JPH0729607Y2 - Composite electronic components - Google Patents
Composite electronic componentsInfo
- Publication number
- JPH0729607Y2 JPH0729607Y2 JP1991044123U JP4412391U JPH0729607Y2 JP H0729607 Y2 JPH0729607 Y2 JP H0729607Y2 JP 1991044123 U JP1991044123 U JP 1991044123U JP 4412391 U JP4412391 U JP 4412391U JP H0729607 Y2 JPH0729607 Y2 JP H0729607Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- low heat
- high thermal
- generating electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002131 composite material Substances 0.000 title claims description 7
- 239000000463 material Substances 0.000 claims description 25
- 229920003002 synthetic resin Polymers 0.000 description 14
- 239000000057 synthetic resin Substances 0.000 description 14
- 239000003990 capacitor Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は複合電子部品に係り、特
に、ケース内に抵抗器やコンデンサ等を複数個封入した
形式の部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component, and more particularly to a component in which a plurality of resistors, capacitors and the like are enclosed in a case.
【０００２】[0002]
【従来の技術】従来、複数の電子部品をパッケージ化し
て、特定用途に容易に使用できるようにした複合電子部
品が種々提案されている。2. Description of the Related Art Conventionally, various composite electronic components have been proposed in which a plurality of electronic components are packaged so that they can be easily used for a specific purpose.
【０００３】これは、例えば、抵抗器とコンデンサとを
接続してスパークキラー回路とし、電源やモータ等に取
り付けて使用するようになっている。For example, a spark killer circuit is formed by connecting a resistor and a capacitor, and is used by being attached to a power source, a motor or the like.
【０００４】[0004]
【考案が解決しようとする課題】ところで、この種の部
品において、ノイズフィルタやスパークキラーを構成す
る場合には、抵抗器とコンデンサのように、発熱性の電
子部品と熱に対して脆弱な低耐熱電子部品とを同居する
ことが多い。しかし、一般にコンデンサは、加熱される
と内部の絶縁フィルムが溶融して絶縁が破れ、ショート
してしまうという問題がある。By the way, when a noise filter or a spark killer is constructed in this type of component, a heat generating electronic component such as a resistor and a capacitor and a low vulnerable to heat are used. They often live with heat-resistant electronic components. However, in general, a capacitor has a problem that when heated, the insulating film inside melts to break the insulation and cause a short circuit.
【０００５】このように発熱性電子部品と低耐熱電子部
品を含む場合にはケースへの封入が困難であり、封入す
る場合でも両者を離して封入しなければならず、大型化
してしまうという問題がある。As described above, when the heat-generating electronic component and the low heat-resistant electronic component are included, it is difficult to encapsulate them in the case, and even if they are encapsulated, they must be separated from each other, resulting in an increase in size. There is.
【０００６】また、ケースは合成樹脂により形成される
が、この金型は高価であるため多品種少量生産の場合に
はコスト上昇の要因となっている。Although the case is made of synthetic resin, this mold is expensive, which causes a cost increase in the case of high-mix low-volume production.
【０００７】本考案は上記事項に鑑みてなされたもの
で、発熱性電子部品と低耐熱電子部品とを小形でかつ安
価にパッケージできるようにした複合電子部品を提供す
ることを技術的課題とする。The present invention has been made in view of the above matters, and it is a technical object to provide a composite electronic component in which a heat-generating electronic component and a low heat-resistant electronic component can be packaged in a small size and at a low cost. .
【０００８】[0008]
【課題を解決するための手段】本考案は上記技術的課題
を解決するために、以下のような構成とした。In order to solve the above technical problems, the present invention has the following constitution.
【０００９】即ち、筒状の長尺材を所定の長さで切断し
て形成した筒型ケース内に、発熱性電子部品と低耐熱性
電子部品とを内装してなる複合電子部品であって、上記
発熱性電子部品を筒型ケース内の一端側に配置するとと
もに、該発熱性電子部品の周囲に取り付け面に密接して
固定される高熱伝導性支持材を上記筒型ケースの一端縁
から小許突出して露出せしめて配置し、また、上記低耐
熱性電子部品を筒型ケース内の他端側に配置し、さらに
上記高熱伝導性支持材と低耐熱性電子部品との間に断熱
性部を設けた。That is, a composite electronic component in which a heat-generating electronic component and a low heat-resistant electronic component are housed inside a tubular case formed by cutting a tubular long material into a predetermined length. The heat-generating electronic component is arranged on one end side in the tubular case, and a highly heat-conductive support member, which is closely fixed to a mounting surface around the heat-generating electronic component, is provided from one edge of the tubular case. It is placed so that it protrudes and is exposed, and the low heat-resistant electronic component is placed on the other end side in the cylindrical case, and further the heat insulating property is provided between the high heat conductive support material and the low heat resistant electronic component. Part was set up.
