JPH07304B2 - Mold for exterior resin molding of composite electronic parts - Google Patents
Mold for exterior resin molding of composite electronic partsInfo
- Publication number
- JPH07304B2 JPH07304B2 JP1080954A JP8095489A JPH07304B2 JP H07304 B2 JPH07304 B2 JP H07304B2 JP 1080954 A JP1080954 A JP 1080954A JP 8095489 A JP8095489 A JP 8095489A JP H07304 B2 JPH07304 B2 JP H07304B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- exterior resin
- molding die
- resin
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000465 moulding Methods 0.000 title claims description 59
- 229920005989 resin Polymers 0.000 title claims description 58
- 239000011347 resin Substances 0.000 title claims description 58
- 239000002131 composite material Substances 0.000 title claims description 28
- 239000004020 conductor Substances 0.000 claims description 29
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
- 239000003990 capacitor Substances 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、抵抗、コンデンサ、インダクタ等の電子部品
を組み合わせて新たな機能を具備した複合電子部品の外
装樹脂を成形する成形用型に関する。Description: TECHNICAL FIELD The present invention relates to a molding die for molding an exterior resin of a composite electronic component having a new function by combining electronic components such as a resistor, a capacitor, and an inductor.
［従来の技術］ 例えば、複合電子部品の例として、LC複合電子部品を第
５図により説明する。インダクタ２、２は、例えばフェ
ライト磁芯に巻線を施して、その端末を磁芯に植設した
リード線に絡げ、磁芯等の表面を絶縁性の樹脂で被覆し
たものである。コンデンサ３は誘電体セラミック素体の
表面に一対の電極を形成し、この電極からリード線を導
出し、その素体上を絶縁性の樹脂で被覆したものであ
る。[Prior Art] For example, as an example of a composite electronic component, an LC composite electronic component will be described with reference to FIG. The inductors 2 and 2 are, for example, windings on a ferrite magnetic core, entwining the ends thereof with a lead wire planted in the magnetic core, and coating the surface of the magnetic core with an insulating resin. The capacitor 3 is formed by forming a pair of electrodes on the surface of a dielectric ceramic body, leading out lead wires from the electrodes, and coating the body with an insulating resin.
これらのインダクタ２、２及びコンデンサ３の一方のリ
ード線５を、第５図のように導体１に接続し、これらを
外装樹脂７で覆い、LC複合電子部品を構成している。One of the lead wires 5 of the inductors 2 and 2 and the capacitor 3 is connected to the conductor 1 as shown in FIG. 5, and these are covered with the exterior resin 7 to form an LC composite electronic component.
従来、このような複合電子部品に外装樹脂７を施す場
合、接続されたインダクタ２、２とコンデンサ３とを、
半割状の成形型に挿入し、組み立てた成形型内に溶解し
た樹脂を注入、これを硬化させることによって行われて
いる。前記成形型の対向する内壁には、それを組み立て
た時、電子部品のうち、例えばインダクタ２、２の側面
を両側から挟む位置に一対の突起が設けられている。ま
た、この成形型の下部に互いに接続されていないインダ
クタ２、２とコンデンサ３の他方のリード線６を導出す
る溝が設けられ、その上部に溶解した樹脂を成形型内に
注入する注入孔が設けられている。Conventionally, when applying the exterior resin 7 to such a composite electronic component, the connected inductors 2 and 2 and the capacitor 3 are
It is performed by inserting the resin into a half-molded mold, injecting the melted resin into the assembled mold, and curing the resin. A pair of protrusions are provided on the inner walls of the molding die, which face each other, at positions where, for example, the side surfaces of the inductors 2 and 2 of the electronic component are sandwiched from both sides when they are assembled. In addition, a groove for leading out the other lead wire 6 of the inductors 2 and 2 and the capacitor 3 which are not connected to each other is provided in the lower part of the molding die, and an injection hole for injecting the melted resin into the molding die is provided above the groove. It is provided.
