JPH0739278Y2 - Circuit board device - Google Patents
Circuit board deviceInfo
- Publication number
- JPH0739278Y2 JPH0739278Y2 JP1990108148U JP10814890U JPH0739278Y2 JP H0739278 Y2 JPH0739278 Y2 JP H0739278Y2 JP 1990108148 U JP1990108148 U JP 1990108148U JP 10814890 U JP10814890 U JP 10814890U JP H0739278 Y2 JPH0739278 Y2 JP H0739278Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- circuit board
- component
- generating component
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 claims description 17
- 230000005855 radiation Effects 0.000 description 8
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- 239000000779 smoke Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000391 smoking effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 この考案は、ハロゲンランプの点灯装置等に適用される
回路基板装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a circuit board device applied to a lighting device for a halogen lamp or the like.
複写機等の電子機器に適用されるハロゲンランプの点灯
装置において、発熱部品を含む強電回路部分と弱電回路
部分が同一のプリント基板に実装される場合がある。In a halogen lamp lighting device applied to an electronic device such as a copying machine, a high-current circuit part including a heat-generating component and a low-current circuit part may be mounted on the same printed circuit board.
またこのようなプリント基板を電子機器に組み付ける作
業や、他の場所へ移動させる作業において、プリント基
板に実装された電子部品に外力すなわち機械的応力が加
えられることがある。In addition, external force, that is, mechanical stress may be applied to the electronic components mounted on the printed circuit board during the operation of assembling the printed circuit board into an electronic device or the operation of moving it to another place.
とくに、発熱部品の場合、電子部品の変形や半田はずれ
などによって動作不良を発生し、発煙や発火等のトラブ
ルを生じることがあった。また発熱部品の放熱性が問題
となった。Particularly, in the case of heat-generating components, malfunctions may occur due to deformation of electronic components, detachment of solder, and the like, causing problems such as smoking and ignition. In addition, the heat dissipation of the heat-generating component became a problem.
したがって、この考案の目的は、発熱部品を保護するこ
とができるとともに発熱部品の放熱を良好にすることが
できる回路基板装置を提供することである。Therefore, an object of the present invention is to provide a circuit board device capable of protecting the heat-generating component and improving heat dissipation of the heat-generating component.
この考案の回路基板装置は、複数の発熱部品を含む電子
部品を実装したプリント基板と、Ｌ字形に折曲された一
対の板からなり前記プリント基板に立設されて前記発熱
部品を箱形に囲むとともに前記発熱部品の少なくとも一
部を内面に取付けた放熱兼保護体とを備えたものであ
る。A circuit board device of the present invention comprises a printed circuit board on which electronic components including a plurality of heat generating components are mounted, and a pair of plates bent in an L shape, and is erected on the printed circuit board to form the heat generating component into a box shape. A heat radiation and protection body is provided which is surrounded and at least a part of the heat generating component is attached to the inner surface.
この考案の構成によれば、プリント基板の発熱部品を一
対のＬ字形の板からなる放熱兼保護体により略箱形に囲
んでいるため、外力が放熱兼保護体に加わり発熱部品に
は加わらないので、簡単な構成により、発熱部品の変形
等を防止でき発火や発煙を防止できるとともに、複数の
発熱部品の少なくとも一部を放熱兼保護体の内面に取付
けているため、発熱部品の放熱性が良好になる。しかも
放熱兼保護体により発熱部品と他の電子部品とを遮熱す
るので他の電子部品の熱影響を回避することができる。
さらに放熱兼保護体がＬ字形であるため、発熱部品を内
面に取付けやすく実装が容易になる。According to the configuration of the present invention, the heat-generating component of the printed circuit board is enclosed in a substantially box shape by the heat-radiating / protecting body composed of a pair of L-shaped plates, and therefore external force is applied to the heat-radiating / protective body and is not applied to the heat-generating component. Therefore, with a simple configuration, it is possible to prevent deformation of the heat generating parts and prevent ignition and smoke, and at least a part of the plurality of heat generating parts is attached to the inner surface of the heat dissipation and protection body, so the heat dissipation of the heat generating parts is improved. Get better Moreover, since the heat dissipation component and the protection component shield the heat-generating component from other electronic components, it is possible to avoid the thermal influence of the other electronic components.
Further, since the heat dissipation / protection body is L-shaped, the heat-generating component can be easily attached to the inner surface and can be easily mounted.
