JPH07316421A - Permanently antistatic composite resin molding - Google Patents
Permanently antistatic composite resin moldingInfo
- Publication number
- JPH07316421A JPH07316421A JP6137893A JP13789394A JPH07316421A JP H07316421 A JPH07316421 A JP H07316421A JP 6137893 A JP6137893 A JP 6137893A JP 13789394 A JP13789394 A JP 13789394A JP H07316421 A JPH07316421 A JP H07316421A
- Authority
- JP
- Japan
- Prior art keywords
- composite
- resin
- dispersant
- molded product
- polyurethane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000805 composite resin Substances 0.000 title claims abstract description 19
- 238000000465 moulding Methods 0.000 title abstract description 10
- -1 polyoxyethylene chain Polymers 0.000 claims abstract description 41
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000004814 polyurethane Substances 0.000 claims abstract description 12
- 229920002635 polyurethane Polymers 0.000 claims abstract description 12
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 11
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 11
- 229920000098 polyolefin Polymers 0.000 claims abstract description 11
- 239000002131 composite material Substances 0.000 claims abstract description 9
- 239000002344 surface layer Substances 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims description 20
- 229910052739 hydrogen Inorganic materials 0.000 claims description 16
- 239000001257 hydrogen Substances 0.000 claims description 16
- 239000002270 dispersing agent Substances 0.000 claims description 15
- 229920001577 copolymer Polymers 0.000 claims description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 229920000728 polyester Polymers 0.000 claims description 8
- 239000004952 Polyamide Substances 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- 150000002431 hydrogen Chemical class 0.000 claims description 5
- 238000004898 kneading Methods 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 125000006353 oxyethylene group Chemical group 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 229920006324 polyoxymethylene Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229930182556 Polyacetal Natural products 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 2
- 238000010008 shearing Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 18
- 239000011347 resin Substances 0.000 abstract description 18
- 229920001223 polyethylene glycol Polymers 0.000 abstract description 10
- 239000002202 Polyethylene glycol Substances 0.000 abstract description 9
- 230000000379 polymerizing effect Effects 0.000 abstract description 3
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000004743 Polypropylene Substances 0.000 description 8
- 238000001746 injection moulding Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 239000004677 Nylon Substances 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 6
- 150000002009 diols Chemical class 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920001778 nylon Polymers 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 5
- 229920005682 EO-PO block copolymer Polymers 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- GNUGVECARVKIPH-UHFFFAOYSA-N 2-ethenoxypropane Chemical compound CC(C)OC=C GNUGVECARVKIPH-UHFFFAOYSA-N 0.000 description 1
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 description 1
- FMFHUEMLVAIBFI-UHFFFAOYSA-N 2-phenylethenyl acetate Chemical compound CC(=O)OC=CC1=CC=CC=C1 FMFHUEMLVAIBFI-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical class OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
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- MBOZGLMBKQFIBB-UHFFFAOYSA-N N=C=O.OP(O)(=S)OC1=CC=CC=C1 Chemical compound N=C=O.OP(O)(=S)OC1=CC=CC=C1 MBOZGLMBKQFIBB-UHFFFAOYSA-N 0.000 description 1
- 239000008118 PEG 6000 Substances 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical class C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
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- 229920002584 Polyethylene Glycol 6000 Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
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- 239000007983 Tris buffer Substances 0.000 description 1
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- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
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- 150000001298 alcohols Chemical class 0.000 description 1
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- 150000001336 alkenes Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
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- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
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- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
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- 238000001125 extrusion Methods 0.000 description 1
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- 125000000524 functional group Chemical group 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
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- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
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- 239000012778 molding material Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
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- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
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- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
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- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002523 polyethylene Glycol 1000 Polymers 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
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- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- VWQXLMJSFGLQIT-UHFFFAOYSA-N prop-2-enoyl bromide Chemical compound BrC(=O)C=C VWQXLMJSFGLQIT-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、永久帯電防止性複合樹
脂成形体および樹脂成形品の帯電防止方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a permanent antistatic composite resin molded article and a method for antistatically charging a resin molded article.
【0002】[0002]
【従来の技術】従来、樹脂に帯電防止性を付与する方法
として、多価アルコール脂肪酸エステルを主成分とした
界面活性剤を添加する方法(特公平6−21198公
報、特公平4−43104公報等)が知られている。2. Description of the Related Art Conventionally, as a method of imparting antistatic properties to a resin, a method of adding a surfactant having a polyhydric alcohol fatty acid ester as a main component (Japanese Patent Publication No. 6-21198, Japanese Patent Publication No. 43104, etc.). )It has been known.
【0003】しかしながらこれらの方法は水洗すると帯
電防止性が消失するなど帯電防止性の永続性に問題があ
った。However, these methods have a problem in the durability of the antistatic property such that the antistatic property disappears when washed with water.
【0004】[0004]
【課題を解決するための手段】本発明者らは、良好な永
久帯電防止性と樹脂特性を有した複合樹脂成形体を得る
べく鋭意検討した結果、本発明に到達した。The present inventors have arrived at the present invention as a result of intensive studies to obtain a composite resin molded article having good permanent antistatic properties and resin properties.
【0005】すなわち本発明は、熱可塑性樹脂(A)と
ポリオキシエチレン鎖を有するポリウレタン(B)との
複合体からなり、(B)相の少なくとも一部が複合樹脂
表層部分でスジ状に分散した永久帯電防止性複合樹脂成
形体である。および溶融した(A)中で活性水素含有多
官能化合物(B−1)とポリイソシアネート(B−2)
を重合させてなる複合体、または(A)と(B)とを溶
融混練してなる複合体に、少なくとも102sec-1の剪断
を与えて(B)相の少なくとも一部を複合樹脂表層部分
でスジ状に分散させる成形体の永久帯電防止法である。That is, the present invention comprises a composite of a thermoplastic resin (A) and a polyurethane (B) having a polyoxyethylene chain, and at least a part of the (B) phase is dispersed in a streak form at the surface layer of the composite resin. And a permanent antistatic composite resin molded product. And the active hydrogen-containing polyfunctional compound (B-1) and polyisocyanate (B-2) in the melted (A)
At least a part of the (B) phase is applied to the composite resin surface layer by applying at least 10 2 sec -1 to the composite obtained by polymerizing the above or the composite obtained by melt-kneading (A) and (B). This is a method of permanently preventing static charge of a molded body in which stripes are dispersed at a portion.
