JPH073668Y2 - Circuit board locking mechanism - Google Patents
Circuit board locking mechanismInfo
- Publication number
- JPH073668Y2 JPH073668Y2 JP1988059092U JP5909288U JPH073668Y2 JP H073668 Y2 JPH073668 Y2 JP H073668Y2 JP 1988059092 U JP1988059092 U JP 1988059092U JP 5909288 U JP5909288 U JP 5909288U JP H073668 Y2 JPH073668 Y2 JP H073668Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- case
- locking
- locking mechanism
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】 産業上の利用分野 本考案は回路基板の係止機構に係り、特にケース等の基
台縁部に回路基板を仮止めするに適した回路基板の係止
機構に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board locking mechanism, and more particularly, to a circuit board locking mechanism suitable for temporarily fixing a circuit board to an edge of a base such as a case.
従来の技術 例えばリモートコントローラに組込まれる受光器のよう
に、小型の電子機器では、筐体状シールドケースの一面
を開口し、この開口されたシールドケースの縁部に又は
縁部近傍に直接回路基板を係止した上で半田付けして取
付けることが行なわれている。2. Description of the Related Art In a small electronic device such as a light receiver incorporated in a remote controller, one surface of a case-like shield case is opened, and a circuit board is directly provided at or near an edge of the opened shield case. It is carried out by locking and soldering and then attaching.
従来における回路基板の係止機構を第４図及び第５図に
示す。第４図に示す係止機構１は、シールドケース２
（以下、単にケースという）の下縁近傍位置に折曲部2a
を形成しておき、回路基板３をケース２内に図中矢印Ａ
方向に挿入した後に折曲部2aを矢印Ｂ方向へ折り曲げて
回路基板３を係止する機構である。A conventional circuit board locking mechanism is shown in FIGS. 4 and 5. The locking mechanism 1 shown in FIG.
Bent portion 2a near the lower edge (hereinafter simply referred to as the case)
Is formed, and the circuit board 3 is placed in the case 2 by an arrow A
This is a mechanism for locking the circuit board 3 by bending the bent portion 2a in the direction of arrow B after being inserted in the direction.
一方、第５図に示す係止機構４は、ケース５の縁部に突
出した係止部5aを形成すると共に、この係止部5aと対応
する回路基板６に取付孔6aを形成し、回路基板６をケー
ス５に装着後、取付孔6aより突出した係止部5aを捩るこ
とにより回路基板３を係止する機構である。On the other hand, in the locking mechanism 4 shown in FIG. 5, a protruding locking portion 5a is formed at the edge of the case 5, and a mounting hole 6a is formed in the circuit board 6 corresponding to the locking portion 5a, so that the circuit This is a mechanism for locking the circuit board 3 by mounting the board 6 on the case 5 and then twisting the locking portion 5a protruding from the mounting hole 6a.
考案が解決しようとする課題 しかるに、上記した第４図に示される係止機構１では、
回路基板３の係止位置は必然的にケース２の下縁部より
内側位置（図では寸法Ｈだけ内側位置）となるため、こ
の寸法Ｈ分だけケース２が大型化してしまうという課題
があった。また、この寸法Ｈは回路基板３に実装される
電子部品のリード線カット寸法よりも大きかったため、
シールドケース２の半田付けと電子部品の自動ディップ
を同時に行なうことができず、半田処理が２度必要とな
り組立て工数が増大するという課題があった。更に、回
路基板３をケース２内に挿入後、折曲部2aを内側へ折曲
げねばならず、作業が面倒であるという課題があった。However, in the locking mechanism 1 shown in FIG. 4 described above,
Since the locking position of the circuit board 3 is inevitably located inside the lower edge portion of the case 2 (inside position by the dimension H in the figure), there is a problem that the case 2 is upsized by the dimension H. . Further, since the dimension H is larger than the lead wire cut dimension of the electronic component mounted on the circuit board 3,
There is a problem that soldering of the shield case 2 and automatic dipping of electronic components cannot be performed at the same time, and soldering processing is required twice, which increases the number of assembling steps. Furthermore, after the circuit board 3 is inserted into the case 2, the bent portion 2a must be bent inward, which causes a problem that the work is troublesome.