この考案の一実施例を第１図および第２図に基づいて説
明する。すなわち、この回路基板装置は、複写機のハロ
ゲンランプの点灯装置に適用したもので、プリント基板
１と放熱兼保護体２を有する。An embodiment of the present invention will be described with reference to FIGS. 1 and 2. That is, this circuit board device is applied to a halogen lamp lighting device of a copying machine, and has a printed circuit board 1 and a heat radiation and protection body 2.
プリント基板１は、発熱部品３を含む電子部品４を実装
している。このプリント基板１は機器本体（図示せず）
の側面に鉛直方向すなわち縦姿勢に取付けられるもので
ある。発熱部品３はプリント基板１の上端側に実装さ
れ、この発熱部品３はハロゲンランプの点灯装置の回路
の強電部分である１次側の電子部品を実施例とし、チョ
ークコイル５、トランス６、電源ライン間コンデンサ
７、固定抵抗８、トライアック９、ダイオード10を含め
ている。また電子部品４は主として２次側である弱電回
路の電子部品を実施例とし、電源コネクタ12、およびラ
ンプ側コネクタ13を含み、その他の電子部品４は省略さ
れている。The printed circuit board 1 is mounted with electronic components 4 including heat generating components 3. This printed circuit board 1 is a device body (not shown)
It is attached to the side surface of the in the vertical direction, that is, in the vertical posture. The heat-generating component 3 is mounted on the upper end side of the printed circuit board 1, and the heat-generating component 3 is an electronic component on the primary side, which is a high-power part of the circuit of the lighting device of the halogen lamp, as an example. An inter-line capacitor 7, a fixed resistor 8, a triac 9, and a diode 10 are included. The electronic component 4 is mainly an electronic component of a weak electric circuit on the secondary side, and includes a power supply connector 12 and a lamp side connector 13, and the other electronic components 4 are omitted.
放熱兼保護体２はＬ字形に折曲された一対の板20a,20b
からなりプリント基板１に立設されて発熱部品３を箱形
に囲むとともに発熱部品３の少なくとも一部を内面に取
付けている。実施例ではアルミニウム等の金属製の平板
をＬ字形に折曲したものを用い、そのプリント基板当接
側に舌片18を延出してプリント基板１の孔（図示せず）
に通し折曲することにより固定している。とくに、発熱
部品３のトライアック９およびダイオード10は放熱兼保
護体２に固定されている。The heat dissipation / protection body 2 is a pair of plates 20a, 20b bent in an L shape.
Is formed on the printed circuit board 1 so as to surround the heat generating component 3 in a box shape and at least a part of the heat generating component 3 is attached to the inner surface. In the embodiment, a flat plate made of a metal such as aluminum is bent into an L-shape, and the tongue piece 18 is extended to the contact side of the printed board to form a hole (not shown) in the printed board 1.
It is fixed by bending it through. In particular, the triac 9 and the diode 10 of the heat generating component 3 are fixed to the heat radiation / protection body 2.
この実施例によれば、プリント基板１の発熱部品３を一
対のＬ字形の板20a,20bからなる放熱兼保護体２により
略箱形に囲んでいるため、外力が放熱兼保護体２に加わ
り発熱部品３には加わらないので、簡単な構成により、
発熱部品３の変形等を防止でき発火や発煙を防止でき、
万一事故が発生した場合でも他の部分への影響を減ずる
ことができる。According to this embodiment, since the heat-generating component 3 of the printed circuit board 1 is enclosed in a substantially box shape by the heat radiation / protection body 2 including the pair of L-shaped plates 20a and 20b, an external force is applied to the heat radiation / protection body 2. Since it does not participate in the heat-generating component 3, it has a simple structure
It is possible to prevent deformation of the heat-generating component 3 and prevent fire and smoke,
Even if an accident should occur, it is possible to reduce the influence on other parts.