【0006】本発明の樹脂組成物中の(A)としては、
例えばビニル化合物の(共)重合体、ポリエステル、ポ
リアミド、ポリイミド、およびポリ(チオ)エーテルな
どの熱可塑性樹脂が挙げられる。As (A) in the resin composition of the present invention,
Examples thereof include (co) polymers of vinyl compounds, polyesters, polyamides, polyimides, and thermoplastic resins such as poly (thio) ethers.
【0007】これらのうち、ビニル化合物の(共)重合
体を構成するビニル化合物としては、オレフィン類(エ
チレン、プロピレン、ブテン−1、イソブテン、4−メ
チルペンテン−1、オクテンなど);芳香族ビニル炭化
水素またはその置換体(スチレン、α−メチルスチレ
ン、t−ブチルスチレン、ジメチルスチレン、アセトキ
シスチレン、ビニルトルエンなど);(メタ)アクリル
酸およびそのアルキル(炭素数1〜18)エステル(ア
クリル酸メチル、アクリル酸エチル、アクリル酸ブチ
ル、メタクリル酸メチルなど);ビニルエーテル(メチ
ルビニルエーテル、エチルビニルエーテル、イソプロピ
ルビニルエーテルなど);ビニルアルコール誘導体(酢
酸ビニル、酪酸ビニルなど);(メタ)アクリロニトリ
ル;(メタ)アクリルアミドおよびそのN置換誘導体;
ジエン類(ブタジエン、イソプレンなど);エチレンの
ハロゲン置換化合物(塩化ビニル、塩化ビニリデン、テ
トラフルオロエチレン、フッ化ビニリデンなど);不飽
和ポリカルボン酸(マレイン酸、フマル酸など)もしく
はその無水物、ハロゲン化物、アルキル(炭素数1〜1
8)エステル化物などが挙げられる。Of these, vinyl compounds constituting the (co) polymer of vinyl compounds include olefins (ethylene, propylene, butene-1, isobutene, 4-methylpentene-1, octene, etc.); aromatic vinyl Hydrocarbons or their substitution products (styrene, α-methylstyrene, t-butylstyrene, dimethylstyrene, acetoxystyrene, vinyltoluene, etc.); (meth) acrylic acid and its alkyl (C 1-18) esters (methyl acrylate) , Ethyl acrylate, butyl acrylate, methyl methacrylate, etc.); vinyl ether (methyl vinyl ether, ethyl vinyl ether, isopropyl vinyl ether, etc.); vinyl alcohol derivative (vinyl acetate, vinyl butyrate, etc.); (meth) acrylonitrile; (meth) acrylic Bromide and N-substituted derivatives thereof;
Dienes (butadiene, isoprene, etc.); halogen-substituted compounds of ethylene (vinyl chloride, vinylidene chloride, tetrafluoroethylene, vinylidene fluoride, etc.); unsaturated polycarboxylic acids (maleic acid, fumaric acid, etc.) or their anhydrides, halogens Compounds, alkyls (C1-C1
8) Examples include esterified products.
【0008】またこれらのビニル化合物の重合体または
共重合体としては、例えばポリオレフィン系熱可塑性樹
脂[ポリエチレン、ポリプロピレン、エチレン-α-オレ
フィン共重合体(エチレンープロピレン共重合体、エチ
レンーブテンー1共重合体など)、オレフィンージエン共重
合体(EPDMなど)、エチレン-酢酸ビニル共重合
体、エチレン-(メタ)アクリル酸共重合体、塩素化ポリ
プロピレン、マレイン酸変性ポリプロピレンなど]の
他、スチレン系熱可塑性樹脂(ポリスチレン、ABS樹
脂、AS樹脂)、ポリアクリル酸、ポリメタクリル酸メ
チル、ポリアクリロニトリル、ポリアクリルアミド、ポ
リビニルアルコール、ポリ酢酸ビニル、ポリブタジエ
ン、ポリ塩化ビニル、ポリテトラフルオロエチレンなど
を挙げることができる。Examples of polymers or copolymers of these vinyl compounds include polyolefin thermoplastic resins [polyethylene, polypropylene, ethylene-α-olefin copolymer (ethylene-propylene copolymer, ethylene-butene-1 Copolymers, etc.), olefin-diene copolymers (EPDM, etc.), ethylene-vinyl acetate copolymers, ethylene- (meth) acrylic acid copolymers, chlorinated polypropylene, maleic acid-modified polypropylene, etc.] Thermoplastic resins (polystyrene, ABS resin, AS resin), polyacrylic acid, polymethylmethacrylate, polyacrylonitrile, polyacrylamide, polyvinyl alcohol, polyvinyl acetate, polybutadiene, polyvinyl chloride, polytetrafluoroethylene, etc. You can
【0009】ポリエステルとしては、芳香族ポリエステ
ル類[芳香族ジカルボン酸エステル類の重合体(ポリエ
チレンテレフタレ−ト、ポリブチレンテレフタレ−ト、
ビスフェノールAとテレフタル酸および/またはイソフ
タル酸との重縮合物など)、パラオキシ安息香酸の重縮
合物など];脂肪族ポリエステル[脂肪族ジカルボン酸
エステル類の重合体(ポリブチレンアジペート、ポリエ
チレンアジペートなど)など];ポリカ−ボネ−ト;並
びにこれらの2種以上の共エステル化物やこれら重合体
を構成する化合物とアルキレンオキシド(ポリエチレン
グリコール、ポリプロピレングリコールなど)との共重
縮合物が挙げられる。As the polyester, aromatic polyesters [polymers of aromatic dicarboxylic acid esters (polyethylene terephthalate, polybutylene terephthalate,
Polycondensation products of bisphenol A with terephthalic acid and / or isophthalic acid, etc.), polycondensation products of paraoxybenzoic acid, etc.]; Aliphatic polyesters [Polymers of aliphatic dicarboxylic acid esters (polybutylene adipate, polyethylene adipate, etc.)] Etc.]; polycarbonate; and a co-polycondensation product of an alkylene oxide (polyethylene glycol, polypropylene glycol, etc.) with a compound constituting two or more kinds of these, or a compound constituting these polymers.
【0010】ポリアミドとしては、6−ナイロン、6,
6−ナイロン、6,10−ナイロン、11−ナイロン、
12−ナイロン、4,6−ナイロン等およびこれらの2
種以上の共アミド化物やこれら重合体を構成する化合物
とポリエステルを構成する化合物もしくはアルキレンオ
キシド(ポリエチレングリコール、ポリプロピレングリ
コールなど)との共重縮合物があげられる。As the polyamide, 6-nylon, 6,
6-nylon, 6,10-nylon, 11-nylon,
12-nylon, 4,6-nylon, etc. and these 2
Examples thereof include a co-amidated compound of at least one kind, and a copolycondensate of a compound forming the polymer with a compound forming the polyester or an alkylene oxide (polyethylene glycol, polypropylene glycol, etc.).
