JPH07320902A - Electronic part - Google Patents

Abstract

PURPOSE:To provide an electronic part capable of maintaining the electric contact between a terminal and an electrode even if an excessive force is given to the terminal. CONSTITUTION:A clamp part 17A of a metallic terminal 17 is fitted to a substrate 1 having an electrode 1 on the surface so as to come into contact with the electrode as if holding the substrate l in the thickness direction. The clamp part 17A is provided with the first and second contact pieces 17a and 17b respectively in contact with the electrode and the rear surface of the substrate l. Besides, the first contact piece 17a is coupled with the electrode using the first bonding agent. At this time, the first contact piece 17a is directly brought into electric contact with the electrode. Furthermore, the second contact piece 17b of the clamp part 1 is coupled with the rear surface of the substrate 1. In such a constitution, the second bonding agent layer can be sufficiently thickened by forming a recession to accumulate the bonding agent on the second contact piece 17b or the rear surface of the substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a variable resistor used in electronic equipment, and more particularly to a mounting structure for its terminal.

[0002]

2. Description of the Related Art Some electronic parts such as variable resistors are provided with a metal terminal having a clamp part for sandwiching a substrate from the thickness direction and a leg part provided integrally with the clamp part. . In the conventional electronic component of this type, the electrodes provided on the substrate and the clamp portions of the terminals are connected by soldering to electrically and mechanically connect the electrodes and the terminals.

When performing a soldering operation, it is necessary to clean and remove the flux adhered to the substrate with freon. However, in recent years, the use of CFCs has been reduced due to environmental problems such as destruction of the ozone layer, and it is necessary to eliminate the use of CFCs in the future. Flux removal is indispensable in soldering, and no harmless cleaning agent having an equivalent function in place of CFC has been provided yet. Moreover, since the resistor and the like cannot be covered with the protective coat, the resistor is directly contacted with the cleaning liquid of the CFC, and the resistance value may change under the influence of the cleaning liquid.

When the terminal is connected to the electrode by soldering, an expensive material having high heat resistance such as silver-palladium alloy is used for the electrode so that the electrode is not eaten by the heat of the solder. Need to be formed. When the unit price of the material becomes high as described above, the manufacturing cost becomes very high when a large number of electronic components are manufactured by mass production.

Further, when mass-producing electronic parts,
Rather than soldering one by one, a large number of electronic components with cream solder applied on the electrodes are placed in a furnace to melt the cream solder and perform soldering. Therefore, the electronic elements of the electronic components will also be exposed to high temperatures in the furnace,
There is a problem that the characteristics of the electronic device change. In particular, when the electronic component is a variable resistor, the linearity of change in resistance value is greatly affected, and the linearity of change in variable resistance value deteriorates. Therefore, in various electronic parts, it has been desired to reduce the soldering points as much as possible.

[0006] Therefore, the applicant of the present application, Japanese Patent Application No. 5-20864 and Japanese Patent Application No. 5-316084, uses an adhesive to electrically and mechanically connect the terminals of the substrate to the substrate without using soldering. It was proposed to fix it to the electrode. In the electronic component proposed above, a terminal including a sandwiching portion or a clamp portion having a first contact piece and a second contact piece that sandwich the substrate from the thickness direction is used. Then, the first contact piece is brought into contact with the surface of the electrode provided on the surface of the substrate, the second sandwiching piece is brought into contact with the back surface of the substrate, and the first contact piece is attached to the electrode provided on the surface of the substrate with an adhesive. Are combined using.

[0007]

SUMMARY OF THE INVENTION At the stage of filing the previous application, the electric power can be obtained only by the clamping force or the clamping force of the clamp portion provided on the terminal and the adhesive force of the adhesive agent for connecting the first contact piece and the electrode. It was believed that sufficient physical and mechanical contact was obtained. However, actually, when the usage test of the electronic parts proposed previously in various modes was carried out, it was found that there were some cases where the contact between the first contact piece and the electrode was insufficient.

An object of the present invention is to provide an electronic component which can firmly bond the terminal and the electrode by using an adhesive.

Another object of the present invention is to provide an electronic component capable of maintaining electrical contact between a terminal and an electrode even when an excessive force is applied to the terminal.

Another object of the present invention is to provide an electronic component capable of ensuring contact between a terminal and an electrode.

Still another object of the present invention is to provide an electronic component capable of preventing an electrode formed by printing from peeling off from a substrate.

[0012]

The electronic parts to be improved by the present invention are as follows.
An insulative substrate 1 having an electronic element (resistor) 7 and electrodes 9, 11 electrically connected to the electronic element on the surface, and a clamp part that is in contact with the electrodes 9 and 11 and sandwiches the substrate 1 from the thickness direction. Metal terminals 15 and 17 having 15A and 17A
It has and. Then, the first contact pieces 15a and 17 with which the clamp portions 15A and 17A contact the electrodes 9 and 11, respectively.
a and second contact pieces 15b, 17 that contact the back surface of the substrate 1
and b. In addition, the first contact pieces 15a and 17a of the clamp portions 15A and 17A and the electrodes 9 and 11 are joined by the first adhesive (19, 21).

According to the present invention, in such an electronic component, the second contact pieces 15b and 17b are bonded to the back surface of the substrate 1 by the second adhesive.

The second adhesive is preferably applied between the second contact piece 17b and the back surface of the substrate 1. This makes it possible to sufficiently increase the bonding strength between the second contact piece 17b and the back surface of the substrate 1 with a small amount of adhesive. The second adhesive may be applied so as to extend over the second contact piece 17b and the back surface of the substrate 1.