【００１０】[0010]
【作用】筒状の長尺材を所定の長さで切断して筒型ケー
スとしたので、ケース成型のための金型を用意する必要
がなく、大幅なコストダウンを図ることができる。そし
て、この筒型ケースの両端に、発熱性電子部品と低耐熱
性電子部品とを離して内装し、発熱性電子部品の周囲に
高熱伝導性支持材を配置し、この支持材を取り付け面に
密接させるようにしたため、発熱性電子部品で発生した
熱を高熱伝導性支持材を介して取り付け面に逃がすこと
ができる。Since the tubular long material is cut into a predetermined length to form a tubular case, it is not necessary to prepare a die for molding the case, and a large cost reduction can be achieved. Then, at both ends of this cylindrical case, the heat-generating electronic component and the low heat-resistant electronic component are separated and internally mounted, and a high thermal conductive support material is arranged around the heat-generating electronic component, and this support material is attached to the mounting surface. Because of the close contact, the heat generated in the heat-generating electronic component can be released to the mounting surface via the high thermal conductive support material.
【００１１】ここで高熱伝導性支持材を筒型ケースの一
端縁から小許突出させ露出せしめて配置しているため、
高熱伝導性支持材と取り付け面との密着が確実となり放
熱特性が良好である。Here, since the high thermal conductive support material is arranged so as to be slightly exposed and exposed from one end edge of the cylindrical case,
Adhesion between the highly heat-conductive support material and the mounting surface is ensured, and heat dissipation characteristics are good.
【００１２】また、上記高熱伝導性支持材と低耐熱性電
子部品との間に断熱部を設けたため、上記発熱性電子部
品からの熱が伝わる虞れがなくなり耐久性や信頼性が向
上する。Further, since the heat insulating portion is provided between the high heat conductive support member and the low heat resistant electronic component, there is no fear of transmitting heat from the heat generating electronic component, and durability and reliability are improved.
【００１３】[0013]
【実施例】本考案の実施例を図１及び図２に基づいて説
明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS.
【００１４】筒型ケース２は図２に示すように、合成樹
脂により断面角型に形成した筒状の長尺材１を適宜切断
して構成されている。As shown in FIG. 2, the cylindrical case 2 is constructed by appropriately cutting a cylindrical long member 1 formed of a synthetic resin and having a rectangular cross section.
【００１５】この筒型ケース２内には、発熱性電子部品
３たる抵抗器と低耐熱性電子部品４たるコンデンサが内
装されている。この抵抗器とコンデンサはプリント配線
基板Ｐ上において直列接続されており、スパークキラー
回路を構成している。そして上記発熱性電子部品３は筒
型ケース２内の一端側２ａに配置されており、また、低
耐熱性電子部品４は筒型ケース２内の他端側２ｂに配置
されている。即ち、図１に示すように、発熱性電子部品
３は下側、低耐熱性電子部品４は上側に配置されてお
り、低耐熱性電子部品４から直接導出されたリード線１
０とプリント配線基板Ｐから導出されたリード線１１と
が筒型ケース２の他端側２ｂから外部へ導出されてい
る。A resistor, which is a heat-generating electronic component 3, and a capacitor, which is a low heat-resistant electronic component 4, are housed in the cylindrical case 2. The resistor and the capacitor are connected in series on the printed wiring board P to form a spark killer circuit. The heat-generating electronic component 3 is arranged on one end side 2a in the cylindrical case 2, and the low heat resistant electronic component 4 is arranged on the other end side 2b in the cylindrical case 2. That is, as shown in FIG. 1, the heat-generating electronic component 3 is arranged on the lower side and the low heat-resistant electronic component 4 is arranged on the upper side, and the lead wire 1 directly led from the low heat-resistant electronic component 4 is arranged.