【0011】ポリイミドとしてはピロメリット酸と1,
4−ジアミノベンゼンとの重縮合物など;ポリイミドを
構成する化合物と上記ポリアミドを構成する化合物との
共重縮合物、すなわちポリアミドイミドなどが挙げられ
る。As the polyimide, pyromellitic acid and 1,
Examples thereof include polycondensates with 4-diaminobenzene and the like; copolycondensates of compounds forming polyimide with the compounds forming the polyamide, that is, polyamideimide.
【0012】ポリ(チオ)エ−テルとしては、ポリフェ
ニレンエ−テル、ポリオキシメチレン、ポリエーテルエ
ーテルケトン、ポリフェニレンサルファイド、ポリサル
ホン等およびこれらの2種以上の共エーテル化物があげ
られる。Examples of the poly (thio) ether include polyphenylene ether, polyoxymethylene, polyether ether ketone, polyphenylene sulfide, polysulfone and the like, and co-etherified products of two or more of these.
【0013】これら熱可塑性樹脂(A)のうち好ましい
ものはビニル化合物の(共)重合体、特にポリオレフィ
ン系熱可塑性樹脂とスチレン系熱可塑性樹脂である。Among these thermoplastic resins (A), preferred are (co) polymers of vinyl compounds, particularly polyolefin type thermoplastic resins and styrene type thermoplastic resins.
【0014】以上熱可塑性樹脂(A)として例示したも
のは、2種以上を併用することもできる。The above examples of the thermoplastic resin (A) can be used in combination of two or more kinds.
【0015】この熱可塑性樹脂(A)の分子量は通常1
0,000〜7,000,000、好ましくは10,0
00〜3,000,000である。分子量が10,00
0未満あるいは7,000,000を超えると成形が難
しくなり実用的でない。The molecular weight of this thermoplastic resin (A) is usually 1
10,000 to 7,000,000, preferably 10.0
It is 00 to 3,000,000. Molecular weight is 10,000
If it is less than 0 or exceeds 7,000,000, molding becomes difficult and it is not practical.
【0016】この熱可塑性樹脂(A)の量は、60〜9
5重量%、好ましくは、80〜95重量%である。60
重量%未満では機械的強度が劣り、95重量%を超える
と帯電防止性が低下するために好ましくない。The amount of the thermoplastic resin (A) is 60 to 9
It is 5% by weight, preferably 80 to 95% by weight. 60
If it is less than 95% by weight, the mechanical strength will be poor.
【0017】(A)の溶融温度は80℃以上、好ましく
は100℃以上である。溶融温度が80℃未満の場合は
耐熱性が劣るため実用的でない。The melting temperature of (A) is 80 ° C. or higher, preferably 100 ° C. or higher. If the melting temperature is less than 80 ° C, the heat resistance is poor and it is not practical.
【0018】本発明において、活性水素含有多官能化合
物(B−1)および/またはポリイソシアネート(B−
2)のうちでポリオキシエチレン鎖を有するものとして
は、例えばポリエチレングリコール、エチレンオキシド
プロピレンオキシドブロック共重合体(プルロニック型
エチレンオキシドプロピレンオキシド共重合体など)、
両末端変性ポリエチレングリコール(両末端ジアミン型
ポリエチレングリコール、両末端グリシジルポリエチレ
ングリコール、ポリエチレングリコールを1成分とした
両末端イソシアネート型ウレタンプレポリマーなど)両
末端変性エチレンオキシドプロピレンオキシドブロック
共重合体(両末端ジアミン型エチレンオキシドプロピレ
ンオキシドブロック共重合体、両末端グリシジルエチレ
ンオキシドプロピレンオキシドブロック共重合体、エチ
レンオキシドプロピレンオキシドブロック共重合体を1
成分とした両末端イソシアネート型ウレタンプレポリマ
ーなど)などが挙げられる。In the present invention, the active hydrogen-containing polyfunctional compound (B-1) and / or polyisocyanate (B-
Examples of those having a polyoxyethylene chain in 2) include polyethylene glycol, ethylene oxide propylene oxide block copolymers (pluronic type ethylene oxide propylene oxide copolymers, etc.),
Both-end modified polyethylene glycol (both-end diamine type polyethylene glycol, both-end glycidyl polyethylene glycol, both-end isocyanate type urethane prepolymer containing polyethylene glycol as a component, etc.) Both-end modified ethylene oxide propylene oxide block copolymer (both-end diamine type) Ethylene oxide propylene oxide block copolymer, glycidyl ethylene oxide propylene oxide block copolymer at both ends, ethylene oxide propylene oxide block copolymer 1
Both ends isocyanate type urethane prepolymer as a component) and the like.
【0019】ポリオキシエチレン鎖とはオキシエチレン
が4連鎖以上繰り返されるものをいう。オキシエチレン
連鎖が4未満のものは本発明で得られる永久帯電防止性
複合樹脂組成物での帯電防止機能が発現しない。さらに
好ましくは4連鎖以上70連鎖以下である。70連鎖を
超えるものは永久帯電防止性に関しては良好であるが、
樹脂特性を落とす場合がある。これをさらに具体的に説
明すると、例えば、(B−1)としてポリエチレングリ
コール(以下PEGと記載)を用いた場合、4〜70連
鎖の範囲にあるPEG−400、PEG−1000、P
EG−2000などを用いた成形体は良好な永久帯電防
止性と樹脂特性を示すが、3連鎖であるトリエチレング
リコールのみを用いた成形体は永久帯電防止性が十分で
ない。また70連鎖を超えるPEG−6000のみを用
いた成形体は永久帯電防止性は良好であるが耐沸水性等
が十分でない。The polyoxyethylene chain means a chain in which oxyethylene is repeated by 4 or more chains. Those having an oxyethylene chain of less than 4 do not exhibit the antistatic function in the permanent antistatic composite resin composition obtained in the present invention. More preferably, it is 4 or more and 70 or less. Those having more than 70 chains are good in terms of permanent antistatic property,
It may reduce the resin properties. This will be described more specifically. For example, when polyethylene glycol (hereinafter referred to as PEG) is used as (B-1), PEG-400, PEG-1000, and P in the range of 4 to 70 chains are used.
Molded articles using EG-2000 and the like show good permanent antistatic properties and resin properties, but molded articles using only triethylene glycol, which has three chains, have insufficient permanent antistatic properties. Further, the molded product using only PEG-6000 having more than 70 chains has good permanent antistatic property but does not have sufficient boiling water resistance.
