JPH07314497A - Two-layer molding method - Google Patents

Two-layer molding method

Info

Publication number
JPH07314497A
JPH07314497A JP13257594A JP13257594A JPH07314497A JP H07314497 A JPH07314497 A JP H07314497A JP 13257594 A JP13257594 A JP 13257594A JP 13257594 A JP13257594 A JP 13257594A JP H07314497 A JPH07314497 A JP H07314497A
Authority
JP
Japan
Prior art keywords
layer
resin
mold
cavity
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13257594A
Other languages
Japanese (ja)
Inventor
Takuzo Kikuchi
拓三 菊池
Masahiro Suna
雅洋 砂
Masaru Matsuzawa
勝 松澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victor Company of Japan Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Priority to JP13257594A priority Critical patent/JPH07314497A/en
Publication of JPH07314497A publication Critical patent/JPH07314497A/en
Pending legal-status Critical Current

Links

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To provide a method for uniformly forming a thick layer over the entire periphery of one surface of one layer by the molds of a core side and a cavity side in the method for molding two layers of resin by injection molding. CONSTITUTION:Primary resin is injected from a gate 17 in a cavity, and cooled to be solidified by a cooling circuit 21. Simultaneously upon cooling, the cavity side (stationary mold 16 side) of a movable mold (core side) 15 is heated by a heater 22 to form a melted layer 23 of the primary resin. Then, secondary resin is injected from a gate 18 at the surface of the layer 23 at the mold (core side) 15 side, and a secondary resin layer is cooled to be solidified. Thus, a two-layer molded form having a uniformly thick primary resin layer over the entire periphery of the one side of the secondary resin layer can be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、射出成形による樹脂の
2層成形方法に関し、特に、コア側、キャビティ側各1
つの金型によって、一方の層の片面全周にわたって均等
に肉厚の層を形成できる2層成形方法を提供することを
目的としている。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a two-layer molding method of resin by injection molding, and more particularly, one core side and one cavity side.
An object of the present invention is to provide a two-layer molding method capable of forming a layer having a uniform thickness over the entire circumference of one surface of one layer by one mold.

【0002】[0002]

【従来の技術】まず、従来の金型後退による2層成形方
法について図9と共に説明する。同図(a)において、
キャビティ側である固定金型(固定型)2とコア側であ
る可動金型(可動型)3との一対の金型のスプール1か
ら、1層目の樹脂を射出してキャビティに樹脂を充填さ
せ、1層目を冷却固化させる。次に、同図(b)に示す
ように、可動型3を2層目の樹脂の厚さ分だけ後退さ
せ、スプール1から2層目の樹脂を射出し、2層目の冷
却固化後に金型を取り外す。
2. Description of the Related Art First, a conventional two-layer molding method by retreating a mold will be described with reference to FIG. In FIG.
The resin of the first layer is injected from the spool 1 of a pair of molds including the fixed mold (fixed mold) 2 on the cavity side and the movable mold (movable mold) 3 on the core side to fill the cavity with the resin. Then, the first layer is cooled and solidified. Next, as shown in FIG. 3B, the movable die 3 is retracted by the thickness of the resin of the second layer, the resin of the second layer is injected from the spool 1, and after the second layer is cooled and solidified, the metal mold is removed. Remove the mold.

【0003】この方法の問題点は、同図(c)に示すよ
うに、2層目の樹脂4が金型の端面方向に成形されない
ことである(金型端面部5,6には、抜きテーパーの角
度にも依存するが、2層目の樹脂が回り込めない難点が
ある。)。よって、1層目のキャビティ側全面にわたっ
ては2層目が成形できず、不完全な2層成形となってし
まう。
The problem with this method is that the resin 4 of the second layer is not molded in the end face direction of the mold as shown in FIG. Although it depends on the taper angle, there is a problem that the second layer resin cannot go around.) Therefore, the second layer cannot be molded over the entire cavity side of the first layer, resulting in incomplete two-layer molding.

