JPH0729672Y2 - Printed circuit board mounting structure - Google Patents

Printed circuit board mounting structure

Info

Publication number
JPH0729672Y2
JPH0729672Y2 JP1990128117U JP12811790U JPH0729672Y2 JP H0729672 Y2 JPH0729672 Y2 JP H0729672Y2 JP 1990128117 U JP1990128117 U JP 1990128117U JP 12811790 U JP12811790 U JP 12811790U JP H0729672 Y2 JPH0729672 Y2 JP H0729672Y2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
chassis
guide
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990128117U
Other languages
Japanese (ja)
Other versions
JPH0485774U (en
Inventor
貞一 松元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Priority to JP1990128117U priority Critical patent/JPH0729672Y2/en
Publication of JPH0485774U publication Critical patent/JPH0485774U/ja
Application granted granted Critical
Publication of JPH0729672Y2 publication Critical patent/JPH0729672Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

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  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【考案の詳細な説明】 〈産業上の利用分野〉 本考案はプリント基板を収容するのに用いられる電子機
器用筐体に係り、特に組立性の向上に関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a housing for electronic equipment used for housing a printed circuit board, and more particularly to improvement of assemblability.

〈従来の技術〉 本出願人は例えば実開昭63−162466号公報でプリント基
板の収容構造を提案している。第3図はこのような従来
装置の構成斜視図、第4図は組立図である。図におい
て、シャーシ10は箱形のもので、アルミ等の電磁シール
ド効果を有しながら構造的な強度を有する材料よりな
る。プリント基板20は抵抗、コンデンサ、IC等の電子部
品が搭載されたものである。スタッド30はシャーシ10に
プリント基板20を取付ける際に必要な剛性を確保するの
に使用するもので、両者の間にクリアランスを確保する
と共にネジ32がプリント基板20を介して螺着される。ガ
イド打出し40はシャーシ10の側面には4箇所設けられた
もので、プリント基板20の挿入を案内すると共に支持を
行なう役割を有し、例えばダブルブリッジ打出しと呼ば
れる製造法で形成される。
<Prior Art> The applicant of the present invention has proposed a structure for accommodating a printed circuit board, for example, in Japanese Utility Model Laid-Open No. 63-162466. FIG. 3 is a perspective view of the configuration of such a conventional device, and FIG. 4 is an assembly diagram. In the figure, the chassis 10 has a box shape and is made of a material having structural strength while having an electromagnetic shielding effect, such as aluminum. The printed circuit board 20 has electronic components such as resistors, capacitors, and ICs mounted thereon. The stud 30 is used to secure the rigidity required when the printed circuit board 20 is mounted on the chassis 10. The stud 30 secures a clearance between the two and a screw 32 is screwed through the printed circuit board 20. The guide embossing 40 is provided at four places on the side surface of the chassis 10, has a role of guiding the insertion of the printed circuit board 20 and supporting it, and is formed by a manufacturing method called double bridge embossing, for example.

プリント基板20上で、部品実装禁止域22は両端の斜線部
分で、ガイド打出し40が存在するために電子部品の実装
が禁止されている。リード配置禁止域24はスタッド穴21
からプリント基板20挿入側先頭に直線上に延びたもの
で、ハンダ面に電子部品のリードが突出しないよう配慮
する。第5図はリード配置禁止域24の説明図である。ス
タッド30が存在するので、ハンダ面にリードが存在する
と挿入ができなくなったり、或いは短絡などの好ましく
ない現象が生じる。
On the printed circuit board 20, the component mounting prohibited area 22 is a shaded portion at both ends, and the mounting of electronic components is prohibited due to the presence of the guide embossing 40. Lead placement prohibited area 24 is stud hole 21
From the printed circuit board 20 on the insertion side to the top so that the leads of the electronic components do not protrude from the solder surface. FIG. 5 is an explanatory diagram of the lead placement prohibited area 24. Since the studs 30 are present, if the leads are present on the solder surface, insertion becomes impossible, or an undesirable phenomenon such as a short circuit occurs.

