JPH0743902A - (meth)acrylamide group introduced phenol-containing oligomer - Google Patents
(meth)acrylamide group introduced phenol-containing oligomerInfo
- Publication number
- JPH0743902A JPH0743902A JP18776893A JP18776893A JPH0743902A JP H0743902 A JPH0743902 A JP H0743902A JP 18776893 A JP18776893 A JP 18776893A JP 18776893 A JP18776893 A JP 18776893A JP H0743902 A JPH0743902 A JP H0743902A
- Authority
- JP
- Japan
- Prior art keywords
- phenol
- meth
- polymer
- acrylamide
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title claims abstract description 48
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 125000000524 functional group Chemical group 0.000 claims abstract description 14
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000005011 phenolic resin Substances 0.000 claims abstract description 13
- 229920001577 copolymer Polymers 0.000 claims abstract description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 3
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000011342 resin composition Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 abstract description 18
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 5
- 229920001568 phenolic resin Polymers 0.000 abstract description 5
- 238000007336 electrophilic substitution reaction Methods 0.000 abstract description 4
- 239000007858 starting material Substances 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 25
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 12
- -1 printing plates Substances 0.000 description 10
- 239000011541 reaction mixture Substances 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 239000012044 organic layer Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000012153 distilled water Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 3
- 235000017557 sodium bicarbonate Nutrition 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- NPFYZDNDJHZQKY-UHFFFAOYSA-N 4-Hydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 NPFYZDNDJHZQKY-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000006757 chemical reactions by type Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- IIQWTZQWBGDRQG-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate;isocyanic acid Chemical compound N=C=O.CCOC(=O)C(C)=C IIQWTZQWBGDRQG-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、塗料、印刷インキ、刷
版材、接着剤、レジストなどの活性エネルギー線硬化性
樹脂原料として有用な新規重合性オリゴマーすなわち、
(メタ)アクリルアミド基導入フェノール含有オリゴマ
ーに関する。BACKGROUND OF THE INVENTION The present invention relates to a novel polymerizable oligomer useful as a raw material for active energy ray-curable resins such as paints, printing inks, printing plates, adhesives, resists, etc.
It relates to a (meth) acrylamide group-introduced phenol-containing oligomer.
【0002】[0002]
【従来の技術及び問題点】近年、活性エネルギー線硬化
性樹脂は、溶剤を必要としないことなどによる低公害
性、硬化時間が短いことによる高生産性、熱硬化性樹脂
と比較して硬化に特に熱を必要としないことから低温硬
化が可能であること、あるいは省エネルギーなどの様々
な利点を活かして、塗料、印刷インキ、刷版材、接着
剤、レジストなどの幅広い分野で使われるようになって
きた。このような利用分野の拡大、またUV、EB、レ
ーザー等の使用活性エネルギー線への適応、さらには熱
硬化等の他の硬化方法との併用による硬化システムの多
様化などと共に活性エネルギー線硬化性樹脂に対して種
々の性能が要求されるようになってきている。活性エネ
ルギー線硬化性樹脂の物性は、そこに含まれる重合性オ
リゴマーの影響を大きく受けるため、重合性オリゴマー
の開発が重要である。2. Description of the Related Art In recent years, active energy ray curable resins have low pollution due to not requiring a solvent, high productivity due to short curing time, and curing in comparison with thermosetting resins. Since it does not require heat in particular, it can be used at low temperature, and it has been used in a wide range of fields such as paints, printing inks, printing materials, adhesives, and resists by taking advantage of various advantages such as energy saving. Came. With the expansion of such fields of application, adaptation to active energy rays used such as UV, EB, and laser, and further diversification of curing systems by combination with other curing methods such as heat curing, active energy ray curability Various performances are required for resins. Since the physical properties of the active energy ray-curable resin are greatly influenced by the polymerizable oligomer contained therein, development of the polymerizable oligomer is important.
【0003】フェノール樹脂、ビニルフェノール(共)
重合体などのフェノールをもつ重合体は、電気絶縁性、
機械的強度、寸法安定性などの優れた物性をもつことか
ら、電気部品、機械部品などの成形材料、積層板などの
積層材料、シェルモールド用などの結合剤、接着剤、塗
料等様々な分野で利用されている。Phenolic resin, vinylphenol (co)
Polymers with phenols such as polymers are electrically insulating,
Due to its excellent physical properties such as mechanical strength and dimensional stability, it is used in various fields such as molding materials for electrical parts and machine parts, laminate materials such as laminates, binders for shell molds, adhesives, paints, etc. It is used in.
