JPH07304107A - Conductive floor tiles - Google Patents

Abstract

(57) [Summary] [Objective] Conductive floor tiles and conductive through-chip tiles having a volume resistance value of 10 ⁴ to 10 ⁶ Ω, no surface bleeding, excellent dimensional stability, and unlimited coloring. provide. [Structure] A conductive floor tile mainly composed of a conductive filler and a thermoplastic resin, which is obtained by previously impregnating an inorganic powder with a quaternary ammonium salt-type compound, and an inorganic powder containing the quaternary ammonium salt-type compound in advance. A conductive through-chip tile in which 40% by weight or more of a chip mainly composed of an impregnated conductive filler and a thermoplastic resin are randomly mixed.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a computer room,
The present invention relates to a conductive floor tile used for floors of IC assembly factories, clean rooms and the like.

[0002]

2. Description of the Related Art Conventionally, conductive floor tiles used for floors in computer rooms, IC assembly plants, clean rooms, etc. include metal fibers, metal powders, metal oxides having conductivity in the composition of floor tiles. There are those in which a conductive material such as carbon black or carbon fiber is added, or those in which these are added are laminated and integrated as a conductive sheet.

[0003]

The conventional floor tile composition to which a conductive material is added is limited in coloring because the color of the conductive material itself is black or dark. There is a problem of loss of sex. Further, a floor tile composition in which a quaternary ammonium salt type antistatic agent is simply mixed is not limited by coloring, but the volume resistance value does not decrease to 10 ⁴ to 10 ⁶ Ω, and the floor material surface is not affected. There are problems such as migration of the antistatic agent (surface bleeding) and deterioration of dimensional stability. The present invention solves these problems and has a volume resistance value of 10 ⁴ to 10 ⁶ without coloring limitation.
It is an object of the present invention to provide a conductive floor tile having a surface bleeding property of Ω which is excellent in dimensional stability and has no bleeding.

[0004]

[Means for Solving the Problems] The above-mentioned problem is a conductive floor tile mainly composed of a conductive filler and a thermoplastic resin in which an inorganic powder is impregnated with a quaternary ammonium salt type compound in advance or a quaternary class in advance. This is solved by a conductive through-chip tile in which 40 wt% or more of a conductive filler in which an ammonium salt type compound is impregnated in an inorganic powder and a chip mainly composed of a thermoplastic resin are randomly mixed. The conductive floor tile and the conductive through chip tile of the present invention will be described below.

The thermoplastic resin used in the conductive floor tile of the present invention is a thermoplastic resin such as vinyl chloride resin or vinyl chloride-vinyl acetate copolymer resin (polymerization degree: 500 to 1500) which can be used in the flooring material.

The inorganic powder used in the conductive floor tile of the present invention is calcium carbonate, talc, mica, clay and the like. From the viewpoint of coloring of the conductive floor tile, white inorganic powder such as calcium carbonate, talc, mica and clay is preferable. Depending on the color of the conductive floor tile, colored inorganic powder other than white inorganic powder can be used.

The quaternary ammonium salt type compound used in the conductive floor tile of the present invention has a structural formula

[0008]

[Chemical 1]

It is represented by For example, those having an amide bond and whose anion is a perchlorate anion, or cation-based ones in which an anion is a nitrate ion such as stearamidopropyldimethyl-β-hydroxyethylammonium nitrate are listed. .

The conductive filler of the present invention is an inorganic powder 100.
Quaternary ammonium salt type compound 0.1 to 1 relative to parts by weight
0 parts by weight was added, and the mixture was stirred and heated while heating to 70 to 140 ° C. to adhere and adsorb the quaternary ammonium salt type compound on the surface of the inorganic powder.

The conductive floor tile according to the first aspect of the present invention comprises the following composition components as the thermoplastic resin 10 to 20% by weight Stabilizer / binder 1 to 3% by weight Plasticizer 3 to 10% by weight Conductivity Filler 60 to 85% by weight Other additives 1 to 10% by weight Kneading under pressure with a Banbury mixer, then heat kneading with a mixing roll, and sheeting with a calendar roll,
It is manufactured by cutting it into a predetermined size.

The conductive through-chip tile according to the second aspect of the present invention is formed into a sheet with a calender roll in the same manner as the conductive floor tile according to the first aspect of the present invention, and then crushed to a size of 2 to 5 mm at the maximum. Amorphous through-chip is manufactured. In the same manner, a through chip mainly composed of a conventional filler made of inorganic powder and a thermoplastic resin is manufactured. Both through-chips are mixed, heated, sheeted, then rolled with a calender roll and cut with a cutter to manufacture. In the conductive through-chip tile according to the invention of claim 2 of the present application, it is necessary to mix 40% by weight or more of a through-chip using a conductive filler. 40% by weight
If it is less than the above range, sufficient conductivity may not be obtained in some cases.