前記の突起は、インダクタ２、２の成形型内での位置を
規制するもので、外装樹脂７を形成する際、内部の電子
部品が所定の位置からずれないようにするためのもので
ある。従って、半割状の成形型を組み立てた時に、互い
の成形型の突起の先端の間隔は、塗装されたインダクタ
２、２の径と等しいことが好ましい。しかし、塗装され
たインダクタ２、２の径には相当なバラツキがあり、こ
のバラツキを皆無にすることは現実には困難である。そ
こで、そのバラツキを見込んで、突起の先端の間隔に
は、インダクタの径に対して相当の余裕が与えてある。The protrusions serve to regulate the positions of the inductors 2 and 2 in the molding die and prevent the internal electronic components from being displaced from predetermined positions when the exterior resin 7 is formed. Therefore, when the mold halves are assembled, the distance between the tips of the protrusions of the molds is preferably equal to the diameter of the coated inductors 2, 2. However, there are considerable variations in the diameters of the coated inductors 2 and 2, and it is actually difficult to eliminate this variation. Therefore, in consideration of the variation, the gap between the tips of the protrusions has a considerable margin with respect to the diameter of the inductor.
第５図は、外装樹脂７の成形の後、成形型から取り出し
た複合電子部品を示すもので、外装樹脂中にインダクタ
２、２とコンデンサ３とが正常な位置にモールドされた
状態を示す。この第５図において、符号４は、成形型の
突起の跡である。FIG. 5 shows the composite electronic component taken out from the molding die after the molding of the exterior resin 7, and shows a state in which the inductors 2, 2 and the capacitor 3 are molded in normal positions in the exterior resin. In FIG. 5, reference numeral 4 is a mark of the protrusion of the molding die.
［発明が解決しようとする課題］ しかしながら、前記従来の成形用型によって電子部品に
外装樹脂を施す場合、成形型内で対向する突起が、複合
電子部品を構成する電子部品の径より多少広めの間隔で
対向しているので、実際には成形型の突起が実際に電子
部品を挟持せずに、電子部品が遊動可能な状態で溶解し
た樹脂が成形型内に圧入されることになる。このため、
流動樹脂の圧力によって、例えば、第６図に示すよう
に、成形型内部の電子部品が所定の位置から移動し、そ
のまま樹脂が硬化されて外装樹脂７が形成されることが
ある。また時には、内部の電子部品が外装樹脂から露出
し、不良品になる。このため、製品の歩留りが低く、生
産性が低いという課題があった。[Problems to be Solved by the Invention] However, when an external resin is applied to an electronic component by the conventional molding die, the protrusions facing each other in the molding die are slightly wider than the diameter of the electronic component forming the composite electronic component. Since they are opposed to each other at intervals, the protrusions of the molding die do not actually sandwich the electronic component, and the resin melted in a state in which the electronic component is free to move is press-fitted into the molding die. For this reason,
Due to the pressure of the flowing resin, for example, as shown in FIG. 6, the electronic component inside the molding die may move from a predetermined position and the resin may be cured as it is to form the exterior resin 7. In addition, the electronic components inside are sometimes exposed from the exterior resin and become defective. Therefore, there are problems that the yield of products is low and the productivity is low.
さらに、複合電子部品の外装樹脂を施した後は、すべて
の電子部品が外装樹脂に完全に覆われてしまうため、そ
の後、複合電子部品を構成する個々の電子部品について
は、その特性の測定を行うことができなかった。従っ
て、複合電子部品としての特性試験は、非破壊で行うこ
とができるが、個々の電子部品の特性試験は、一部のサ
ンプルの外装樹脂を破壊して行わなければならなかっ
た。Furthermore, after applying the exterior resin to the composite electronic component, all the electronic components will be completely covered with the exterior resin, so the characteristics of the individual electronic components that make up the composite electronic component must be measured. Could not be done. Therefore, the characteristic test as the composite electronic component can be performed nondestructively, but the characteristic test of each electronic component must be performed by destroying the exterior resin of a part of the samples.
本発明の目的は、前記従来技術の課題を解消するもの
で、複合電子部品を構成する電子部品を成形型内の所定
の位置に収めた状態で外装樹脂を成形することができ、
しかも外装樹脂の成形後でも、個々の電子部品の特性測
定が可能となる外装樹脂成形用型を提供することにあ
る。An object of the present invention is to solve the above-mentioned problems of the prior art, and it is possible to mold the exterior resin in a state where the electronic component forming the composite electronic component is housed at a predetermined position in the molding die,
Moreover, it is an object of the present invention to provide an outer resin molding die that enables the characteristics of individual electronic components to be measured even after the outer resin is molded.
