JPH07297232A - TAB tape manufacturing method - Google Patents

Abstract

(57) [Summary] [Purpose] Prevents uneven plating appearance and obtains stable inner lead bonding. [Structure] TA that forms a predetermined wiring pattern on a TAB carrier tape, cleans the tape surface, and then performs plating treatment
A method for producing a TAB tape, which is characterized in that after the surface of the TAB tape is washed, it is air-dried before the plating treatment to remove the water drop residue on the surface of the TAB tape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB tape manufacturing method capable of preventing the occurrence of uneven plating appearance.

[0002]

2. Description of the Related Art A TAB tape has a structure shown in FIG. 1, for example, and includes a polyimide tape 1 with an adhesive, a sprocket hole 2, a device hole 3, an outer lead slit 4, an inner lead 5a, and an input side outer. The wiring pattern 5 includes a lead 5b and an output side outer lead 5c.

Conventionally, the production of such a TAB tape is generally performed by the following steps. First, a sprocket hole 2, an element mounting device hole 3 and an outer lead slit 4 are formed on a polyimide tape 1 with an adhesive by a mold forming process, and then a copper foil (thickness 35 μm) obtained by rolling or electrolysis is formed on the polyimide tape. 1 is laminated and bonded, and the bonded copper foil is subjected to metal etching to form a predetermined wiring pattern 5. As an example of this wiring pattern, the inner lead 5a is used with a 200-pin tape.
Has a pitch of 100 μm and a line width of 50 μm. Next, the TAB tape having the wiring pattern 5 formed thereon is degreased, washed with water,
After performing a washing step (pretreatment) of pickling and washing with water to wash the surface, the wiring pattern 5 is plated (tin, solder or gold).

While solder and gold plating are performed by electroplating, tin plating is mainly performed by electroless plating. In the case of tin plating, the specified plating thickness (0.3 ~
TAB tape for a long time (5 to 5 μm)
It is immersed in a high temperature (50 to 70 ° C.) plating bath for 10 minutes. Further, in the tin plating, heat treatment is performed after the plating treatment in order to prevent the generation of tin whiskers that cause defective lead shorts.

[0005]

However, in the conventional manufacturing process of the TAB tape, there is a possibility that unevenness in appearance may occur after plating due to residual water droplets on the copper lead surface of the tape that has undergone pretreatment. Especially, the plating time is long,
This tendency is high in tin electroless plating, which has a high plating temperature.

[0006] Such appearance unevenness is
Since the lead position is detected at the time of inner lead bonding with the C chip by the binarization method depending on the brightness of the lead and the polyimide film, a malfunction in the binarization reading may occur and a bonding defect may be caused. In addition, since there is a difference in the crystal shape of the plating between the portion having the uneven appearance and the portion having no unevenness, which affects the bonding wettability, strength, etc., stable bonding cannot be secured. In order to prevent this, the plating bath may be repeated twice, but this complicates the process.

[0007]

The present invention has been made in view of the above problems, and in order to prevent the occurrence of uneven plating appearance and obtain stable inner lead bonding,
A method of manufacturing a TAB tape in which a predetermined wiring pattern is formed on a carrier tape for TAB, the surface of the tape is washed, and then plating is performed. In the method of manufacturing the TAB tape, after drying the surface of the TAB tape, air drying is performed before the plating to remove water droplets on the surface of the TAB tape. The present invention provides a method for producing a TAB tape that removes

That is, according to the present invention, in the TAB tape manufacturing process, the TAB tape is air-dried immediately before the plating process to remove the water drop residue on the lead surface of the TAB tape, thereby preventing uneven plating appearance. be able to. The method for manufacturing a TAB tape of the present invention can be applied to electroless solder plating and gold plating in addition to electroless tin plating.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below.
After forming a predetermined wiring pattern on the TAB carrier tape, each step of pretreatment, air drying, electroless tin plating, posttreatment and drying was performed. <Pretreatment> First, the TAB tape is immersed in an alkaline solution at 40 to 50 ° C. for 30 seconds to 1 minute, washed with ionized water at room temperature for 30 seconds to 1 minute, and then immersed in a potassium persulfate solution at room temperature. Soak for 1 second to 1 minute, then again with room temperature ionized water for 30 seconds
It was washed with water for 1 minute. <Air drying> Then, wash the TAB tape with water for 10
3 at room temperature while passing air at a flow rate of 30 liters / minute
It was dried for 0 seconds to 1 minute. <Electroless tin plating> 50-70 dry TAB tape
It was immersed in an organic acid bath in which tin was dissolved at 5 ° C for 5 to 10 minutes to perform tin plating. A reel-to-reel type plating device was used. The composition of the obtained tin plating was 100% tin and the thickness was 0.3 to 0.6 μm. <Post-treatment> The tin-plated TAB tape is washed with room temperature ion water for 30 seconds to 1 minute, then washed with water at 60 to 80 ° C for 30 seconds to 3 minutes, and again washed with room temperature ion water for 30 seconds to 1 minute. did. <Drying> Finally, while passing hot air of 100 to 200 ° C through the TAB tape at a flow rate of 5 to 20 liters / minute, 30 seconds to
It was dried for 1 minute.

The TAB tape used has a width of 35 m.
m, pin number 200, 125 μm thick polyimide film,
The epoxy adhesive was 20 μm and the copper foil thickness was 35 μm.
The electroless tin-plated TAB tape obtained in this example was subjected to an appearance inspection and an inner lead bonding property (lead detection accuracy, bonding wetting amount, tensile strength). As a result, as shown in Table 1, the conventional manufacturing method (tin As shown in Table 1, the appearance and bonding properties of the product of this example were superior to those of the conventional product, as compared with those obtained by not performing air drying immediately before plating).

[0011]

[Table 1] This example does not limit the scope of the present invention at all,
For example, it is possible to use a borofluoride bath or the like as the plating bath instead of the organic acid bath.

[0012]

As described in detail above, the TA of the present invention
According to the method for producing a B tape, a method for producing a TAB tape, in which a predetermined wiring pattern is formed on the TAB carrier tape, the surface of the tape is washed, and then plating treatment is performed,
After the AB tape surface is washed and air-dried before the plating treatment to remove the water drop residue on the TAB tape surface, it is possible to prevent uneven plating appearance and obtain stable inner lead bonding properties.

[Brief description of drawings]

FIG. 1 is a plan view showing the structure of a TAB tape.

[Explanation of symbols]

 1 Polyimide tape with adhesive 2 Sprocket hole 3 Device hole 4 Outer lead slit 5 Wiring pattern 5a Inner lead 5b Input side outer lead 5c Output side outer lead

Claims (2)

[Claims] 1. A method for producing a TAB tape in which a predetermined wiring pattern is formed on a TAB carrier tape and the surface of the tape is washed, and then plating is performed. In the method, a TAB tape is washed and air drying is performed before the plating. TA, characterized by removing water droplets residue on the tape surface
B tape manufacturing method. 2. The method for producing a TAB tape according to claim 1, wherein the plating treatment is electroless plating of tin on a copper lead.