After the second adhesive is applied to the second contact piece 17b or the back surface of the substrate 1, the clamp portions 15A and 17A are formed.
When sandwiched between the second contact piece 17b and the back surface of the substrate 1, depending on the shape of the second contact piece 17b and the like,
Most of the adhesive may be extruded. Therefore, in the worst case, a layer of the second adhesive cannot be sufficiently secured between the second contact piece 17b and the back surface of the substrate 1, and the second contact piece 17b and the back surface of the substrate 1 cannot be secured. It also occurs when and cannot be bonded with sufficient strength. Therefore, the adhesive reservoir 7 in which the second adhesive 723 accumulates on at least one of the back surface side of the substrate 701 and the second contact piece 717b.
It is preferable to form 18,718 '. In this way, the second adhesive 723 can be stored in the adhesive reservoirs 718 and 718 ', and the second adhesive 723 is applied between the second contact piece 717b and the back surface of the substrate 701. The amount can be increased, and the adhesive reservoirs 718, 718
The second contact 717b and the back surface of the substrate 701 can be firmly adhered to each other by the second adhesive 723 accumulated on the surface ′.

The shape of the adhesive reservoir has a second
The adhesive may have any shape as long as it can collect the adhesive, for example, it may be a single recess or a plurality of recesses. Further, when forming the adhesive agent reservoir portion on the second contact piece 717b, the adhesive agent reservoir portion 718 'may be formed by a through hole penetrating the second contact piece 717b in the thickness direction. When the adhesive reservoir is formed by the through hole, the second adhesive 723
The shape and size of the through hole are determined so that the water will collect in the through hole due to surface tension. Even when the adhesive reservoir is formed by the through hole, the adhesive that collects in the through hole acts to attract the inner wall surface of the through hole to the back surface of the substrate, so that the adhesive reservoir is formed by the through hole. Also the second contact piece 71
7b and the back surface of the substrate 1 can be firmly adhered. Such an adhesive reservoir is provided as a second contact piece 717.
If it is formed in b, it is not necessary to form a thin portion on the substrate 701, so that not only the damage of the substrate can be prevented, but also
The adhesive reservoir portion can be easily formed, and the number of manufacturing steps and manufacturing cost of electronic components can be reduced.

When forming the adhesive reservoir 801b on the back surface side of the substrate 801, a part 817b1 of the second contact piece 817b may be fitted into the adhesive reservoir 801b. By this fitting, the clamp portion 817A of the terminal 817 can be prevented from coming off. Further, in this case, when the contact piece fitting concave portion 801a into which the part 817a1 of the first contact piece 817a is fitted is formed in the portion where the electrode is formed on the surface side of the substrate 801, the substrate 801 is formed.
The parts 817a1 and 817b1 of the first and second contact pieces 817a and 817b are fitted into the contact piece fitting recesses 801a and 801b formed on the substrate 801, respectively, so that the clamp portion of the terminal is prevented from coming off. Can be ensured.

When at least a part of the electrode is located inside the contact piece fitting recess 801a, the conductive paint can be stored in the contact piece fitting recess 801a, so that the thickness of printing for forming the electrode is increased. You can
It is possible to prevent the electrode from peeling off from the substrate 801.

When the surfaces of the first and second contact pieces 17a, 17b that come into contact with the first and second adhesives are roughened, the bonding strength of the adhesives increases. For example, if at least the clamp portions 15A and 17A of the terminals are plated with non-gloss,
Corrosion of the surface that comes into contact with the adhesive can be prevented, and the surface can be roughened easily.

The first adhesive has a thixot index (thixot index) that does not easily flow out from the applied area.
It preferably has a ropy index or factor). Further, when the second adhesive is applied between the second contact piece and the back surface of the substrate, the second adhesive may cause the second adhesive due to the capillary phenomenon.
It is preferable that the thixotropy index is such that it spreads in the gap between the contact piece 17b and the back surface of the substrate. By using such a second adhesive, the adhesive layer 23 can be reliably formed between the second contact piece and the back surface of the substrate, and the bonding strength between the two can be increased. .

The terminal 17 used when inserting the terminal into the through hole provided in the circuit board has a leg portion 17B integrally with the clamp portion 17A. In such a terminal, when an external force is applied to the leg portion, the second contact piece 17b of the clamp portion is deformed so as to prevent the second contact piece 17b from separating from the back surface of the substrate 1 and absorbs the external force. Part 17B
Preferably, it is formed. When such an external force absorbing portion is provided on the leg portion, when an external force is applied to the leg portion, a large force is applied to the joint portion between the second contact piece 17b and the back surface of the substrate 1, and the joint between the two is broken. Can be prevented.

The position of the external force absorbing portion is arbitrary as long as it does not reduce the strength of the legs more than necessary, but it is preferable to form the external force absorbing portion at a position close to or adjacent to the second contact piece. preferable. This is because it is possible to reliably and directly prevent the external force from being transmitted to the second contact piece. The structure of the external force absorbing portion may be configured by forming at least one through hole penetrating in a thickness direction in a part of the leg portion, or by bending a part of the leg portion, or by forming the leg portion. The width dimension of a part of the above may be narrowed.

For example, the leg portion 17B of the terminal is continuous with the second contact piece 17b of the clamp portion and is continuous with the first portion 17f extending in the direction away from the back surface of the substrate 1 and the first portion. And a second portion 17g extending in the direction in which the second contact piece extends, and a third portion 17h continuous with the second portion and extending in the direction in which the first portion extends, It is preferable to form a through hole H penetrating in the thickness direction in the first portion 17f to serve as an external force absorbing portion.