【0004】このように有用なフェノールをもつ重合体
に不飽和結合を導入し、重合性を付与したオリゴマーが
種々検討されている。不飽和結合の導入方法は、フェノ
ール性水酸基反応型とフェノール芳香環置換型に分類で
きる。As described above, various oligomers in which an unsaturated bond is introduced into a polymer having a useful phenol to impart a polymerizing property have been studied. The unsaturated bond introduction method can be classified into a phenolic hydroxyl group reaction type and a phenol aromatic ring substitution type.
【0005】フェノール性水酸基反応型には以下のよう
なオリゴマーが知られている。すなわち、グリシジルエ
ーテル化フェノール樹脂と(メタ)アクリル酸との反応
から得られるいわゆるエポキシ(メタ)アクリレートを
始めとして、イソシアネートエチルメタクリレートやヒ
ドロキシエチル(メタ)アクリレートとトリレン−2,
4−ジイソシアネートとの付加体のようにイソシアネー
トと(メタ)アクリル基をあわせもつ化合物とフェノー
ル樹脂とのカルバミン酸エステル(DE 3,630,
954 A1)、イソシアナートエチルメタクリレート
とポリビニルフェノールとのカルバミン酸エステル(特
開昭63−269,147)、ブロモ化ポリビニルフェ
ノールのメタクリル酸エステル(永井,高橋,片桐,向
尾,大木,プリント回路学会第5回学術講演大会論文
集,157(1990))、アリルエーテル化フェノー
ル樹脂(特公昭43−25,994、森永,村山,中
塚,高分子化学,22,615(1965))等であ
る。ところでフェノールをもつ重合体はフェノール性水
酸基による反応性、および水酸基により活性化された芳
香環の求電子置換反応性を有することを特徴とし、例え
ば前者はエポキシ樹脂の硬化剤として利用され、後者は
ヘキサメチレンテトラミンとの併用により不飽和結合を
導入しなくともそれ自身熱硬化樹脂として利用されてい
る。またフェノールをもつ重合体はその溶解性を活かし
てアルカリ現像型の半導体用フォトレジストとして利用
されている。しかし前述の重合性オリゴマーはフェノー
ル性水酸基がエーテル化、エステル化またはカルバミン
酸エステル化されていることによりフェノールをもつ重
合体が有する反応性、溶解性などの特徴を損なってい
る。The following oligomers are known for the phenolic hydroxyl group reaction type. That is, starting with so-called epoxy (meth) acrylate obtained from the reaction of glycidyl etherified phenol resin and (meth) acrylic acid, isocyanate ethyl methacrylate or hydroxyethyl (meth) acrylate and tolylene-2,
Carbamic acid ester of a compound having an isocyanate and a (meth) acrylic group, such as an adduct with 4-diisocyanate, and a phenol resin (DE 3,630,
954 A1), carbamic acid ester of isocyanate ethyl methacrylate and polyvinyl phenol (Japanese Patent Laid-Open No. 63-269,147), and methacrylic acid ester of brominated polyvinyl phenol (Nagai, Takahashi, Katagiri, Mukai, Ohki, The Printed Circuit Society of Japan) The 5th Scientific Lecture Meeting Proceedings, 157 (1990)), allyl etherified phenolic resin (Japanese Patent Publication No. 43-25,994, Morinaga, Murayama, Nakatsuka, Kogaku Kagaku, 22,615 (1965)) and the like. By the way, a polymer having phenol is characterized by having reactivity with a phenolic hydroxyl group and electrophilic substitution reactivity of an aromatic ring activated by the hydroxyl group.For example, the former is used as a curing agent for an epoxy resin, and the latter is When used in combination with hexamethylenetetramine, it is itself used as a thermosetting resin without introducing an unsaturated bond. Further, a polymer having a phenol is utilized as an alkali developing type photoresist for semiconductors by utilizing its solubility. However, the above-mentioned polymerizable oligomer is impaired in the characteristics such as reactivity and solubility of the polymer having phenol because the phenolic hydroxyl group is etherified, esterified or carbamate esterified.
