JPH073686B2 - Method of manufacturing thin film magnetic head - Google Patents
Method of manufacturing thin film magnetic headInfo
- Publication number
- JPH073686B2 JPH073686B2 JP15726488A JP15726488A JPH073686B2 JP H073686 B2 JPH073686 B2 JP H073686B2 JP 15726488 A JP15726488 A JP 15726488A JP 15726488 A JP15726488 A JP 15726488A JP H073686 B2 JPH073686 B2 JP H073686B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- head
- magnetic
- film magnetic
- magnetic head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/3116—Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、薄膜磁気ヘッドの製造方法に係り、詳しく
は、薄膜磁気ヘッドにおける媒体摺動面の耐摩耗性を向
上させるための薄膜磁気ヘッドの製造方法に関するもの
である。The present invention relates to a method for manufacturing a thin film magnetic head, and more particularly to a thin film magnetic head for improving the wear resistance of a medium sliding surface of the thin film magnetic head. The present invention relates to a manufacturing method of.
〔従来の技術〕 薄膜積層技術、或いは、フォトリソグラフィーなどによ
り形成される薄膜磁気ヘッドにあっては、第４図に示す
ように、基板（フェライトなどの磁性基板、若しくは、
非磁性基板）１上に形成された磁気回路２を保護する目
的で保護板３を低融点ガラスなどの接合剤４にて接合し
ている。[Prior Art] In a thin film magnetic head formed by a thin film laminating technique or photolithography, as shown in FIG. 4, a substrate (magnetic substrate such as ferrite, or
In order to protect the magnetic circuit 2 formed on the (non-magnetic substrate) 1, the protective plate 3 is bonded with a bonding agent 4 such as low melting point glass.
ところで、上記のように保護板３の接合に低融点ガラス
を用いると、同じく接合に樹脂を用いた場合に比べ、耐
環境性（耐湿性・耐薬品性等）や耐摩耗性の点で著しい
向上が見られるのであるが、かかる低融点ガラスは、一
般に基板或いは保護板として用いられるフェライトや結
晶化ガラスに比べると軟らかいため、磁気記録媒体摺動
時に、磁気記録媒体との接触部分、すなわち媒体摺動面
に偏摩耗が起こり、凹部Ｅが生じがちとなる。このよう
に凹部Ｅが生じると、ヘッドの目詰まり、更にはヘッド
・磁気記録媒体間の空隙によるスペーシング損失を誘発
し、その結果、ヘッドの出力が低下するという問題を招
来する。By the way, when the low melting point glass is used for joining the protective plate 3 as described above, it is remarkably excellent in environment resistance (moisture resistance, chemical resistance, etc.) and abrasion resistance as compared with the case where a resin is also used for joining. Although an improvement can be seen, since such a low melting point glass is softer than ferrite or crystallized glass which is generally used as a substrate or a protective plate, when the magnetic recording medium slides, a contact portion with the magnetic recording medium, that is, the medium Uneven wear occurs on the sliding surface, and the recess E tends to occur. The formation of the recess E in this way causes clogging of the head and further causes a spacing loss due to a gap between the head and the magnetic recording medium, resulting in a problem that the output of the head is reduced.
そこで、上記の接合に用いるガラスの硬度を高めること
が考えられる。Therefore, it is conceivable to increase the hardness of the glass used for the above joining.
