JPH0732978U - Oxide removal device in jet solder bath - Google Patents

Abstract

(57) [Summary] [Purpose] To enable sufficient removal of oxides near the jet nozzle where oxides are likely to occur. [Structure] To remove oxide 4 floating on the surface 3A of a solder melt 3 in a solder bath 2 by scraping and removing the oxide 4, a removing plate 21 composed of a plurality of rotatable plate-like members, and these removing plates When the oxide 21 is moved in the scraping direction, the rotation is blocked, and when the oxide 4 is moved in the opposite direction, the drive shaft 11 is mounted so as to be swung up and rotated by the guide member. And a drive device 15 for reciprocating.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an oxide removing device in a jet type solder bath for scraping and removing oxides of a solder melt in a solder bath.

[0002]

[Prior art]

 Conventionally, a jet-type soldering apparatus pressurizes the solder melt in a solder bath with a pressure device such as a pump to jet the solder melt from the first jet bath and the second jet bath, and to The solder melt is made to soak into the chip parts attached to the board and the wiring board, and the first jet solder for removing bubbles between the chip parts is formed, and then the first jet flow in the second jet tank. The first jet solder from the bath forms a second jet solder to remove bridges and excess build-up parts or icicles generated between the wiring substrate and chip parts. Solder was carried by transporting them so that they would touch each other.

As described above, the solder melt jetted from the first jet tank and the second jet tank causes a turbulent flow when flowing down to the surface of the melt, and a portion in contact with the atmosphere becomes wide. Therefore, oxides are often generated, and when removing oxides generated in such a part, an oxide film removing device for a solder bath as described in JP-A-62-9771 is used. It was applied to a jet type soldering device to scrape oxides and the like.

[0004]

[Problems to be solved by the device]

 By the way, in the above-mentioned conventional soldering apparatus, between the first and second jet tanks, the solder melt jetted from these jet tanks collides with each other, so that oxides are often generated. When an object is entrained in the solder melt and returned to the pressurizing device, jet solder containing oxide is jetted from the first and second jet tanks and an oxide film adheres to the wiring board and chip parts. There were problems such as deterioration of the quality of the wiring board and clogging due to oxides adhering to the nozzles of these jet tanks.

Further, in the oxide film removing device for a solder bath disclosed in Japanese Patent Laid-Open No. 62-9771, there is a problem that the structure of the oxide film removing device itself becomes large and the cost becomes high. .

The present invention has been made in order to solve the above-mentioned problems, and is a jet type sprayer capable of sufficiently removing oxides in the vicinity of a jet nozzle where oxides are easily generated. The purpose of the present invention is to obtain an oxide removing device in a tank.

[0007]

[Means for Solving the Problems]

 The oxide removing device in the jet solder bath according to the present invention comprises a plurality of removing plates for scraping the oxide on the surface of the solder melt, and the removing plates are arranged so that their flat portions are parallel to each other. It consists of a drive shaft mounted so as to separate from the surface of the solder melt only when moving in the direction opposite to the oxide scraping direction, and a drive device that moves the drive shaft back and forth in the longitudinal direction. is there.

Further, a plurality of removing plates are provided along the dropping position of the jet solder.

Further, a stopper is provided on the drive shaft to prevent the removal plates from rotating by contacting the removal plates when the drive shaft moves in the oxide scraping direction. A guide member is provided in the solder bath so as to separate the respective removal plates from the surface of the solder melt when the solder bath moves in the direction opposite to the approaching direction.

[0010]

[Action]

 In the present invention, since the removal plate provided on the drive shaft reciprocated by the drive means is prevented from rotating only when the oxide is moved in the scraping direction, the oxide on the surface of the solder melt is sequentially fed. It can be scraped to the side of the solder bath.

Further, the oxide generated at the position where the jet solder is dropped can be scraped off and removed.

Further, since the removal plate is prevented from rotating only when it moves in the direction of scraping oxide, when it is immersed in the surface of the solder melt and moves in the direction opposite to the scraping direction of oxide, As it rotates and moves away from the surface of the solder melt, the oxide can be progressively removed.

