JPH07307323A - Carrier for wet treatment - Google Patents

Abstract

PURPOSE:To smoothly feed and discharge chemical liquid without stagnation, and improve drain efficiency when the chemical liquid is taken out from a chemical liquid tank, concerning a carrier for wet treatment. CONSTITUTION:A protruding part is installed which protrudes from an aperture 9b of the bottom part of a carrier for wet treatment, comes into contact with the lowermost end of a wafer 5, and retains it. Thereby chemical liquid flowing down from the wafer surface is transferred to the protruding part through the lowermost part of the wafer, and made easy to flow, when the carrier for wet treatment is taken out from a chemical liquid tank. A hole 1a is formed through which the chemical liquid flows into a trench part with which the wafer 5 comes into contact.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wet processing carrier which is used when a wafer, which is a semiconductor substrate, is immersed in a chemical solution or the like for wet processing, and accommodates a plurality of wafers and is immersed in the chemical solution.

[0002]

2. Description of the Related Art FIGS. 3 (a) and 3 (b) are a perspective view and a sectional view showing an example of a conventional wet processing carrier. Conventionally, as shown in FIG. 3, a carrier for wet processing of this kind has a structure in which grooves 1 into which a plurality of wafers 5 are respectively inserted are formed side by side, and the grooves 1 are arranged facing each other and spaced apart from each other. It is provided with a pair of grooved plates 3 that are bent so that their sides are closer to each other, and a fixed plate 4 that closes both side surfaces of the grooved plates 3 that are spaced apart from each other. It is a box-shaped body having a narrow opening 9b through which the processing liquid is discharged. Also, the groove 1 of this box-shaped body
The windows 2 are provided at the two positions so that the processing liquid can be easily discharged.

Due to such a structure, FIG.
As shown in (b), when the wafer 5 is put in the carrier for wet processing, the wafer 5 comes into contact with and is supported by the bottom of the groove 1 bent inside the grooved plate 3. Further, the bottom plate is not provided at the bottom in order to improve the flow efficiency of the treatment liquid on the surface of the wafer.

The procedure for treating a wafer with such a wet treatment carrier is as follows. First, the wet treatment carrier containing the wafer 5 is immersed in a chemical bath for a certain period of time, then taken out, and then placed in a washing bath. By exchanging several times, the chemical liquid on the surface of the wafer and the carrier for wet processing is completely replaced with pure water. After that, the carrier for wet processing is taken out from the water washing tank and loaded in a dryer to remove pure water from the surface of the wafer and the carrier for wet processing to complete the wet processing of the wafer.

[0005]

In the conventional wet processing carrier described above, for example, when wet etching is performed, when the wafer is taken out from the etching tank by the conventional wet processing carrier, the chemical solution attached to the wafer is removed. Although most of the liquid drops, the liquid chemical residue 8 shown in FIG. 3 is generated at the bottom of the wafer due to the surface tension of part of the liquid chemical. As a result, there is a problem that while the wafer is being moved from the etching tank to the water washing tank, the remaining etching liquid etches the lowermost portion of the wafer, resulting in over-etching and defective circuit elements in that portion. Further, there is a problem that the etching solution is not sufficiently filled in a portion of the grooved plate which is bent inward and comes into contact with the wafer, and an etching residue 7 shown in FIG. 3 is generated in this portion.

Therefore, an object of the present invention is to provide a carrier for wet treatment which is free from stagnation and which can smoothly discharge and inject a chemical solution and which is well drained when taken out from the chemical solution tank.

[0007]

A feature of the present invention is that grooves into which a plurality of wafers are respectively inserted are formed side by side, and the grooves are opposed to each other and are spaced apart from each other, and the lower side is not close to each other. A pair of grooved plates bent so as to bend, and a fixed plate that closes both side surfaces of the grooved plates that are spaced apart are provided with a wide opening into which the wafer is inserted and a narrow opening into which the processing liquid is discharged below. The box-shaped wet processing carrier has at least one protruding member that protrudes inward from the narrow opening and contacts the lower end of the wafer. In addition, it is preferable to form a hole penetrating the bottom of the groove in contact with the wafer or to provide three protruding members to support the wafer.

[0008]

The present invention will be described below with reference to the drawings. 1 (a) and 1 (b) are a cross-sectional view showing a carrier for wet processing of one embodiment of the present invention and a perspective view showing an extracted bottom portion. As shown in FIG. 1, this wet processing carrier is provided with a protrusion 6 that protrudes from a leg 10 that passes through an opening 9b and comes into contact with the lowermost end of the wafer 5.