ところが、低融点ガラスの硬度は、その温度特性と密接
な関係を有しており、ガラス硬度を高めるためには、高
い作業温度のガラスを選ばなければならない。一方、薄
膜磁気ヘッドにおいては、その磁気的・電気的特性の確
保、および外観上の不良（クラック・剥離など）の防止
を考慮すると、その耐熱温度としては600℃前後が限界
であるから、上記の接合に用いるガラスは、600℃以下
の作業温度を有するガラスに限定されることになる。従
って、この600℃以下の作業点を有する上記低融点ガラ
スの硬度を上げるには自ずと限界があり、上記の凹部Ｅ
の形成を阻止し得ないというのが実情であった。However, the hardness of the low melting point glass is closely related to its temperature characteristic, and in order to increase the glass hardness, it is necessary to select a glass having a high working temperature. On the other hand, in thin-film magnetic heads, considering the securing of magnetic and electrical characteristics and the prevention of defects in appearance (cracks, peeling, etc.), the heat resistance temperature is around 600 ° C. The glass used for the joining will be limited to the glass having a working temperature of 600 ° C. or lower. Therefore, there is naturally a limit to increasing the hardness of the low melting point glass having a working point of 600 ° C. or less, and the recess E
The reality is that the formation of
本発明に係る薄膜磁気ヘッドの製造方法は、上記の課題
を解決するために、磁気回路におけるヘッドギャップ部
側の盛り上がりを反映して形成される絶縁保護層におけ
る段差部の前方部分を、上記段差部上端の高さよりも高
くなるように形成する工程と、この工程の後に保護板を
接合剤にて接合する工程と、この工程の後に前記段差部
の前方部分の所定位置まで摺動面研磨を施す工程とを有
することを特徴としている。In order to solve the above-mentioned problems, a method for manufacturing a thin-film magnetic head according to the present invention, in order to solve the above-mentioned problems, the front portion of the step portion in the insulating protective layer formed to reflect the swell on the head gap portion side in the magnetic circuit is The step of forming so that it is higher than the height of the upper end of the part, the step of joining the protective plate with a bonding agent after this step, and the polishing of the sliding surface to a predetermined position in the front part of the step after this step And a step of applying.
上記の構成によれば、絶縁保護層における段差部の前方
部分は、上記段差部上端の高さよりも高くなるように形
成され、且つ、上記前方部分の所定位置まで摺動面研磨
が施されるから、媒体摺動面には接合剤ではなく、上記
の絶縁保護層が露出することになる。そして、上記の絶
縁保護層として硬度の高いものを選べるから、媒体摺動
面において凹部の発生を回避することができ、この凹部
に起因するヘッドの目詰まり、更にはヘッド・磁気記録
媒体間のスペーシング損失を防止してヘッド出力の低下
防止を図ることができる。According to the above configuration, the front portion of the step portion in the insulating protective layer is formed to be higher than the height of the upper end of the step portion, and the sliding surface is polished to a predetermined position of the front portion. Therefore, the insulating protective layer is exposed on the medium sliding surface, not the bonding agent. Since the insulating protective layer having a high hardness can be selected, it is possible to avoid the formation of the concave portion on the medium sliding surface, the head is clogged due to the concave portion, and further, between the head and the magnetic recording medium. It is possible to prevent spacing loss and prevent head output from decreasing.
また、上述の接合剤は露出しないから、この接合剤の硬
度を考慮する必要がなくなる。従って、この接合剤とし
て樹脂を使用することが可能になるとともに、接合剤と
して低融点ガラスを使用する場合には、低融点ガラスの
作業温度を低く設定できるから、薄膜磁気ヘッドの磁気
的・電気的特性の確保、および外観上の不良（クラック
・剥離など）防止を図ることができ、且つ、この低融点
ガラスの奏する利点、例えば、樹脂に比べて耐環境性
（耐湿性・耐薬品性等）の点で優れているという利点を
そのまま享受できることになる。Further, since the above-mentioned bonding agent is not exposed, it is not necessary to consider the hardness of this bonding agent. Therefore, it becomes possible to use a resin as the bonding agent, and when the low melting point glass is used as the bonding agent, the working temperature of the low melting point glass can be set low, so that the magnetic and electrical properties of the thin film magnetic head can be set. It is possible to secure physical properties and prevent defects in appearance (cracks, peeling, etc.), and the advantages of this low-melting glass are, for example, environmental resistance (moisture resistance, chemical resistance, etc.) compared to resin. ), You will be able to enjoy the advantage of being superior.
本発明の一実施例を第１図ないし第３図に基づいて説明
すれば、以下の通りである。An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.
