JPH0743814B2 - Method of manufacturing thin film magnetic head - Google Patents
Method of manufacturing thin film magnetic headInfo
- Publication number
- JPH0743814B2 JPH0743814B2 JP62246651A JP24665187A JPH0743814B2 JP H0743814 B2 JPH0743814 B2 JP H0743814B2 JP 62246651 A JP62246651 A JP 62246651A JP 24665187 A JP24665187 A JP 24665187A JP H0743814 B2 JPH0743814 B2 JP H0743814B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- magnetic circuit
- protective layer
- magnetic head
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
- G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
- Hall/Mr Elements (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、薄膜磁気ヘッドの製造方法に係り、特に、磁
気回路におけるヘッドギャップ部側の盛り上がりを反映
して形成された絶縁保護層における段差部に起因する悪
影響を排除して良好な性能を発揮させるための薄膜磁気
ヘッドの製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin film magnetic head, and more particularly to a step in an insulating protective layer formed by reflecting a ridge on the head gap side in a magnetic circuit. The present invention relates to a method of manufacturing a thin film magnetic head for eliminating a bad influence caused by a portion and exhibiting good performance.
薄膜積層技術、或いは、フォトリソグラフィーなどによ
り形成される薄膜磁気ヘッドにあっては、第４図に示す
ように、基板（フェライトなどの磁性基板、若しくは、
非磁性基板）１上に形成された磁気回路２を保護する目
的で保護板３を樹脂により接着している。In a thin film magnetic head formed by a thin film laminating technique or photolithography, as shown in FIG. 4, a substrate (a magnetic substrate such as ferrite, or
A protective plate 3 is adhered with resin for the purpose of protecting the magnetic circuit 2 formed on the non-magnetic substrate 1.
また、上記磁気回路２上には、この磁気回路２を覆うよ
うに絶縁保護層４が形成されるが、この絶縁保護層４に
は、上記磁気回路２におけるヘッドギャップ部側の盛り
上がり（フロントギャップ部の段差）を反映して段差部
4aが形成されることになる。このため、上記保護板３を
接着するための樹脂が上記段差部4aに入り込み、上記段
差部4aの高さに対応した厚みの樹脂層５・６が形成され
ることになる。An insulating protective layer 4 is formed on the magnetic circuit 2 so as to cover the magnetic circuit 2. The insulating protective layer 4 has a swell (front gap) on the head gap side in the magnetic circuit 2. (Step difference)
4a will be formed. Therefore, the resin for bonding the protective plate 3 enters the step portion 4a, and the resin layers 5 and 6 having a thickness corresponding to the height of the step portion 4a are formed.
薄膜磁気ヘッドを完成させるには、記録媒体に摺接する
摺動面形成のための摺動面研磨を行うのであるが、この
摺動面研磨終了位置には樹脂層５が存在しているため、
摺動面研磨を行った後においては、樹脂層５が露出する
ことになる。樹脂層５は、摺動面研磨の際に同時に研磨
される部分、即ち、絶縁保護層４、基板１、および保護
板３などよりも硬度が低いために、かかる研磨によって
凹みＡが発生し、この凹みＡによって、記録媒体の摺動
時にヘッドの目詰まりを誘発するという不都合を有して
いた。In order to complete the thin film magnetic head, the sliding surface is polished to form the sliding surface that is in sliding contact with the recording medium. However, since the resin layer 5 exists at this sliding surface polishing end position,
The resin layer 5 is exposed after the sliding surface is polished. Since the resin layer 5 has a hardness lower than that of the portion that is simultaneously polished during the sliding surface polishing, that is, the insulating protective layer 4, the substrate 1, the protective plate 3, etc., a dent A is generated by the polishing. The dent A has a disadvantage that the head is clogged when the recording medium slides.