また、第５図に示される係止機構４では、回路基板６を
ケース５の縁部に装着後、係止部5aを捩る作業を必要
と、係止作業が面倒となると共に、この捩り量を適宜選
定しないと回路基板６がケース５から外れてしまった
り、係止部5aが捩り切れたりしてしまう虞れがあるとい
う課題があった。In addition, in the locking mechanism 4 shown in FIG. 5, it is necessary to twist the locking portion 5a after the circuit board 6 is mounted on the edge of the case 5, which makes the locking work troublesome and increases the amount of twist. There is a problem that the circuit board 6 may be disengaged from the case 5 or the locking portion 5a may be twisted unless the appropriate selection is made.
本考案は上記の点に鑑みて創作されたものであり、簡単
な操作で回路基板を確実にケースに係止し得る回路基板
の係止機構を提供することを目的とする。The present invention was created in view of the above points, and an object of the present invention is to provide a circuit board locking mechanism capable of reliably locking the circuit board to the case by a simple operation.
課題を解決するための手段 上記課題を解決するために、本考案では、 回路基板を基台の縁部に向け押圧操作することにより、
該基台に回路基板を係止する回路基板の係止機構であっ
て、 上記縁部より突出形成されると共に上記回路基板の押圧
方向に向け幅広となる形状を有し、側部に対向形成され
た一対の折曲部により構成される可撓部が互いに折曲部
が広がる方向にのみ弾性的に可撓して上記回路基板と対
向するよう構成された係止片を上記基台の縁部に設け、 この係止片に形成された可撓部が上記押圧操作時に回路
基板と係合して可撓され、 上記回路基板が所定係止位置に到った時、一対の折曲部
により構成される可撓部が弾性復元して回路基板と係合
しこれを係止する構成としたことを特徴とするものであ
る。Means for Solving the Problems In order to solve the above-mentioned problems, in the present invention, the circuit board is pressed toward the edge of the base to perform a pressing operation.
A circuit board locking mechanism for locking a circuit board to the base, which has a shape protruding from the edge portion and widened in a pressing direction of the circuit board, and is formed opposite to a side portion. The flexible portion formed by the pair of bent portions elastically bends only in the direction in which the bent portions spread and the locking piece configured to face the circuit board is provided at the edge of the base. And a flexible portion formed on the locking piece is engaged with the circuit board during the pressing operation to be flexed, and when the circuit board reaches a predetermined locking position, a pair of bent portions is formed. The flexible portion constituted by is elastically restored to engage with the circuit board and lock the same.
作用 回路基板の係止機構を上記の如く構成することにより、
回路基板の押圧操作時には可撓部は撓んで回路基板の押
圧操作を許容し、回路基板が縁部と当接した時に可撓部
は弾性復元して回路基板と係合するため、簡単な操作で
確実に回路基板をケースに係止できる。By configuring the locking mechanism of the circuit board as described above,
When the circuit board is pressed, the flexible part bends to allow the circuit board to be pressed, and when the circuit board contacts the edge, the flexible part elastically restores and engages with the circuit board. The circuit board can be securely locked in the case.
実施例 次に本考案の実施例について図面と共に説明する。第２
図は本考案の一実施例である回路基板の係止機構（以
下、単に係止機構という）を用いてなる電子機器９の斜
視図である。Embodiment Next, an embodiment of the present invention will be described with reference to the drawings. Second
FIG. 1 is a perspective view of an electronic device 9 using a circuit board locking mechanism (hereinafter, simply referred to as a locking mechanism) according to an embodiment of the present invention.