【0004】次に、キャビティ側である固定型を2個、
コア側である可動型を1個用いて完全な2層成形品が得
られる従来方法を図10と共に説明する。同図(a)は
1層目の成形過程であり、固定型7と可動型8とを用
い、スプール&ランナ10から1層目の樹脂を射出しそ
の樹脂を冷却固化させて1層目の成形品9を得る。次
に、可動型8は、1層目の成形品9を保持したまま2番
目の固定型12と組み合わされる。この時、スプール&
ランナ10等は、自動的にカットされるか、2層目の成
形に支障を来たさない位置に配置される。また、2番目
の固定型12と可動型8とは、機械的な回転等により組
み合わされる。同図(b)は2層目の成形過程であり、
スプール&ランナ14から2層目の樹脂を射出しその樹
脂を冷却固化させて2層目の成形品13を得、最後に金
型を取り外す。
Next, two fixed molds on the cavity side,
A conventional method for obtaining a complete two-layer molded product by using one movable mold on the core side will be described with reference to FIG. FIG. 3A shows the molding process of the first layer, in which the fixed mold 7 and the movable mold 8 are used to inject the resin of the first layer from the spool & runner 10 to cool and solidify the resin to form the first layer. A molded product 9 is obtained. Next, the movable mold 8 is combined with the second fixed mold 12 while holding the molded product 9 of the first layer. At this time, spool &
The runners 10 and the like are automatically cut or placed at positions that do not hinder the molding of the second layer. The second fixed die 12 and the movable die 8 are combined by mechanical rotation or the like. The same figure (b) is the molding process of the second layer,
The resin of the second layer is injected from the spool & runner 14, the resin is cooled and solidified to obtain a molded product 13 of the second layer, and finally the mold is removed.

【0005】この方法では、前述の方法のような金型端
面方向に2層目が成形されないといった問題はなく、1
層目のキャビティ側全面にわたって2層目が成形でき
る。(同図(c)参照)
In this method, there is no problem that the second layer is not formed in the direction of the end face of the mold, unlike the above-mentioned method.
The second layer can be molded over the entire cavity side of the layer. (See Figure (c))

【0006】しかし、上記方法は、固定型が2個必要で
あったり、2個の固定型の交換のために可動型を回転さ
せる機構が必要となり、成形機の大型化、金型設備の増
加等、コスト面と設置スペースの面とで問題があった。
However, the above method requires two fixed dies or a mechanism for rotating the movable dies for exchanging the two fixed dies, thus increasing the size of the molding machine and increasing the die equipment. However, there was a problem in terms of cost and installation space.

【0007】[0007]

【発明が解決しようとする課題】このように、従来の金
型後退による2層成形方法では、1層目のキャビティ側
全面にわたっては2層目が成形できず、不完全な2層成
形となるといった問題があり、また、従来のキャビティ
側の金型を2個使用する方法では、成形機の大型化、金
型設備の増加等、コスト面と設置スペースの面とで問題
があった。
As described above, in the conventional two-layer molding method by retreating the mold, the second layer cannot be molded over the entire cavity side of the first layer, resulting in incomplete two-layer molding. In addition, the conventional method of using two molds on the cavity side has problems in terms of cost and installation space, such as an increase in the size of a molding machine and an increase in mold equipment.

【0008】この発明は、コストや設置スペースの増大
を招かず、コア側、キャビティ側各1つの金型によっ
て、一方の層の片面全周にわたって均等に肉厚の層を形
成できる2層成形方法を提供することを目的としてい
る。
According to the present invention, a two-layer molding method is possible in which a thick layer is uniformly formed over the entire circumference of one surface of one layer by using one mold for each of the core side and the cavity side without increasing cost and installation space. Is intended to provide.

【0009】[0009]

【課題を解決するための手段】そこで、上記課題を解決
するために本発明は、コア側、キャビティ側各1つの金
型によって2層成形品を得る2層成形方法において、コ
ア側、キャビティ側各1つの金型を対向させた時の2つ
の金型間の空間であるキャビティ内に第1の樹脂を射出
して充填し、その後、前記第1の樹脂を冷却固化させる
第1の工程と、前記コア側金型のキャビティ面側をヒー
ターにより加熱し、冷却固化しつつある前記第1の樹脂
の前記コア側金型面側部分を溶融層とする第2の工程
と、前記溶融層の前記コア側金型面側に第2の樹脂を射
出し、その後、前記第2の樹脂と前記溶融層とを冷却固
化させる第3の工程とを備え、前記第2の工程におい
て、前記溶融層を所定の厚さとするために、前記キャビ
ティ内の圧力と前記溶融層の温度とを検出するセンサを
用いることを特徴とする2層成形方法を提供するもので
ある。
In order to solve the above problems, the present invention provides a two-layer molding method in which a two-layer molded product is obtained by using one die for each of the core side and the cavity side. A first step of injecting and filling a first resin into a cavity, which is a space between two dies when the respective dies are opposed to each other, and then cooling and solidifying the first resin; A second step of heating the cavity surface side of the core side mold with a heater to make the core side mold surface side part of the first resin which is being cooled and solidified into a molten layer; A third step of injecting a second resin onto the core-side mold surface side and then cooling and solidifying the second resin and the molten layer, wherein the molten layer is included in the second step. Pressure in the cavity and the melting There is provided a two-layer molding method is characterized by using a sensor for detecting the temperature of the layer.