そこで、上記絶縁保護層４を研削して平坦化した後、保
護板３を接着するという手法が採用されている。これに
よれば、平坦面同士の接着となり、且つ、上記樹脂層５
・６の厚みを十分に薄くできるので、ヘッドの目詰まり
を防止することが可能となる。具体的には、第５図に示
すように、基板１を平坦度の優れた定盤７上にその背面
が接するように固定し、定盤７および基板１の背面を基
準にして、回転砥石８などにより絶縁保護層４を平面研
削する手法や、第６図に示すように、定盤７上に研磨シ
ート９を固定し、この研磨シート９に絶縁保護層４を対
向させ、基板１の背面から適当な圧力を加えつつ摺接さ
せて絶縁保護層４を平坦化する手法などがある。Therefore, a method is adopted in which the insulating protective layer 4 is ground and flattened, and then the protective plate 3 is bonded. According to this, the flat surfaces are bonded to each other, and the resin layer 5 is
Since the thickness of 6 can be made sufficiently thin, clogging of the head can be prevented. Specifically, as shown in FIG. 5, the substrate 1 is fixed on a surface plate 7 having excellent flatness so that the back surface of the surface plate 7 is in contact with the surface plate 7. A method of surface-grinding the insulating protective layer 4 with 8 or the like, or as shown in FIG. 6, a polishing sheet 9 is fixed on a surface plate 7, the insulating protective layer 4 is opposed to the polishing sheet 9, and There is a method of flattening the insulating protective layer 4 by sliding it while applying an appropriate pressure from the back surface.
ところが、第５図に示した手法では、基板１の背面を基
準とするため、基板１の厚みの“バラツキ”、および、
膜内応力による基板１の“反り”に起因して、絶縁保護
層４の研削量にも“バラツキ”が生じる結果、磁気回路
２などが疵付く虞れがあり、しかも、平面研削時の機械
精度も加算すると、研削の仕上がり精度を厳格に管理し
ていくには種々の困難を伴うことになる。このため、上
記絶縁保護層４の厚みは20μｍ以上に設定されている
が、これでは、スパッタリング、或いはCVD（Chemical
Vapor Deposition）法などで絶縁保護層４を形成す
る際の生産的な面で不利となり、さらに、膜厚の増大に
伴う膜内応力による素子へのダメージも問題となってい
る。However, in the method shown in FIG. 5, since the back surface of the substrate 1 is used as a reference, "variation" in the thickness of the substrate 1 and
Due to the “warpage” of the substrate 1 due to the in-film stress, the amount of grinding of the insulating protection layer 4 also becomes “variable”. As a result, the magnetic circuit 2 or the like may be scratched, and moreover, the machine for surface grinding. If the precision is also added, various difficulties will be involved in strictly controlling the finish precision of grinding. Therefore, the thickness of the insulating protection layer 4 is set to 20 μm or more. However, in this case, sputtering or CVD (Chemical
This is disadvantageous in terms of productivity when the insulating protection layer 4 is formed by the Vapor Deposition) method or the like, and further, damage to the element due to in-film stress due to an increase in film thickness becomes a problem.
また、第６図に示した手法においても、上述と同様、基
板１の厚みの“バラツキ”および基板１の“反り”のた
めに、研削量の管理が困難になり、さらに、研削時にお
ける基板１に対する加圧によって素子がダメージを受け
るという欠点も有している。Further, also in the method shown in FIG. 6, it is difficult to control the grinding amount due to the “variation” of the thickness of the substrate 1 and the “warpage” of the substrate 1 as described above. There is also a drawback that the element is damaged by the pressure applied to 1.