[0024]

The electronic parts in which the first contact pieces 15a and 17a of the clamp part are bonded to the electrodes 9 and 11 by the adhesive (19 and 21), and the electronic parts in which the contact failure occurs between the two are investigated. However, it was found that the cause was that the second contact pieces 15b and 17b were separated from the back surface of the substrate 1. When the second contact piece 17b (15b) is separated from the back surface of the substrate 1, the first contact pieces 15a and 17a and the electrodes 9 and 11 are released.
The contact pressure between the first contact piece and the electrode becomes small, which causes a problem in electrical contact between the first contact piece and the electrode. Further, if the second contact pieces 15b and 17b are separated from the back surface of the substrate 1 after the bonding, an unreasonable force is applied to the bonding portion, which causes a problem in electrical contact. Clamp part 1 for terminals 15 and 17
Since 5A and 17B are configured to sandwich the substrate 1 from the thickness direction, normally, the second contact pieces 15b and 1B are formed.
7b does not separate from the back surface of the substrate 1. However, there is a possibility that an unreasonable force is applied to the terminal during the assembly process such as when the terminal clamp portion is fitted to the board or when the bonding work is performed. As a result, the second contact piece may be separated from the back surface of the substrate 1.

In the present invention, since the second contact piece and the back surface of the substrate are bonded with an adhesive, the second contact piece is not easily separated from the back surface of the substrate even if an excessive force is applied to the terminal. Therefore, it is possible to maintain a good contact state between the terminal and the electrode. Therefore, the yield of products is significantly improved. Particularly, in the present invention, since the bonding is performed with an adhesive, it is not necessary to clean and remove the flux with flon, unlike the case of bonding by soldering. Therefore, it is possible to solve the problem that the resistance value changes due to the influence of the cleaning liquid. Furthermore, since it is not necessary to use an expensive material such as a silver-palladium alloy having solder resistance for the electrodes, the manufacturing cost can be reduced when a large number of electronic components are manufactured. Further, since it is not necessary to heat the electronic element as in soldering, it is possible to prevent the characteristics of the electronic element from changing.
Especially when the electronic component is a variable resistor, it is possible to prevent the linearity of the change in the variable resistance value from being deteriorated.

[0026]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 5 show an embodiment in which the present invention is applied to a variable resistor. In these figures, 1 is a ceramic substrate. As shown in FIG. 2, a through hole 3 is formed in the central portion of the substrate 1, and as shown in FIG.
A recess 5 is formed at the center of the end 1A on one side. Further, on the surface of the substrate 1, as shown in FIG.
A circular variable resistor (hereinafter, simply referred to as a resistor) 7 is formed concentrically with. Electrodes 9 and 11 are formed on both ends of the resistor 7 by silver paint or the like. Resistor 7
Is formed by screen-printing a thermosetting resin (resistive paint) containing carbon powder on the substrate 1 and then heating the substrate in a furnace. Since the contact portion 13a of the slider 13 slides on the surface of the resistor 7, in order to reduce friction between the contact portion 13a and the resistor 7,
It is preferable to make the surface of the resistor 7 as smooth as possible.

The electrodes 9 and 11 may be formed by using a conductive paint such as silver paint or may be formed by plating. The surfaces of the electrodes 9 and 11 are preferably rough surfaces. This is to prevent the adhesive applied to the surfaces of the electrodes 9 and 11 from flowing, that is, exuding. In order to make the surfaces of the electrodes 9 and 11 rough, the following is done.
For example, when an electrode is formed of a conductive paint, the shape of the particles of the conductive powder added to the conductive paint may be appropriately selected so that the surface of the electrode has irregularities. When the electrodes are formed by plating, the electrodes may be formed by matte plating. When the surfaces of the electrodes 9 and 11 are roughened, the electrodes 9 and 11 can be formed closer to the end portions of the resistor 7, and the overall print pattern becomes smaller, thus reducing the substrate used. As a result, the variable resistor can be downsized.

A terminal 15 attached to the end 1A of the substrate 1.
Clamps 1 and 17 clamp the substrate from the thickness direction.
5A and 17A, and leg portions 15B and 17B integrally formed with the clamp portion. The terminals 15 and 17 of this embodiment are formed by copper-plating an iron plate, and then cutting and bending a plated plate on which solder plating is applied. Solder plating was formed without adding a brightening agent to the plating solution. Therefore, the surface of the terminal is entirely covered with dull plating, and the surface is rough. Although iron is exposed on the cut surface, the exposed area of iron is small compared to the entire surface area, so it can be considered that the surface of the terminal is covered with a substantially matte plating. it can.

The clamp portions 15A and 17A of the terminals 15 and 17 are the first contact pieces 15 that come into contact with the electrodes 9 and 11.
a and 17a, second contact pieces 15b and 17b that come into contact with the back surface of the substrate 1, and connecting pieces 15c and 17c that connect the ends of both contact pieces. The width of each of the first contact pieces 15a and 17a is smaller than that of each of the second contact pieces 15b and 17b. First contact piece 15a
The width dimensions of 17a and 17a will be determined from the relationship between the size of the electrodes 9 and 11 and the required contact area. The width dimension of the second contact pieces 15b and 17b is determined according to the bonding strength required between the contact piece and the back surface of the substrate 1.

Since the contact piece 15a has the same structure as the contact piece 17a, the structure of the contact piece 17a shown in FIG. 4 will be described below. The first contact piece 17a and the first inclined portion 17d which are inclined to approach the second contact piece 17b as the distance from the connecting piece 17c increases before being fitted to the end 1A of the substrate 1. The second inclined portion 17e is configured to incline away from the second contact piece 17b as the distance from the tip end of the inclined portion increases. Clamp part 1
In the state in which 7A is fitted to the end of the substrate, the first contact piece 17a is spread apart from the second contact piece 17b, and the boundary between the first inclined portion 17d and the second inclined portion 17e. The portion or the first inclined portion 17d contacts the surface of the electrode 11. When the dimension of the connecting piece 17c is appropriately set, the first inclined portion 17d contacts the surface of the electrode 11, and when the dimension of the connecting piece 17c is lengthened, the boundary between the first inclined portion 17d and the second inclined portion 17e is increased. The part contacts the surface of the electrode 11. In order to increase the contact pressure between the first contact piece 17a and the surface of the electrode 11, the dimension of the connecting piece 17c is made longer than the thickness dimension of the substrate 1, and the first inclined portion 17d and the second inclined portion are formed. It is preferable that the boundary portion of the portion 17e contacts the surface of the electrode 11. This is because when the contact pressure decreases, the first contact piece 17a
This is because the adhesive may enter between the contact surface and the surface of the electrode 11.