［課題を解消するための手段］ すなわち、前記本発明の目的を達成するための手段の要
旨は、複数の電子部品を並列に配し、その一方のリード
線を互いに接続し、他方のリード線を同一方向に平行に
導出し、これら電子部品を成形型内に配置すると共に、
前記他方のリード線を成形型から導出し、この導出部分
で同リード線を支持した状態で、同成形型内に樹脂を注
入して硬化させることにより、前記他方のリード線を除
いて電子部品を一体に覆う外装樹脂を成形する複合電子
部品の外装樹脂成形用型において、前記成形型の内壁
に、前記複数の電子部品の一方のリード線を互いに接続
する導体を両側から挟持する突起を設けたことを特徴と
する複合電子部品の外装樹脂成形用型である。[Means for Solving the Problems] That is, the gist of the means for achieving the object of the present invention is to arrange a plurality of electronic components in parallel, connect one of the lead wires to each other, and connect the other lead wire to each other. And parallel to the same direction, and place these electronic components in the mold,
The other lead wire is led out from the molding die, and while the lead wire is supported by the leading portion, a resin is injected into the molding die and cured to remove the other lead wire, and the electronic component is removed. In a mold for molding an exterior resin of a composite electronic component for integrally molding an exterior resin, a protrusion for sandwiching a conductor for connecting one lead wire of the plurality of electronic components from each other is provided on an inner wall of the mold. A mold for molding an exterior resin of a composite electronic component, which is characterized in that
［作用］ 本発明は、成形型に内壁に設けた突起で電子部品の一方
のリード線を接続した導体が挟持されると共に、電子部
品の他方のリード線がそれを成形型から引き出した部分
で支持される。従って、電子部品は、その両端側が共に
成形型に支持されるので、安定した状態で成形型内に支
持、配置される。[Operation] According to the present invention, the conductor to which one lead wire of the electronic component is connected is sandwiched by the protrusion provided on the inner wall of the molding die, and the other lead wire of the electronic component is a portion pulled out from the molding die. Supported. Therefore, since both ends of the electronic component are both supported by the molding die, the electronic component is stably supported and arranged in the molding die.
また、前記電子部品の一方のリード線を接続する導体
は、金属であり、絶縁樹脂塗装等を設けた部品本体部分
より寸法精度がはるかに高いため、突起の対向間隔と導
体の幅寸法との間に大きな余裕を持たせる必要はない。
このため、導体を突起の間に確実に挟持することができ
る。Further, since the conductor connecting one of the lead wires of the electronic component is a metal and has much higher dimensional accuracy than the component main body portion provided with an insulating resin coating or the like, the distance between the facing interval of the protrusion and the width dimension of the conductor is There is no need to leave a big margin between them.
Therefore, the conductor can be reliably sandwiched between the protrusions.
この２つの点から、成形型内での電子部品の遊動を確実
に防止でき、電子部品を確実に固定した状態で成形型内
に樹脂を注入することができる。From these two points, it is possible to reliably prevent the electronic component from moving in the molding die, and it is possible to inject the resin into the molding die while the electronic component is securely fixed.
さらに、前述のようにして、外装樹脂を成形する際、電
子部品の一方のリード線を接続する導体が突起に挟持さ
れるため、成形された外装樹脂には、突起の跡として、
その表面から前記導体に達する穴が形成される。そのた
め、この穴から測定用の接触針を挿入して前記導体と接
触、導通させることで、各電子部品の外装樹脂から導出
されたリード線との間で各電子部品の特性が測定でき
る。Furthermore, as described above, when the exterior resin is molded, the conductor connecting one of the lead wires of the electronic component is sandwiched by the protrusions, so that the molded exterior resin shows marks of the protrusions.
A hole is formed from its surface to the conductor. Therefore, the characteristic of each electronic component can be measured with the lead wire derived from the exterior resin of each electronic component by inserting the contact needle for measurement through this hole and contacting and conducting with the conductor.