本発明に係る薄膜磁気ヘッドの製造方法は、上記課題を
解決するために、磁気回路上に絶縁保護層を形成し、次
に、上記磁気回路におけるヘッドギャップ部側の盛り上
がりを反映して形成された絶縁保護層における段差部お
よびその近傍の平坦箇所を残すように上記段差部の高さ
以上で上記磁気回路に達しない厚みだけ絶縁保護層を除
去して突起部と平坦部を形成し、次いで、上記突起部を
研削して平坦化した後に上記絶縁保護層上に保護板を接
着剤にて接着し、しかる後、上記段差部の下端付近まで
摺動面研磨を施すことを特徴としている。In order to solve the above problems, a method for manufacturing a thin film magnetic head according to the present invention is formed by forming an insulating protective layer on a magnetic circuit, and then forming a bulge on the head gap side in the magnetic circuit. The insulating protection layer is removed by a thickness not exceeding the magnetic circuit above the height of the step so as to leave a step and a flat portion in the vicinity of the step in the insulation protection layer, and then a protrusion and a flat portion are formed. After the projections are ground and flattened, a protective plate is adhered onto the insulating protective layer with an adhesive, and then the sliding surface is polished to near the lower end of the step.
上記の構成において、上記突起部における被研削部位の
面積は、平坦部の面積よりも十分に小さい。それゆえ、
突起部の研削を終了して平坦部に到達した途端に、被研
削面積が急増することになり、この時点で研削速度が著
しく低下し、結果的に上記平坦部がストッパーの役割を
果たすことになる。これにより、上記絶縁保護層の平坦
化工程において、たとえその研削量に“バラツキ”が生
じても、過剰な研削は回避されるから、上記磁気回路な
どに疵が付くといった事態を防止することができ、研削
の仕上がり精度を厳格に管理していくことが可能にな
る。また、上記段差部の下端付近では、平坦化されて接
着剤としての樹脂などが介在していないから、かかる箇
所まで摺動面研磨を行うことにより、摺動面に樹脂層が
露出するといった事態が防止できる。よって、摺動面研
磨によって凹みが発生し、この凹みによって、記録媒体
の摺動時にヘッドの目詰まりを誘発するという不都合も
解消することができる。In the above structure, the area of the ground portion of the protrusion is sufficiently smaller than the area of the flat portion. therefore,
As soon as the grinding of the protrusions is finished and the flat parts are reached, the area to be ground will increase rapidly, and the grinding speed will decrease significantly at this point, and as a result the flat parts will act as stoppers. become. As a result, in the step of flattening the insulating protective layer, excessive grinding is avoided even if the amount of grinding varies, so that the magnetic circuit can be prevented from being damaged. This makes it possible to strictly control the finishing accuracy of grinding. Further, in the vicinity of the lower end of the stepped portion, since the resin as an adhesive is flattened and does not intervene, the situation in which the resin layer is exposed on the sliding surface by polishing the sliding surface to such a portion Can be prevented. Therefore, it is possible to eliminate the inconvenience that a recess is generated by polishing the sliding surface, and the recess causes the clogging of the head when the recording medium slides.
本発明の一実施例を第１図ないし第３図に基づいて説明
すれば、以下の通りである。An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.
例えば、ヨーク型（磁気抵抗効果型）の薄膜磁気ヘッド
11は、第１図（ｇ）に示すように、磁性基板12、層間絶
縁層13、上部磁極14、磁気抵抗効果素子15、絶縁保護層
16、樹脂層17、保護板18、磁気抵抗効果素子15にバイア
ス磁界をかけるバイアス層（図示せず）、および、磁気
抵抗効果素子15に接続された電極引出層（図示せず）な
どにより構成されている。For example, a yoke type (magnetoresistive effect type) thin film magnetic head
Reference numeral 11 denotes a magnetic substrate 12, an interlayer insulating layer 13, an upper magnetic pole 14, a magnetoresistive element 15, an insulating protective layer, as shown in FIG. 1 (g).
16, a resin layer 17, a protective plate 18, a bias layer (not shown) for applying a bias magnetic field to the magnetoresistive effect element 15, and an electrode lead layer (not shown) connected to the magnetoresistive effect element 15 Has been done.