本発明に係る薄膜磁気ヘッドの製造方法により製造され
る例えば巻線型の薄膜磁気ヘッド11は、第１図（ｄ）に
示すように、磁性基板12、下部磁性層13、層間絶縁層1
4、電磁誘導により図示しない磁気記録媒体の信号磁界
を検出する巻線導体15、前記の下部磁性層13とで磁気回
路21を構成する上部磁性層16、絶縁保護層17、ガラス下
地層18、接合剤19、および保護板20などにより構成され
ている。A winding type thin film magnetic head 11 manufactured by the method of manufacturing a thin film magnetic head according to the present invention has a magnetic substrate 12, a lower magnetic layer 13, an interlayer insulating layer 1 as shown in FIG.
4, a winding conductor 15 for detecting a signal magnetic field of a magnetic recording medium (not shown) by electromagnetic induction, an upper magnetic layer 16 constituting a magnetic circuit 21 with the lower magnetic layer 13, an insulating protective layer 17, a glass underlayer 18, It is composed of a bonding agent 19, a protective plate 20, and the like.
上記の薄膜磁気ヘッド11を製造するには、同図（ａ）に
示すように、フェライトなどの磁性基板12上にFe−Al−
Si或いはFe−Niなどの磁性金属からなる下部磁性層13を
スパッタ法、蒸着法、若しくは電着法などにより形成す
る。次いで、SiO2やAl2O3などからなる層間絶縁層14を
何層かに分けて形成する間に、Ag、Au、Al、Cuなどの金
属をスパッタ法或いは蒸着法により被着し、これを所定
のパターンに加工して巻線導体15を得る。そして、この
巻線導体15の起伏に起因する層間絶縁層14の上面の凹凸
を平坦化するとともに、フロントギャップ部Ａおよびバ
ックギャップ部Ｂのためのテーパエッチングを行った
後、上部磁性層16としてFe−Al−Si或いはFe−Niなどの
磁性金属を積層し、これの所定のパターンに加工して磁
気回路21を得る。In order to manufacture the above-mentioned thin film magnetic head 11, as shown in FIG. 3A, Fe--Al-- is formed on a magnetic substrate 12 such as ferrite.
The lower magnetic layer 13 made of a magnetic metal such as Si or Fe—Ni is formed by a sputtering method, a vapor deposition method, an electrodeposition method or the like. Then, while forming the interlayer insulating layer 14 made of SiO 2 or Al 2 O 3 into several layers, a metal such as Ag, Au, Al, or Cu is deposited by a sputtering method or a vapor deposition method. Is processed into a predetermined pattern to obtain the winding conductor 15. Then, the unevenness of the upper surface of the interlayer insulating layer 14 caused by the undulations of the winding conductor 15 is flattened, and taper etching is performed for the front gap portion A and the back gap portion B, and then the upper magnetic layer 16 is formed. A magnetic metal such as Fe-Al-Si or Fe-Ni is laminated and processed into a predetermined pattern to obtain a magnetic circuit 21.
次に、同図（ｂ）に示すように、上部磁性層16上に、ス
パッタ法若しくはCVD（Chemical Vapor Deposition）
法などによりSiO2やAl2O3などの耐摩耗性に優れた無機
材料を成膜することにより絶縁保護層17を得る。なお、
このとき、前記の磁気回路21におけるヘッドギャップ部
Ａ側の盛り上がりを反映して形成された上記絶縁保護層
17における段差部Ｃの前方部分Ｄ（幅ｘは10μｍ〜500
μｍ程度）を、上記段差部Ｃ上端の高さよりも高くなる
ように形成する。Next, as shown in FIG. 3B, a sputtering method or a CVD (Chemical Vapor Deposition) method is performed on the upper magnetic layer 16.
The insulating protective layer 17 is obtained by forming a film of an inorganic material having excellent wear resistance such as SiO 2 or Al 2 O 3 by a method or the like. In addition,
At this time, the insulating protective layer formed so as to reflect the bulge on the side of the head gap A in the magnetic circuit 21.
The front portion D of the step C in 17 (width x is 10 μm to 500 μm
μm) is formed to be higher than the height of the upper end of the stepped portion C.