0 and the lead wire 11 led out from the printed wiring board P are led out from the other end side 2b of the tubular case 2.
【００１６】上記した配置状態において、筒型ケース２
の一端側２ａの開口部を蓋状の治具により閉塞した状態
で、筒型ケース２の他端側２ｂの開口部から筒型ケース
２内に高熱伝導性合成樹脂を注入する。一端側２ａの開
口部を閉塞するための治具は、開口部の内側を凹ませて
あり、高熱伝導性合成樹脂が固化して高熱伝導性支持材
５が形成された際、この高熱伝導性支持材５の底面が、
筒型ケース２の一端縁から小許突出して露出するように
なっている。この突出高さＤは０．５ｍｍから２ｍｍ程
度が望ましい。In the above-mentioned arrangement state, the cylindrical case 2
In the state where the opening on the one end side 2a is closed by the lid-shaped jig, the high thermal conductive synthetic resin is injected into the cylindrical case 2 through the opening on the other end side 2b of the cylindrical case 2. The jig for closing the opening on the one end side 2a has a recessed inside, and when the high thermal conductive synthetic resin is solidified to form the high thermal conductive support material 5, the high thermal conductivity is improved. The bottom surface of the support material 5
The cylindrical case 2 is configured to be slightly exposed from one end edge and exposed. The protrusion height D is preferably about 0.5 mm to 2 mm.
【００１７】上記高熱伝導性合成樹脂としては固化状態
において熱伝導率が８×１０−４（ｃａｌ・ｃｍ／ｓ・
ｃｍ２・℃）以上の高熱伝導率の液状合成樹脂を使用し
た。また、この高熱伝導性合成樹脂が固化して形成され
る高熱伝導性支持材５は柔軟性をもたせてあり、実施例
ではＪＩＳＡ硬度６５とした。The high thermal conductivity synthetic resin has a thermal conductivity of 8 × 10 −4 (cal · cm / s · s) in a solidified state.
A liquid synthetic resin having a high thermal conductivity of not less than cm 2 · ° C.) was used. Further, the high thermal conductive support material 5 formed by solidifying the high thermal conductive synthetic resin has flexibility, and has a JIS A hardness of 65 in the examples.
【００１８】高熱伝導性合成樹脂の注入量は発熱性電子
部品３が完全に隠れる量とする。高熱伝導性合成樹脂を
加熱硬化させて高熱伝導性支持材５を形成した後、断熱
性の高い断熱性合成樹脂を充填する。この断熱性合成樹
脂としては固化状態において熱伝導率が５×１０
−４（ｃａｌ・ｃｍ／ｓ・ｃｍ２・℃）以下の、例え
ば、エポキシ樹脂、ウレタン樹脂を主成分とする発泡樹
脂が適する。そして、上記低耐熱性電子部品４の周囲に
断熱性合成樹脂を行き渡らせ、これを加熱硬化させて断
熱性支持材６を形成する。この断熱性支持材６における
上記低耐熱性電子部品４と高熱伝導性支持材５との間に
配された部分が断熱部９を構成している。The injection amount of the synthetic resin with high thermal conductivity is such that the heat-generating electronic component 3 is completely hidden. After the high thermal conductive synthetic resin is heated and cured to form the high thermal conductive support material 5, the high thermal insulating synthetic resin is filled. This heat insulating synthetic resin has a thermal conductivity of 5 × 10 5 in a solidified state.
-4 (cal · cm / s · cm 2 · ° C) or less, for example, a foamed resin containing an epoxy resin or a urethane resin as a main component is suitable. Then, a heat insulating synthetic resin is spread around the low heat resistant electronic component 4, and this is heat-cured to form the heat insulating support material 6. A portion of the heat insulating support member 6 disposed between the low heat resistant electronic component 4 and the high heat conductive support member 5 constitutes a heat insulating portion 9.
