JPH0741434B2 - 水溶性半田ペースト - Google Patents

水溶性半田ペースト

Info

Publication number
JPH0741434B2
JPH0741434B2 JP28678391A JP28678391A JPH0741434B2 JP H0741434 B2 JPH0741434 B2 JP H0741434B2 JP 28678391 A JP28678391 A JP 28678391A JP 28678391 A JP28678391 A JP 28678391A JP H0741434 B2 JPH0741434 B2 JP H0741434B2
Authority
JP
Japan
Prior art keywords
paste
oil
acid
water
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP28678391A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04262891A (ja
Inventor
レイモンド・エル・ターナー
カーク・イー・ジョンソン
ラリー・エル・キメル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/608,041 external-priority patent/US5141568A/en
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of JPH04262891A publication Critical patent/JPH04262891A/ja
Publication of JPH0741434B2 publication Critical patent/JPH0741434B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP28678391A 1990-10-31 1991-10-31 水溶性半田ペースト Expired - Lifetime JPH0741434B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US60720090A 1990-10-31 1990-10-31
US07/608,041 US5141568A (en) 1990-05-15 1990-10-31 Water-soluble soldering paste
US607200 1990-10-31
US608041 1990-10-31

Publications (2)

Publication Number Publication Date
JPH04262891A JPH04262891A (ja) 1992-09-18
JPH0741434B2 true JPH0741434B2 (ja) 1995-05-10

Family

ID=27085452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28678391A Expired - Lifetime JPH0741434B2 (ja) 1990-10-31 1991-10-31 水溶性半田ペースト

Country Status (2)

Country Link
JP (1) JPH0741434B2 (fr)
CA (1) CA2053751C (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101934437A (zh) * 2010-09-30 2011-01-05 常州市亚太微电子材料有限公司 无铅焊锡膏及其制备方法
JP6592350B2 (ja) * 2014-12-26 2019-10-16 積水化学工業株式会社 異方性導電材料、接続構造体及び接続構造体の製造方法
JP7668512B2 (ja) * 2019-05-15 2025-04-25 株式会社弘輝 フラックス及びソルダペースト

Also Published As

Publication number Publication date
JPH04262891A (ja) 1992-09-18
CA2053751C (fr) 1999-12-07
CA2053751A1 (fr) 1992-05-01

Similar Documents

Publication Publication Date Title
JP2637635B2 (ja) はんだ付け方法
JP2516286B2 (ja) 水溶性はんだ付けフラックス、部品の表面にフラックスを付与する方法および二つの部品を接合する方法
CA2022625A1 (fr) Compose de nettoyage d'ester dibasique, de solvant hydrocarbure, de surfactif compatibilisant et d'eau
JPH04228289A (ja) 水溶性ソルダフラックス及びペースト
US5141568A (en) Water-soluble soldering paste
US3730782A (en) Non-activated soldering flux
EP0486685A4 (en) Use of organic acids in low residue solder pastes
CA2022624A1 (fr) Composition pour nettoyage comprenant un ester debasique, un solvant hydrocarbone et un element compatibilisant
EP0494271A4 (en) Solder pastes using alcohol blends as rheological aids
US5092943A (en) Method of cleaning printed circuit boards using water
JPH0741434B2 (ja) 水溶性半田ペースト
JP4352866B2 (ja) はんだ付け用フラックス
EP0458161B1 (fr) Flux pour le soudage tendre soluble dans l'eau
EP0538821B1 (fr) Flux moussant pour un procédé de soudage automatique
JP2520552B2 (ja) 自動はんだ付け工程のための発泡性融剤
JPH0741433B2 (ja) コアード半田用水溶性フラックス
JP2015059254A (ja) はんだ合金粒子に用いる表面処理剤、表面処理方法、該処理が施されたはんだ合金粒子、および該処理粒子を含有するクリームはんだ
EP0483762A2 (fr) Fondant de soudure, soluble à l'eau, pour baguette à noyau
EP0384627A1 (fr) Compositions de flux pour soudure tendre
JP3164656B2 (ja) 洗浄剤組成物
US5192360A (en) Water-soluble flux for cored solder
WO1992005228A1 (fr) Pates a braser contenant de l'acide acrylique et ses derives
JPH04127955A (ja) 物品表面の清浄化方法
JPS6160266A (ja) フレオン洗浄性の良いはんだ付け法
IE67182B1 (en) Cleaning compositions