[0013]

The conductive filler in the present invention has high conductivity because the quaternary ammonium salt type compound is previously adsorbed and adsorbed on the inorganic powder. In the conductive floor tile of the present invention, a thermoplastic resin having extremely low conductivity and a conductive filler having high conductivity are mixed. Therefore, the electric charge charged on the conductive floor tile of the present invention is grounded through the conductive filler having high conductivity. Further, since the quaternary ammonium salt type compound is sufficiently adhered / adsorbed to the inorganic powder in advance, it does not bleed to the surface of the conductive floor tile. If inorganic powder having a high degree of whiteness is used and a color pigment is added as an additive to the composition component, the coloring can be freely colored. Further, in the conductive through chip tile of the present invention, a through chip having a high conductivity and a through chip having an extremely low conductivity are mixed, and the electric charge charged in the conductive through chip tile is grounded through the through chip having a high conductivity. Further, since the quaternary ammonium salt type compound is sufficiently adhered and adsorbed to the inorganic powder in advance, it does not bleed on the surface of the conductive through chip tile.

[0014]

【Example】

[Conductive filler] Structural formula while heating and stirring 100 parts by weight of calcium carbonate with a ribbon blender from room temperature to 80 ° C.

[0015]

[Chemical 2]

6 parts by weight of the quaternary ammonium salt type compound shown in 1 was added, and the mixture was further heated and stirred up to 100 ° C. to be adsorbed on the surface of the calcium carbonate particles to obtain a conductive filler in the present invention. Insulation resistance meter (insulation resistance meter (K-1) manufactured by Kasuga Electric Co., Ltd.)
When measured at 20 ° C. and 65% RH, it is 5.0 × 10 ^6.
It was less than (Ω). The electric resistance value of untreated calcium carbonate was 4.0 × 10 ⁸ (Ω). The conductive filler was tested as follows.

Example 1 The following composition components (conductive composition) vinyl chloride resin 12% by weight plasticizer 4% by weight binder and stabilizer 2% by weight conductive filler 75% by weight other additives 7% by weight Banbury Knead with a mixer, heat with a mixing roll, and roll with a calendar roll to a thickness of 2 mm
The sheet was cut into 304.8 mm × 304.8 mm to obtain a conductive floor tile of the present invention.

[Embodiment 2] A sheet having a thickness of 2 mm was rolled by a calender roll in the same manner as in Embodiment 1, and the sheet was crushed by a crusher to obtain an amorphous chip (hereinafter referred to as a conductive chip) having a maximum length of 2 to 5 mm. Obtained. The following composition components (non-conductive composition) Vinyl chloride resin 12% by weight Plasticizer 6% by weight Binder, stabilizer 3% by weight Filler 79% by weight are kneaded with a Banbury mixer, heated and kneaded with a mixing roll, and further calender rolls Rolled to a thickness of 2 mm
Sheet, and hang this sheet on the crusher for up to 2
~ 5 mm irregular shaped chip (hereinafter referred to as non-conductive chip)
Got Next, the conductive tip and the non-conductive tip are set to 60: 4.
Mix in a ratio of 0 to form a heating sheet, and roll with a calendar roll to form a sheet with a thickness of 2 mm, which is 304.8 mm x 3
It was cut into 04.8 mm to obtain a conductive through-chip tile of the present invention.

Comparative Example 1 Composition components of the following conventional antistatic tile: Vinyl chloride resin 18% by weight Plasticizer 6% by weight Binder, stabilizer 2% by weight Filler 72% by weight Quaternary ammonium salt type antistatic 2% by weight of the agent is kneaded with a Banbury mixer, heated and kneaded with a mixing roll, and further rolled with a calender roll to obtain a thickness of 2 mm.
Sheet was cut into 304.8 mm × 304.8 mm to obtain a floor tile for comparison.

Comparative Example 2 A floor tile for comparison was obtained in the same manner as in Example 2 except that the ratio of conductive chips to non-conductive chips was 30:70.

[Tests and Results] The tiles obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were subjected to the following tests and the results are shown in Table 1. Electric resistance: Bureau of Mechanical Information Industry, Ministry of International Trade and Industry "Electronic computer system safety measure standard: Volume resistance measuring method" JIS K-6911 "General thermosetting plastic testing method 5.13 Resistivity" Length change rate by heating: JIS A-5705 "Vinyl flooring material 6.7 Length change test by heating" Bleed property: After standing for 10 days in an environment of 23 ° C and 65% RH, migration of an antistatic agent or the like to the tile surface was visually judged.

[0022]

[Table 1] Remarks: MITI, K-6911 measurement, each sample is 20
It was cured for 90 hours in an environment of 40 ° C and 40% RH, and measured. The volume resistance value (Ω) according to the Ministry of International Trade and Industry method of Examples 1 and 2 is shown in the table as 5.0 × 10 ⁶ or less because the lower limit of the measuring instrument is 5.0 × 10 ⁶ (Ω).

[0023]

As shown in the results of Table 1, the conductive floor tile and the conductive through-chip tile of the present invention have a volume resistance value of 5.0 × 10 ⁶ or less (Ω) according to the Ministry of International Trade and Industry, and JIS K-6911 method.
Excellent in 3.5 × 10 ⁵ and 1.0 × 10 ⁶ (Ω), excellent in dimensional stability as compared with the conventional tile in Comparative Example 1, more flexible in coloring, and good in bleeding property.

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Claims (2)

[Claims] 1. A conductive floor tile comprising a conductive resin and a thermoplastic resin as main materials, which are obtained by previously impregnating an inorganic powder with a quaternary ammonium salt type compound. 2. A conductive material characterized by randomly mixing 40% by weight or more of a conductive filler in which an inorganic powder has been impregnated with a quaternary ammonium salt type compound in advance and a chip mainly made of a thermoplastic resin. Sex through chip tile.