上記の薄膜磁気ヘッド11を製造するには、同図（ａ）に
示すように、フェライトなどの磁性基板12上にSiO2から
成る層間絶縁層13を形成するとともに、Ni−Fe合金から
成る上部磁極14および磁気抵抗効果素子15などを積層し
て磁気回路19を形成した後、この磁気回路19上にスパッ
タリング法、若しくは、CVD（Chemical Vapor Deposi
tion）法などを使用し、SiO2などの素材により厚み約８
μｍの絶縁保護層16を形成する。ここで、この絶縁保護
層16には、上記磁気回路19におけるヘッドギャップ部側
の盛り上がり（上部磁極14のフロントギャップ部の段
差）を反映して高さ２μｍ〜３μｍの段差部16aが形成
されることになる。なお、図中のＥ線は、記録媒体に対
する摺動面形成のための摺動面研磨終了位置を示してお
り、この位置は上記段差部16aの下端付近に設定され
る。In order to manufacture the thin film magnetic head 11, the interlayer insulating layer 13 made of SiO 2 is formed on the magnetic substrate 12 made of ferrite and the upper portion made of Ni--Fe alloy is formed as shown in FIG. After forming the magnetic circuit 19 by laminating the magnetic pole 14 and the magnetoresistive effect element 15 etc., a sputtering method or a CVD (Chemical Vapor Deposi) method is formed on the magnetic circuit 19.
method, etc., with a thickness of approximately 8 depending on the material such as SiO 2.
An insulating protective layer 16 of μm is formed. Here, a step portion 16a having a height of 2 μm to 3 μm is formed on the insulating protection layer 16 so as to reflect the bulge on the head gap portion side in the magnetic circuit 19 (step difference of the front gap portion of the upper magnetic pole 14). It will be. The E line in the figure indicates the sliding surface polishing end position for forming the sliding surface on the recording medium, and this position is set near the lower end of the step portion 16a.
次に、同図（ｂ）に示すように、上記段差部16aおよび
その近傍位置にネガタイプ、若しくは、ポジタイプのレ
ジスト20を形成した後、同図（ｃ）に示すように、RIE
（反応性イオンエッチング:Reactive Ion Etching）
によって絶縁保護層16を５μｍエッチングする。なお、
このエッチング量は、上記段差部16aの高さ（２μｍ〜
３μｍ）以上で、上部磁極14が露出しない範囲の高さで
適当に選ばれる。Next, as shown in FIG. 6B, after a negative type or positive type resist 20 is formed on the step portion 16a and its vicinity, RIE is performed as shown in FIG.
(Reactive Ion Etching)
The insulating protection layer 16 is etched by 5 μm. In addition,
This etching amount is the height of the step portion 16a (2 μm to
3 μm or more, the height is selected in a range where the upper magnetic pole 14 is not exposed.
次いで、同図（ｄ）に示すように、レジスト20を剥離し
て突起部16bおよび平坦部16cを露出させる。突起部16b
の幅と平坦部16cの幅との関係は、第２図に示すよう
に、突起部16bの幅Ｘが約0.03mm、平坦部16cの幅Ｙが約
3mmになっており、Y/X＝100の関係に設定されている。
次に、第１図（ｅ）に示すように、上記突起部16bを研
削して平坦化する。かかる平坦化は、第３図に示すよう
に、基板保持具21にシリコンゴムなどの弾性体22を貼付
しておき、前記基板12をその背面が上記弾性体22に接す
るようにして固着する。そして、定盤23上に固着された
研磨シート24に上記基板12のパターン表側面を摺接させ
て研削する。なお、上記弾性体22は、基板12の厚みの
“バラツキ”や、膜内応力に起因する基板12の“反り”
など、研削量を管理する上での誤差要因を吸収・緩和
し、適当な加圧力を基板12に与えて被研削部位を上記研
削シートに漏れなく圧接させるように機能する。Then, as shown in FIG. 3D, the resist 20 is peeled off to expose the protrusion 16b and the flat portion 16c. Protrusion 16b
As shown in FIG. 2, the width X of the flat portion 16c is about 0.03 mm, and the width Y of the flat portion 16c is about 0.03 mm.