[0013]

【Example】

 FIG. 1 is a perspective view showing an embodiment of the present invention, 1 is the whole of a jet solder bath, 2 is a solder bath, 3 is a solder melt, 3A is the surface of the solder melt 3, 4 is the above It is an oxide floating on the surface 3A and also contains other foreign matter. 5 is a first jet tank, 6 is a second jet tank, 7 is a first jet solder jetted from the first jet tank 5, 8 is a second jet jet jetted from the second jet tank 6. Solder 9 is a wiring board on which chip parts and electronic parts (not shown) are temporarily attached and conveyed in the direction of arrow A.

Reference numeral 10 denotes an entire oxide removing apparatus for removing the oxide 4 on the surface 3 A of the solder melt 3. Reference numeral 11 is two drive shafts which are parallel to each other, 12 is an attachment of the drive shaft 11, 13 is a link device, and 14 is an arrow B in a direction crossing the drive shaft 11 direction through the link device 13. , A motor that slides in the C direction and reciprocates, and the link device 13 and the motor 14 constitute the drive device 15. The motor 14 may also be used for the operation of swinging the nozzle of the first jet tank 5. Reference numeral 16 is a bearing of the drive shaft 11, 20 is a plurality of oxide removing portions provided on each of the drive shafts 11, an oxide removing plate 21 constituting the oxide removing portion 20, and a stopper described later. 24 and a guide member 25. Reference numeral 21a is a plane portion of the removal plate 21.

FIG. 2 is an enlarged perspective view showing details of the oxide removing portion 20 of FIG. 1, and FIG. 3 is a view seen from a direction of an arrow D 1 of FIG.

In FIG. 2, the same reference numerals as those in FIG. 1 indicate the same parts, the removal plate 21 is made of a plate-shaped member for removing the oxide 4 of FIG. 1, and the flat portions 21 a of each removal plate 21 are parallel to each other. So that the base 21b of the removal plate 21 is rotatably loosely fitted to the drive shaft 11 by a fixed shaft 22 fixed by screwing or the like, and removed. The tip portion 21c of the plate 21 is a portion that is immersed in the solder melt 3 when the oxide 4 shown in FIG. 1 is removed. Reference numeral 23 is a pin fixed to the side of the removing plate 21, 24 is a stopper fixed to the drive shaft 11, and when the drive shaft 11 moves in the direction of arrow B, the removing plate 21 causes the surface 3A of the solder melt 3 to move. It is to be held so that it is immersed in. Reference numeral 25 denotes a guide member for jumping up the removing plate 21, which is formed of an elastic material such as spring steel and is used for other than the oxide 4 removing operation, that is, when the drive shaft 11 moves in the direction of arrow C. The pins 23 slide along the upper surface thereof to prevent the removing plates 21 from coming into contact with the surface 3A of the solder melt 3. The number corresponding to the number of each removing plate 21 is provided, and It is fixed to the solder bath 2 by a mounting plate or the like (not shown). In addition, 25a is an upper surface of the guide member 25, 26 is an inclined portion of the guide member 25, and 26a is an inclined surface of the inclined portion 26.

Next, the operation will be described. The oxide removing device 10 drives the motor 14 to reciprocate the drive shaft 11 in the directions of arrows B and C via the link device 13, and every time the oxide removing portion 20 reciprocates by one stroke, the oxide removing device 20 moves. Scrape 4

FIGS. 4A to 4E are explanatory views showing the operation of the oxide removing section 20.

FIG. 4A shows a state in which the drive shaft 11 has finished moving in the direction of arrow B. The removal plate 21 has finished scraping off the oxide 4 and the drive shaft 11 has moved in the direction of arrow C. It indicates the time to start moving.

Next, in FIG. 4B, when the drive shaft 11 is moved in the direction of arrow C from the position of FIG. 4A, the pin 23 of the removing plate 21 is moved as shown by the chain double-dashed line of FIG. 4B. Since it contacts the inclined surface 26a of the inclined portion 26 of the guide member 25 and slides on the upper surface 25a of the guide member 25, the tip 21C of the removing plate 21 is separated from the surface 3A of the solder melt 3. As it is, the oxide 4 is moved to the scraping position.

Next, in FIG. 4C, the drive shaft 11 is further moved up to the stroke end in the direction of the arrow C, and the removal plate 21 reaches the position where the oxide 4 is scraped off. The pin 23 of 21 is separated from the guide member 25 as shown by the chain double-dashed line, and the removal plate 21 rotates in the direction of arrow E to move to the position indicated by the solid line. It will be in a state of submerged in the surface 3A.