〈考案が解決しようとする課題〉 このように、部品実装禁止域22やリード配置禁止域24が
プリント基板20上に存在することは、部品実装の自由度
が低くなると共にスタッド設置場所も限定されてしまう
と言う課題があった。
<Problems to be solved by the invention> As described above, the presence of the component mounting prohibited area 22 and the lead placement prohibited area 24 on the printed circuit board 20 reduces the degree of freedom in mounting the component and limits the stud installation place. There was a problem that it would end up.

本考案はこのような課題を解決したもので、プリント基
板のシャーシ取り付けに伴なう実装面積の減少が少な
く、設計の自由度の高いプリント基板の実装構造を提供
することを目的とする。
The present invention solves such a problem, and an object of the present invention is to provide a printed circuit board mounting structure in which the reduction of the mounting area accompanying the chassis mounting of the printed circuit board is small and the degree of freedom in design is high.

〈課題を解決するための手段〉 このような目的を達成する本考案は、シャーシ(10)に
は、プリント基板(20)の端部を保持する所定長さ(l
2)のガイド打ち出し部(40)を、このシャーシの側面
に当該ガイド打ち出し部の長さよりも長い間隔(l3)で
複数個設けている。また、プリント基板には、このプリ
ント基板が当該シャーシに収用された状態で当該ガイド
打ち出し部と接触する部品実装禁止域(22)、この部品
実装禁止域のプリント基板挿入方向に設けられた当該ガ
イド打ち出し部の長さよりも僅かに長い長さ(l5)の切
欠き部(26)、この部品実装禁止域のプリント基板挿入
方向に沿って当該切欠き部と反対側に設けられた部品実
装許可部(28)を有している。そして、前記シャーシの
前記プリント基板と対向する面に取り付けられて、前記
プリント基板を前記シャーシに所定のクリアランスで取
り付けるスタッド(30)を有している。更に、前記プリ
ントが当該シャーシに収用された状態で前記スタッドと
対向する部位の、プリント基板挿入方向に沿って前記ガ
イド打ち出し部の長さ程度の長さ(l8)で設けられた、
前記プリントに実装する電子部品に付設されたリードが
当該スタッド対向面に突出して実装されるのを禁止する
リード配置禁止域(24)を有することを特徴としてい
る。
<Means for Solving the Problems> According to the present invention to achieve such an object, a chassis (10) has a predetermined length (l) for holding an end portion of a printed circuit board (20).
A plurality of guide knockout parts (40) of 2) are provided on the side surface of the chassis at intervals (l3) longer than the length of the guide hitch parts. Further, on the printed circuit board, a component mounting prohibited area (22) that comes into contact with the guide ejection portion in a state where the printed circuit board is accommodated in the chassis, and the guide provided in the printed circuit board insertion direction of the component mounting prohibited area. A cutout portion (26) having a length (l5) slightly longer than the length of the punched-out portion, and a component mounting permission portion provided on the opposite side of the cutout portion along the printed circuit board insertion direction of the component mounting prohibited area. It has (28). The stud (30) is attached to the surface of the chassis that faces the printed circuit board and mounts the printed circuit board to the chassis with a predetermined clearance. Further, provided in the portion facing the stud in a state where the print is confiscated in the chassis, in a length (l8) about the length of the guide punching portion along the printed board insertion direction,
It is characterized in that it has a lead placement prohibition region (24) for prohibiting the leads attached to the electronic components mounted on the print from protruding and mounting on the stud facing surface.

〈作用〉 本考案の各構成要素はつぎの作用をする。プリント基板
の端部には、シャーシ挿入用の切欠部、ガイド打出し部
と当接する部品実装禁止域及び部品実装可能な領域に区
分され、部品実装可能の領域相当分の面積が有効に利用
できる。スタッド取付け領域についても、リード配置禁
止域がほぼ切欠部に相当する領域のみになり、部品配置
の自由度が増大する。
<Operation> Each component of the present invention has the following operation. The end of the printed circuit board is divided into a notch for inserting a chassis, a component mounting prohibited area in contact with the guide driving portion, and a component mountable area, and an area equivalent to the component mountable area can be effectively used. . Also in the stud mounting area, the lead placement prohibited area is limited to an area substantially corresponding to the cutout portion, and the degree of freedom in component placement is increased.