【0010】[0010]

【実施例】本発明の一実施例を説明する。図1は金型の
断面構造を示す図であり、キャビティ側である1つの固
定型16と、コア側である1つの可動型15とにより2
層成形を行う。1層目の樹脂はゲート17を用いて固定
型側(キャビティ側)から射出され、2層目の樹脂はゲ
ート18を用いて可動型側(コア側)から射出されるゲ
ート構造となっている。
EXAMPLE An example of the present invention will be described. FIG. 1 is a view showing a cross-sectional structure of a mold, which includes one fixed mold 16 on the cavity side and one movable mold 15 on the core side.
Perform layer forming. The resin of the first layer is injected from the fixed mold side (cavity side) using the gate 17, and the resin of the second layer is injected from the movable mold side (core side) using the gate 18. .

【0011】次に、射出方法について説明する。図2に
1次樹脂(1層目の樹脂)充填の概略を示す。1次樹脂
は、可動型15に設けられている20のボスやリブに入
り込まないような例えば粒子の大きな樹脂として1次樹
脂ゲート17からキャビティ内に射出される。固定型1
6のキャビティ表面は、1次樹脂が充填された後、冷却
回路21により冷却され1次樹脂は硬化する。
Next, the injection method will be described. FIG. 2 shows an outline of filling the primary resin (first layer resin). The primary resin is injected into the cavity from the primary resin gate 17 as a resin having large particles that does not enter the bosses and ribs of the 20 provided on the movable mold 15. Fixed type 1
After the surface of the cavity 6 is filled with the primary resin, it is cooled by the cooling circuit 21 and the primary resin is hardened.

【0012】冷却固化と同時(または冷却固化後)に、
可動型(コア側)15のキャビティ側表面をヒーター2
2により加熱し、冷却固化しつつある1次樹脂層のコア
側表面を溶融させ、溶融層23を形成する。溶融層23
の厚さ、温度等は、圧力・温度センサ25により所定値
となるように制御する。圧力・温度センサ25は、図4
に示すように、溶融層23のなるべく近傍に位置させ
る。溶融層23は2次樹脂(2層目の樹脂)充填のため
に重要な働きをするものである。
Simultaneously with the cooling and solidification (or after the cooling and solidification),
The surface of the movable mold (core side) 15 on the cavity side is heated by the heater 2
The core side surface of the primary resin layer which is being heated and cooled and solidified by 2 is melted to form a molten layer 23. Melting layer 23
The thickness, temperature, etc. are controlled by the pressure / temperature sensor 25 so as to have predetermined values. The pressure / temperature sensor 25 is shown in FIG.
As shown in FIG. The molten layer 23 plays an important role for filling the secondary resin (second layer resin).