【0006】もう一方のフェノール芳香環置換型にはフ
ェノール樹脂にアリル基(森永,村山,中塚,高分子化
学,22,615(1965))、プロペニル基を導入
したオリゴマー等が知られている。しかしながらこれら
の官能基は、アクリル基に比べて重合反応性が低い。As the other phenol-aromatic ring-substituted type, an oligomer in which an allyl group (Morinaga, Murayama, Nakatsuka, Kogaku Kagaku, 22,615 (1965)) or a propenyl group is introduced into a phenol resin is known. However, these functional groups have lower polymerization reactivity than acrylic groups.
【0007】[0007]
【発明が解決しようとする課題】本発明の課題は、活性
エネルギー線硬化性樹脂原料として有用な新規フェノー
ル含有重合性オリゴマーを提供することにある。An object of the present invention is to provide a novel phenol-containing polymerizable oligomer useful as a raw material for active energy ray-curable resin.
【0008】[0008]
【課題を解決するための手段】本発明者らは、活性エネ
ルギー線硬化性樹脂原料として有用な新規フェノール含
有重合性オリゴマーについて鋭意研究を重ねた結果、フ
ェノールをもつ重合体中のフェノールの芳香環に構造式
(1)に示される官能基が導入されたオリゴマーすなわ
ち(メタ)アクリルアミド基導入フェノール含有オリゴ
マーを新たに見いだし本発明を完成した。[Means for Solving the Problems] The inventors of the present invention have conducted extensive studies on a novel phenol-containing polymerizable oligomer useful as a raw material for an active energy ray-curable resin. As a result, the aromatic ring of phenol in a polymer having phenol is The present invention has been completed by newly finding an oligomer in which the functional group represented by the structural formula (1) is introduced, that is, a (meth) acrylamide group-introduced phenol-containing oligomer.
【0009】[0009]
【化2】 (式中Rは水素またはメチル基を表わす。)[Chemical 2] (In the formula, R represents hydrogen or a methyl group.)
【0010】本発明の(メタ)アクリルアミド基導入フ
ェノール含有オリゴマーは、フェノールをもつ重合体中
のフェノールの芳香環に対するN−メチロール(メタ)
アクリルアミドあるいはそのアルキルエーテル化物の求
電子置換反応によって得ることができる。The (meth) acrylamide group-introduced phenol-containing oligomer of the present invention is N-methylol (meth) to the aromatic ring of phenol in a polymer having phenol.
It can be obtained by an electrophilic substitution reaction of acrylamide or its alkyl ether compound.
【0011】ここでいうフェノールをもつ重合体は、フ
ェノール樹脂あるいはビニルフェノール(共)重合体で
ある。さらに詳しく説明するならばフェノール樹脂は、
フェノール類とアルデヒド類を縮合させて得られる分子
量300から10,000の重合体であり、例えばフェ
ノール類としてフェノール、メチルフェノール、ジメチ
ルフェノール、ジヒドロベンゼン、ビスフェノールA、
ビスフェノールF等、またアルデヒド類としては、ホル
ムアルデヒド、パラホルムアルデヒド、アセトアルデヒ
ド、フルフラール等を各々用いることができる。またビ
ニルフェノール(共)重合体は分子量300から50、
000のビニルフェノールの単独重合体あるいは共重合
体である。コモノマーとして例えば、ブタジエン、イソ
プレンをはじめとするジエン誘導体、スチレン、α−メ
チルスチレンなどのスチレン誘導体、酢酸ビニルなどの
ビニルエステル誘導体、(メタ)アクリル酸およびその
エステル、(メタ)アクリルアミドおよびそのN−置換
体、(メタ)アクリロニトリル、無水マレイン酸やマレ
イミドをはじめとするマレイン酸、マレイミド誘導体、
N−ビニルピロリドン、ビニルエーテルなどがある。The phenol-containing polymer mentioned here is a phenol resin or a vinylphenol (co) polymer. To explain in more detail, phenolic resin is
It is a polymer having a molecular weight of 300 to 10,000 obtained by condensing phenols and aldehydes, and examples of the phenols include phenol, methylphenol, dimethylphenol, dihydrobenzene, bisphenol A,
As bisphenol F and the like, as aldehydes, formaldehyde, paraformaldehyde, acetaldehyde, furfural and the like can be used. The vinylphenol (co) polymer has a molecular weight of 300 to 50,
It is a homopolymer or copolymer of 000 vinylphenols. As comonomers, for example, diene derivatives such as butadiene and isoprene, styrene, styrene derivatives such as α-methylstyrene, vinyl ester derivatives such as vinyl acetate, (meth) acrylic acid and its esters, (meth) acrylamide and its N- Substitutes, (meth) acrylonitrile, maleic acid including maleic anhydride and maleimide, maleimide derivatives,
Examples include N-vinylpyrrolidone and vinyl ether.