電子機器９はケース10と回路基板11とにより構成されて
いる。ケース10は金属製で筐体形状を有しておりシール
ドケースとして機能する。また、ケース10の回路基板11
の取付け位置は開放されており、その縁部10aには本考
案の要部となる係止機構を構成する係止片7,8が夫々ケ
ース10と一体的に設けられている。係止片7,8はケース1
0と一体成形されるため、この形成に際し困難を伴うも
のではない。The electronic device 9 includes a case 10 and a circuit board 11. The case 10 is made of metal and has a housing shape, and functions as a shield case. In addition, the circuit board 11 of the case 10
The mounting position is open, and at its edge 10a, locking pieces 7 and 8 constituting a locking mechanism, which is a main part of the present invention, are provided integrally with the case 10, respectively. Locking pieces 7 and 8 are case 1
Since it is integrally molded with 0, there is no difficulty in this formation.
回路基板11は、周知構造のプリント配線基板であり、ケ
ース10と対向する面には、図示しない電子部品が配置さ
れる。また、回路基板11には孔11aが形成されており、
その形成位置は係止片８の形成位置と対応するよう選定
されている。The circuit board 11 is a printed wiring board having a well-known structure, and an electronic component (not shown) is arranged on the surface facing the case 10. Further, the circuit board 11 is formed with a hole 11a,
The formation position thereof is selected so as to correspond to the formation position of the locking piece 8.
ここで、本考案の要部となる係止機構を第１図に拡大し
て示す。尚、各係止機構は同一構成であるため、一方の
係止機構を構成する係止片７のみを図示して説明する。Here, the locking mechanism which is the main part of the present invention is enlarged and shown in FIG. Since each locking mechanism has the same structure, only the locking piece 7 that constitutes one locking mechanism will be illustrated and described.
係止片７はケース10の縁部10aに突出して形成されてお
り、支柱部7aと可撓部7bとにより構成されている。支柱
部7aはケース10の縁部10aより所定量だけ突出した部分
であり、この突出量（図中、矢印Ｌで示す）は回路基板
11の厚さ寸法と等しいか、これより若干大なる寸法に選
定されている。The locking piece 7 is formed so as to project from the edge portion 10a of the case 10, and is composed of a column portion 7a and a flexible portion 7b. The pillar portion 7a is a portion protruding from the edge portion 10a of the case 10 by a predetermined amount, and the protruding amount (indicated by an arrow L in the drawing) is a circuit board.
It is selected to have a thickness equal to or slightly larger than 11 thickness dimensions.
また、可撓部7bは回路基板11の押圧方向（後述するよう
に、回路基板11をケース10に取付けるには、回路基板11
をケース10に向け押圧操作する）に向け、次第にその幅
寸法が広く、なるように、半円状の形状とされている。
この可撓部材7bに両側部分は内側に向け折り曲げられて
いる（以下、この折り曲げられた部分を折曲部7b-1,7b-
2という）。可撓部7bの両側に形成された一対の折曲部7
b-1,7b-2は、金属の有する弾性により、第１図（Ａ）
中、矢印C1,C2方向へ、即ち一対の折曲部7b-1,7b-2が互
いに広がる方向にのみ可撓し得る構成とされている。In addition, the flexible portion 7b is in the pressing direction of the circuit board 11 (as will be described later, the circuit board 11 is attached to the case 10 by the circuit board 11).
Is pressed toward the case 10), and the width dimension thereof is gradually widened to have a semicircular shape.
Both sides of the flexible member 7b are bent inward (hereinafter, this bent portion will be referred to as bent portions 7b- 1 and 7b-
2 ). A pair of bent portions 7 formed on both sides of the flexible portion 7b.
b- 1 and 7b- 2 are due to the elasticity of the metal, as shown in Fig. 1 (A).
The inside is configured to be flexible only in the directions of the arrows C 1 and C 2 , that is, in the directions in which the pair of bent portions 7b- 1 and 7b- 2 expand.
続いて回路基板11をケース10に係止する時の、上記係止
機構の動作について説明する。Next, the operation of the locking mechanism when locking the circuit board 11 to the case 10 will be described.
回路基板11をケース10に係止させるには、第２図におい
て孔11aが係止片８に一致し、回路基板11が各係止片7,8
の間に位置するよう位置決めした上で、回路基板11をケ
ース10に向け押圧操作する。この際、可撓部7bは押圧方
向に向け幅広となった形状（換言すれば、上方に向け尖
った形状）とされているため、操作開始時における位置
決めは容易に行ない得る。To lock the circuit board 11 to the case 10, the hole 11a is aligned with the locking piece 8 in FIG.
