JPH07297331A - Assembling apparatus for heat sink and fan - Google Patents

Abstract

PURPOSE:To assemble a heat sink and a fan without special machining. CONSTITUTION:A heat sink, wherein many pin-shaped heat radiating fins are juxtaposed on the upper surface of a substrate, whose lower surface is made to be the contact surface of a semiconductor element, and a fan for cooling the heat sink are assembled to each other in an apparatus. In this apparatus, receiving pieces facing through pin-shaped fins 4, 4... are provided in the heat sink 1. Holding plates, which are elastically engaged with receiving parts 10 provided at the receiving pieces at engaging pieces 19 provided at both sides, are overlapped on the fan 12 embedded between the pin-shaped heat radiating fins 4, 4....

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink in which a large number of pin-shaped heat radiation fins are arranged in parallel on the upper surface of a rectangular substrate whose lower surface is in contact with a semiconductor element, and to cool the pin-shaped heat radiation fins of the heat sink. Then, the present invention relates to a device for assembling with a fan for achieving a heat dissipation effect of a semiconductor element by a heat sink.

[0002]

2. Description of the Related Art A heat sink in which a large number of pin-shaped heat radiation fins are arranged in parallel on the upper surface of a rectangular substrate whose lower surface is a contact surface with a semiconductor element is designed to radiate heat generated by the semiconductor element through the substrate by the pin-shaped heat radiation fins. Although it is used for preventing the functional deterioration of the semiconductor element, conventionally, there is no one that attaches a fan to this to cool the radiation fin.

[0003]

SUMMARY OF THE INVENTION In view of such a point, the present inventor has made a screw rod penetrate the base of a fan, and a female screw is partially formed on the fin peripheral surface between the heat dissipating fins of the screw. In this way, the fan was forcibly screwed in, the fan was assembled to the heat radiation fin, that is, the heat sink, and a heat sink with a cooling fan was obtained in which the heat radiation effect of the pin-shaped heat radiation fin could be further expected, but the screw was not engraved. Since the screw rod is forcibly inserted and rotated, the tightening operation of the heat sink and the fan is complicated, sometimes not only the board of the heat sink is damaged, but also the stability of the assembled state is lacking. did.

The present invention was created with attention to such points.

[0005]

In a device for assembling a heat sink having a large number of pin-shaped heat radiation fins arranged in parallel on the upper surface of a substrate whose lower surface is in contact with a semiconductor element and a fan for cooling the heat sink, A pair of receiving portions that face each other with a pin-shaped radiating fin interposed therebetween, and a holding plate elastically locked by the locking portions provided on both sides in the receiving holes provided in the receiving portion pieces. The fan is embedded between the pin-shaped heat radiation fins and is superposed on the fan.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The drawings show an embodiment of a device for assembling a heat sink and a fan according to the present invention. FIG. 1 is a partially cutaway front view of the assembled heat sink and fan, and FIG. 2 is a holding plate. FIG. 3 is a perspective view of the holding frame.

In the figure, reference numeral 1 denotes a heat sink, and the heat sink 1 is manufactured by a manufacturing method described in, for example, Japanese Patent Application No. 4-207941. The lower surface 2a is in contact with a semiconductor element (CPU etc.) 3. A large number of pin-shaped radiating fins (hereinafter referred to as radiating fins) on the upper surface of the rectangular substrate 2 having a flat surface
, 4 are arranged side by side, and holding frames 5 and 5 are provided at opposite ends 2 ′ and 2 ′ of one side of the substrate 2 of the heat sink 1, and the holding frame 5 is composed of the pieces. Stop pieces 6 and 6 are provided so as to face each other with the radiation fins 4, 4, ...

The holding frame 5 is composed of an elastically deformable metal plate, and the upper end of the fixing portion piece 7 is bent downward in a U shape to form a holding portion piece 8, and the lower end of the holding portion piece 8 is covered. The gripping portion 8a is formed by bending and bending it in a letter shape to form the holding portion 8a, and cutting and raising the holding portion 8 at the center of the boundary portion between the fixing portion 7 and the holding portion 8.
Is arranged on an extension of the holding part piece 8, and the receiving part piece 6 is continuously provided at both ends of the boundary part so as to be parallel to the gripping piece piece 9 in an upward direction. The receiving hole 10 is provided in the receiving portion 6a which is bent in a dogleg shape at the upper end of the.

This holding frame 5 is attached to one of the opposite ends 2 ', 2'of the substrate 2 with a fixing screw 11 in the fixing portion piece 7, and the holding portion 8a of the holding portion piece 8 is placed below the substrate 2. On the other hand, the receiving portions 6a of the receiving portion pieces 6 are made to face each other with the radiation fins 4, 4 ,.

In the figure, reference numeral 12 denotes a fan, which is lower than a group of inside one of the radiation fins 4, 4, ... Standing on the substrate 2 as compared with another group surrounding the group. Fitting space 13 provided (by cutting off the upper part)
Which is fitted to the heat sink 1 and
Cooling air is blown from the ventilation blades provided on the four sides and the bottom surface of the base body to blow cold air by the blower vanes to the respective radiation fins 4 and the substrate 2.
Is designed to be cooled.

Reference numeral 15 is a holding plate superposed on the fan 12, and the holding plate 15 is a window 1 for introducing air into the fan 12.
7 on the four sides of the main plate 18 provided in the center, side plates 20, 20,
20 and 20 are arranged in series, and the side plates 20, 20, 20, 20
The receiving portion 6a in a horizontal direction to a pair of opposing
The locking piece 19 is provided so as to correspond to the above, and the locking piece 1 is placed on the fan 12 or the radiation fin 4.
The locking portion 19a provided at the tip of 9 is locked in the receiving hole 10 provided in the receiving portion 6a by utilizing the elastic deformation of the receiving portion piece 6 (the locking portion piece 19 or the side plate). 20 may be elastically deformed).

The fan 12 is fitted into the fitting space 13, and the holding plate 15 is arranged so as to overlap with the fan 12, and the locking portion 19a of the holding plate 15 is locked in the receiving hole 10 to cause the fan 12 to move. In the heat sink 1 with the assembled substrate 2, the substrate 2 is superposed on the semiconductor element 3 assembled with the wiring substrate 27, and the superposed state of the holding portion 8 (which is opened and closed by utilizing the elasticity of the handle portion 9) is held. The semiconductor element 3 is held by being held by the holding portion 8a. Reference numeral 28 in the drawing denotes a lead wire insertion hole.

[0013]

Since the present invention has the above-mentioned constitution,
The heat sink and the fan can be easily assembled without special processing, and the assembled state can be reliably maintained.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view showing a state where a heat sink and a fan are assembled.

FIG. 2 is a perspective view of a holding plate.

FIG. 3 is a perspective view of a holding frame.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 heat sink 2 substrate 3 semiconductor element 4 pin type radiation fin 6 receiving part piece 10 receiving hole 12 fan 15 holding plate 19 locking part piece

Claims (1)

[Claims] 1. A device for assembling a heat sink having a large number of pin-shaped heat radiation fins arranged in parallel on the upper surface of a substrate whose lower surface is in contact with a semiconductor element, and a fan for cooling the heat sink, wherein the pin-shaped heat radiation is applied to the heat sink. The pin-shaped pin is provided with a holding plate provided with opposed fins with a fin interposed therebetween, and the holding plate elastically locked by the locking pieces provided on both sides in the receiving hole provided in the receiving plate. An assembly device of a heat sink and a fan, which is polymerized on a fan embedded between heat radiation fins.