By providing the protrusion 6, when the wet processing carrier is taken out from the etching tank,
The chemical liquid flowing down from the wafer 5 is transmitted to the protrusion 6 via the lowermost surface of the wafer 5 and is collected in the protrusion 6 a formed below the protrusion 6. Then, the drug solution collected at the tip of the protrusion 6a forms a spherical drug drop in a state where the surface tension and the weight of the drug solution are dispersed. When the drug droplets formed by collecting the drug solution become large, the weight thereof eventually exceeds the adhesive force to the protrusion and falls. Further, it is preferable to provide a groove in the vertical direction around the outer periphery of the protrusion 6 so that the chemical liquid can be more easily transferred from the wafer 5 to the protrusion 6.

Further, by providing the protrusions 6, conventionally, there are two portions of the groove 1 for supporting the wafer 5, but now there are three portions including the protrusions 6, and the weight of the portion of the groove 1 is supported. Is reduced. As a result, when immersed in a chemical solution, the reduced supporting force is further reduced by the buoyancy force of the chemical solution, and the wafer 5 is lifted by the circulating chemical solution,
The chemical solution easily enters the contact portion between the groove 1 and the wafer 5, and the etching residue is reduced. Further, it is desirable to provide a hole 1a penetrating between the wafer 5 and a portion of the groove 1 which is in contact with the wafer so as to penetrate between the grooves so as to improve the discharge / inflow of the chemical solution. In addition, it is preferable that the carrier for wet treatment is formed of Teflon resin which is vinyl fluoride having a chemical compatibility.

FIG. 2 is a sectional view of a carrier for wet processing showing another embodiment of the present invention. As shown in FIG. 2, the carrier for wet processing is such that the protrusions 6 b supporting the wafer 5 are provided on both sides of the protrusion 6 supporting the lowermost end of the wafer 5, and the wafer 5 is floated from the groove 1. . In this way, the wafer 5 is completely floated above the groove 1 by the three protrusions 6 and 6b, whereby the chemical solution can be discharged and discharged more smoothly, and the etching residue 7 on the wafer can be completely eliminated. The projection 6b does not need to have a sharp tip, but rather it should have a flat surface so that the wafer 5 can be stably supported.

[0012]

As described above, according to the present invention, the wet processing carrier is taken out from the chemical bath by providing the projection that projects from the bottom opening of the wet processing carrier and comes into contact with the lowermost end of the wafer to support the wafer. At this time, the chemical liquid flowing down from the wafer surface can be easily transferred to the protrusions via the lowermost portion of the wafer. As a result, there is an effect that it is possible to prevent overetching due to the retention of the chemical solution.

Further, a hole through which the chemical is introduced is formed in the groove portion in contact with the wafer, or three protrusions are provided and supported by the three protrusions so as to separate the wafer from the groove, thereby supporting the groove and the wafer. There is also an effect that the etching residue due to insufficient supply of the chemical solution can be eliminated by vigorously discharging and injecting the chemical solution between and.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a wet processing carrier according to an embodiment of the present invention and a perspective view showing an extracted bottom portion.

FIG. 2 is a cross-sectional view of a carrier for wet processing showing another embodiment of the present invention.

FIG. 3 is a perspective view and a cross-sectional view showing an example of a conventional wet processing carrier.

[Explanation of symbols]

 1 Groove 1a Hole 2 Window 3 Grooved Plate 4 Fixing Plate 5 Wafer 6, 6a, 6b Protrusion 7 Remaining Etching 8 Remaining Chemical Solution 9a, 9b Opening 10 Leg

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H01L 21/68 T

Claims (3)

[Claims] 1. A pair of grooved plates in which grooves into which a plurality of wafers are respectively inserted are formed side by side, and the grooves are arranged so as to face each other and are spaced apart from each other, and are bent so that their lower sides are close to each other. A box-shaped wet processing carrier having a wide opening into which the wafer is inserted on the upper side and a narrow opening from which the processing liquid is discharged to the lower side, the fixing plate closing both side surfaces of the grooved plate, A carrier for wet processing, comprising at least one protrusion member that protrudes inward from the narrow opening and is in contact with a lower end of the wafer. 2. The wet processing carrier according to claim 1, wherein a hole is formed through the bottom of the groove that comes into contact with the wafer. 3. The carrier for wet processing according to claim 1, further comprising three protrusion members, which support the wafer.