On the first contact pieces 15a and 17a of the terminals 15 and 17, an epoxy type thermosetting adhesive (first
The adhesive portions 19 and 21 are formed by applying and then heating and curing. In the present embodiment, the first contact piece 15a of the clamp portions 15A and 17A.
And part of electrode 17a located on electrodes 9 and 11 and electrode 9
Adhesive is applied so as to cover most of 11 and 11. In this embodiment, since the contact pressure of the first contact pieces 15a and 17a with respect to the surfaces of the electrodes 9 and 11 is increased, even if the insulating adhesive is applied onto the electrodes 9 and 11, The adhesive does not enter into the contact portions between the contact pieces 15a and 17a and the electrodes 9 and 11, and the electrical contact between the first contact pieces and the electrodes is ensured.

The first adhesive applied on the first contact pieces 15a and 17a and the electrodes 9 and 11 has a thixotropic index or thixotropy which does not easily flow out from the applied area after application. Preferably. If this adhesive easily flows out from the area where it is applied, it is necessary to provide some outflow prevention means such as forming an electrode in the recess. If the adhesive does not flow out easily, the adhesive can be applied by screen printing or the like, which facilitates mass production of variable resistors. An epoxy adhesive sold under the trade name of PDS368 by Loctite Co., Ltd. can be used as an adhesive satisfying such requirements. By the way, the thixotropy index or thixotropy ratio (HATD) of this adhesive is 3.7, and the range of the acceptable thixotropy index of the adhesive that can be used in this example is as follows.
3 to 4.

In this embodiment, a thermosetting epoxy-based adhesive is used. As this adhesive, a room temperature curing type adhesive or an ultraviolet curing type adhesive that is cured when irradiated with ultraviolet rays is used. Various adhesives such as agents can be used. Although the adhesive of this embodiment has an insulating property, a conductive adhesive obtained by adding a conductive powder such as silver powder or copper powder to a resin coating may be used as the adhesive. The conductive adhesives currently on the market generally have a lower adhesive strength than adhesives having an insulating property. Therefore, if sufficient adhesive strength cannot be obtained with the conductive adhesive alone, apply the conductive adhesive and cure it, and then apply the insulating adhesive to cover the entire area. Then, it may be cured to form a reinforcing adhesive portion.

In the above embodiment, the adhesive is applied so that the adhesive portions 19 and 21 cover most of the first contact pieces 15a and 17a. However, these adhesive parts 1
9 and 21 connect the first contact pieces 15a and 17a to the electrode 9
And 11 are provided for the purpose of coupling. Therefore, the adhesive is applied to the first contact pieces 15a and 17
It suffices that the adhesive be applied across a and the electrodes 9 and 11, and it is not always necessary to apply the adhesive so as to cover almost all of the first contact pieces 15a and 17a.

The second contact pieces 15b and 17b are also connected to the substrate 1
Is bonded to the back surface of the adhesive with an adhesive (second adhesive). In this embodiment, as shown in FIG. 5, the adhesive layer 23 is formed between the back surface of the substrate 1 and the second contact piece 17b (15b), and the second contact piece 17b (15b) and the substrate The back surface of No. 1 is joined. The second contact piece 17b (15b) is the substrate 1
The contact pressure between the first contact piece 17a (15a) and the electrode 11 (9) becomes small when it is separated from the back surface of the electrode, and the contact pressure between the first contact piece 17a (15a) and the electrode 11 (9) decreases. It means that a problem occurs in electrical contact. Therefore, in this embodiment, the second contact piece 17b (1
5b) and the back surface of the substrate 1 are joined together to form the first contact piece 17
The contact pressure between a (15a) and the electrode 11 (9) is prevented from becoming small. In the present embodiment, since the adhesive layer 23 is formed in the slight gap formed between the second contact piece 17b (15b) and the back surface of the substrate 1, the adhesive having a small thixotropic index, that is, a small thixotropic property. Is preferably used. The adhesive used here preferably has a thixotropic index that spreads in the gap between the second contact piece 17b (15b) and the back surface of the substrate 1 due to the capillary phenomenon. An adhesive that meets such requirements is, for example, a thermosetting epoxy adhesive sold by Toyobo Co., Ltd. under the name KA215. By the way, the thixo ratio of this adhesive is 1. The adhesive is used on the back surface of the substrate 1 and / or the second contact piece 17b (15b).
Apply in advance on.

The second contact piece 17b (15
If b) is bonded to the back side of the substrate 1, the first contact piece 1
Adhesive part 1 for joining 5a and 17a with electrodes 9 and 11
Similar to 9 and 21, the adhesive may be applied so as to cover the second contact piece 17b (15b). In this case, an adhesive having a large thixotropic index, that is, a large thixotropic property, is used similarly to the adhesive forming the adhesive portions 19 and 21.