【0012】フェノールをもつ低分子化合物、例えば4
−ヒドロキシベンゾフェノン(特公昭59−29,56
2)、ビスフェノールA(USP 3,839,447
(1974))などへのN−メチロールアクリルアミド
の求電子置換反応については既に種々検討されている。
本発明のアクリルアミド基導入フェノール含有オリゴマ
ーもこれらの方法を用いて合成することができる。すな
わちフェノールをもつ重合体とN−メチロール(メタ)
アクリルアミドあるいはそのアルキルエーテル化物とを
溶媒中、酸触媒存在下反応させることにより、アクリル
アミド基導入フェノール含有オリゴマーが得られる。溶
媒はアセトン、メチルエチルケトンあるいはアセトン・
水混合溶媒、メタノール、エタノール、プロパノール、
ジメチルホルムアミド、2−ピロリドン等を用いること
ができる。触媒は塩酸、硫酸、燐酸等の無機酸あるいは
p−トルエンスルホン酸等の有機酸を用いることができ
る。反応は0から150℃、好ましくは室温から80℃
の範囲で行なわれ、反応時間は、30分から数日間であ
る。Low molecular weight compounds with phenols, eg 4
-Hydroxybenzophenone (JP-B-59-29,56)
2), bisphenol A (USP 3,839,447
(1974)) and other electrophilic substitution reactions of N-methylolacrylamide have already been studied.
The acrylamide group-introduced phenol-containing oligomer of the present invention can also be synthesized using these methods. That is, a polymer having phenol and N-methylol (meth)
An acrylamide group-introduced phenol-containing oligomer is obtained by reacting acrylamide or its alkyl ether compound in a solvent in the presence of an acid catalyst. The solvent is acetone, methyl ethyl ketone or acetone.
Water mixed solvent, methanol, ethanol, propanol,
Dimethylformamide, 2-pyrrolidone, etc. can be used. As the catalyst, an inorganic acid such as hydrochloric acid, sulfuric acid or phosphoric acid or an organic acid such as p-toluenesulfonic acid can be used. The reaction is 0 to 150 ° C, preferably room temperature to 80 ° C
The reaction time is 30 minutes to several days.
【0013】フェノールをもつ重合体中のフェノールの
芳香環に導入されうる構造式(1)に示される官能基の
位置および数は、反応させる重合体中のフェノールの芳
香環の置換基数、置換基の位置、置換基の立体障害、置
換基の誘起効果、置換基の共鳴効果等の様々な影響を受
けるため一概にいうことができない。例えばフェノール
樹脂の場合理想的には、水酸基のオルト位あるいはパラ
位にフェノール1個当り構造式(1)で示される官能基
が1個まで導入可能である。またビニルフェノール
(共)重合体の場合理想的には、水酸基のオルト位、パ
ラ位にフェノール1個当り構造式(1)で示される官能
基が2個程度まで導入可能である。一方導入した構造式
(1)で示される官能基数が少ない場合、得られるオリ
ゴマーの活性エネルギー線硬化性が低い。そこでフェノ
ールをもつ重合体に導入された構造式(1)で示される
官能基数は、フェノール樹脂の場合、フェノールの芳香
環1個当り0.1から1個、ビニルフェノール(共)重
合体の場合、フェノールの芳香環1個当り0.1から2
個が適当である。The position and number of the functional group represented by the structural formula (1) that can be introduced into the aromatic ring of phenol in the polymer having phenol is determined by the number of substituents and the number of substituents on the aromatic ring of phenol in the polymer to be reacted. It is impossible to say unconditionally because it is affected by various effects such as the position of, the steric hindrance of the substituent, the inducing effect of the substituent, and the resonance effect of the substituent. For example, in the case of a phenol resin, ideally, up to one functional group represented by the structural formula (1) can be introduced per one phenol at the ortho or para position of the hydroxyl group. Further, in the case of a vinylphenol (co) polymer, ideally, up to about two functional groups represented by the structural formula (1) can be introduced per one phenol at the ortho and para positions of the hydroxyl group. On the other hand, when the number of introduced functional groups represented by the structural formula (1) is small, the active energy ray curability of the resulting oligomer is low. Therefore, the number of functional groups represented by the structural formula (1) introduced into a polymer having phenol is 0.1 to 1 per one aromatic ring of phenol in the case of phenol resin, and that of vinylphenol (co) polymer in the case of phenol resin. , 0.1 to 2 per one aromatic ring of phenol
Individuals are appropriate.