前方部分Ｄを、上記段差部Ｃ上端の高さよりも高くなる
ように形成するには、第２図に示すように、スリット22
a…を上記の前方部分Ｄに対応する箇所に有するメタル
マスク22を用いて選択的に上記の前方部分Ｄが高くなる
ように成膜する。この成膜時の絶縁保護層17における前
方部分Ｄの膜厚は、例えば、10〜30μｍに設定され、ま
たその成膜方法としては、スパッタ法やＰ−CVD法など
が用いられる。To form the front portion D to be higher than the height of the upper end of the stepped portion C, as shown in FIG.
Using the metal mask 22 having a ... at a portion corresponding to the front portion D, the film is selectively formed so that the front portion D becomes higher. The film thickness of the front portion D of the insulating protection layer 17 at the time of this film formation is set to, for example, 10 to 30 μm, and as the film formation method, a sputtering method, a P-CVD method or the like is used.
次いで、第１図（ｃ）に示すように、絶縁保護層17上
に、接合剤19の下地層となるCr膜のガラス下地層18を0.
1〜1.0μｍの膜厚で積層する。その後、このガラス下地
層18上に接合剤19となるガラスロッド、ガラス板若しく
はフリットなどの低融点ガラス材料を介在させてフェラ
イト若しくは結晶化ガラスからなる保護板20を載置した
後、加熱および加圧処理を施してこの保護板20を接合す
る。Then, as shown in FIG. 1 (c), a glass underlayer 18 of a Cr film, which serves as an underlayer of the bonding agent 19, is formed on the insulating protective layer 17 in a 0.1.
Laminate with a film thickness of 1 to 1.0 μm. Thereafter, a protective plate 20 made of ferrite or crystallized glass is placed on the glass underlayer 18 with a low-melting glass material such as a glass rod, a glass plate, or a frit to be the bonding agent 19 interposed therebetween, followed by heating and heating. This protective plate 20 is joined by applying pressure treatment.
そして、同図（ｄ）に示すように、前方部分Ｄの所定位
置まで摺動面研磨を施す。Then, as shown in FIG. 3D, the sliding surface is polished to a predetermined position of the front portion D.
このように、本発明に係る薄膜磁気ヘッドの製造方法に
よれば、絶縁保護層17における段差部Ｃの前方部分Ｄ
を、上記段差部Ｃ上端の高さよりも高くなるように形成
し、且つ、上記前方部分Ｄの所定位置まで摺動面研磨を
施すから、媒体摺動面には接合剤19ではなく、上記の絶
縁保護層17が露出することになる。そして、上記の絶縁
保護層17として硬度の高いSiO2やAl2O3などを選べるか
ら、媒体摺動面において凹部が発生するのを回避するこ
とができ、この凹部に起因するヘッドの目詰まり、更に
はヘッド・磁気記録媒体間の空隙によるスペーシング損
失を低減してヘッドの出力の低下防止を図ることができ
る。As described above, according to the method of manufacturing the thin film magnetic head according to the present invention, the front portion D of the step portion C in the insulating protection layer 17 is formed.
Is formed so as to be higher than the height of the upper end of the stepped portion C, and the sliding surface is polished to a predetermined position of the front portion D. Therefore, the medium sliding surface is not the bonding agent 19 but the above-mentioned material. The insulating protective layer 17 is exposed. Since SiO 2 or Al 2 O 3 having a high hardness can be selected as the insulating protection layer 17, it is possible to avoid the formation of a recess on the medium sliding surface, and the clogging of the head due to this recess. Further, it is possible to reduce the spacing loss due to the gap between the head and the magnetic recording medium to prevent the output of the head from decreasing.