Next, the legs 15B and 1 of the terminals 15 and 17
The structure of 7B will be described. Since the legs 15B and 17B of the terminals 15 and 17 have the same structure, the leg 17B of the terminal 17 will be described in the following description, and the legs of the terminal 15 have the same reference numerals as the legs 17B. And the description thereof will be omitted. As shown in FIG. 1 (B), the leg portion 17B of the terminal 17 is continuous with the second contact piece 17b of the clamp portion 17A, and has a first portion 17f extending in a direction away from the back surface of the substrate 1, and A second portion that is continuous with the first portion 17f and extends in the direction in which the second contact piece 17c extends.
17g and a third portion 17 that is continuous with the second portion 17g and extends in the direction in which the first portion 17f extends.
and h.

The first portion 17f is formed with a through hole H penetrating in the thickness direction and extending in the longitudinal direction. In the through hole H, the second contact piece 17b of the clamp portion is provided on the substrate 1 when an external force that bends the leg portion is applied to the leg portion 17B.
To prevent it from moving away from the back of the first part 17
It is formed so that f is deformed. In this embodiment, the first portion 17f and the through hole H form an external force absorbing portion that absorbs an external force. The second portion 17g functions as a stopper that comes into contact with the surface of the circuit board when the leg 17B is inserted into the through hole formed in the circuit board. Also, a corner portion between the second portion 17g and the first portion 17f and a second portion 17g and a third portion 17h
The corner portion between the two portions constitutes an external force absorbing portion that is deformed when an external force is applied to the leg portion 17B before the leg portion 17B is inserted into the through hole formed in the circuit board. The third portion 17h is composed of a straight portion 17i and a bent portion 17j. The bent portion 17j functions as a retaining portion when it is inserted into a through hole formed in the circuit board.

As shown in FIG. 1 (D), FIG. 2 and FIG. 3, the slider 13 is formed by processing a metal plate, and in addition to the contact portion 13a, an annular shape to which the contact portion 13a is integrally attached. The receiving portion 13b, the tubular portion 13c provided integrally with the receiving portion 13b, and the four projecting pieces 13 provided at the end of the tubular portion 13c at a predetermined interval in the circumferential direction of the tubular portion 13c.
d to 13g and a stopper portion 13h provided integrally with the receiving portion 13b are provided. The tubular portion 13c of the slider 13
Is rotatably fitted in the through hole 3 provided in the substrate 1 and the through hole 25b formed in the flat plate portion 25a of the intermediate terminal 25 attached to the back surface of the substrate 1. And tubular portion 13
The four protruding pieces 13d to 13g provided at the end of c are
It is bent to the flat plate portion 25a side of the intermediate terminal 25,
The slider 13 is designed to be prevented from coming off. In addition, the stopper 1
3 h is fitted into a fitting recess 27 a formed inside an insulating resin cap, that is, the rotating body 27 to prevent the slider 13 from rotating.

The intermediate terminal 25 further includes a leg portion 25c and a stopper standing piece 25d. The standing piece 25d is fitted into the recess 5 formed in the substrate 1, and the tip end thereof extends into the internal space 27b formed inside the rotating body 27. The main portion of the slider 13 is housed in the internal space 27b of the rotating body 27, and the standing piece 25d of the intermediate terminal 25 contacts the wall portion surrounding the internal space 27b to prevent the rotating body 27 from rotating. I am trying.

The rotating body 27 includes a sliding portion 27A which slides on the surface of the substrate 1 and an operating portion 2 which is integrally provided on the sliding portion.
7B and 7B. The sliding portion 27A has an outer diameter dimension such that the outer peripheral surface thereof does not contact the adhesive portions 19 and 21, and has a height dimension higher than the height dimension of the adhesive portions 19 and 21. The maximum outer diameter of the operating portion 27B is larger than the outer dimension of the sliding portion 27A. With such a size, even if the adhesive portions 19 and 21 are provided, the rotating body 27 can be rotated without any trouble, and the operation portion 27B can be made large, which facilitates the operation.

In the central portion of the operating portion 27B of the rotating body 27,
The rotary shaft 29 is integrally provided. This rotating shaft 29
Is composed of a first fitting portion 29a fitted in the receiving portion 13b of the slider 13 and a second fitting portion 29b fitted in the tubular portion 13c of the slider 13. . Second fitting part 2
A slit 29c is formed at the center of 9b so as to extend in the axial direction. The tip ends of the two divided pieces 29d and 29e divided by the slit 29c are heated and deformed to form a retaining portion. The recess 31 formed in the operating portion 27B of the rotating body 27 is a driver slit into which a driver for adjustment is inserted, and the above-mentioned slit 29c.
Can also be used as a driver slit.

Next, a modified example of the terminal that can be used in the present invention will be described. In FIG. 6, the same parts as those shown in the embodiment shown in FIGS. 1 to 5 are given the same reference numerals as those shown in FIGS. 1 to 5 plus 100. In the terminal 117 shown in FIG. 6, the slit 118 is formed in the first contact piece 117a of the clamp portion 117A, and the first contact piece 117a is composed of two divided contact pieces. The second contact piece 117b has the first portion at the center.
Is bent to the contact piece 117a side. This terminal 117
As described above, when the first contact piece is composed of the divided contact pieces, the electrical contact between the first contact piece 117 and the electrode 111 becomes more reliable. This is the first contact piece 117a.
In the case of one sheet, if dust or the like is caught between the first contact piece 117a and the electrode 111, the first contact piece 117a
This is because the electrical connection between the electrode and the electrode 111 may be broken. When the first contact piece 117a is composed of a plurality of divided contact pieces like the terminal 117, if one divided contact piece is in contact with the electrode 111, an electrical connection can be obtained, so that the reliability can be improved. Will be more likely. In the terminal of this embodiment, one slit 118 is formed in the first contact piece 117a to obtain two divided contact pieces, but more slits are formed so that three or more divided contact pieces are formed. You may form. The terminal 117 also has the first contact piece 117a.
And the second contact piece 117b are bonded to the substrate with an adhesive.