It is set to 3 mm and is set to have a relationship of Y / X = 100.
Next, as shown in FIG. 1 (e), the protrusion 16b is ground and flattened. For such flattening, as shown in FIG. 3, an elastic body 22 such as silicon rubber is attached to the substrate holder 21, and the substrate 12 is fixed so that the back surface thereof is in contact with the elastic body 22. Then, the front surface of the pattern of the substrate 12 is brought into sliding contact with the polishing sheet 24 fixed on the surface plate 23 to perform grinding. In addition, the elastic body 22 has a "variation" in the thickness of the substrate 12 and a "warp" of the substrate 12 caused by the stress in the film.
For example, it functions to absorb and mitigate error factors in controlling the amount of grinding and to apply an appropriate pressing force to the substrate 12 to press the part to be ground against the grinding sheet without leakage.
上記のごとく、突起部16bが研削されることで上記絶縁
保護層16の上面が、第１図（ｅ）に示すように平坦化さ
れたら、次に、同図（ｆ）に示すように、保護板18をエ
ポキシ系樹脂（樹脂層17）によって接着する。そして、
記録媒体に対する摺動面形成のために、摺動面研磨終了
位置Ｅまで研磨して摺動面の仕上げを行い、第１図
（ｇ）に示すように、ヨーク型の薄膜磁気ヘッド11を得
る。As described above, when the upper surface of the insulating protection layer 16 is flattened by grinding the protrusions 16b as shown in FIG. 1 (e), next, as shown in FIG. The protective plate 18 is adhered with an epoxy resin (resin layer 17). And
In order to form a sliding surface for the recording medium, the sliding surface is polished to the sliding surface polishing end position E to finish the sliding surface, and the yoke type thin film magnetic head 11 is obtained as shown in FIG. 1 (g). .
上記の構成において、上記突起部16bにおける被研削部
位の面積は、平坦部16cの面積よりも十分に小さい。そ
れゆえ、突起部16bの研削を終了して上記平坦部16cに到
達した途端に、研削面積が急増することになり、この時
点で研削速度が著しく低下し、結果的に上記平坦部16c
がストッパーとしての役割を果たすことになる。これに
より、絶縁保護層16の平坦化工程において、たとえその
研削量に“バラツキ”が生じても、誤って上記磁気回路
19などを疵付けるといった事態を回避することができ、
研削の仕上がり精度を厳格に管理していくことができ
る。また、上記突起部16bの研削は短時間にて行えるの
で生産効率の向上にも寄与できる。さらに、絶縁保護層
16の厚みを薄くできるからその膜内応力が低減でき、素
子に与えるダメージが低減できる。なお、本実施例にお
いては、突起部16bの幅Ｘを約0.03mm、平坦部16cの幅Ｙ
を約3mmにそれぞれ設定しているが、Y/X＞10程度であれ
ば、かかる効果を十分に奏し得るものである。In the above structure, the area of the ground portion of the protrusion 16b is sufficiently smaller than the area of the flat portion 16c. Therefore, as soon as the grinding of the protrusion 16b is finished and the flat portion 16c is reached, the grinding area rapidly increases, and at this time, the grinding speed is remarkably reduced, resulting in the flat portion 16c.
Will act as a stopper. As a result, in the flattening process of the insulating protection layer 16, even if the amount of grinding varies, the magnetic circuit is erroneously
You can avoid the situation of scratching 19 etc.,
The finishing accuracy of grinding can be strictly controlled. Further, since the protrusion 16b can be ground in a short time, it can contribute to the improvement of production efficiency. In addition, insulation protection layer
Since the thickness of 16 can be reduced, the stress in the film can be reduced and the damage given to the element can be reduced. In this embodiment, the width X of the protrusion 16b is about 0.03 mm and the width Y of the flat portion 16c is Y.
Are set to about 3 mm, but if Y / X> 10, such effects can be sufficiently exhibited.