【0014】本発明のアクリルアミド基導入フェノール
含有オリゴマーは、種々の単官能および多官能(メタ)
アクリートまたは(メタ)アクリルアミド、光重合開始
剤、増感剤、バインダー高分子、フィラー等の一部ある
いはすべてからなる組成物に添加し、活性エネルギー線
硬化性樹脂組成物とすることができる。単官能あるいは
多官能(メタ)アクリートまたは(メタ)アクリルアミ
ドとしては、例えば2−エチルヘキシル(メタ)アクリ
レート、2−エトキシエチル(メタ)アクリレート、2
−ヒドロキシエチル(メタ)アクリレート、2−ヒドロ
キシプロピル(メタ)アクリレート、テトラヒドロフル
フリル(メタ)アクリレート、N−ビニルピロリドン、
N−アクリロイルモルホリン、N,N−ジメチル(メ
タ)アクリルアミド、ダイアセトン(メタ)アクリルア
ミド、エチレングリコールジ(メタ)アクリレート、ジ
エチレングリコールジ(メタ)アクリレート、プロピレ
ングリコール(メタ)アクリレート、1,4−ブタンジ
オールジ(メタ)アクリレート、1,6−ヘキサンジオ
ールジ(メタ)アクリレート、ポリエチレングリコール
ジ(メタ)アクリレート、ポリプロピレングリコールジ
(メタ)アクリレート、トリメチロールプロパントリ
(メタ)アクリレート、ペンタエリスリトールトリ(メ
タ)アクリレート、ペンタエリスリトールテトラ(メ
タ)アクリレート、ジペンタエリスリトールヘキサ(メ
タ)アクリレート、ポリエステル(メタ)アクリレー
ト、エポキシ(メタ)アクリレート、ウレタン(メタ)
アクリレート、ポリブタジエン(メタ)アクリレート、
シリコーン(メタ)アクリレート等が使用できる。光開
始剤としては例えば、2−ヒドロキシ−2−メチル−1
−フェニルプロパン−1−オン、2−メチル−1−[4
−(メチルチオ)フェニル]−2−モルホリノプロパン
−1−オン等アセトフェノン類、ベンゾインイソプロピ
ルエーテル等ベンゾイン類、ベンゾフェノン類、チオキ
サンソン類、2,4,6−トリメチルベンゾイルジフェ
ニルホスフィンオキサイド、カンファーキノン等が使用
できる。増感剤としては、各種のアミンが使用できる。
バインダー高分子としては、ポリビニルアルコール、ポ
リエチレングリコール、ポリプロピレングリコール、ポ
リアクリルアミド、ポリビニルピロリドン、ポリビニル
エーテル、フェノキシ樹脂、スチレン無水マレイン酸共
重合体、ポリブタジエン、ポリウレタン等が挙げられ
る。フィラーとしては硫酸バリウム、チタン酸バリウ
ム、シリカ、タルク、炭酸カルシウム、水酸化アルミニ
ウム等を用いることができる。The acrylamide group-introduced phenol-containing oligomer of the present invention has various monofunctional and polyfunctional (meth).