【0020】(B)中のポリオキシエチレン鎖の合計量
は、5〜40重量%、好ましくは、5〜20重量%であ
る。5重量%未満では帯電防止性が不十分となり、40
重量%を超えると樹脂特性が不十分となるために好まし
くない。本発明において(B)の製造に必要により使用
される、ポリオキエチレン鎖を有しない、活性水素含有
多官能化合物(B−1)としては、例えば低分子量ジオ
ール[エチレングリコール、プロピレングリコール、
1,4−ブタンジオール、1,6−ヘキサンジオールな
ど];ポリエーテルジオール[上記に例示した低分子量
ジオールのアルキレンオキシド(エチレンオキシド、プ
ロピレンオキシド、ブチレンオキシドなど)付加物(但
しエチレンオキシドの付加数は4連鎖未満)、アルキレ
ンオキシドの開環重合物(ポリテトラメチレングリコー
ルなど)];ポリエステルジオール[脂肪族ジカルボン
酸(アジピン酸、マレイン酸、二量化リノレイン酸な
ど)または芳香族ジカルボン酸(フタル酸、テレフタル
酸など)と上記に例示した低分子量ジオールとの縮合ポ
リエステルジオール、ε−カプロラクトンの開環重合に
よるポリラクトンジオールなど];ジアミン類(イソホ
ロンジアミン、4,4’−ジアミノ−3,3’−ジメチ
ルジシクロヘキシルメタン、ポリエーテルジアミンな
ど);3価以上のアルコール類(トリメチロールプロパ
ン、ペンタエリスリトール、ソルビトールなど);3価
以上のアミン類(ジエチレントリアミン、トリエチレン
テトラミンなど);アミノアルコール(トリエタノール
アミンなど);および上記活性水素含有化合物と下記ポ
リイソシアネートとの反応によって得られる活性水素含
有ウレタンプレポリマーなどが挙げられる。The total amount of polyoxyethylene chains in (B) is 5-40% by weight, preferably 5-20% by weight. If it is less than 5% by weight, the antistatic property becomes insufficient, and
If it exceeds the weight%, the resin properties become insufficient, which is not preferable. Examples of the active hydrogen-containing polyfunctional compound (B-1) having no polyoxyethylene chain, which is optionally used in the production of (B) in the present invention, include low molecular weight diols [ethylene glycol, propylene glycol,
1,4-butanediol, 1,6-hexanediol, etc.]; polyether diol [alkylene oxide (ethylene oxide, propylene oxide, butylene oxide, etc.) adduct of the above-exemplified low molecular weight diols (however, the number of ethylene oxide added is 4 (Less than a chain), ring-opening polymer of alkylene oxide (polytetramethylene glycol, etc.)]; polyester diol [aliphatic dicarboxylic acid (adipic acid, maleic acid, dimerized linoleic acid, etc.) or aromatic dicarboxylic acid (phthalic acid, terephthalate) Acid, etc.) with a low molecular weight diol exemplified above, a polylactone diol, etc. by ring-opening polymerization of ε-caprolactone]; diamines (isophoronediamine, 4,4′-diamino-3,3′-dimethyl) Dicyclohexyl meta Amine, polyetherdiamine, etc.); trivalent or higher alcohols (trimethylolpropane, pentaerythritol, sorbitol, etc.); trivalent or higher amines (diethylenetriamine, triethylenetetramine, etc.); amino alcohols (triethanolamine, etc.); And an active hydrogen-containing urethane prepolymer obtained by reacting the above-mentioned active hydrogen-containing compound with the following polyisocyanate.
【0021】本発明において(B)の製造に必要により
使用される、ポリオキエチレン鎖を有しない、ポリイソ
シアネート(B−2)としては、例えば芳香族ジイソシ
アネート(トリレンジイソシアネート、キシリレンジイ
ソシアネート、ナフチレンジイソシアネート、ジフェニ
ルメタンジイソシアネートなど)、脂環式ジイソシアネ
ート(イソホロンジイソシアネート、ジシクロヘキシル
メタンジイソシアネート、シクロヘキシレンジイソシア
ネート、ジイソシアネートメチルシクロヘキサンな
ど)、脂肪族ジイソシアネート(ヘキサメチレンジイソ
シアネートなど)、3官能以上のポリイソシアネート
[トリフェニルメタントリイソシアネート、トリス(イ
ソシアネートフェニル)チオフォスフェート、ヘキサメ
チレンジイソシアネートの環状3量体など]、およびこ
れらと前記活性水素含有化合物との反応によって得られ
るイソシアネート基含有ウレタンプレポリマー(但し前
記のポリオキシエチレン鎖を有するものを除く)などが
挙げられる。Examples of the polyisocyanate (B-2) having no polyoxyethylene chain, which is optionally used in the production of (B) in the present invention, include aromatic diisocyanates (tolylene diisocyanate, xylylene diisocyanate, naphthyl). Diisocyanate, diphenylmethane diisocyanate, etc., alicyclic diisocyanate (isophorone diisocyanate, dicyclohexylmethane diisocyanate, cyclohexylene diisocyanate, diisocyanate methylcyclohexane, etc.), aliphatic diisocyanate (hexamethylene diisocyanate, etc.), trifunctional or higher polyisocyanate [triphenylmethane Triisocyanate, tris (isocyanate phenyl) thiophosphate, hexamethylene diisocyanate Cyclic trimer, etc.], and (except those with the proviso the polyoxyethylene chain) isocyanate group-containing urethane prepolymer obtained by the reaction of these with the active hydrogen-containing compound and the like.
【0022】これら活性水素を少なくとも2個有する化
合物およびポリイソシアネートは、それぞれ2種以上を
併用することもできる。Two or more kinds of these compounds having at least two active hydrogens and polyisocyanate may be used in combination.
【0023】このときイソシアネート基と活性水素との
比は1:2〜2:1であり、末端基はイソシアネート基
あるいは活性水素のいずれでもよく、さらに末端イソシ
アネート基を一つの活性水素を有する化合物で封鎖して
もなんら問題ない。At this time, the ratio of isocyanate group to active hydrogen is 1: 2 to 2: 1, the terminal group may be either an isocyanate group or active hydrogen, and the terminal isocyanate group is a compound having one active hydrogen. There is no problem with the blockade.
【0024】本発明で得られる永久帯電防止性樹脂成形
体中の(B)の分子量は通常6,000〜500,00
0である。分子量が6,000未満あるいは500,0
00を超えると永久帯電防止性が十分に発現しない。The molecular weight of (B) in the permanent antistatic resin molding obtained in the present invention is usually 6,000 to 500,000.