FIG. 7A shows a perspective view of a clamp part 117A of another terminal which can be used in the present invention, and FIG. 7B shows a cross-sectional view of the main part of FIG. 7A. Shows. Also in this embodiment, the same parts as the parts shown in the embodiment shown in FIGS. 1 to 5 are denoted by the reference numerals added to the reference numerals shown in FIGS. In this embodiment, a plurality of grooves (or elongated recesses) 218 are formed by press working on the contact surface of the second contact piece 217b that contacts the back surface of the substrate. These plural grooves 218
Constitutes an adhesive agent accumulating portion for accumulating the second adhesive agent. The depth of these grooves 218 is such that the adhesive spreads through the inside of these grooves by capillary action. When such a groove is formed, the second contact piece 217b is formed.
The adhesive layer can be reliably formed between the substrate and the back surface of the substrate. The terminal 217 also has the first contact piece 217a.
And the second contact piece 217b are bonded to the substrate with an adhesive.

FIG. 8A shows a front view of a clamp portion 317A of another terminal which can be used in the present invention, and FIG. 8B is a sectional view taken along line VIIIB-VIIIB of FIG. 8A. Is shown. Also in the present embodiment, the same parts as those shown in the embodiment shown in FIGS. 1 to 5 are denoted by the reference numerals obtained by adding 300 to the reference numerals shown in FIGS. In the present embodiment, the first contact piece 317a is formed with one protrusion 318 protruding by pressing to the second contact piece 317b. Such a protrusion 3
By providing 18, the pressure concentrates on the tip of the projection 318, so that the contact pressure between the first contact piece 317a and the electrode can be increased. The number of protrusions should be at least 1.
Only one piece may be provided, and a plurality of protrusions may be provided. Further, in this embodiment, the through hole is not formed in the first portion 317f of the leg portion 317B, and this portion is thinned to serve as an external force absorbing portion that absorbs external force. The terminal 317 also connects the first contact piece 317a and the second contact piece 317b to the substrate with an adhesive.

FIG. 9 shows a perspective view of a clamp portion 317A of another terminal 317 that can be used in the present invention. Also in the present embodiment, the same parts as those shown in the embodiment shown in FIGS. 1 to 5 are denoted by the reference numerals added to the reference numerals shown in FIGS. 1 to 5 by 400. In the present embodiment, the tip portion of the first contact piece 417a is bent to the second contact piece 417b side to form the bent portion 418. The tip of the bent portion 418 contacts the electrode on the surface of the substrate 401. The terminal 417 is also the first contact piece 417.
a and the second contact piece 417b are bonded to the substrate with an adhesive.

FIG. 10 shows a perspective view of a clamp portion 517A of another terminal 517 that can be used in the present invention. Also in this embodiment, the same parts as the parts shown in the embodiment shown in FIGS. 1 to 5 are denoted by the reference numerals added to the reference numerals shown in FIGS. In this embodiment, the first contact piece 517a is replaced by the second contact piece 517b.
A cut-and-raised portion 518 cut and raised on the side is provided. In the terminal 517, the cut-and-raised portion 518 comes into contact with the electrode on the surface of the substrate 501. Also in this terminal 517, the first contact piece 517a and the second contact piece 517b are bonded to the substrate by an adhesive.

11A to 11C are front views of the terminal 617 which can be used in the present invention, and XIB in FIG. 11A.
-XIB line sectional drawing and the front view are each shown. The terminals shown in FIGS. 1 to 10 are all terminals for arranging the board in parallel with a circuit board (not shown).
The terminals 617 are terminals for arranging the board vertically to a circuit board (not shown). The feature of this terminal 617 is that the clamp portion 617A and the second contact piece 617a
And the contact piece 617b. 61
7k is a stopper piece that comes into contact with the surface of a circuit board (not shown). This terminal 617 is also the first contact piece 617a.
And the second contact piece 617b are bonded to the substrate with an adhesive.

FIG. 12A shows a partial perspective view of a clamp portion of another terminal that can be used in the present invention.
FIG. 12B shows a sectional view when the substrate is sandwiched by the clamp portions of this terminal. Also in this embodiment, FIG.
The same parts as those shown in the embodiment shown in FIG. 5 are denoted by the reference numerals shown in FIGS. 1 to 5 plus 700. In the present embodiment, the second contact piece 717b is provided with an adhesive agent reservoir consisting of one recess 718 for accumulating the second adhesive agent 723. Such a recess 71
Since 8 can be easily formed by press working, the price of the terminal does not increase even if such a recess 718 is formed. When attaching the terminal to the substrate, first, the second adhesive 723 is stored in the recess 718, and then the clamp portion 717A is sandwiched between the substrate 701. By doing so, the amount of the second adhesive 723 protruding from between the second contact piece 717b and the back surface of the substrate 701 can be reduced, and at the same time,
The second adhesive 723 collected in the recess 718 can firmly bond the second contact piece 717b to the back surface of the substrate 701.

In FIG. 12C, the adhesive reservoir is formed through the through hole 7.
18 'shows a cross-sectional view in the case of being formed by 18'. In this case, the second adhesive 723 causes the surface tension to penetrate the through-hole 71.
The shape and dimensions of the through-hole 718 'are determined so as to collect in 8'. The adhesive that has accumulated in the through hole 718 'and hardened strongly bonds the inner wall surface of the through hole 718' and the back surface of the substrate 701 to bond the second contact piece 717b to the back surface of the substrate 701. In this embodiment, the second contact piece 7
Although the adhesive accumulating portion is formed on 17b, a concave portion for accumulating the second adhesive 723 may be formed on the back surface of the substrate 701.