〈実施例〉 以下図面を用いて、本考案を説明する。<Example> The present invention will be described below with reference to the drawings.

第1図は本考案の一実施例を示す構成斜視図である。図
において、シャーシ10は高さh、奥行きl0、幅w0の略直
方体形状をしたもので、両側面には長さl2のガイド打ち
出し40が設けられ、底面にはスタッド30が取付けられ
る。前面(フロントパネル)及び天井板は取外されてお
り、プリント基板20の装着をこれらの方向から実行する
ことが可能になっている。ガイド打出し40は、前面側に
設けられた前ガイド打出し41と背面側に設けられた後ガ
イド打出し42よりなり、前面と前ガイド打出し41の間隔
は1、前ガイド打出し41と後ガイド打出し42の間隔は
l3、後ガイド打出し42と背面の間隔はl4になっている。
ガイド打出40のシャーシ10内部に張り出した高さはw2に
なっている。
FIG. 1 is a configuration perspective view showing an embodiment of the present invention. In the figure, the chassis 10 is of a substantially rectangular parallelepiped shape having a height h, a depth l0 and a width w0, and guide guides 40 having a length l2 are provided on both side surfaces, and studs 30 are attached to the bottom surface. The front surface (front panel) and the ceiling plate are removed, and the mounting of the printed circuit board 20 can be performed from these directions. The guide embossing 40 is composed of a front guide embossing 41 provided on the front side and a rear guide embossing 42 provided on the back side. The distance between the front and the front guide embossing 41 is 1, and the front guide embossing 41 is The interval of the rear guide launch 42 is
The distance between the rear guide ejection 42 and the rear is l4.
The height of the guide embossed 40 protruding into the chassis 10 is w2.

プリント基板20の対向する両側辺には、ガイド打出し40
と接触するほぼガイド打出し40と等しい大きさの部品実
装禁止域22と、この部品実装禁止域22の背面側に設けら
れた長さl5で切欠幅w1の切欠部26と、この部品実装禁止
域22の前面側に設けられた部品実装許可域28が設けられ
ている。部品実装禁止域22の長さl6はガイド打出し40の
長さl2に見合ったものであり、切欠部26の長さl5はガイ
ド打出し40の長さl2より僅かに大きいものであり、部品
実装許可域28の長さl7が部品実装可能な領域の増大にな
っている。スタッド穴21はスタッド30とネジ32を螺合さ
せる際使用する、プリント基板20の略中央前面側に設け
られたもので、この背面側にリード配置禁止域24が長さ
l8で存在している。この各長さの間には次の関係式が成
立している。
On both sides of the printed circuit board 20 facing each other, guide embossing 40
The component mounting prohibited area 22 that is almost the same size as the guide embossing 40, the notch 26 with the notch width w1 and the length l5 provided on the back side of the component mounting prohibited area 22, and this component mounting prohibited A component mounting permission area 28 provided on the front side of the area 22 is provided. The length l6 of the component mounting prohibited area 22 corresponds to the length l2 of the guide embossing 40, and the length l5 of the cutout portion 26 is slightly larger than the length l2 of the guide embossing 40. The length l7 of the mounting permission area 28 increases the area where components can be mounted. The stud hole 21 is used for screwing the stud 30 and the screw 32 together, and is provided on the front side of the center of the printed circuit board 20.
It exists in l8. The following relational expression holds between these lengths.