また、上記段差部16aの下端付近は、平坦化されて接着
剤としての樹脂などが介在していないから、かかる箇所
まで摺動面研磨を行うことにより、摺動面に樹脂層が露
出するといった事態が防止できる。これにより、摺動面
研磨によって凹みが発生し、この凹みによって、記録媒
体の摺動時にヘッドの目詰まりを誘発するという不都合
も解消することができる。In addition, since the vicinity of the lower end of the step portion 16a is flattened and there is no resin or the like as an adhesive agent, by polishing the sliding surface to such a portion, the resin layer is exposed on the sliding surface. The situation can be prevented. As a result, it is possible to eliminate the inconvenience that a recess is generated by polishing the sliding surface, and the recess causes the clogging of the head when the recording medium slides.
なお、本実施例においては、ヨーク型の薄膜磁気ヘッド
を例に挙げたが、巻線型の薄膜磁気ヘッドなどにおいて
も適用できることは勿論であり、また、上記の研削方法
を遊離砥粒によって行うことも可能である。In the present embodiment, the yoke type thin film magnetic head is taken as an example, but it is needless to say that the present invention can be applied to a wound type thin film magnetic head and the like, and the above-mentioned grinding method is performed with loose abrasive grains. Is also possible.
本発明に係る薄膜磁気ヘッドの製造方法は、以上のよう
に、磁気回路上に絶縁保護層を形成し、次に、上記磁気
回路におけるヘッドギャップ部側の盛り上がりを反映し
て形成された絶縁保護層における段差部およびその近傍
の平坦箇所を残すように上記段差部の高さ以上で上記磁
気回路に達しない厚みだけ絶縁保護層を除去して突起部
と平坦部を形成し、次いで、上記突起部を研削して平坦
化した後に上記絶縁保護層上に保護板を接着剤にて接着
し、しかる後、上記段差部の下端付近まで摺動面研磨を
施す構成である。As described above, the method of manufacturing a thin film magnetic head according to the present invention forms the insulating protection layer on the magnetic circuit, and then forms the insulating protection formed by reflecting the swelling on the head gap side in the magnetic circuit. The protrusion and the flat portion are formed by removing the insulating protective layer by a thickness not exceeding the magnetic circuit above the height of the step so as to leave the step in the layer and the flat portion in the vicinity thereof, and then the projection is formed. After the portion is ground and flattened, a protective plate is adhered onto the insulating protective layer with an adhesive, and then the sliding surface is polished to the vicinity of the lower end of the stepped portion.
これにより、絶縁保護層の平坦化において、たとえその
研削量に“バラツキ”が生じても、誤った上記磁気回路
などを疵付けるといった事態を回避することができ、研
磨の仕上がり精度を厳格に管理していくことができる。
しかも、記録媒体に対する摺動面には、樹脂層が露出し
ないので、記録媒体の摺動時におけるヘッドの目詰まり
を誘発するという不都合も解消できる。そのうえ、上記
突起部の研削は短時間にて行えるので生産効率の向上に
も寄与できる。さらに、絶縁保護層の厚みを薄くできる
からその膜内応力が低減でき、素子に与えるダメージを
低減できる。This makes it possible to avoid the situation where the above-mentioned magnetic circuit is mistakenly scratched even when the amount of grinding is “varied” in the flattening of the insulating protection layer, and the finishing accuracy of polishing is strictly controlled. You can do it.
Moreover, since the resin layer is not exposed on the sliding surface with respect to the recording medium, it is possible to eliminate the inconvenience of causing clogging of the head during sliding of the recording medium. In addition, since the protrusions can be ground in a short time, it can contribute to the improvement of production efficiency. Furthermore, since the thickness of the insulating protective layer can be reduced, the stress in the film can be reduced and the damage to the device can be reduced.