FIG. 13 shows a cross-sectional view of a substrate sandwiched by clamp portions of other terminals that can be used in the present invention. Also in the present embodiment, the same parts as the parts shown in the embodiment shown in FIGS. 1 to 5 are denoted by the reference numerals added to the reference numerals shown in FIGS. In this embodiment, the contact piece fitting recess 801a is formed on the front surface of the insulating substrate 801, and the recess 801b is formed on the back surface of the insulating substrate 801. The recess 801b constitutes an adhesive reservoir for accumulating the second adhesive 823. The recesses 8 formed in the substrate 801 are formed in the first and second contact pieces 817a and 817b of the terminal clamp portion 817A.
Fitting protrusions 817a1 and 817b1 that are fitted to 01a and 801b, respectively, are formed. Recess 8
An electrode (not shown) is formed in 01a.
When such recesses 801a and 801b are formed in the substrate 801, and the first and second contact pieces 817a and 817b are partly fitted in these recesses, the clamp portion 817A is formed.
To prevent the clamp part 8 from coming off from the substrate 801.
17A can be firmly sandwiched between the substrates 801. Also,
The electrical contact between the first contact piece 817a and the electrode (not shown) can be made more reliable. Further, as in the embodiment of FIG. 12, since the concave portion 801b serves as an adhesive reservoir for the second adhesive, the adhesive force between the second contact piece 817b and the back surface of the substrate 801 can be increased.

The end face of the substrate 801 and the clamp portion 817
Although a void 830 is formed between the inner surface of A and the inner surface of A, the void 830 is also filled with the second adhesive 823 in this embodiment. By doing so, the bond between the substrate 801 and the clamp portion 817A can be further strengthened.

In the present embodiment, when the electrode is formed by printing using a conductive paint, if the electrode is formed so that at least a part of the electrode is located inside the recess 801a, the conductive paint will be stored inside the recess 801a. Therefore, the thickness of the electrode can be increased. Therefore, the electrode can be prevented from being separated from the substrate 801.

Although the above embodiments apply the present invention to a variable resistor, the present invention can also be applied to other electronic parts such as switches, capacitors and integrated circuits.

Further, although the terminal of the above embodiment is provided with the leg portion integrally with the clamp portion, the shape of the connecting portion integrally provided with the clamp portion is arbitrary, and the shape of the leg portion is not required. Good.

Among the various inventions disclosed in the specification of the present application, some inventions will be described in the form of embodiments, which are indispensable for the constitution of the invention. For easy understanding, reference numerals attached to the embodiments shown in the drawings are also shown.

[Embodiment 1] An insulative substrate 1 having an electronic element 7 and electrodes 9 and 11 electrically connected to the electronic element on the surface, and an electrode which is in contact with the electrode and sandwiches the substrate from the thickness direction. An electronic component comprising clamp portions 15A, 17A and metal terminals 15, 17 having leg portions 15B, 17B integrally provided with the clamp portions,
The clamp portions 15A and 17A include first contact pieces 15a and 17a that come into contact with the electrodes and second contact pieces 15b and 17b that come into contact with the back surface of the substrate 1, and the first contact pieces of the clamp portion An electronic component in which an adhesive (19, 21) is applied on the contact piece and the electrode to bond the first contact piece and the electrode.

[Embodiment 2] The first contact piece 117a.
Is an electronic component according to the first embodiment, which is composed of a plurality of divided contact pieces.

[Embodiment 3] The tip portion of the first contact piece 17a of the clamp portion 17A has the second contact piece 1a.
The electronic component according to embodiment 1, which is curved so as to be convex toward 7b.

[Embodiment 4] At least one protrusion 318 is formed on the first contact piece 317a of the clamp portion 317A by press working and protrudes toward the second contact piece 317b. Embodiment 1
Electronic components described in.

[Embodiment 5] Embodiment 1 in which a plurality of grooves 218 are formed on the contact surface of the second contact piece 217b of the clamp portion 217A that contacts the back surface of the substrate.
Electronic components described in.

[Embodiment 6] The first contact piece 417a of the clamp portion 417A is replaced by the second contact piece 417b.
The electronic component according to embodiment 1, which is bent to the side.

[Embodiment 7] The first contact piece 517a of the clamp portion 517A is the second contact piece 517.
The electronic component according to the first embodiment, which includes a cut-and-raised portion 518 cut and raised on the b side.

[Embodiment 8] The electronic component according to Embodiment 1, wherein one recess 718 for accumulating the second adhesive 723 is formed in the second contact piece.

[Embodiment 9] An insulating substrate 1 having a variable resistor 7 on its surface and two electrodes 9 and 11 connected to both ends of the variable resistor is slid on the variable resistor. A metal having a slider 13, a rotating body 27 rotatably supported by the substrate to which the slider 13 is fixed, and a contact portion fixed to the substrate 1 and in contact with the slider 13. A metal having an intermediate terminal 25 made of metal, clamp portions 15A and 17A that are in contact with the two electrodes 9 and 11 and sandwich the substrate 1 from the thickness direction, and leg portions 15B and 17B that are integrally provided with the clamp portions. Made of two terminals 15,1
7 is a variable resistor including the first clamp member 15A, 17A of the terminal is in contact with the electrode
Contact piece and a second contact piece that comes into contact with the back surface of the substrate, and the first contact piece 17a of the clamp portion.
And a first adhesive 21 is applied on the electrodes to bond the first contact piece 17a and the electrode 11, and the second contact piece 17b is a second adhesive (23). The electronic component is adhered to the back surface of the substrate 1 by.

