opaque. Furthermore, the decorative plate 23 may be omitted. Particularly, the resin plate base material 1
1 does not have to be a transparent plate, in which case the resin to be filled or inserted may be a resin of the same color as the resin plate base material, and the decorative plate may be omitted.

A liquid crystal display device is shown in FIGS. 5 and 6 as an example of an electric product made by using a conductor enclosing plate. FIG. 5 is a front view and FIG. 6 is a sectional view. In the figure, 10 is a conductor enclosing plate, 11 is a resin plate base material, 12 is a thin conductor wire, 13 is a thin conductor wire, 23 is a decorative plate, 24 is a transparent resin, 25 is a conductive paste, and 26 is an electrode terminal. . Conductor enclosure plate 10
An opening 10a is formed in the liquid crystal display device main body 41, and the liquid crystal display device main body 41 is fixed to the conductor enclosing plate 10 by a mounting plate 42 and an anchor member 43. The lead wire 44 for power supply and the lead wire 45 for signal input, which are led out from the liquid crystal display device body 41, are connected to the electrode terminals 26 near the liquid crystal display device body 41.
26, while a lead wire 47 for supplying power from the AC adapter 46 and a lead wire 49 for inputting a signal from the video terminal 48 are connected to the electrode terminals 26, 26 near the end sides of the conductor encapsulation plate 10. Has been done.

[0039]

As described above, according to the first electrode terminal mounting structure of the present invention, the holes are formed by laser cutting the base material of the resin plate in order to expose the conductor thin wires without cutting them by forming the holes. Since it is formed, it is possible to remove the restriction on the formation position of the hole, that is, the attachment position of the electrode terminal, and it is possible to attach the electrode terminal at an arbitrary position. Further, since the conductive bonding material is filled in the through hole in a state of covering almost the entire conductor thin wire portion that is exposed without being cut in the hole, the contact area of the conductive bonding material with respect to the conductor thin wire portion is large and The electrically connected state between the electrode terminal embedded in the conductive bonding material and the thin conductor wire can be made highly reliable.

Further, according to the second electrode terminal mounting structure of the present invention, the through hole can simplify and facilitate the laser processing, and yet, the laser processing can be performed on the side opposite to the electrode terminal take-out side. Since the through hole is covered with the resin, the joint portion can be prevented from falling off and the appearance can be improved.

Furthermore, according to the third electrode terminal mounting structure of the present invention, when the resin plate base material is a transparent plate,
Since the decorative plate is inserted into the back side of the resin that seals the hole and the joint is hidden by the decorative plate, terminal connection can be performed in a state in which the appearance is good.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a process of forming an electrode terminal mounting structure in a conductor enclosing plate according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a process of forming an electrode terminal mounting structure in a conductor enclosing plate of the second embodiment.

FIG. 3 is a cross-sectional view showing a process of forming an electrode terminal mounting structure in a conductor encapsulating plate of a third embodiment.

FIG. 4 is a perspective view showing a part of a process of forming an electrode terminal mounting structure in a conductor enclosing plate of a fourth embodiment.

FIG. 5 is a front view showing a liquid crystal display device manufactured using a conductor enclosing plate.

FIG. 6 is a cross-sectional view of the liquid crystal display device.

FIG. 7 is a partially cutaway perspective view showing a structure of a conductor enclosing plate.

FIG. 8 is a sectional view showing a conventional method of an electrode terminal mounting structure.

FIG. 9 is a plan view showing another conventional method of the electrode terminal mounting structure.

[Explanation of symbols]

 10 ... Conductor enclosing plate 11 ... Resin plate base material 11a ... Thin base material portion 12 ... Conductor thin wire 12a ... Exposed conductor thin wire portion 13 ... Non-conductor thin wire 14 ... Fine wire assembly 21, 22 ... Pilot hole 23 ... Decorative plate 24 ... Transparent resin 25 ... Conductive paste 26 ... Electrode terminal 27 ... Through hole 28 ... Expanded hole portion 31, 32 ... Recess 33 ... Through recess 41 ... Liquid crystal Display unit 46 …… AC adapter 48 …… Video terminal

Claims (3)

[Claims] 1. A laser engraving machine or a machine for the resin plate base material in a state where the conductor thin wire is exposed without being cut at a proper position of a conductor enclosing plate in which a large number of conductor fine wires are encapsulated in a resin plate base material. There is a hole formed by machining and laser processing, and the conductive bonding material is filled in the hole in a state of covering almost the entire conductor fine wire portion exposed in the hole, and the conductive bonding material is attached to the electrode terminal. An electrode terminal mounting structure in a conductor encapsulation plate, characterized in that the tip portions of the are joined. 2. The conductor according to claim 1, wherein, when the formed hole is a through hole, a solid resin is inserted or a liquid resin is filled in the through hole on the side opposite to the electrode terminal extraction side. Electrode terminal mounting structure on encapsulation plate. 3. The solid resin or the filled liquid resin inserted into the hole on the side opposite to the electrode terminal take-out side when the resin plate base material is a transparent plate according to claim 1 or 2. Electrode terminal mounting structure in a conductor encapsulation plate with a decorative plate inserted in the back of the.