このように、本発明の薄膜磁気ヘッドの製造方法によれ
ば、生産性の向上が図れるとともに、性能の良好な薄膜
磁気ヘッドを得ることができるという効果を奏する。As described above, according to the method of manufacturing a thin film magnetic head of the present invention, it is possible to improve productivity and obtain a thin film magnetic head having good performance.
第１図ないし第３図は本発明の一実施例を示すものであ
って、第１図（ａ）ないし（ｇ）はそれぞれ薄膜磁気ヘ
ッドの製造の工程を示す断面図、第２図は突起部におけ
る被研削部位の幅と絶縁保護層における平坦部の幅との
関係を示す平面図、第３図は絶縁保護層の平坦化工程を
示す説明図、第４図ないし第６図は従来例を示すもので
あって、第４図は薄膜磁気ヘッドの断面図、第５図およ
び第６図はそれぞれ絶縁保護層の平坦化を示す説明図で
ある。 11はヨーク型薄膜磁気ヘッド、12は磁性基板、13は層間
絶縁層、14は上部磁極、15は磁気抵抗効果素子、16は絶
縁保護層、16aは段差部、16bは突起部、16cは平坦部、1
7は樹脂層、18は保護板、19は磁気回路、24は研磨シー
トである。1 to 3 show an embodiment of the present invention. FIGS. 1A to 1G are sectional views showing the steps of manufacturing a thin film magnetic head, and FIG. 2 is a projection. Plan view showing the relationship between the width of the portion to be ground and the width of the flat portion of the insulating protective layer, FIG. 3 is an explanatory view showing the step of flattening the insulating protective layer, and FIGS. 4 to 6 are conventional examples. FIG. 4 is a cross-sectional view of the thin film magnetic head, and FIGS. 5 and 6 are explanatory views showing flattening of the insulating protection layer. 11 is a yoke type thin film magnetic head, 12 is a magnetic substrate, 13 is an interlayer insulating layer, 14 is an upper magnetic pole, 15 is a magnetoresistive element, 16 is an insulating protective layer, 16a is a stepped portion, 16b is a protruding portion, and 16c is flat. Part, 1
7 is a resin layer, 18 is a protective plate, 19 is a magnetic circuit, and 24 is a polishing sheet.
Claims (1)
上記磁気回路におけるヘッドギャップ部側の盛り上がり
を反映して形成された絶縁保護層における段差部および
その近傍の平坦箇所を残すように上記段差部の高さ以上
で上記磁気回路に達しない厚みだけ絶縁保護層を除去し
て突起部と平坦部を形成し、次いで、上記突起部を研削
して平坦化した後に上記絶縁保護層上に保護板を接着剤
にて接着し、しかる後、上記段差部の下端付近まで摺動
面研磨を施すことを特徴とする薄膜磁気ヘッドの製造方
法。1. An insulating protective layer is formed on a magnetic circuit, and then,
Insulation of a thickness not exceeding the magnetic circuit above the height of the stepped portion so as to leave a stepped portion and a flat portion in the vicinity of the stepped portion in the insulating protection layer formed by reflecting the bulge on the head gap side in the magnetic circuit The protective layer is removed to form a protrusion and a flat portion, and then the protrusion is ground and flattened, and then a protective plate is bonded onto the insulating protective layer with an adhesive. A method for manufacturing a thin film magnetic head, which comprises polishing a sliding surface up to near the lower end of the.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62246651A JPH0743814B2 (en) | 1987-09-30 | 1987-09-30 | Method of manufacturing thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62246651A JPH0743814B2 (en) | 1987-09-30 | 1987-09-30 | Method of manufacturing thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6489009A JPS6489009A (en) | 1989-04-03 |
| JPH0743814B2 true JPH0743814B2 (en) | 1995-05-15 |
Family
ID=17151588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62246651A Expired - Fee Related JPH0743814B2 (en) | 1987-09-30 | 1987-09-30 | Method of manufacturing thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0743814B2 (en) |
-
1987
- 1987-09-30 JP JP62246651A patent/JPH0743814B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6489009A (en) | 1989-04-03 |
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