【0013】図3に2次樹脂充填の概略を示す。溶融層
23の可動型(コア)15側の面に、2次樹脂が2次樹
脂ゲート18から射出される。所定量の2次樹脂の射出
が完了した後、冷却回路27に水等を流し、2次樹脂層
26を冷却固化させる。この時、2次樹脂境界面28
は、図5に示すように、樹脂の射出圧力で1次樹脂の溶
融層23をキャビティ側の1次樹脂層に押し入れる(矢
印29の方向)。また、溶融層23は、固化している1
次樹脂層により冷却されているので、溶融層23の1次
樹脂層側は固化して比較的密度が濃く比重の高い層とな
る。よって、冷却固化後の1次樹脂層と2次樹脂層との
接合面は、図3(b)に示すように、複雑に凹凸を有す
るアンカー効果による強い接合面24となる。
FIG. 3 shows an outline of the secondary resin filling. The secondary resin is injected from the secondary resin gate 18 onto the surface of the molten layer 23 on the movable mold (core) 15 side. After the injection of the predetermined amount of the secondary resin is completed, water or the like is caused to flow through the cooling circuit 27 to cool and solidify the secondary resin layer 26. At this time, the secondary resin boundary surface 28
As shown in FIG. 5, the molten layer 23 of the primary resin is pushed into the cavity-side primary resin layer by the injection pressure of the resin (in the direction of arrow 29). The molten layer 23 is solidified 1
Since it is cooled by the next resin layer, the primary resin layer side of the molten layer 23 is solidified to be a layer having a relatively high density and a high specific gravity. Therefore, the joint surface between the primary resin layer and the secondary resin layer after being cooled and solidified becomes a strong joint surface 24 due to the anchor effect having complicated irregularities as shown in FIG. 3B.

【0014】図6に冷却固化後の2層成形品の概略を示
す。この成形品を金型から取り外し、ゲートカット部3
0,31で、ゲート&ランナを切り離し、成形品として
完成させる。
FIG. 6 shows an outline of a two-layer molded product after cooling and solidification. This molded product is removed from the mold and the gate cut part 3
At 0 and 31, the gate and runner are separated and completed as a molded product.

【0015】図6に示すように、本実施例の方法は、従
来とほぼ同様のコア側、キャビティ側各1つの金型によ
って、コストや設置スペースの増大を招かず、2次樹脂
層の片面全周にわたって均等に肉厚の1次樹脂層を備え
た2層成形品を得ることができる。
As shown in FIG. 6, in the method of the present embodiment, one die for each of the core side and the cavity side, which is almost the same as the conventional one, does not cause an increase in cost and installation space, and one side of the secondary resin layer It is possible to obtain a two-layer molded product provided with a primary resin layer having a uniform thickness over the entire circumference.

【0016】例えば、1次樹脂層を柔らかい材質の樹
脂、2次樹脂層を硬い材質の樹脂とした2層成形品を、
1次樹脂層を外側としてテレビジョン受像機の筐体に利
用する(図10,図11参照)。1次樹脂層は肉厚であ
るのでクッション製を備えたものとなり、この2層成形
品は傷が付きにくくソフトな感触の外観を実現できる。
また、テレビジョン受像機以外の筐体、例えば、ラジカ
セ、掃除機等の傷が付きやすく、持ち運ぶなど移動して
使用することが多い機器の筐体としても有効である。
For example, a two-layer molded product in which the primary resin layer is a soft resin and the secondary resin layer is a hard resin is
The primary resin layer is used as an outer side for a housing of a television receiver (see FIGS. 10 and 11). Since the primary resin layer is thick, it is made of cushion material, and this two-layer molded product is hard to be scratched and has a soft touch appearance.
Further, it is also effective as a casing other than the television receiver, for example, a casing of a radio cassette player, a vacuum cleaner, or the like that is easily scratched and is often moved such as being carried around.

【0017】なお、上記実施例では、キャビティ側を固
定型、コア側を可動型としたが、その逆でもよく、ま
た、1次樹脂層をコア側から充填もよい。
In the above embodiment, the cavity side is the fixed type and the core side is the movable type, but the opposite may be the case, and the primary resin layer may be filled from the core side.

【0018】[0018]

【発明の効果】以上の通り、本発明の2層成形方法は、
コストや設置スペースの増大を招かず、コア側、キャビ
ティ側各1つの金型によって、一方の層の片面全周にわ
たって均等に肉厚の層を成形できる。さらに、2つの層
の間の接合面は、アンカー効果による強い接合面が得ら
れる。
As described above, the two-layer molding method of the present invention is
A layer having a uniform thickness can be uniformly formed over the entire circumference of one surface of one layer by using one mold for each of the core side and the cavity side without increasing cost and installation space. Furthermore, the joint surface between the two layers is a strong joint surface due to the anchor effect.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に使用する金型の一実施例を示す図であ
る。
FIG. 1 is a diagram showing an embodiment of a mold used in the present invention.

【図2】一実施例の1次樹脂充填の概略を示す図であ
る。
FIG. 2 is a diagram showing an outline of primary resin filling in one example.