[Embodiment 10] The rotating body 27 includes a sliding portion 27 A that slides on the surface of the substrate 1 and the sliding portion 2.
7A and an operating portion 27B integrally provided on the
The sliding portion 27A has an outer diameter dimension such that the outer peripheral surface does not come into contact with the hardened first adhesive (19, 21) and a height higher than the height of the hardened first adhesive (19, 21). 10. The variable resistor according to the ninth embodiment, which has a height dimension, and a maximum outer diameter dimension of the operation portion 27B is larger than an outer dimension dimension of the sliding portion 27A.

[0067]

According to the present invention, the portion (first contact piece) of the terminal which contacts the electrode of the clamp portion and the electrode of the substrate are connected by the adhesive, so that the terminal can be connected without using soldering. Can be electrically and mechanically connected to the electrodes of the substrate,
There is an advantage that the CFC cleaning step can be eliminated. Further, there is an advantage that heating at the time of soldering can be eliminated and adverse effects of heat on the electronic element can be eliminated. In particular, according to the present invention, since the second contact piece and the back surface of the substrate are bonded with an adhesive, the second contact piece can be easily separated from the back surface of the substrate even if an excessive force is applied to the terminal. In addition, a good contact state can be maintained between the terminal and the electrode, and the yield of products can be significantly improved.

[Brief description of drawings]

1A is a front view of an embodiment in which the present invention is applied to a variable resistor, FIG. 1B is a side view of the embodiment of FIG. 1A, and FIG. FIG. 3 is a plan view of the embodiment of A),
FIG. 1D is a bottom view of the embodiment shown in FIG.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a partially cutaway view of the plan view of the embodiment of FIG.

FIG. 4 is a sectional view of a main part of the embodiment of FIG.

FIG. 5 is an enlarged cross-sectional view showing a bonded state of the back surface of the substrate and the clamp portion of the terminal.

FIG. 6 is a diagram showing a modification of the terminal.

7A is a perspective view showing a modified example of the clamp portion of another terminal, and FIG. 7B is a cross-sectional view of a main portion of FIG. 7A.

8A is a front view of a clamp portion of another terminal, and FIG. 8B is a sectional view taken along line VIIIB-VIIIB of FIG. 8A.

FIG. 9 is a perspective view showing a relationship between a clamp portion of another terminal and a substrate.

FIG. 10 is a perspective view showing a relationship between substrates of clamp portions of other terminals.

11A is a front view of another terminal, FIG. 11B is a sectional view taken along line XIB-XIB of FIG. 11A, and FIG. 11C is a plan view of the terminal of FIG. Is.

12A is a partial perspective view of a clamp portion of another terminal, FIG. 12B is a cross-sectional view of the clamp portion sandwiching the substrate, and FIG. 12C is an adhesive agent reservoir portion provided on the terminal. It is a sectional view for showing a modification of.

FIG. 13 is a cross-sectional view in which a substrate is sandwiched by clamp portions of other terminals.

[Explanation of reference numerals] 1 substrate 3 through hole 5 recess 7 resistor (electronic element) 9, 11 electrode 13 slider 15, 17 terminal 15A, 17A clamp portion 15B, 17B leg portion 15a, 17a first contact piece 15b , 17b Second contact piece 19, 21 Adhesive portion 23 Adhesive layer 25 Intermediate terminal 27 Rotating body

Claims (12)

[Claims] 1. A metal terminal having an insulative substrate having an electronic element and an electrode electrically connected to the electronic element on a surface thereof, and a clamp portion that is in contact with the electrode and sandwiches the substrate from the thickness direction. An electronic component comprising: a clamp portion having a first contact piece that contacts the electrode and a second contact piece that contacts the back surface of the substrate; The first contact piece and the electrode are first
And an electronic component in which the second contact piece is joined to the back surface of the substrate by a second adhesive. 2. The electronic component according to claim 1, wherein the second adhesive is applied between the second contact piece and the back surface of the substrate. 3. The adhesive agent accumulating portion for accumulating the second adhesive agent is formed on at least one of the back surface side of the substrate and the second contact piece. Electronic components. 4. The adhesive reservoir is provided on the back surface side of the substrate, and the second contact piece is formed so that a part thereof fits into the adhesive reservoir. The electronic component according to item 3. 5. A contact piece fitting recess, into which a part of the first contact piece is fitted, is formed at a portion where the electrode is formed on the front surface side of the substrate, and at least a part of the electrode. Is formed so as to be located in the contact piece fitting concave portion, and a part of the first contact piece is formed so as to be fitted in the contact piece fitting concave portion. Four
Electronic components described in. 6. The electronic component according to claim 1, wherein the surfaces of the first and second contact pieces that come into contact with the adhesive are rough surfaces. 7. The electronic component according to claim 6, wherein at least the clamp portion of the terminal is plated with non-gloss. 8. The electronic component according to claim 1, wherein the first adhesive has a thixotropic index that does not easily flow out from the applied area. 9. The electron according to claim 2, wherein the second adhesive has a thixotropic index that spreads in a gap between the second contact piece and the back surface of the substrate due to a capillary phenomenon. parts. 10. The terminal has a leg portion integrally with the clamp portion, and the second contact piece of the clamp portion is provided on the leg portion when an external force is applied to the leg portion. An external force absorbing portion which is deformed so as to prevent the substrate 1 from being separated from the back surface and absorbs the external force is formed.
The electronic component according to 4, 5, or 6. 11. The electronic component according to claim 10, wherein the external force absorbing portion is configured by forming a through hole penetrating in a thickness direction in a part of the leg portion adjacent to the second contact piece. 12. The first portion, wherein the leg portion of the terminal is continuous with the second contact piece of the clamp portion and extends in a direction away from the back surface of the substrate, and the first portion. A second portion which is continuous and extends in a direction in which the second contact piece extends; and a third portion which is continuous with the second portion and extends in a direction in which the first portion extends. ,
2. The through hole is formed in the first portion.
The electronic component according to 1.