【００１９】このようにして、各合成樹脂を注入した
後、合成樹脂を硬化させ、上記露出面７を配電盤や放熱
板等の取り付け面８に密着させた状態で取り付ける。取
り付け方法の一例として、筒型ケース２の基部にフラン
ジを接着し、このフランジに穿孔部を設けて取り付け面
８にビス止めすることが考えられる。高熱伝導性支持材
５をＪＩＳＡ硬度８５以下の柔軟性を有するものとした
場合には、取り付け面８に多少の凹凸がその弾性によっ
てあっても確実に密着させることができ、放熱性が向上
する。After each synthetic resin is injected in this manner, the synthetic resin is hardened, and the exposed surface 7 is attached in a state in which the exposed surface 7 is in close contact with the attachment surface 8 such as a switchboard or a heat dissipation plate. As an example of the mounting method, it is conceivable to bond a flange to the base of the cylindrical case 2 and provide a perforated portion in the flange to fix the mounting surface 8 with a screw. When the highly heat conductive support material 5 has flexibility of JIS A hardness of 85 or less, even if there is some unevenness on the mounting surface 8 due to its elasticity, it can be surely brought into close contact, and the heat dissipation is improved. .
【００２０】以上述べたように、筒型ケース２は長尺材
１を所望の長さに切断して構成するものであるため、金
型を要せず、大型の部品を内装する場合には長めに切断
するだけでよい。このため製造コストを大幅に低減する
ことができる。As described above, since the cylindrical case 2 is constructed by cutting the long material 1 into a desired length, a mold is not required, and when a large-sized component is to be housed, All you have to do is cut it to a longer length. Therefore, the manufacturing cost can be significantly reduced.
【００２１】しかも、発熱性電子部品３で発生した熱
は、高熱伝導性支持材５を介して取り付け面８に逃がす
ことができる。また、上記高熱伝導性支持材５と低耐熱
性電子部品４との間に断熱部９を設けたので、発熱性電
子部品３で発生した熱が低耐熱性電子部品まで伝達され
る虞れがなくなりさらに信頼性を向上させることができ
た。Moreover, the heat generated in the heat-generating electronic component 3 can be released to the mounting surface 8 via the highly heat-conductive support member 5. Further, since the heat insulating portion 9 is provided between the high heat conductive support member 5 and the low heat resistant electronic component 4, there is a fear that heat generated in the heat generating electronic component 3 may be transferred to the low heat resistant electronic component. It was possible to improve reliability even more.
【００２２】なお、高熱伝導性支持材と低耐熱性電子部
品との間の断熱部９は、断熱性支持材６とは別体の断熱
材や空洞等で形成してもよく、低耐熱性電子部品４に対
し、同様の断熱効果が得られるものである。The heat insulating portion 9 between the high thermal conductive support material and the low heat resistant electronic component may be formed of a heat insulating material or a cavity which is separate from the heat insulating support material 6, and has a low heat resistance. The same heat insulating effect can be obtained for the electronic component 4.
【００２３】また、上記高熱伝導性支持材５は、発熱性
電子部品３に対する収納部を形成したアルミ等の金属部
材より成るものでも同様の放熱効果が得られるものであ
る。この場合には、上記金属部材を筒型ケース２の一端
から小許突出させ、且つ、上記断熱性支持材６の硬度を
ＪＩＳＡ硬度８５以下として弾力性を具備させれば、取
り付け面８との密着性が良好なものとなる。Further, even if the high thermal conductive support member 5 is made of a metal member such as aluminum in which a housing portion for the heat generating electronic component 3 is formed, a similar heat radiation effect can be obtained. In this case, if the metal member is allowed to project slightly from one end of the tubular case 2 and the heat insulating support member 6 has elasticity such that the hardness of the heat insulating support member 6 is 85 or less, the mounting surface 8 can be formed. Adhesion becomes good.
【００２４】[0024]
【考案の効果】本考案によれば、筒状の長尺材を所定の
長さで切断してケースとしたので、ケースの製造に特別
な型を起こす必要がなく、多品種少量生産でも低コスト
で製造することができる。EFFECTS OF THE INVENTION According to the present invention, since a long cylindrical member is cut into a predetermined length to form a case, it is not necessary to make a special mold for manufacturing the case, and it is possible to reduce the production of a wide variety of products in small quantities. It can be manufactured at a cost.