It is 0. Molecular weight less than 6,000 or 500,0
If it exceeds 00, the permanent antistatic property is not sufficiently exhibited.
【0025】またこれらのポリオキシエチレン鎖を有す
る活性水素含有多官能化合物および/またはポリイソシ
アネートと他の重合性官能基含有化合物とを混合して用
いてもなんら問題ない。There is no problem even if these active hydrogen-containing polyfunctional compounds having polyoxyethylene chains and / or polyisocyanates are mixed with other polymerizable functional group-containing compounds.
【0026】本発明において、複合樹脂成形体中には各
構成成分の分散を助けるために、分散剤を存在させるこ
ともできる。In the present invention, a dispersant may be present in the composite resin molded product in order to assist the dispersion of the respective constituent components.
【0027】この分散剤(C)として好ましいものは、
熱可塑性樹脂(A)がポリオレフィンの場合は、活性水
素、(無水)カルボン酸基、またはカルボン酸ハライド
基を有するポリオレフィン、またはポリオレフィンとポ
リウレタンの共重合体系分散剤である。このうち好まし
いのは、水酸基、エポキシ基、酸無水物基含有ポリオレ
フィンである。これをさらに具体例で示すと、水酸基変
性ポリオレフィン、無水マレイン酸グラフト変性ポリオ
レフィンなどである。(A)がポリスチレンの場合、好
ましい(C)としては、水酸基、エポキシ基、酸無水物
基含有スチレン系(共)重合体である。これをさらに具
体的に例示すると、スチレン−ヒドロキシエチルメタク
リレート共重合体、スチレンーグリシジルメタクリレー
ト共重合体、スチレン−無水マレイン酸共重合体などで
ある。これら分散剤(C)を加えた成形体は樹脂特性が
向上する。(A)が芳香族ポリエステル、ポリカーボネ
ート、ポリアミド、ポリイミド、ポリアミドイミド、ポ
リアセタール、ポリフェニレンオキシド、ポリエーテル
エーテルケトン、ポリフェニレンサルファイド、および
ポリサルホンの場合は、スチレン無水マレイン酸共重合
体、SBS樹脂、SEBS樹脂、末端アミノ型および/
またはカルボン酸型ポリアミドオリゴマー、末端カルボ
ン酸型および/または水酸基型ポリエステルオリゴマー
などが主に用いられる。The preferred dispersant (C) is
When the thermoplastic resin (A) is a polyolefin, it is a polyolefin having active hydrogen, a (anhydrous) carboxylic acid group, or a carboxylic acid halide group, or a copolymer-based dispersant of polyolefin and polyurethane. Of these, preferred are hydroxyl group-, epoxy group-, and acid anhydride group-containing polyolefins. More specific examples include hydroxyl group-modified polyolefin and maleic anhydride graft-modified polyolefin. When (A) is polystyrene, preferable (C) is a styrene (co) polymer containing a hydroxyl group, an epoxy group, and an acid anhydride group. More specific examples thereof include a styrene-hydroxyethyl methacrylate copolymer, a styrene-glycidyl methacrylate copolymer, and a styrene-maleic anhydride copolymer. The resin properties of the molded product containing these dispersants (C) are improved. When (A) is an aromatic polyester, a polycarbonate, a polyamide, a polyimide, a polyamideimide, a polyacetal, a polyphenylene oxide, a polyether ether ketone, a polyphenylene sulfide, and a polysulfone, a styrene maleic anhydride copolymer, an SBS resin, a SEBS resin, Terminal amino type and /
Alternatively, a carboxylic acid type polyamide oligomer, a terminal carboxylic acid type and / or a hydroxyl group type polyester oligomer and the like are mainly used.
【0028】(C)の分子量は数平均で通常800〜
3,000,000、好ましくは1,000〜200,
000である。800未満では成形体の樹脂物性が劣
り、3,00,000以上では(C)を添加する効果が
得られない。The number average molecular weight of (C) is usually 800-
3,000,000, preferably 1,000-200,
It is 000. If it is less than 800, the physical properties of the resin of the molded product are poor, and if it is 300,000 or more, the effect of adding (C) cannot be obtained.
【0029】分散剤(C)を用いる場合(C)の割合と
しては、(A),(B)の合計重量に対して通常0.0
5〜50%、好ましくは0.1〜20%である。When the dispersant (C) is used, the proportion of (C) is usually 0.0 with respect to the total weight of (A) and (B).
It is 5 to 50%, preferably 0.1 to 20%.
【0030】本発明の複合樹脂組成物は通常(A)と予
め(B−1)と(B−2)から製造した(B)とを溶融
混練することで得られる。また溶融した(A)中で(B
−1)と(B−2)を重合して得ることもできる。この
場合に(D)の存在下に重合を行うこともできる。これ
らを行う温度は通常10〜350℃の範囲内で、好まし
くは80〜230℃である。The composite resin composition of the present invention is usually obtained by melt-kneading (A) and (B) prepared in advance from (B-1) and (B-2). In the melted (A) (B
It can also be obtained by polymerizing -1) and (B-2). In this case, the polymerization can be carried out in the presence of (D). The temperature for carrying out these is usually in the range of 10 to 350 ° C, preferably 80 to 230 ° C.
【0031】反応圧力は特に制限はないが工業的生産を
考えたとき通常減圧(0.1mmHg)〜50気圧、好
ましくは減圧(0.1mmHg)〜30気圧である。The reaction pressure is not particularly limited, but when industrial production is considered, it is usually reduced pressure (0.1 mmHg) to 50 atm, preferably reduced pressure (0.1 mmHg) to 30 atm.
【0032】(B)は(B−1)と(B−2)とから予
めウレタン化反応させて製造するのが通常で、反応温度
としては30〜230℃の範囲内で、好ましくは40〜
200℃である。(B) is usually produced by subjecting (B-1) and (B-2) to a urethanization reaction in advance, and the reaction temperature is in the range of 30 to 230 ° C., preferably 40 to
It is 200 ° C.
【0033】反応圧力は特に制限はないが工業的生産を
考えたとき通常減圧(0.1mmHg)〜10気圧、好
ましくは減圧(0.1mmHg)〜5気圧である。The reaction pressure is not particularly limited, but in view of industrial production, it is usually reduced pressure (0.1 mmHg) to 10 atm, preferably reduced pressure (0.1 mmHg) to 5 atm.