The circuit board 11 is pressed toward the case 10 after being positioned so as to be located between the two. At this time, since the flexible portion 7b has a shape that widens in the pressing direction (in other words, a shape that is pointed upward), positioning at the start of the operation can be easily performed.
前記のように折曲部7b-1,7b-2は押圧されてくる回路基
板11と対向しこれと係合するよう内側に向け折曲されて
いるため、押圧操作に伴って回路基板11がケース10の縁
部10aに向け進行するに従い、回路基板10は各折曲部7b-
1,7b-2に次第に強く係合することとなる。これにより、
折曲部7b-1,7b-2は第１図（Ａ）中、矢印C2方向に付勢
され、この付勢力により折曲部7b-1,7b-2はC2方向へ可
撓し、回路基板11の縁部10aに向かう進行は許容され
る。As described above, since the bent portions 7b- 1 and 7b- 2 are bent inward so as to face the circuit board 11 which is being pressed and engage with the circuit board 11, the circuit board 11 is pressed by the pressing operation. As the circuit board 10 advances toward the edge 10a of the case 10, the circuit board 10 is bent at each bent portion 7b-
1 , 7b- 2 will be gradually and strongly engaged. This allows
Bent portion 7b-1, 7b-2 during the first diagram (A), is biased in the arrow C 2 direction, the bent portion 7b-1 This biasing force, 7b-2 is flexible to C 2 direction The movement toward the edge 10a of the circuit board 11 is allowed.
そして、進行に伴い回路基板11の上面が可撓部7bから離
脱すると、折曲部7b-1,7b-2は弾性復元力により第１図
（Ａ）中、C1方向へ変位する。この状態を第１図（Ｃ）
に示す。同図に示すように弾性復元した状態で、可撓部
7bは回路基板11の上面11b（この上面は半田処理面とさ
れている）と係合し、上方向への離脱を防止している。
また、この状態で回路基板11の下面11cはケース10の縁
部10aと当接すうよう構成されている。従って、回路基
板11は縁部10aを可撓部7bとに挾持された状態となり、
ケース10に確実に係止される。また、上記のように回路
基板11はケース10の縁部10aに係止されるため、この係
止のためにケース10に係止用のスペースを設ける必要は
なく、これが用いられる電子機器の小型化を図ることで
きる。更に、上記のように回路基板11をケース10に係止
するための作業は、単に回路基板11をケース10に向け押
圧するだけの作業であるため、作業性の向上を図ること
ができる。When the upper surface of the circuit board 11 separates from the flexible portion 7b as it advances, the bent portions 7b- 1 and 7b- 2 are displaced by the elastic restoring force in the C 1 direction in FIG. 1 (A). This state is shown in Fig. 1 (C).
Shown in. As shown in the figure, in the elastically restored state, the flexible part
7b engages with the upper surface 11b of the circuit board 11 (this upper surface is a soldering surface) to prevent upward disengagement.
Further, the lower surface 11c of the circuit board 11 is configured to come into contact with the edge portion 10a of the case 10 in this state. Therefore, the circuit board 11 is in a state in which the edge portion 10a is sandwiched between the flexible portion 7b and
Securely locked to the case 10. Further, since the circuit board 11 is locked to the edge portion 10a of the case 10 as described above, it is not necessary to provide a locking space in the case 10 for this locking, and a small electronic device using this is provided. Can be realized. Furthermore, since the work for locking the circuit board 11 to the case 10 as described above is simply the work of pressing the circuit board 11 toward the case 10, the workability can be improved.
