JPH0737802Y2 - High frequency frame bonding device - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention is a device for mainly manufacturing a wooden rectangular frame for frames, furniture, fittings, etc., and a high frequency frame for heating and bonding four corners by high frequency dielectric heating. This is a device relating to a bonding device.

More specifically, the invention relates to a high-frequency frame bonding apparatus that can perform both heat-bonding by high frequency and fixing by nails.

[Conventional technology]

2. Description of the Related Art A high-frequency frame bonding apparatus used for bonding four-sided component members at four corners when manufacturing a frame or the like has been conventionally known. In the conventional high-frequency frame bonding device, the four side components are arranged in a rectangular shape, and the joint surface part is sandwiched between the upper electrode and the lower electrode in a state where the four corners of the frame are pressed and fixed inward, and a high-frequency current is applied. Let it heat bond.

However, for example, when the member forming the frame is thin and the area of the bonding surface is small, sufficient bonding strength cannot be obtained. At this time, conventionally, an operator manually nails the frame to the frame after the bonding process.

[Problems to be solved by the device]

The frame shape of the frame bonded by the high-frequency frame bonding device is maintained only by the adhesive force of the bonding surface.

In addition, when fixing and reinforcing with nails, it is necessary to perform the work as a separate process, which is extremely inefficient. Further, the one that is reinforced by nails is mainly used when the bonding strength is low, and there is a problem that the bonded portion is easily separated during handling.

In view of such a point, the present invention has devised a high-frequency frame bonding apparatus capable of efficiently performing heat bonding by high-frequency heating and reinforcement by nails.

[Means for Solving the Problems]

The four corners of the workpiece (4) formed by abutting the members on the four sides in a square shape are supported by four pedestals (3) and (3) serving as lower electrodes, respectively. Four cradle (3),
A pressing piece (5) is provided on the (3), which comes into contact with the outer surface of the corner of the workpiece, and the pedestal (3) itself is moved toward and away from the workpiece at an angle of 45 degrees in the horizontal direction. In addition to the above, an upper electrode (6) for pressing the four corners of the workpiece from above is provided above the pedestal (3).

The pressing piece (5) for pressing the work piece is provided with a through hole (10) in the extension direction of one side of the work piece having a rectangular frame shape, and nailing is performed in the extension direction of the through hole (10). A machine (8) is provided.
The nailing machine (8) has a working position where the working part (8a) at the tip passes through the through hole and reaches the work piece, and a position apart from the corner of the work piece, and which is covered by the upper electrode (6). A standby position that is separated by a distance that does not affect the high-frequency heating of the four corners of the workpiece such as electric discharge can be moved back and forth.

[Action]

When the four side members constituting the work piece are butted against each other in a rectangular shape, the four corners are supported by the pedestal (3), and the pedestal (3) is advanced at an angle of 45 degrees in the horizontal direction, the pedestal 3 The pressing pieces (5) provided above press the four corners of the workpiece inwardly, so that the workpiece is maintained in an accurate frame shape. In this state, the four corners of the workpiece (4) are pressed by the upper electrode (6), and a high-frequency current is applied between the pedestal (3) [the pedestal (3) serves as the lower electrode] and the upper electrode (6). When electricity is applied to the butt, the butted portions are heated and bonded by high frequency dielectric heating. At this time, the nailing machine (8) is in a standby position apart from the work piece that does not affect discharge or the like when energizing the high frequency current.

A high-frequency current is supplied, and when the heating and bonding is completed, the high-frequency current is stopped and the nailing machine (8) is advanced to the operating position. Then, the working part (8a) at the tip of the nailing machine (8) can pass through the through hole (10) of the pressing piece (5) and directly hit the nails at the four corners of the frame that has been heat-bonded as it is. Become.

〔Example〕

Hereinafter, an embodiment of the high-frequency frame bonding apparatus of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a front view of the entire apparatus, and FIG. 2 is a plan view. On the main body frame (1), movable frames (2) and (2) having a substantially trapezoidal plane are arranged at left and right opposing positions, and two pedestals (3) and (3) are arranged on the movable frame (2). Are provided to support the four corners of the workpiece (4) composed of four sided members. A pressing piece (5) is provided on each pedestal (3), and the pedestal (3) itself can be moved back and forth at an angle of 45 degrees, so that the work piece placed on the pedestal (3) can be processed. The frame shape can be maintained by pressing the object (4) with the pressing piece (5) diagonally forward in the horizontal direction. Also, the pedestal (3) serves as the lower electrode (ground side), but the upper electrode (6) can be lifted and lowered so that the four corners of the workpiece (4) can be pressed from above onto each pedestal part. To be installed. The upper electrode (6) has a size capable of covering the abutting portions at the four corners of the workpiece.