【0034】また、この反応時、必要により溶媒、触媒
を用いることもできる。用いる場合の溶媒としては活性
水素を有しないウレタン化反応の溶媒として公知のもの
でよく、例えばジメチルホルムアミド、メチルエチルケ
トン、トルエンなどを挙げることができる。用いる場合
の触媒としては、ウレタン化反応の触媒として公知のも
のでよく、例えばジブチルスズジラウレート、ジオクチ
ルスズジラウレートなどの有機金属化合物や、トリエチ
ルアミン、ジアザビシクロウンデセンなどのアミン類な
どを挙げることができる。During this reaction, a solvent and a catalyst can be used if necessary. The solvent to be used may be a known solvent for urethanization reaction having no active hydrogen, and examples thereof include dimethylformamide, methyl ethyl ketone and toluene. The catalyst to be used may be one known as a catalyst for urethanization reaction, and examples thereof include organometallic compounds such as dibutyltin dilaurate and dioctyltin dilaurate, and amines such as triethylamine and diazabicycloundecene. .
【0035】反応容器としては公知の各種混合機、例え
ば押出機、ニーダー、バンバリーミキサーなど、各種反
応槽が挙げられる。Examples of the reaction vessel include various known mixers such as extruders, kneaders and Banbury mixers.
【0036】本発明において(B)相の少なくとも一部
が複合樹脂表層部分でスジ状に分散させるには、102s
ec-1以上の剪断を与えることが必要である。剪断が10
2sec-1未満の場合は表層部分で十分なスジ状分散が得ら
れず帯電防止性に劣る。剪断を与えるには公知の各種成
形機、例えば射出成形機、インフレーション成形機、押
出成形機、ブロー成形機、紡糸機などが挙げられる。In the present invention, it is necessary to disperse at least a part of the phase (B) in the form of streaks in the surface portion of the composite resin in an amount of 10 2 s
It is necessary to apply a shear of ec -1 or more. Shear 10
If it is less than 2 sec -1 , sufficient streaky dispersion cannot be obtained in the surface layer portion, and the antistatic property is poor. For imparting shear, various known molding machines such as an injection molding machine, an inflation molding machine, an extrusion molding machine, a blow molding machine, and a spinning machine can be used.
【0037】本発明の成形体は、コンテナ、ケース類、
バンパー、ホース類、フィルム、各種ハウジング材料用
などとして好適である。The molded product of the present invention includes containers, cases,
It is suitable for bumpers, hoses, films and various housing materials.
【0038】[0038]
【実施例】以下、実施例により本発明をさらに説明する
が、本発明はこれに限定されるものではない。実施例中
の部は重量部を示す。なお実施例および比較例に記載し
た成形品の評価は、以下の方法によって実施した。 (1)衝撃強度 :ASTM D256(ノッチ
付、3.2mm厚) (2)曲げ弾性率 :ASTM D790 (3)表面固有抵抗値:射出成形した厚さ2mmの試験
片を用い、超絶縁計(アト゛ハ゛ンテスト製)により20℃、湿度5
0%RH雰囲気下で測定 した。 なお、表面固有抵抗の評価は、試験片を下記に示す処理
およびコンデイショニングを行い表面固有抵抗値を測定
することによって行った。 (a)水洗未処理:成形後、試験片をそのまま20℃、
湿度50%RH雰囲気下に24時間放置。 (b)水洗処理:成形後、試験片を洗剤(ママレモン;
ライオン(株)製)水溶液で洗浄処理し、次いでイオン交
換水で充分洗ったのち、表面の水分を乾燥除去してから
20℃、湿度50%RH雰囲気下に24時間放置。 以下実施例により本発明をさらに説明するが、本発明は
これに限定されるものではない。以下の記載において部
は重量部を表す。EXAMPLES The present invention will be further described below with reference to examples, but the present invention is not limited thereto. Parts in the examples indicate parts by weight. The evaluation of the molded articles described in Examples and Comparative Examples was performed by the following methods. (1) Impact strength: ASTM D256 (notched, 3.2 mm thick) (2) Flexural modulus: ASTM D790 (3) Surface specific resistance value: injection molded 2 mm thick test piece was used to measure the super insulation 20 ℃, humidity 5
It was measured in a 0% RH atmosphere. The surface resistivity was evaluated by subjecting the test piece to the treatment and conditioning described below and measuring the surface resistivity. (A) Unwashed with water: after molding, the test piece is kept at 20 ° C.
Leave for 24 hours in an atmosphere of 50% humidity RH. (B) Washing with water: After molding, the test piece was washed with a detergent (Mama Lemon;
After washing with an aqueous solution of Lion Co., Ltd., followed by thorough washing with ion-exchanged water, the surface water is dried and removed, and then left in an atmosphere of 20 ° C. and a humidity of 50% RH for 24 hours. The present invention will be further described below with reference to examples, but the present invention is not limited thereto. In the following description, part means part by weight.
【0039】実施例1 ポリプロピレン[宇部興産(株)製UBE−ポリプロJ
609H、以下PPと略記;熱可塑性樹脂(A)にあた
る]80部、三洋化成工業(株)製PEG2000[数
平均分子量2,000;活性水素含有多官能化合物(B
−1)にあたる]17.8部、およびジフェニルメタン
ジイソシアネート[以下MDIと略記;ポリイソシアネ
ート(B−2)にあたる]2.2部を二軸押出機(東芝
機械(株)製TEM35B、37mmφ、L/D=4
1)を用いて、シリンダー温度190℃で5分間溶融混
練した。得られた複合樹脂を、シリンダー温度200
℃、金型温度50℃で射出成形し、本発明の成形体の試
験片を作成(この時の剪断は103sec-1であった)し、
この試験片の表面固有抵抗および樹脂特性評価結果を表
1に示す。Example 1 Polypropylene [UBE-Polypro J manufactured by Ube Industries, Ltd.]
609H, abbreviated as PP hereinafter; corresponding to thermoplastic resin (A)] 80 parts, PEG2000 manufactured by Sanyo Chemical Industry Co., Ltd. [number average molecular weight 2,000; active hydrogen-containing polyfunctional compound (B)
-1)] and 17.8 parts of diphenylmethane diisocyanate [hereinafter abbreviated as MDI; corresponding to polyisocyanate (B-2)] 2.2 parts are twin-screw extruders (manufactured by Toshiba Machine Co., Ltd., TEM35B, 37 mmφ, L / D = 4
Using 1), the mixture was melt-kneaded at a cylinder temperature of 190 ° C. for 5 minutes. The obtained composite resin is heated to a cylinder temperature of 200.
Injection molding at a mold temperature of 50 ° C. to prepare a test piece of the molded product of the present invention (shear at this time was 10 3 sec −1 ),
Table 1 shows the surface specific resistance and resin property evaluation results of this test piece.