また、上記の接合剤19は媒体摺動面に露出することはな
いから、この接合剤19の硬度を考慮する必要がなくな
る。従って、この接合剤19として樹脂を使用することが
可能になるとともに、この接合剤19として低融点ガラス
を使用する場合には、低融点ガラスの作業温度を低く設
定できるから、薄膜磁気ヘッド11の磁気的・電気的特性
の確保、および外観上の不良（クラック・剥離など）の
防止を図ることができ、且つ、この低融点ガラスの奏す
る利点、例えば、樹脂に比べて耐環境性（耐湿性・耐薬
品性等）の点で優れているという利点をそのまま享受で
きることになる。Further, since the above-mentioned bonding agent 19 is not exposed on the medium sliding surface, it is not necessary to consider the hardness of this bonding agent 19. Therefore, it becomes possible to use a resin as the bonding agent 19, and when using a low-melting point glass as the bonding agent 19, the working temperature of the low-melting point glass can be set low, so that the thin film magnetic head 11 It is possible to secure magnetic and electrical properties and prevent appearance defects (cracks, peeling, etc.), and the advantages of this low-melting glass are, for example, environmental resistance (moisture resistance) compared to resin.・ You will be able to enjoy the advantage that it is superior in terms of chemical resistance.
なお、上記の実施例では、前方部分Ｄを、上記段差部Ｃ
上端の高さよりも高くなるように形成するのにメタルマ
スク22を用いたが、これ以外の方法として、第３図
（ａ）に示すように、上記絶縁保護層17における膜厚ａ
を、仮想線で示す最終的に必要な上記段差部Ｃ上端の高
さｂよりも厚くなるように、例えば10〜30μｍの厚みで
形成し、次いで、同図（ｂ）に示すように、前方部分Ｄ
に対応する箇所にフォトレジスト23を形成した後、露光
・現像を行い、同図（ｃ）に示すように、RIE（Reactiv
e Ion Etching）法により、上記前方部分Ｄ以外の箇
所を最終的に膜厚が１〜５μｍとなるように選択的に除
去すれば良い。In the above embodiment, the front portion D is replaced by the step portion C.
Although the metal mask 22 is used to form it so that it is higher than the height of the upper end, as another method, as shown in FIG.
Is formed with a thickness of, for example, 10 to 30 μm so as to be thicker than the finally required height b of the upper end of the stepped portion C indicated by an imaginary line, and then, as shown in FIG. Part D
After the photoresist 23 is formed at a position corresponding to the RIE, exposure and development are performed, and as shown in FIG.
It is sufficient to selectively remove the portions other than the front portion D by the e Ion Etching) method so that the final film thickness is 1 to 5 μm.
また、上記の実施例では、薄膜磁気ヘッドとして巻線型
の薄膜磁気ヘッドを挙げたが、その他の薄膜磁気ヘッ
ド、例えば、ヨーク型の磁気抵抗効果素子型薄膜磁気ヘ
ッドなどにおいても適用できることは勿論である。Further, in the above embodiment, the winding type thin film magnetic head was mentioned as the thin film magnetic head, but it is needless to say that it can be applied to other thin film magnetic heads, for example, a yoke type magnetoresistive element type thin film magnetic head. is there.
本発明にかかる薄膜磁気ヘッドの製造方法は、以上のよ
うに、磁気回路におけるヘッドギャップ部側の盛り上が
りを反映して形成される絶縁保護層における段差部の前
方部分を、上記段差部上端の高さよりも高くなるように
形成する工程と、この工程の後に保護板を接合剤にて接
合する工程と、この工程の後に前記段差部の前方部分の
所定位置まで摺動面研磨を施す工程とを有する構成であ
る。As described above, the method of manufacturing a thin-film magnetic head according to the present invention is characterized in that the front portion of the step portion in the insulating protection layer formed by reflecting the swelling on the head gap portion side in the magnetic circuit is made higher than the height of the upper end of the step portion. A step of forming a protective plate after the step with a bonding agent, and a step of polishing the sliding surface to a predetermined position in the front part of the step after the step. It is a structure having.
これにより、媒体摺動面において凹部の発生を回避する
ことができ、この凹部に起因するヘッドの目詰まり、更
にはヘッド・磁気記録媒体間のスペーシング損失を防止
してヘッドの出力が低下するという問題を解消すること
ができる。As a result, it is possible to avoid the formation of the concave portion on the medium sliding surface, prevent the head from being clogged due to the concave portion, and further prevent the spacing loss between the head and the magnetic recording medium to reduce the output of the head. The problem can be solved.