l2≒l5≒l6≒l8=(プリント基板移動量) このように構成された装置の組立作業を次に説明する。
第2図は組立状態の要部説明図で、(A)はガイド打出
し40と切欠部26の位置合わせ、(B)はガイド打出し40
と部品実装禁止域22の接触した状態を示している。最
初、プリント基板20を矢印A方向(シャーシ10の高さ方
向)に移動させて、ガイド打出し40と切欠部26の位置合
わせをすることにより、プリント基板20がガイド打出し
40を通過する。次にプリント基板20を矢印B方向(底面
と同一面内で背面方向)に移動させると、ガイド打出し
40と部品実装禁止域22が重なる。この状態で、スタッド
穴21にネジ32を挿入すれば、スタッド30とネジ32が螺合
してプリント基板20のシャーシ10に対する固定がなされ
る。
l2≅l5≅l6≅l8 = (moving amount of printed circuit board) The assembling work of the device thus configured will be described below.
FIG. 2 is an explanatory view of the main parts in the assembled state. (A) aligns the guide embossing 40 with the notch 26, and (B) shows the guide embossing 40.
And the component mounting prohibited area 22 are in contact with each other. First, the printed circuit board 20 is moved in the direction of arrow A (the height direction of the chassis 10) to align the guide embossing 40 and the notch 26, so that the printed circuit board 20 is embossed.
Pass 40. Next, when the printed circuit board 20 is moved in the direction of arrow B (backward in the same plane as the bottom), the guide is ejected.
40 and component mounting prohibited area 22 overlap. In this state, if the screw 32 is inserted into the stud hole 21, the stud 30 and the screw 32 are screwed together to fix the printed circuit board 20 to the chassis 10.

尚、上記実施例においてはシャーシ10の底面とプリント
基板20を平行に載置する場合を説明したが、本考案はこ
れに限定されるものではなく、シャーシ10の側面に相当
する面と平行にプリント基板20を載置したものでも良
い。
Although the case where the bottom surface of the chassis 10 and the printed circuit board 20 are placed parallel to each other has been described in the above embodiment, the present invention is not limited to this, and the bottom surface of the chassis 10 may be placed parallel to the side surface of the chassis 10. It may be the one on which the printed circuit board 20 is placed.

〈考案の効果〉 以上説明したように、本考案によれば次のような実用上
の効果がある。
<Effect of Device> As described above, the present invention has the following practical effects.

プリント基板をシャーシに装着する際に、切欠部を用
いてガイド打出し部を通過させて部品実装禁止域をガイ
ド打出し部と接触させているので、ガイド打出し部との
係合に伴なう移動量が少なくて済み、部品実装許可域相
当分の実装面積が増大する。
When mounting the printed circuit board on the chassis, the notch is used to pass through the guide embossing part to bring the component mounting prohibited area into contact with the guide embossing part. The amount of movement is small, and the mounting area corresponding to the component mounting permission area increases.

スタッドに伴なうリード配置禁止域が従来例に比較し
て減少し、実装面積が増大すると共にプリント基板上で
のスタッド取付け位置の自由度が増大する。
The lead disposition prohibited area associated with the stud is reduced as compared with the conventional example, the mounting area is increased, and the degree of freedom of the stud mounting position on the printed circuit board is increased.