上記の如く、係止片７により回路基板11が係止された状
態において、可撓部7bは回路基板11の上面11bより第１
図（Ｃ）中、矢印ｈで示す寸法だけ突出している。この
寸法ｈは回路基板11に取付けられる電子部品のリード線
カット寸法（標準で２±0.5mm）より小となるよう選定
されている。このように寸法ｈを選定することにより、
係止片７が電子部品のリードカット時に邪魔になるよう
なことはなくなり、ケース10を回路基板11に係止後にリ
ードカット処理を行なうとができる。また、回路基板11
からの可撓部7bの突出寸法ｈを小とすることにより、可
撓部7b自体の機械的強度を向上させることができ、変形
が起りにくく取扱いが容易となる。As described above, in the state where the circuit board 11 is locked by the locking piece 7, the flexible portion 7b is located at the first position from the upper surface 11b of the circuit board 11.
In the figure (C), it projects by the dimension indicated by the arrow h. This dimension h is selected to be smaller than the lead wire cut dimension (2 ± 0.5 mm as standard) of the electronic component mounted on the circuit board 11. By selecting the dimension h in this way,
The locking piece 7 does not interfere with the lead cutting of the electronic component, and the lead cutting process can be performed after the case 10 is locked to the circuit board 11. Also, the circuit board 11
By reducing the protruding dimension h of the flexible portion 7b from the above, the mechanical strength of the flexible portion 7b itself can be improved, deformation is less likely to occur, and handling is easy.
係止片７により回路基板11にケース10が係止されると、
続いて半田処理が行なわれる。この時、可撓部7bは回路
基板11に配設された電子部品のリードカット寸法より小
とされているため、リード部と共に可撓部7bの半田付け
処理を自動半田ディップで行なうことができる。これに
より組立て工数の低減を図ることができる。更に半田付
け時において可撓部7bは曲がった状態であり、かつその
形状は半円形状であるため、半田付の融合性が高くな
り、半田付け不良が生じ難く、確実な半田付を行なうこ
とができる。When the case 10 is locked to the circuit board 11 by the locking piece 7,
Subsequently, soldering processing is performed. At this time, since the flexible portion 7b is smaller than the lead cut size of the electronic component arranged on the circuit board 11, the flexible portion 7b can be soldered together with the lead portion by automatic solder dipping. . As a result, the number of assembling steps can be reduced. Further, since the flexible portion 7b is bent during soldering and the shape thereof is semicircular, the fusion property of soldering is enhanced, soldering failure is unlikely to occur, and reliable soldering is performed. You can
尚、第２図において回路基板11が所定位置で係止された
状態では、係止片７は回路基板11の一側縁11dを係止
し、また係止片８は孔11aの周縁部分を係止するため、
回路基板11はケース10に確実に係止される。In FIG. 2, when the circuit board 11 is locked at a predetermined position, the locking piece 7 locks one side edge 11d of the circuit board 11, and the locking piece 8 locks the peripheral portion of the hole 11a. To lock
The circuit board 11 is securely locked to the case 10.
また、上記実施例では可撓部7bの形状を半円状の形状と
したが、れに限るものではなく、回路基板11の押圧操作
方向に向け幅広となる形状であれば良く例えば第３図に
示されるように（第１図に示した構成と対応する構成に
は同一の符号を附す）、台形形状としても良い。Further, although the flexible portion 7b has a semi-circular shape in the above-described embodiment, the shape is not limited to this and may be any shape that widens in the pressing operation direction of the circuit board 11, for example, as shown in FIG. The trapezoidal shape may be used as shown in FIG. 1 (the same reference numerals are attached to the configurations corresponding to those shown in FIG. 1).
考案の効果 上述の如く、本考案によれば、単に回路基板をケース
（基台）に向け押圧操作するだけで回路基板をケースに
係止することができ、従来のような面倒な折曲げ作業や
捩り作業が不要となるため、作業性良く確実に回路基板
の係止を行なうことができると共に、回路基板はケース
の縁部近傍で係止されるため、係止機構が用いられた電
子機器の小型化を図ることができる等の特長を有する。Effect of the Invention As described above, according to the present invention, the circuit board can be locked to the case by simply pushing the circuit board toward the case (base), and the bending work that is conventionally required Since a twisting operation is unnecessary, the circuit board can be locked with good workability, and the circuit board is locked near the edge of the case, so that an electronic device using a locking mechanism is used. It has features such as downsizing.