Next, in FIG. 4D, when the slide shaft 11 moves in the direction of arrow B, the removing plate 21 comes into contact with the stopper 24, so that the removing plate 21 operates to scrape out the oxide 4. At this time, the pin 23 passes under the guide member 25.

Next, in FIG. 4E, when the drive shaft 11 further moves to scrape out the oxide 4, the pin 23 comes into contact with the lower surface of the inclined portion 26 of the guide member 25, so that the inclined portion 26 Is pushed up by the elasticity of the guide member 25 as shown in the illustrated position. Next, when the drive shaft 11 further moves and moves to the end of the stroke in the direction of the arrow B, the pin 23 separates from the inclined portion 26, returns by the restoring force of the guide member 25, and returns to the state of FIG. 4 (a). .

In this way, the operations shown in FIGS. 4A to 4E are performed as one stroke, and by repeating this operation, the oxides 4 are respectively removed from the removal plate of the next stage as shown in FIG. 21 is sequentially sent to the side of the solder bath 2 by the removal plate 21 at the final end.

It should be noted that the moving distance of one stroke of the drive shaft 11 is substantially equal to the distance at which each removing plate 21 is attached.

The sliding direction of the drive shaft 11 of the oxide removing apparatus 10 is not limited to the arrows B 1 and C 2 shown in FIG. 1, and the sliding direction is the conveying direction of the wiring board 9 (direction of arrow A). ) May be provided on both sides of the first jet tank 5 and the second jet tank 6 in the same direction as the above). In this case, other configurations are the same as those in FIGS.

[0027]

[Effect of device]

 As described above, according to the present invention, a plurality of removal plates for scraping the oxide on the surface of the solder melt and the flat surfaces of the removal plates are made parallel to each other so that the oxide scrapes Since it consists of a drive shaft mounted so as to be separated from the surface of the solder melt only when moving in the opposite direction, and a drive device that reciprocates this drive shaft in its longitudinal direction, it is an oxide removal device. Of the first jet tank and the second jet tank, and can be installed in a place where oxides are easily generated between the first jet tank and the second jet tank.

Further, since the plurality of removal plates are provided along the dropping position of the jet solder, the oxide generated between the first jet tank and the second jet tank can be efficiently and easily generated. It has the advantage that it can be removed.

Further, a stopper is provided on the drive shaft to prevent the removal plates from rotating when the drive shaft moves in the direction of scraping the oxide, and the drive shaft is provided with a stopper. Since a guide member is provided in the solder bath for separating each removal plate from the surface of the solder melt when moving in the direction opposite to the moving direction, even if the distance of one stroke for scraping the oxide is short. It has an advantage that oxides can be gradually removed by sufficient removal.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of an oxide removing device in a jet type solder bath according to the present invention.

FIG. 2 is an enlarged perspective view showing details of an oxide removing portion in the embodiment of FIG.

FIG. 3 is a view as seen from the direction of arrow D in FIG.

FIG. 4 is a view showing the operation of the oxide removing unit according to the present invention.

[Explanation of symbols]

 1 Jet-Type Solder Tank 2 Solder Bath 3 Solder Melt 3A Surface 4 Oxide 7 First Jet Solder 8 Second Jet Solder 10 Oxide Removal Device 11 Drive Shaft 15 Drive Device 20 Oxide Removal Portion 21 Removal Plate 21a Plane Part 24 Stopper 25 Guide member

Claims (3)

[Scope of utility model registration request] 1. A device for removing oxides in a jet solder bath for scraping and removing oxides floating on the surface of a solder melt in a solder bath of a jet solder bath, which comprises: A plurality of removal plates that scrape oxides,
These removal plates make the flat parts parallel to each other,
A drive shaft attached so as to separate from the surface of the solder melt only when the oxide is moved in a direction opposite to the scraping direction; and a drive device for reciprocating the drive shaft in its longitudinal direction. A device for removing oxides in a jet-type solder bath. 2. The oxide removing device in a jet type solder bath according to claim 1, wherein a plurality of removing plates are provided along a dropping position of the jet solder. 3. A stopper is provided on the drive shaft to prevent the rotation of the removal plates by contacting the removal plates when the drive shaft moves in the oxide scraping direction. 3. The solder bath is provided with a guide member for separating the removal plates from the surface of the solder melt when the oxide moves in a direction opposite to the scraping direction. Oxide removal device for jet solder bath.