［実施例］ 以下、図面を参照しながら、本発明の実施例について詳
細に説明する。Embodiments Embodiments of the present invention will be described in detail below with reference to the drawings.
まず、第１図で示すように、複合電子部品を構成する電
子部品を用意し、それらを平行に並べて、一方のリード
線を導体で接続する。例えば、第３図で示すように、ア
キシャルリード型のインダクタ２、２とコンデンサ３と
を用意し、２個のインダクタ２、２の間にコンデンサ３
を並列に配置し、これらの一方のリード線５を、別に用
意した平板状の導体１にスポット溶接し、他方のリード
線６を平行に導出する。First, as shown in FIG. 1, electronic components that make up a composite electronic component are prepared, they are arranged in parallel, and one lead wire is connected by a conductor. For example, as shown in FIG. 3, the axial lead type inductors 2 and 2 and the capacitor 3 are prepared, and the capacitor 3 is placed between the two inductors 2 and 2.
Are arranged in parallel, one of these lead wires 5 is spot-welded to a separately prepared flat plate-shaped conductor 1, and the other lead wire 6 is led out in parallel.
次に、第４図に示したような成形型８を一対用意する。
第４図では、一方の成形型８のみを示している。この成
形型８の内壁の上部に突起４′が一対設けられている。
この突起４′は、内部に前記の電子部品、つまりインダ
クタ２、２とコンデンサ３とを挿入した状態で一対の成
形型８を組み立てると、前記平板状の導体１を両側から
挟持する位置に設けられている。また、組み立てた状態
で、成形型８、８から突設された突起４′の先端間隔
は、前記導体１の厚みとほぼ同等であり、それらの先端
が導体１に接触して同導体１を挟持する。また、この成
形型８の下部に互いに接続されてないインダクタ２、２
とコンデンサ３の他方のリード線６を導出する溝10が設
けられ、その上部に溶解した樹脂を導く注入孔９が設け
られている。Next, a pair of molding dies 8 as shown in FIG. 4 are prepared.
In FIG. 4, only one molding die 8 is shown. A pair of protrusions 4 ′ is provided on the upper part of the inner wall of the molding die 8.
When the pair of molding dies 8 are assembled with the above-mentioned electronic parts, that is, the inductors 2 and 2 and the capacitor 3 inserted therein, the projections 4'are provided at positions where the flat conductor 1 is sandwiched from both sides. Has been. Further, in the assembled state, the distance between the tips of the protrusions 4'protruded from the molding dies 8 and 8 is almost equal to the thickness of the conductor 1, and the tips contact the conductor 1 so that the same conductor 1 is formed. Hold it. In addition, inductors 2 and 2 which are not connected to each other are formed below the molding die 8.
A groove 10 for leading the other lead wire 6 of the capacitor 3 is provided, and an injection hole 9 for leading the melted resin is provided above the groove 10.
このような成形型８に前記の導体１に接続したインダク
タ２、２とコンデンサ３を挿入し、成形型８を組み立て
ると、インダクタ２、２とコンデンサ３の一方のリード
線５を接続した導体１が前記突起４′、４′で挟持され
ると共に、他方のリード線６がそれを引き出す成形型８
の溝10により両側から保持される。従って、インダクタ
２、２とコンデンサ３は、その両端のリード線５、６側
が各々突起４′、４′と溝10とで両側から支持された状
態で成形型８内に配置される。従って、この状態で成形
型８内に溶解したエポキシ樹脂等を注入し、これを硬化
させると、外装樹脂７が成形される。この時、注入した
樹脂の圧力によって成形型８の内部に配置したインダク
タ２、２とコンデンサ３が移動しない。When the inductors 2 and 2 and the capacitor 3 connected to the conductor 1 are inserted into the molding die 8 and the molding die 8 is assembled, the conductor 1 in which the inductors 2 and 2 and one lead wire 5 of the capacitor 3 are connected to each other. Is clamped by the projections 4 ', 4', and the other lead wire 6 pulls it out.