第１図は本考案の一実施例である係止機構を説明するた
めの図、第２図は第１図に示した係止機構を用いた電子
機器を示す斜視図、第３図は第１図に示した係止機構の
変形例を示す図、第４図及び第５図は従来の係止機構の
一例を説明するための図である。 7,8……係止片、7a……支柱部、7b……可撓部、7b-1,7b
-2……折曲部、10……ケース、10a……縁部、11……回
路基板。FIG. 1 is a view for explaining a locking mechanism which is an embodiment of the present invention, FIG. 2 is a perspective view showing an electronic device using the locking mechanism shown in FIG. 1, and FIG. The figure which shows the modification of the locking mechanism shown in FIG. 1, FIG.4, and FIG.5 are the figures for demonstrating an example of the conventional locking mechanism. 7,8 …… Locking piece, 7a …… Post part, 7b …… Flexible part, 7b- 1 , 7b
- 2 ...... bent part, 10 ...... case, 10a ...... edge, 11 ...... circuit board.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 昭58−138384（ＪＰ，Ｕ) 実開 昭59−91789（ＪＰ，Ｕ) 実開 昭60−92883（ＪＰ，Ｕ) 実開 昭60−11493（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References SHO 58-138384 (JP, U) ACT 59-91789 (JP, U) ACT 60-92883 (JP, U) ACT 60- 11493 (JP, U)
Claims (1)
ことにより、該基台に該回路基板を係止する回路基板の
係止機構であって、 該縁部より突出形成されると共に該回路基板の押圧方向
に向け幅広となる形状を有し、側部に対向形成された一
対の折曲部により構成される可撓部が互いに該折曲部が
広がる方向にのみ弾性的に可撓して該回路基板と対向す
るよう構成された係止片を該基台の縁部に設け、 該係止片に形成された可撓部が上記押圧操作時に該回路
基板と係合して可撓され、 該回路基板が所定係止位置に到った時、該一対の折曲部
により構成される可撓部が弾性復元して該回路基板と係
合しこれを係止する構成としてなる回路基板の係止機
構。1. A circuit board locking mechanism for locking the circuit board to the base by pressing the circuit board toward the edge of the base, the projection being formed to project from the edge. At the same time, the flexible portions, which have a shape that widens in the pressing direction of the circuit board and that are formed by a pair of bent portions that are formed to face each other, are elastically elastic only in the directions in which the bent portions expand. A locking piece configured to be flexible and to face the circuit board is provided on an edge of the base, and a flexible portion formed on the locking piece engages with the circuit board during the pressing operation. When the circuit board reaches a predetermined locking position, the flexible portion formed by the pair of bent portions elastically restores to engage with the circuit board and lock it. The locking mechanism for the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988059092U JPH073668Y2 (en) | 1988-04-30 | 1988-04-30 | Circuit board locking mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988059092U JPH073668Y2 (en) | 1988-04-30 | 1988-04-30 | Circuit board locking mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01163386U JPH01163386U (en) | 1989-11-14 |
| JPH073668Y2 true JPH073668Y2 (en) | 1995-01-30 |
Family
ID=31284879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988059092U Expired - Lifetime JPH073668Y2 (en) | 1988-04-30 | 1988-04-30 | Circuit board locking mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073668Y2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58138384U (en) * | 1981-10-30 | 1983-09-17 | ナイルス部品株式会社 | Clock printed circuit board installation mechanism |
| JPS5991789U (en) * | 1982-12-10 | 1984-06-21 | パイオニア株式会社 | Printed board |
| JPS6011493U (en) * | 1983-06-30 | 1985-01-25 | 松下電器産業株式会社 | Printed circuit board holding device |
| JPS6092883U (en) * | 1983-12-01 | 1985-06-25 | アルプス電気株式会社 | Mounting structure of printed circuit board on chassis |
-
1988
- 1988-04-30 JP JP1988059092U patent/JPH073668Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01163386U (en) | 1989-11-14 |
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