実施例のように、切欠部のガイド打出し部通過方向と
スタッドのネジ締め方向を一致させると、組立作業が容
易になる。
As in the embodiment, if the guide-pushing portion passing direction of the cutout portion and the screw tightening direction of the stud are made to coincide with each other, the assembling work becomes easy.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案の一実施例を示す構成斜視図、第2図は
組立状態の要部説明図、第3図は従来装置の構成斜視
図、第4図は組立図、第5図はリード配置禁止域の説明
図である。 10…シャーシ、20…プリント基板、22…部品実装禁止
域、24…リード配置禁止域、26…切欠部、28…部品実装
許可域、30…スタッド、40…ガイド打出し部。
FIG. 1 is a perspective view showing the structure of an embodiment of the present invention, FIG. 2 is an explanatory view of a main part in an assembled state, FIG. 3 is a perspective view showing the structure of a conventional apparatus, FIG. 4 is an assembly view, and FIG. It is an explanatory view of a lead placement prohibited area. 10 ... Chassis, 20 ... Printed circuit board, 22 ... Parts mounting prohibited area, 24 ... Lead placement prohibited area, 26 ... Notch part, 28 ... Parts mounting permission area, 30 ... Stud, 40 ... Guide embossing part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】プリント基板(20)の端部を保持する所定
長さ(l2)のガイド打ち出し部(40)を、シャーシ(1
0)の側面に当該ガイド打ち出し部の長さよりも長い間
隔(l3)で複数個設け、 このプリント基板が当該シャーシに収用された状態で当
該ガイド打ち出し部と接触する部品実装禁止域(22)、
この部品実装禁止域のプリント基板挿入方向に設けられ
た当該ガイド打ち出し部の長さよりも僅かに長い長さ
(l5)の切欠き部(26)、この部品実装禁止域のプリン
ト基板挿入方向に沿って当該切欠き部と反対側に設けら
れた部品実装許可部(28)を前記端部に有する前記プリ
ント基板と、 前記シャーシの前記プリント基板と対向する面に取り付
けられて、前記プリント基板を前記シャーシに所定のク
リアランスで取り付けるスタッド(30)を有するプリン
ト基板の実装構造であって、 前記プリントが当該シャーシに収用された状態で前記ス
タッドと対向する部位の、プリント基板挿入方向に沿っ
て前記ガイド打ち出し部の長さ程度の長さ(l8)で設け
られた、前記プリントに実装する電子部品に付設された
リードが当該スタッド対向面に突出して実装されるのを
禁止するリード配置禁止域(24)を有することを特徴と
するプリント基板の実装構造。
1. A guide punching part (40) having a predetermined length (l2) for holding an end part of a printed circuit board (20) is attached to a chassis (1).
A plurality of parts are provided on the side surface of (0) at intervals (l3) longer than the length of the guide punch-out part, and the component mounting prohibited area (22) that comes into contact with the guide punch-out part in a state where this printed circuit board is accommodated in the chassis,
A notch (26) having a length (l5) slightly longer than the length of the guide embossed portion provided in the printed circuit board insertion direction in the component mounting prohibited area, along the printed circuit board insertion direction in the component mounting prohibited area. And a printed circuit board having a component mounting permitting portion (28) provided on the opposite side of the cutout portion at the end, and attached to a surface of the chassis facing the printed circuit board, and A mounting structure of a printed circuit board having a stud (30) attached to a chassis with a predetermined clearance, wherein the guide is provided along a printed circuit board insertion direction at a portion facing the stud in a state where the print is stored in the chassis. Leads attached to the electronic parts to be mounted on the print, which are provided with a length (l8) about the length of the embossed part, project to the stud facing surface. Mounting structure of a printed circuit board, characterized in that it comprises a lead arrangement prohibition area to prohibit from being mounted (24) Te.
JP1990128117U 1990-11-30 1990-11-30 Printed circuit board mounting structure Expired - Lifetime JPH0729672Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990128117U JPH0729672Y2 (en) 1990-11-30 1990-11-30 Printed circuit board mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990128117U JPH0729672Y2 (en) 1990-11-30 1990-11-30 Printed circuit board mounting structure

Publications (2)

Publication Number Publication Date
JPH0485774U JPH0485774U (en) 1992-07-24
JPH0729672Y2 true JPH0729672Y2 (en) 1995-07-05

Family

ID=31875591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990128117U Expired - Lifetime JPH0729672Y2 (en) 1990-11-30 1990-11-30 Printed circuit board mounting structure

Country Status (1)

Country Link
JP (1) JPH0729672Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927650U (en) * 1982-08-13 1984-02-21 三菱電機株式会社 signal transmission equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
発明協会公開技報公枝番号82−1664(’82.3.20発行)

Also Published As

Publication number Publication date
JPH0485774U (en) 1992-07-24

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