It is held from both sides by the groove 10. Therefore, the inductors 2 and 2 and the capacitor 3 are arranged in the molding die 8 in such a manner that the lead wires 5 and 6 at both ends thereof are supported from both sides by the projections 4 ′ and 4 ′ and the groove 10, respectively. Therefore, in this state, when the melted epoxy resin or the like is injected into the molding die 8 and cured, the exterior resin 7 is molded. At this time, the pressure of the injected resin does not move the inductors 2 and 2 and the capacitor 3 arranged inside the molding die 8.
第１図に本発明の成形用型により外装樹脂７を成形した
複合部品の透視図を示し、第２図にその断面図を示す。
これらの図において、４は、前記成形型８の突起４′の
跡である。FIG. 1 shows a perspective view of a composite part obtained by molding the exterior resin 7 with the molding die of the present invention, and FIG. 2 shows a sectional view thereof.
In these figures, 4 is a mark of the protrusion 4 ′ of the molding die 8.
なお、前記の実施例では、各電子部品を接続する導体１
に平板を用いたが、インダクタ２、２やコンデンサ３等
の電子部品から導出されたリード線５を折り曲げて互い
に接続することもできる。そのときは、接続したリード
線を前記導体として前記導体１と同様に挟持する。ま
た、突起４′を導体１に沿って直線的に長く形成しても
良い。また突起４′の数に特に限定はなく、突起４′を
３つ以上設けることもできる。In the above embodiment, the conductor 1 connecting each electronic component
Although the flat plate is used for the above, the lead wires 5 derived from the electronic components such as the inductors 2 and 2 and the capacitor 3 may be bent and connected to each other. At that time, the connected lead wire is sandwiched as the conductor in the same manner as the conductor 1. Further, the protrusion 4'may be linearly elongated along the conductor 1. The number of protrusions 4'is not particularly limited, and three or more protrusions 4'can be provided.
なお、本発明による成形用型では、成形型８の突起４′
と電子部品を接続する導体１とが接触したまま外装樹脂
７が成形されるので、外装樹脂７に突起４′の跡４とし
て穴が形成される。この穴から接触針を挿入して外装樹
脂７の内部の導体１との電気的導通を図ることが可能で
ある。これにより、個々の電子部品の特性測定を行うこ
とも可能である。In the molding die according to the present invention, the projection 4'of the molding die 8 is
Since the exterior resin 7 is molded while the conductor 1 for connecting the electronic component and the conductor 1 are in contact with each other, holes are formed in the exterior resin 7 as marks 4 of the protrusions 4 '. It is possible to insert a contact needle through this hole to achieve electrical conduction with the conductor 1 inside the exterior resin 7. This makes it possible to measure the characteristics of individual electronic components.
［発明の効果］ 以上説明した通り、本発明によれば、成形型に設けた突
起が、一方のリード線を互いに接続する導体を挟持する
ようにしたので、複合電子部品を構成する電子部品は、
この突起と成形型外に導出されるリード線を挟持する溝
とで両端側が成形型内に安定して支持される。また、前
記突起は部品本体部分より寸法精度がはるかに高い導体
を挟持するため、導体を突起の間に確実に挟持すること
ができる。従って、電子部品は成形型内で遊動すること
が無く、外装樹脂が成形される。これにより、電子部品
が外装樹脂内の所定の位置に埋設され、その位置の変動
が無いので、歩留りが向上し、生産性が向上する。[Effects of the Invention] As described above, according to the present invention, since the projections provided on the molding die sandwich the conductors that connect one of the lead wires to each other, the electronic component forming the composite electronic component is ,
Both ends of the projection are stably supported in the molding die by the projection and the groove for sandwiching the lead wire led out of the molding die. Further, since the projections sandwich the conductor having a much higher dimensional accuracy than the component main body portion, the conductors can be securely sandwiched between the projections. Therefore, the electronic component does not move in the mold and the exterior resin is molded. As a result, the electronic component is embedded at a predetermined position in the exterior resin and its position does not change, so that the yield is improved and the productivity is improved.
さらに、外装樹脂を成形した後でも、外装樹脂を破壊す
ることなく、複合電子部品を構成する各電子部品の特性
を測定できる。このため、最終検査及び故障時の検査が
簡便に行える。Furthermore, even after molding the exterior resin, it is possible to measure the characteristics of each electronic component forming the composite electronic component without destroying the exterior resin. Therefore, the final inspection and the inspection at the time of failure can be easily performed.