The mount (7) that moves integrally or in conjunction with the pedestal (3) is an angle of 45 degrees to the pedestal (3), that is, a workpiece (4) that is a rectangular frame. The nail driver (8) is installed on the mount (7) provided in the direction of the side. The mounting base (7) is composed of a fixed base (7a) that moves integrally with the receiving base (3) and a moving base (7b) that moves back and forth with respect to the fixed base (7a). ) Is fixed with a nail driver (8). In the illustrated embodiment, the moving base (7b) can be moved back and forth in the lateral direction with respect to the workpiece by the cylinder (9).

The operating part (8a) of the nailing machine (8) fixed to the moving base (7b) and moving forward and backward by the movement of the moving base (7b) faces the pressing piece (5) on the pedestal (3). A through hole (10) is provided in a part of the pressing piece (5) as understood from FIGS. 3 and 7, and the through hole (10) operates the nailing machine (8). It is arranged to face the section (8a). Therefore, in the standby position shown in FIG. 3, the operating part (8a) of the nailing machine (8) is located away from the corner of the workpiece with which the upper electrode abuts. On the other hand, in the nailing operation position in which the high frequency current is not applied as shown in FIG.
The working part (8a) of the nailing machine (8) penetrates the through hole (10) of the pressing piece (5) to reach the surface of the workpiece (4), and the nail loaded in the magazine (8b) is removed. It can be punched into the butt-bonded portions at the four corners of the workpiece (4).

FIG. 8 shows a door partially provided with a window frame as an example of the workpiece. The window frame provided in the door uses a thin member for the frame member itself, and its outer peripheral surface is not exposed to the outside. Then, this frame is processed as a frame and then used for processing the door. For this reason, it is preferable not only to bond the four corners but also to reinforce the frame with nails because of the strength of handling the door when it is processed and that there is no problem even if a nail hole is formed on the outer periphery. The present invention can be used for processing such a frame. However, it goes without saying that it can be used for various rectangular frames such as arbitrary frames and fittings, as long as they are bonded and reinforced with nails to join the corners.

[Effect of device]

It is not always easy to drive nails for reinforcing the four corners of a frame in which members on four sides are heat-bonded, particularly a frame made of thin members, because the bonding strength of the bonded portions is not sufficient.

According to the high-frequency frame bonding apparatus of the present invention, when the members on the four sides are heat-bonded together, and the reinforcement and fixing by nails are also performed, the work piece is moved in the same posture after the heat-bonding process. Nail driving can be performed. Therefore, even if the bonding area and the bonding strength are small, the nailing process can be efficiently performed.

In addition, when heat bonding is performed, there are some that do not have sufficient strength immediately after bonding, and in such a case, there is a possibility that the bonding strength may be reduced by moving after bonding. On the other hand, in the present invention, since the nail can be driven without moving the workpiece immediately after the heat bonding, there is also an effect of increasing the bonding strength itself.

[Brief description of drawings]

The attached drawings show an embodiment of the high-frequency frame bonding apparatus of the present invention. Fig. 1 is a front view of the whole, Fig. 2 is a side view, and Figs. 3 and 4 are partially cut corners. FIG. 3 is a plan view showing a standby state, FIG. 4 is a plan view showing an operating state of nailing, and FIG. 5 is an operation of a nailing machine. FIG. 5 is a side view showing a standby state, FIG. 6 is a side view showing an operating state, FIG. 7 is a perspective view of only the pressing piece, and FIG. 8 is the present invention. FIG. 6 is a perspective view of a door showing an example of a frame manufactured by the device. (1) …… Main body frame, (2) …… Movement frame,
(3) …… pedestal, (5) …… pressing piece, (6) …… upper electrode, (7) …… mounting base, (8) …… nail driver, (8a) ……
Actuator, (9) …… Cylinder, (10) …… Through hole.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location B29C 65/56 7639-4F

Claims (1)

[Scope of utility model registration request] 1. The four corners of a workpiece (4) formed by abutting four side members in a square shape are supported by four pedestals (3) that are lower electrodes, respectively, and the four pedestals (3) are supported. ) On each of which a pressing piece (5) that abuts the outer surface of the corner of the workpiece is provided, and the pedestal (3) itself can be moved toward and away from the workpiece at an angle of 45 degrees in the horizontal direction. Above the pedestal (3) are upper electrodes (6) that press the four corners of the workpiece from above.
In addition, the pressing piece (5) that comes into contact with the four corners of the work piece is provided with a through hole (10) in the extending direction of one side of the work piece having a rectangular frame shape. The nailing machine (8) is arranged in the extension direction of 10), and the nailing machine (8) has an operating position where the working portion (8a) at the tip passes through the through hole (10) and reaches the workpiece. , At a position away from the corner of the work piece,
A high-frequency frame bonding apparatus characterized in that it can be moved back and forth between a standby position and a standby position that is separated by a distance that does not affect high-frequency heating of the four corners of the workpiece by the upper electrode (6).