【図3】一実施例の2次樹脂充填の概略を示す図であ
る。
FIG. 3 is a diagram showing an outline of secondary resin filling in one example.

【図4】圧力・温度センサの位置を示す図である。FIG. 4 is a diagram showing a position of a pressure / temperature sensor.

【図5】1次樹脂の溶融層の状態を示す図である。FIG. 5 is a diagram showing a state of a molten layer of a primary resin.

【図6】一実施例の2次樹脂射出完了後の概略を示す図
である。
FIG. 6 is a diagram showing an outline after completion of injection of a secondary resin according to an embodiment.

【図7】本発明により成形した製品の使用例を示す図で
ある。
FIG. 7 is a diagram showing an example of use of a product molded according to the present invention.

【図8】本発明により成形した製品の使用例を示す図で
ある。
FIG. 8 is a diagram showing an example of use of a product molded according to the present invention.

【図9】従来例を示す図である。FIG. 9 is a diagram showing a conventional example.

【図10】従来例を示す図である。FIG. 10 is a diagram showing a conventional example.

【符号の説明】[Explanation of symbols]

15 可動型(コア側) 16 固定型(キャビティ側) 17,18 ゲート 22 ヒーター 23 1次樹脂の溶融層 25 圧力・温度センサ 15 Movable type (core side) 16 Fixed type (cavity side) 17, 18 Gate 22 Heater 23 Melt layer of primary resin 25 Pressure / temperature sensor

フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 // B29L 9:00 Continuation of front page (51) Int.Cl. 6 Identification number Office reference number FI technical display area // B29L 9:00

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】コア側、キャビティ側各1つの金型によっ
て2層成形品を得る2層成形方法において、 コア側、キャビティ側各1つの金型を対向させた時の2
つの金型間の空間であるキャビティ内に第1の樹脂を射
出して充填し、その後、前記第1の樹脂を冷却固化させ
る第1の工程と、 前記コア側金型のキャビティ面側をヒーターにより加熱
し、冷却固化しつつある前記第1の樹脂の前記コア側金
型面側部分を溶融層とする第2の工程と、 前記溶融層の前記コア側金型面側に第2の樹脂を射出
し、その後、前記第2の樹脂と前記溶融層とを冷却固化
させる第3の工程とを備え、 前記第2の工程において、前記溶融層を所定の厚さとす
るために、前記キャビティ内の圧力と前記溶融層の温度
とを検出するセンサを用いることを特徴とする2層成形
方法。
1. A two-layer molding method for obtaining a two-layer molded product by using one mold for each of a core side and a cavity side, in which two molds for one core side and one cavity side are opposed to each other.
A first step of injecting and filling a first resin into a cavity that is a space between two molds, and then cooling and solidifying the first resin; And a second step of forming the core-side mold surface side portion of the first resin that is being cooled and solidified into a molten layer, and a second resin on the core-side mold surface side of the molten layer. And then a third step of cooling and solidifying the second resin and the molten layer, wherein in the second step, the inside of the cavity is formed in order to make the molten layer have a predetermined thickness. A two-layer molding method, characterized in that a sensor for detecting the pressure and the temperature of the molten layer is used.
JP13257594A 1994-05-23 1994-05-23 Two-layer molding method Pending JPH07314497A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13257594A JPH07314497A (en) 1994-05-23 1994-05-23 Two-layer molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13257594A JPH07314497A (en) 1994-05-23 1994-05-23 Two-layer molding method

Publications (1)

Publication Number Publication Date
JPH07314497A true JPH07314497A (en) 1995-12-05

Family

ID=15084532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13257594A Pending JPH07314497A (en) 1994-05-23 1994-05-23 Two-layer molding method

Country Status (1)

Country Link
JP (1) JPH07314497A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103507208A (en) * 2012-06-18 2014-01-15 松下电器产业株式会社 Injection molding method and injection molding device
KR101448614B1 (en) * 2010-12-30 2014-10-13 주식회사 대부 Mold apparatus and the product by the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101448614B1 (en) * 2010-12-30 2014-10-13 주식회사 대부 Mold apparatus and the product by the same
CN103507208A (en) * 2012-06-18 2014-01-15 松下电器产业株式会社 Injection molding method and injection molding device

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