第１図は、本発明の実施例による複合部品の外装樹脂成
形用型により外装樹脂が成形された複合電子部品の内部
透視図、第２図は、同複合電子部品の縦断側面図、第３
図は、同複合電子部品の外装樹脂成形前の状態の斜視
図、第４図は、前記実施例に使用する一対の成形型の一
方を示す斜視図、第５図（ａ）は、従来例による複合部
品の外装樹脂成形用型により外装樹脂が成形された複合
電子部品の縦断正面図、同図（ｂ）は、同複合電子部品
の縦断側面図、第６図（ａ）へ、従来例による複合部品
の外装樹脂成形用型により外装樹脂が成形された複合電
子部品の内部の電子部品がずれた状態の縦断正面図、同
図（ｂ）は、同複合電子部品の縦断側面図である。 １……導体、２……インダクタ、３……コンデンサ、
４′……成形型の突起、４……外装樹脂の突起の跡、
５、６……リード線、７……外装樹脂、８……成形型FIG. 1 is an internal perspective view of a composite electronic component in which an exterior resin is molded by a mold for molding an exterior resin of a composite component according to an embodiment of the present invention, and FIG. 2 is a vertical sectional side view of the composite electronic component.
FIG. 4 is a perspective view of the composite electronic component before being molded with an exterior resin, FIG. 4 is a perspective view showing one of a pair of molding dies used in the embodiment, and FIG. FIG. 6B is a vertical sectional side view of the composite electronic component in which the exterior resin is molded by a mold for molding the exterior resin of the composite electronic component. FIG. 6B is a vertical sectional side view of the composite electronic component. FIG. 3B is a vertical sectional front view showing a state in which an electronic component inside the composite electronic component in which the exterior resin is molded by the exterior resin molding die of FIG. . 1 ... conductor, 2 ... inductor, 3 ... capacitor,
4 '... protrusion of molding die, 4 ... mark of protrusion of exterior resin,
5, 6 ... Lead wire, 7 ... Exterior resin, 8 ... Mold
Claims (1)
リード線を互いに接続し、他方のリード線を同一方向に
平行に導出し、これら電子部品を成形型内に配置すると
共に、前記他方のリード線を成形型から導出し、この導
出部分で同リード線を支持した状態で、同成形型内に樹
脂を注入して硬化させることにより、前記他方のリード
線を除いて電子部品を一体に覆う外装樹脂を成形する複
合電子部品の外装樹脂成形用型において、前記成形型の
内壁に、前記複数の電子部品の一方のリード線を互いに
接続する導体を両側から挟持する突起を設けたことを特
徴とする複合電子部品の外装樹脂成形用型。1. A plurality of electronic parts are arranged in parallel, one lead wire is connected to each other, the other lead wire is led out in parallel in the same direction, and these electronic parts are arranged in a molding die. The other lead wire is led out from the molding die, and while the lead wire is supported by the leading portion, a resin is injected into the molding die and cured to remove the other lead wire, and the electronic component is removed. In a mold for molding an exterior resin of a composite electronic component for integrally molding an exterior resin, a protrusion for sandwiching a conductor for connecting one lead wire of the plurality of electronic components from each other is provided on an inner wall of the mold. A mold for exterior resin molding of composite electronic parts, which is characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1080954A JPH07304B2 (en) | 1989-03-31 | 1989-03-31 | Mold for exterior resin molding of composite electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1080954A JPH07304B2 (en) | 1989-03-31 | 1989-03-31 | Mold for exterior resin molding of composite electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0321407A JPH0321407A (en) | 1991-01-30 |
| JPH07304B2 true JPH07304B2 (en) | 1995-01-11 |
Family
ID=13732901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1080954A Expired - Fee Related JPH07304B2 (en) | 1989-03-31 | 1989-03-31 | Mold for exterior resin molding of composite electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07304B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918498Y2 (en) * | 1978-09-12 | 1984-05-29 | 横河電機株式会社 | Reference voltage generation circuit |
-
1989
- 1989-03-31 JP JP1080954A patent/JPH07304B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0321407A (en) | 1991-01-30 |
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