【0040】実施例2 無水マレイン酸変性ポリプロピレン[結合マレイン酸量
5%、数平均分子量5,000、以下PP−MAと略
記;分散剤(C)にあたる]3部を加えた他は実施例1
と同一の材料、条件で溶融混練した。得られた複合樹脂
を、実施例1と同一の射出成形機を用いて同条件で射出
成形し、成形体試験片を作成した。この試験片の特性を
実施例1と同様に評価した。その特性評価結果を表1に
示す。Example 2 Example 1 except that 3 parts of maleic anhydride-modified polypropylene [bound maleic acid content 5%, number average molecular weight 5,000, abbreviated as PP-MA hereinafter; corresponding to dispersant (C)] was added.
The same materials and conditions were used for melt kneading. The obtained composite resin was injection molded under the same conditions by using the same injection molding machine as in Example 1 to prepare a molded body test piece. The characteristics of this test piece were evaluated in the same manner as in Example 1. The results of the characteristic evaluation are shown in Table 1.
【0041】実施例3 PEG2000 89部とMDI 11部とを実施例1
と同一の二軸押出機を用いてシリンダー温度190℃で
5分間溶融混練してポリウレタン(以下PU−1と略
記)を得た。PP 80部、PU−1 20部およびP
P−MA 3部を実施例1と同一の二軸押出機を用いて
同条件で溶融混練した。得られた複合樹脂を、実施例1
と同一の射出成形機を用いて同条件で射出成形し、成形
体試験片を作成した。この試験片の特性を実施例1と同
様に評価した。その特性評価結果を表1に示す。Example 3 89 parts of PEG2000 and 11 parts of MDI were used in Example 1.
Polyurethane (hereinafter abbreviated as PU-1) was obtained by melt-kneading for 5 minutes at a cylinder temperature of 190 ° C. using the same twin-screw extruder. 80 parts PP, 20 parts PU-1 and P
3 parts of P-MA was melt-kneaded using the same twin-screw extruder as in Example 1 under the same conditions. The obtained composite resin was used in Example 1
Using the same injection molding machine as above, injection molding was performed under the same conditions to prepare a molded body test piece. The characteristics of this test piece were evaluated in the same manner as in Example 1. The results of the characteristic evaluation are shown in Table 1.
【0042】比較例1 PP 99部、多価アルコール脂肪酸エステル系帯電防
止剤(三洋化成工業(株)製ケミスタット1100)1
部を実施例1と同一の二軸押出機を用いて溶融混練し
た。 得られた組成物を、実施例1と同一の射出成形機
を用いて同条件で射出成形し、試験片を作成した。この
試験片の特性を実施例1と同様に評価した。その特性評
価結果を表1に示す。Comparative Example 1 PP 99 parts, polyhydric alcohol fatty acid ester type antistatic agent (Chemist 1100 manufactured by Sanyo Kasei Co., Ltd.) 1
Parts were melt-kneaded using the same twin-screw extruder as in Example 1. The obtained composition was injection molded under the same conditions by using the same injection molding machine as in Example 1 to prepare a test piece. The characteristics of this test piece were evaluated in the same manner as in Example 1. The results of the characteristic evaluation are shown in Table 1.
【0043】[0043]
【表1】 [Table 1]
【0044】実施例4 ポリスチレン(旭化成(株)製旭化成ポリスチレン60
0、以下PSと略記)80部、PEG2000 17.
8部、MDI 2.2部および片末端ヒドロキシポリス
チレン(Mw=3300;分散剤)3部を、二軸押出機(東芝
機械(株)製TEM35B、37mmφ、L/D=4
1)を用いて、シリンダー温度200℃で5分間溶融混
練した。得られた複合樹脂を、シリンダー温度200
℃、金型温度50℃で射出成形し、本発明の成形体試験
片を作成し、この試験片の表面固有抵抗を評価した。そ
の特性評価結果を表2に示す。Example 4 Polystyrene (Asahi Kasei Polystyrene 60 manufactured by Asahi Kasei Corporation)
0, hereinafter abbreviated as PS) 80 parts, PEG2000 17.
8 parts, MDI 2.2 parts and one end hydroxypolystyrene (Mw = 3300; dispersant) 3 parts were added to a twin-screw extruder (manufactured by Toshiba Machine Co., Ltd. TEM35B, 37 mmφ, L / D = 4).
Using 1), the mixture was melt-kneaded at a cylinder temperature of 200 ° C. for 5 minutes. The obtained composite resin is heated to a cylinder temperature of 200.
Injection molding at a mold temperature of 50 ° C. and a mold temperature of 50 ° C. to prepare a test piece of the molded article of the present invention, and the surface resistivity of this test piece was evaluated. The results of the characteristic evaluation are shown in Table 2.
【0045】比較例2 PS99部、多価アルコール脂肪酸エステル系帯電防止
剤(三洋化成工業(株)製ケミスタット1100)1部
を、実施例4と同条件で溶融混練した。得られた組成物
を、実施例4と同一の射出成形機を用いて同条件で射出
成形し、試験片を作成した。この試験片の特性を実施例
4と同様に評価した。その特性評価結果を表2に示す。Comparative Example 2 99 parts of PS and 1 part of a polyhydric alcohol fatty acid ester type antistatic agent (Chemistat 1100 manufactured by Sanyo Chemical Industry Co., Ltd.) were melt-kneaded under the same conditions as in Example 4. The obtained composition was injection molded under the same conditions using the same injection molding machine as in Example 4 to prepare test pieces. The characteristics of this test piece were evaluated in the same manner as in Example 4. The results of the characteristic evaluation are shown in Table 2.
【0046】[0046]
【表2】 [Table 2]
【0047】[0047]
【発明の効果】本発明の成形体は従来の技術では達し得
なかった永久帯電防止性があり、かつ優れた樹脂特性を
有する。本発明に係るポリウレタン(B)を用いる永久
帯電防止法は、従来知られている永久制電性ポリマーを
用いる方法に比して、成形温度をより低温域まで広げら
れるなど成形加工性の点で優れている。また成形体の外
観においても優れている。上記効果を奏することから本
発明の成形体は、コンテナ、ケース類、自動車部品、ホ
ース類、フィルム、各種ハウジング材料用など帯電防止
性を必要とするさまざまな用途の成形材料として有用で
ある。EFFECTS OF THE INVENTION The molded article of the present invention has a permanent antistatic property which cannot be achieved by the conventional techniques and has excellent resin properties. The permanent antistatic method using the polyurethane (B) according to the present invention has a molding processability such that the molding temperature can be extended to a lower temperature range as compared with the conventionally known methods using a permanent antistatic polymer. Are better. Also, the appearance of the molded product is excellent. Because of the above effects, the molded product of the present invention is useful as a molding material for various applications requiring antistatic properties such as containers, cases, automobile parts, hoses, films, and various housing materials.