その上、上記の接合剤として樹脂を使用することが可能
になるとともに、接合剤として低融点ガラスを使用する
場合には、低融点ガラスの作業温度を低く設定できるか
ら、薄膜磁気ヘッドの磁気的・電気的特性の確保、およ
び外観上の不良防止を図ることができ、且つ、この低融
点ガラスの奏する利点、例えば、樹脂に比べて耐環境性
の点で優れているという利点をそのまま享受できるとい
う効果も併せて奏する。Moreover, it becomes possible to use a resin as the above-mentioned bonding agent, and when a low-melting point glass is used as the bonding agent, the working temperature of the low-melting point glass can be set low, so that -It is possible to secure electrical characteristics and prevent appearance defects, and enjoy the advantages of this low-melting glass, for example, the advantage of being superior in environmental resistance to resins. This effect is also played.
第１図ないし第３図は本発明の一実施例を示すものであ
って、第１図（ａ）ないし（ｄ）はそれぞれ薄膜磁気ヘ
ッドの製造工程の各段階を示す断面図、第２図はメタル
マスクの平面図、第３図（ａ）ないし（ｃ）は段差部の
前方部分を段差部上端の高さよりも高くなるように形成
するための工程の変形例の各段階を示す断面図、第４図
は従来の製造方法により製造される薄膜磁気ヘッドの断
面図である。 11は巻線型の薄膜磁気ヘッド、12は磁性基板、13は下部
磁性層、14は層間絶縁層、15は巻線導体、16は上部磁性
層、17は絶縁保護層、18はガラス下地層、19は接合剤、
20は保護板、21は磁気回路、22はメタルマスク、23はフ
ォトレジストである。1 to 3 show an embodiment of the present invention, and FIGS. 1 (a) to 1 (d) are cross-sectional views showing respective steps of a manufacturing process of a thin film magnetic head, and FIG. FIG. 3A is a plan view of the metal mask, and FIGS. 3A to 3C are cross-sectional views showing respective steps of a modification of the process for forming the front portion of the step portion to be higher than the height of the upper end of the step portion. FIG. 4 is a sectional view of a thin film magnetic head manufactured by a conventional manufacturing method. 11 is a winding type thin film magnetic head, 12 is a magnetic substrate, 13 is a lower magnetic layer, 14 is an interlayer insulating layer, 15 is a winding conductor, 16 is an upper magnetic layer, 17 is an insulating protective layer, 18 is a glass base layer, 19 is a bonding agent,
Reference numeral 20 is a protective plate, 21 is a magnetic circuit, 22 is a metal mask, and 23 is a photoresist.
Claims (1)
り上がりを反映して形成される絶縁保護層における段差
部の前方部分を、上記段差部上端の高さよりも高くなる
ように形成する工程と、この工程の後に保護板を接合剤
にて接合する工程と、この工程の後に前記段差部の前方
部分の所定位置まで摺動面研磨を施す工程とを有するこ
とを特徴とする薄膜磁気ヘッドの製造方法。1. A step of forming a front portion of a step portion in an insulating protective layer formed so as to reflect a bulge on the head gap portion side in a magnetic circuit so as to be higher than a height of an upper end of the step portion, A method of manufacturing a thin-film magnetic head, comprising a step of joining a protective plate with a joining agent after the step, and a step of polishing the sliding surface up to a predetermined position in the front part of the step portion after this step. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15726488A JPH073686B2 (en) | 1988-06-23 | 1988-06-23 | Method of manufacturing thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15726488A JPH073686B2 (en) | 1988-06-23 | 1988-06-23 | Method of manufacturing thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH025216A JPH025216A (en) | 1990-01-10 |
| JPH073686B2 true JPH073686B2 (en) | 1995-01-18 |
Family
ID=15645855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15726488A Expired - Lifetime JPH073686B2 (en) | 1988-06-23 | 1988-06-23 | Method of manufacturing thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073686B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007057169A (en) * | 2005-08-25 | 2007-03-08 | Kajiwara Kogyo Kk | Exhaust hood |
-
1988
- 1988-06-23 JP JP15726488A patent/JPH073686B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH025216A (en) | 1990-01-10 |
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