また複数の発熱部品３の少なくとも一部を放熱兼保護体
２の内面に取付けているため、発熱部品３の放熱性が良
好になる。しかも放熱兼保護体２により発熱部品３と他
の電子部品４とを遮熱するので他の電子部品４の熱影響
を回避することができる。さらに放熱兼保護体２がＬ字
形であるため、発熱部品３を内面に取付けやすく実装が
容易になる。Further, since at least a part of the plurality of heat-generating components 3 is attached to the inner surface of the heat dissipation / protection body 2, the heat dissipating properties of the heat generating components 3 are improved. Moreover, since the heat dissipation component 3 and the other electronic component 4 are shielded by the heat dissipation / protection body 2, the thermal influence of the other electronic component 4 can be avoided. Further, since the heat dissipation / protection body 2 is L-shaped, the heat generating component 3 can be easily attached to the inner surface and the mounting can be facilitated.
さらに、ハロゲンランプの点灯装置の回路より発生して
いる輻射雑音は、強電回路である一次側の電子部品より
多く発生しているが、放熱兼保護体２により、他の回路
に与える影響を減ずることができる。Further, although the radiation noise generated from the circuit of the halogen lamp lighting device is generated more than that of the primary side electronic component which is a high-power circuit, the heat radiation and protection body 2 reduces the influence on other circuits. be able to.
この考案の回路基板装置によれば、プリント基板の発熱
部品を一対のＬ字形の板からなる放熱兼保護体により略
箱形に囲んでいるため、外力が放熱兼保護体に加わり発
熱部品には加わらないので、簡単な構成により、発熱部
品の変形等を防止でき発火や発煙を防止できるととも
に、複数の発熱部品の少なくとも一部を放熱兼保護体の
内面に取付けているため、発熱部品の放熱性が良好にな
る。しかも放熱兼保護体により発熱部品と他の電子部品
とを遮熱するので他の電子部品の熱影響を回避すること
ができる。さらに放熱兼保護体がＬ字形であるため、発
熱部品を内面に取付けやすく実装が容易になるという効
果がある。According to the circuit board device of the present invention, the heat-generating component of the printed circuit board is enclosed in a substantially box shape by the heat-dissipating / protecting body composed of a pair of L-shaped plates. Since it is not added, it is possible to prevent deformation and the like of the heat generating parts with a simple configuration and prevent ignition and smoke, and at least part of the multiple heat generating parts is attached to the inner surface of the heat dissipation and protection body, so heat dissipation of the heat generating parts Good quality. Moreover, since the heat dissipation component and the protection component shield the heat-generating component from other electronic components, it is possible to avoid the thermal influence of the other electronic components. Further, since the heat dissipation / protection body is L-shaped, there is an effect that the heat-generating component can be easily attached to the inner surface and can be easily mounted.
第１図はこの考案の一実施例の平面図、第２図はその放
熱兼保護体の一部斜視図である。 １……プリント基板、２……放熱兼保護板、３……発熱
部品、４……電子部品FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a partial perspective view of the heat radiation / protection body. 1 ... Printed circuit board, 2 ... Heat dissipation and protection plate, 3 ... Heat generating component, 4 ... Electronic component
Claims (1)
プリント基板と、Ｌ字形に折曲された一対の板からなり
前記プリント基板に立設されて前記発熱部品を箱形に囲
むとともに前記発熱部品の少なくとも一部を内面に取付
けた放熱兼保護体とを備えた回路基板装置。1. A printed circuit board on which electronic components including a plurality of heat generating components are mounted, and a pair of plates bent in an L shape, which are erected on the printed circuit board so as to surround the heat generating components in a box shape. A circuit board device comprising: a heat dissipation and protection body in which at least a part of a heat generating component is attached to an inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990108148U JPH0739278Y2 (en) | 1990-10-15 | 1990-10-15 | Circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990108148U JPH0739278Y2 (en) | 1990-10-15 | 1990-10-15 | Circuit board device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0465494U JPH0465494U (en) | 1992-06-08 |
| JPH0739278Y2 true JPH0739278Y2 (en) | 1995-09-06 |
Family
ID=31854983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990108148U Expired - Lifetime JPH0739278Y2 (en) | 1990-10-15 | 1990-10-15 | Circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739278Y2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4819954U (en) * | 1971-07-15 | 1973-03-07 | ||
| JPS57135787U (en) * | 1981-02-19 | 1982-08-24 | ||
| JPS5961544U (en) * | 1982-10-15 | 1984-04-23 | 松下電工株式会社 | Mounting structure of heat sink on heat generating parts |
| JPH0465493U (en) * | 1990-10-15 | 1992-06-08 |
-
1990
- 1990-10-15 JP JP1990108148U patent/JPH0739278Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0465494U (en) | 1992-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |