JPH0732977U - Component mounting structure for semiconductor substrate - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a component mounting structure for a semiconductor substrate that can reduce costs without requiring an extra space and can reliably prevent a short circuit between an electronic component and a residual pattern. A pattern cutting hole is provided in a semiconductor substrate having a pattern drawn therein, and an electronic component is inserted into the pattern cutting hole to mount the electronic component. Is a component mounting structure for a semiconductor substrate, in which the edge portion corresponding to the pattern extending to the edge portion is provided with a cut portion for cutting the pattern to the outside of the pattern cut hole.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a shape structure of a pattern cut hole provided in a semiconductor substrate for inserting electronic components when mounting various electronic components on the semiconductor substrate.

[0002]

[Prior art]

 In general, a pattern is formed on a semiconductor substrate and various electronic components are mounted at predetermined locations. As the pattern of the semiconductor substrate, for example, as shown in FIG. 5, the pattern is formed by electrolytic plating or the like over the entire surface of the semiconductor substrate 11 regardless of the required portion 12 or the unnecessary portion 13 of the pattern in the pattern manufacturing technique. After that, each pattern cut hole 16 having a predetermined shape is formed in order to insert an electronic component 15 such as a crystal oscillator. Note that the two-dot chain line portion in FIG. 5 shows the portion cut by punching or the like.

Then, as shown in FIGS. 6 and 7, the electronic component 15 is inserted into the pattern cut hole 16, and the respective lead terminals 18 of the electronic component 15 are provided on the semiconductor substrate 11 by soldering or the like. It is connected to the connection terminals 14, 14.

[0004]

[Problems to be solved by the device]

 However, in the conventional semiconductor substrate as described above, since the pattern cut hole having a predetermined shape is only formed, the pattern remains up to the edge portion of the pattern cut hole, and the pattern cut hole is further punched. Burr is often formed at the edge of the hole when the electronic parts are inserted into the pattern cut hole, and the electronic parts are left in the metal case of the electronic parts at the portion A shown in FIG. There was a problem in that the edges of the pattern and the burrs of the pattern come into contact with each other, causing an electrical short.

Therefore, an object of the present invention is to provide a component mounting structure for a semiconductor substrate that can surely prevent a short circuit between an electronic component and a residual pattern.

[0006]

[Means for Solving the Problems]

 According to the present invention, a pattern cutting hole is provided in a semiconductor substrate having a pattern routed therein, and an electronic component is inserted into the pattern cutting hole to mount the electronic component. This is a component mounting structure for a semiconductor substrate in which a cut portion for cutting a pattern to the outside of the pattern cut hole is provided in the edge portion corresponding to the pattern reaching the edge portion of the hole.

[0007]

[Action]

 When mounting an electronic component, the electronic component is inserted into a pattern cut hole that is cut into a predetermined shape, and lead terminals of the electronic component are connected to respective terminals provided on the semiconductor substrate by soldering or the like.

[0008] In this case, since a cut portion for cutting the pattern to the outside of the pattern cut hole is provided at the edge of the pattern reaching the edge portion of the pattern cut hole into which the electronic component is inserted, Even when an electronic component is inserted and mounted inside, the pattern at the edge of the pattern cut hole and burrs generated by punching do not come into contact with the metal case of the electronic component. It can be reliably prevented and quality can be improved. Also, when each cut portion is provided, it can be provided at the same time as the existing pattern cut hole, so that it can be done by one operation and no additional cost is required.

[0009]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. 1 is a plan view showing a pattern cut hole provided in a semiconductor substrate, FIG. 2 is a vertical sectional view showing a pattern cut hole provided in a semiconductor substrate, and FIG. 3 shows a pattern cut hole provided in a semiconductor substrate. FIG. 4 is a plan view showing another example of the pattern cut hole provided in the semiconductor substrate.

As shown in FIG. 1, the semiconductor substrate 1 of the present embodiment has patterns 2 and 3 and connection terminals 4 and 4 in which necessary and unnecessary portions are combined on the semiconductor substrate 1 by electrolytic plating or the like. It is formed, and a pattern cut hole 6 is provided at a required portion of the mounting portion of the electronic component 5 by punching or the like. The pattern 3 in the pattern cut hole 6 shown by the chain double-dashed line in FIG. 3 is an unnecessary pattern that is removed by punching.

The pattern cut hole 6 shown in FIGS. 1 to 3 is provided, for example, for mounting the crystal oscillator 5, and the pattern cut hole 6 has a shape corresponding to an insertion outer shape of the crystal oscillator 5, In the embodiment, it is formed in a substantially trapezoidal shape.

Further, at the edge portion of the pattern cut hole 6 of the present embodiment, that is, at the position of the pattern 2 drawn to the edge portion of the hole 6, a slightly larger number of outwards from the outer shape of the inserted crystal oscillator 5. A cut portion 7 cut up to is provided.

In this embodiment, since there are four patterns 2 that reach the edge of the hole 6, four cut portions 7 are provided. Therefore, the pattern cut hole 6 of the present embodiment is formed in a substantially trapezoidal shape in which the cut portion 7 is added to the existing pattern cut hole, and these cut portions 7 are formed by cutting together with the pattern cut hole 6 at one time. Has been.

The cut portion 7 is provided because when the pattern cut hole 6 is formed by punching or the like, a burr is formed at the edge portion of the hole 6 and the crystal oscillator 5 is inserted when the crystal oscillator 5 is inserted into the hole 6. Since the edge of the residual pattern 2 and the burr of the pattern 2 may come into contact with the metal case of the oscillator 5, this is prevented to prevent an electrical short circuit or the like.

When the crystal oscillator 5 is mounted, the crystal oscillator 5 is inserted into the pattern cut hole 6 cut into a predetermined shape, and the lead terminal 8 of the crystal oscillator 5 is provided on the semiconductor substrate 1. It is mounted by connecting to each of the connection terminals 4 and 4 by soldering or the like.

Further, as shown in FIG. 4, in the case of the pattern cut hole 6 formed to mount the electronic component 5 having a circular plane shape, similarly, the cut portion 7 is provided together with the pattern cut hole 6. .

That is, in FIG. 4, the pattern 2 drawn around to the edge portion of the hole 6 is at two places, and therefore cut portions 7 for cutting a large amount to the outside of the hole 6 are provided at the corresponding places. There is.

Therefore, in the present embodiment, the edge portion of the pattern cut hole that reaches the edge portion of the pattern cut hole into which the electronic component is inserted has a cut portion that cuts the pattern to the outside of the pattern cut hole in a large amount. Since the electronic component is inserted into the pattern cut hole and mounted, the pattern at the edge of the pattern cut hole and burrs generated by punching do not contact the metal case of the electronic component. As a result, it is possible to reliably prevent short-circuiting of electronic components and improve quality.

In addition, when each cut portion is provided, it can be provided at the same time as the existing pattern cut hole. Therefore, it is not necessary to provide a dedicated cutting hole, and the existing pattern cut hole can be used, resulting in cost reduction. It can be reduced.

[0020]

[Effect of device]

 As described above, according to the present invention, since the edge portion corresponding to the pattern reaching the edge portion of the pattern cut hole is provided with the cut portion for cutting the pattern to the outside of the pattern cut hole, Even when an electronic component is inserted and installed in the cut hole, the pattern at the edge of the pattern cut hole and burrs generated by punching do not contact the metal case of the electronic component, and the electronic component is short-circuited. It is possible to reliably prevent such problems and improve quality. Further, when the respective cut portions are provided, they can be provided at the same time as the existing pattern cut holes, so that they can be done by a single operation and no additional cost is required.

[Brief description of drawings]

FIG. 1 is a plan view showing a pattern cut hole formed in a semiconductor substrate according to an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view showing a pattern cut hole provided in a semiconductor substrate.

FIG. 3 is a plan view showing a pattern cut hole provided in a semiconductor substrate.

FIG. 4 is a plan view showing another example of pattern cut holes provided in a semiconductor substrate.

FIG. 5 is a plan view showing a pattern provided on a semiconductor substrate according to a conventional example.

FIG. 6 is a plan view showing a pattern cut hole provided in a semiconductor substrate.

FIG. 7 is a vertical cross-sectional view showing a pattern cut hole provided in a semiconductor substrate.

[Explanation of symbols]

 1 semiconductor substrate 2 pattern 5 electronic component 6 pattern cut hole 7 cut part

Claims (1)

[Scope of utility model registration request] 1. A component mounting structure for a semiconductor substrate, wherein a pattern cut hole is provided in a semiconductor substrate having a pattern routed therein, and an electronic component is inserted into the pattern cut hole to mount the electronic component. A component mounting structure for a semiconductor substrate, characterized in that a cut portion for cutting a pattern to the outside of the pattern cut hole is provided in a large amount at the edge portion corresponding to the pattern reaching the edge portion of the cut hole.