Claims (11)
ン鎖を有するポリウレタン(B)との複合体からなり、
(B)相の少なくとも一部が複合樹脂表層部分でスジ状
に分散した永久帯電防止性複合樹脂成形体。1. A composite of a thermoplastic resin (A) and a polyurethane (B) having a polyoxyethylene chain,
(B) A permanent antistatic composite resin molded product in which at least a part of the phase is dispersed like streaks in the composite resin surface layer portion.
−1)および/またはポリイソシアネート(B−2)の
少なくとも一部としてポリオキシエチレン鎖を有する化
合物を用いてなる(B−1)と(B−2)との重合生成
物である請求項1記載の成形体。2. (B) is a polyfunctional compound containing active hydrogen (B
-1) and / or polyisocyanate (B-2) is a polymerization product of (B-1) and (B-2) obtained by using a compound having a polyoxyethylene chain as at least a part thereof. The molded article described.
含まれるポリオキシエチレン鎖の合計量を5−40重量
%とする請求項1または2記載の成形体。3. The molded product according to claim 1, wherein (A) is 60 to 95% by weight, and the total amount of polyoxyethylene chains contained in (B) is 5 to 40% by weight.
0,000である請求項1、2または3記載の成形体。4. The molecular weight of (B) is from 6,000 to 20.
The molded article according to claim 1, 2 or 3 having a weight average molecular weight of 10,000.
鎖がオキシエチレン4連鎖から70連鎖である請求項1
〜4のいずれか記載の成形体。5. The polyoxyethylene chain contained in (B) is 4 to 70 oxyethylene chains.
The molded product according to any one of to 4.
である請求項1〜5のいずれかに記載の成形体。6. The molded product according to claim 1, wherein (A) is a polyolefin-based thermoplastic resin.
(C)の複合体からなることを特徴とする請求項6に記
載の成形体。 分散剤(C):活性水素、(無水)カルボン酸基、また
はカルボン酸ハライド基を有する変性ポリオレフィン系
分散剤、またはポリオレフィン−ポリウレタン共重合体
系分散剤。7. The molded product according to claim 6, comprising a composite of (A), (B) and the following dispersant (C). Dispersant (C): a modified polyolefin dispersant having active hydrogen, a (anhydrous) carboxylic acid group, or a carboxylic acid halide group, or a polyolefin-polyurethane copolymer dispersant.
求項1〜5のいずれかに記載の成形体。8. The molded product according to claim 1, wherein (A) is a styrene-based thermoplastic resin.
の複合体からなることを特徴とする請求項8に記載の成
形体。 分散剤(C):活性水素、(無水)カルボン酸基、また
はカルボン酸ハライド基を有するスチレン系分散剤、ま
たは[スチレン系(共)重合体]−ポリウレタン共重合
体系分散剤。9. (A), (B) and the following dispersant (C)
The molded article according to claim 8, which is formed of a composite body of Dispersant (C): Styrene-based dispersant having active hydrogen, (anhydrous) carboxylic acid group, or carboxylic acid halide group, or [styrene-based (co) polymer] -polyurethane copolymer-based dispersant.
ーボネート、ポリアミド、ポリイミド、ポリアミドイミ
ド、ポリアセタール、ポリフェニレンオキシド、ポリエ
ーテルエーテルケトン、ポリフェニレンサルファイド、
およびポリサルホンからなる群より選ばれた熱可塑性樹
脂である請求項1〜5のいずれかに記載の成形体。10. (A) is aromatic polyester, polycarbonate, polyamide, polyimide, polyamideimide, polyacetal, polyphenylene oxide, polyether ether ketone, polyphenylene sulfide,
The molded product according to any one of claims 1 to 5, which is a thermoplastic resin selected from the group consisting of and polysulfone.
−2)を重合させてなる複合体、または(A)と(B)
とを溶融混練してなる複合体に、少なくとも102sec-1
の剪断を与えて(B)相の少なくとも一部を複合樹脂表
層部分でスジ状に分散させる、請求項1〜10のいずれ
か記載の成形体の永久帯電防止法。11. In the molten (A), (B-1) and (B)
-2) polymerized complex, or (A) and (B)
Add at least 10 2 sec -1 to the composite obtained by melting and kneading
The permanent antistatic method for a molded article according to any one of claims 1 to 10, wherein at least a part of the phase (B) is dispersed in a streak form in the surface layer of the composite resin by applying the shearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6137893A JPH07316421A (en) | 1994-05-26 | 1994-05-26 | Permanently antistatic composite resin molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6137893A JPH07316421A (en) | 1994-05-26 | 1994-05-26 | Permanently antistatic composite resin molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07316421A true JPH07316421A (en) | 1995-12-05 |
Family
ID=15209146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6137893A Pending JPH07316421A (en) | 1994-05-26 | 1994-05-26 | Permanently antistatic composite resin molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07316421A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09183148A (en) * | 1995-12-21 | 1997-07-15 | Elf Atochem Sa | Antistatic belt |
| JP2002020578A (en) * | 2000-07-07 | 2002-01-23 | Asahi Kasei Corp | Resin composition and molded article thereof |
| JP2011168760A (en) * | 2009-10-08 | 2011-09-01 | Adeka Corp | Compound having diurethane structure, antistatic agent composed of the compound, and thermoplastic resin composition containing the compound |
| JP2014047262A (en) * | 2012-08-30 | 2014-03-17 | Asahi Kasei Chemicals Corp | Sliding member for conveying device |
| US12227648B2 (en) | 2021-05-28 | 2025-02-18 | Shpp Global Technologies B.V. | Articles and structures with colorable anti-static polyetherimide blends |
-
1994
- 1994-05-26 JP JP6137893A patent/JPH07316421A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09183148A (en) * | 1995-12-21 | 1997-07-15 | Elf Atochem Sa | Antistatic belt |
| JP2002020578A (en) * | 2000-07-07 | 2002-01-23 | Asahi Kasei Corp | Resin composition and molded article thereof |
| JP2011168760A (en) * | 2009-10-08 | 2011-09-01 | Adeka Corp | Compound having diurethane structure, antistatic agent composed of the compound, and thermoplastic resin composition containing the compound |
| JP2014047262A (en) * | 2012-08-30 | 2014-03-17 | Asahi Kasei Chemicals Corp | Sliding member for conveying device |
| US12227648B2 (en) | 2021-05-28 | 2025-02-18 | Shpp Global Technologies B.V. | Articles and structures with colorable anti-static polyetherimide blends |
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