【００２５】しかも、高熱伝導性支持材を筒型ケースの
一端縁から小許突出させ露出せしめて配置しているた
め、高熱伝導性支持材と取り付け面との密着が確実とな
り発熱性電子部品から発生する熱を取り付け面へ確実に
逃がすことができる。Moreover, since the highly heat-conductive support material is arranged so as to slightly project from one end of the cylindrical case and is exposed, the high heat-conductive support material and the mounting surface are firmly attached to each other, and the heat-generating electronic component is prevented. The generated heat can be surely released to the mounting surface.
【００２６】さらに、高熱伝導性支持材と低耐熱性電子
部品との間に断熱部を設けたため、低耐熱性電子部品へ
の熱を遮断でき、発熱性電子部品と低耐熱性電子部品と
を近接してパッケージすることができる。このため小型
化と信頼性の向上とを図ることができる。Further, since the heat insulating portion is provided between the high thermal conductive support material and the low heat resistant electronic component, heat to the low heat resistant electronic component can be cut off and the heat generating electronic component and the low heat resistant electronic component can be separated from each other. Can be packaged in close proximity. Therefore, it is possible to reduce the size and improve the reliability.
【図１】本考案の実施例を示す断面図FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】本考案の実施例を示す斜視図FIG. 2 is a perspective view showing an embodiment of the present invention.
１ 長尺材、 ２ 筒型ケース、 ３ 発熱性電子部品、 ４ 低耐熱性電子部品、 ５ 高熱伝導性支持材、 ６ 断熱性支持材、 ７ 露出面、 ８ 取り付け面、 ９ 断熱部。 1 long material, 2 cylindrical case, 3 heat generating electronic parts, 4 low heat resistant electronic parts, 5 high thermal conductivity supporting material, 6 heat insulating supporting material, 7 exposed surface, 8 mounting surface, 9 heat insulating part.
Claims (1)
成した筒型ケース内に、発熱性電子部品と低耐熱性電子
部品とを内装してなる複合電子部品であって、上記発熱
性電子部品を筒型ケース内の一端側に配置するととも
に、該発熱性電子部品の周囲に取り付け面に密接して固
定される高熱伝導性支持材を上記筒型ケースの一端縁か
ら小許突出して露出せしめて配置し、また、上記低耐熱
性電子部品を筒型ケース内の他端側に配置し、さらに上
記高熱伝導性支持材と低耐熱性電子部品との間に断熱性
部を設けたことを特徴とする複合電子部品。1. A composite electronic component in which a heat-generating electronic component and a low heat-resistant electronic component are housed inside a tubular case formed by cutting a tubular long material into a predetermined length. , When the heat-generating electronic component is arranged on one end side in the cylindrical case,
, The high thermal conductivity support material which is closely fixed to the mounting surface around the heat-generating electronic component or one end edge of the tubular casing
And allowed exposed positioned Luo small Huh projects, also the low heat resistant electronic parts arranged on the other end side of the cylindrical casing, further upper <br/> SL highly thermally conductive supporting member and the low heat resistant electronic parts A composite electronic component characterized by having a heat insulating portion between and.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991044123U JPH0729607Y2 (en) | 1991-05-16 | 1991-05-16 | Composite electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991044123U JPH0729607Y2 (en) | 1991-05-16 | 1991-05-16 | Composite electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04130404U JPH04130404U (en) | 1992-11-30 |
| JPH0729607Y2 true JPH0729607Y2 (en) | 1995-07-05 |
Family
ID=31924330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991044123U Expired - Lifetime JPH0729607Y2 (en) | 1991-05-16 | 1991-05-16 | Composite electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729607Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8455136B2 (en) | 2009-08-10 | 2013-06-04 | Taiyo Yuden Co., Ltd. | Electrochemical device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2018128005A1 (en) * | 2017-01-06 | 2019-11-07 | パナソニックＩｐマネジメント株式会社 | Capacitor, capacitor unit, capacitor manufacturing method, and capacitor unit manufacturing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889925U (en) * | 1981-12-14 | 1983-06-17 | 岡谷電機産業株式会社 | composite parts |
| JPH0737307Y2 (en) * | 1988-05-12 | 1995-08-23 | 株式会社村田製作所 | Resin-filled electronic components |
-
1991
- 1991-05-16 JP JP1991044123U patent/JPH0729607Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8455136B2 (en) | 2009-08-10 | 2013-06-04 | Taiyo Yuden Co., Ltd. | Electrochemical device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04130404U (en) | 1992-11-30 |
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