An active energy ray-curable resin composition can be obtained by adding it to a composition comprising a part or all of acrylate or (meth) acrylamide, a photopolymerization initiator, a sensitizer, a binder polymer, a filler and the like. Examples of the monofunctional or polyfunctional (meth) acrylate or (meth) acrylamide include 2-ethylhexyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate and 2
-Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, N-vinylpyrrolidone,
N-acryloylmorpholine, N, N-dimethyl (meth) acrylamide, diacetone (meth) acrylamide, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, propylene glycol (meth) acrylate, 1,4-butanediol Di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate , Pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, polyester (meth) acrylate, epoxy (meth) acrylate Rate, urethane (meth)
Acrylate, polybutadiene (meth) acrylate,
Silicone (meth) acrylate or the like can be used. As the photoinitiator, for example, 2-hydroxy-2-methyl-1
-Phenylpropan-1-one, 2-methyl-1- [4
Acetophenones such as-(methylthio) phenyl] -2-morpholinopropan-1-one, benzoins such as benzoin isopropyl ether, benzophenones, thioxanthones, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and camphorquinone can be used. . As the sensitizer, various amines can be used.
Examples of the binder polymer include polyvinyl alcohol, polyethylene glycol, polypropylene glycol, polyacrylamide, polyvinylpyrrolidone, polyvinyl ether, phenoxy resin, styrene-maleic anhydride copolymer, polybutadiene and polyurethane. As the filler, barium sulfate, barium titanate, silica, talc, calcium carbonate, aluminum hydroxide or the like can be used.
【0015】本発明のアクリルアミド基導入フェノール
含有オリゴマーを含む前述の活性エネルギー線硬化性樹
脂組成物は、塗料、印刷インキ、刷版材、接着剤、レジ
スト等に用いることができる。以下本発明を実施例をも
って説明する。The above-mentioned active energy ray-curable resin composition containing the acrylamide group-introduced phenol-containing oligomer of the present invention can be used in paints, printing inks, printing plate materials, adhesives, resists and the like. The present invention will be described below with reference to examples.
【0016】[0016]
【0017】[0017]
【実施例1】フェノールノボラック樹脂(昭和高分子株
式会社製、商品名BRG−559)212g(2.0当
量)、N−メチロールアクリルアミド202g(2.0
mol)、アセトン400mlの混合物を撹拌しなが
ら、これに36%塩酸203gを反応混合物の温度が4
0℃以下に保ちつつ徐々に滴下した。この反応混合物を
50℃油浴上6時間加熱撹拌した。室温まで放冷後、反
応混合物にメチルエチルケトン2.5l、蒸留水1lを
加えて振とうし、有機層を分離した。この有機層を5%
炭酸水素ナトルウム水溶液で中和し、さらに蒸留水50
0mlで3回洗浄した。溶媒を留去し、得られた固形物
を粉砕した後これを減圧加熱乾燥した。334gの固体
が得られた。その一部を少量のテトラヒドロフランに溶
解し、大量のジクロロメタン中に投じた。得られた沈澱
物を濾別、粉砕し、乾燥した。この物質の1H NMR
スペクトルを図1に示した。フェノールノボラック樹脂
のフェノール1個当り、0.8個の構造式(1)(但し
Rは水素)で示される官能基が導入されていた。Example 1 Phenolic novolac resin (Showa High Polymer Co., Ltd., trade name BRG-559) 212 g (2.0 equivalents), N-methylol acrylamide 202 g (2.0
mol) and 400 ml of acetone while stirring, while adding 203 g of 36% hydrochloric acid to the reaction mixture at a temperature of 4
The solution was gradually added dropwise while keeping the temperature below 0 ° C. The reaction mixture was heated and stirred on a 50 ° C. oil bath for 6 hours. After cooling to room temperature, 2.5 l of methyl ethyl ketone and 1 l of distilled water were added to the reaction mixture and shaken to separate the organic layer. 5% of this organic layer
Neutralize with sodium hydrogen carbonate aqueous solution, and add distilled water 50
Wash 3 times with 0 ml. The solvent was distilled off, and the obtained solid substance was crushed and then dried under reduced pressure. 334 g of solid was obtained. A part thereof was dissolved in a small amount of tetrahydrofuran and poured into a large amount of dichloromethane. The precipitate obtained was filtered off, ground and dried. 1H NMR of this material
The spectrum is shown in FIG. 0.8 functional groups represented by the structural formula (1) (wherein R is hydrogen) were introduced per one phenol of the phenol novolac resin.
【0018】[0018]
【実施例2】ポリp−ビニルフェノール(丸善石油化学
株式会社製、商品名マルカリンカーM S−2P)24
0g(2.0当量)、N−メチロールアクリルアミド2
02g(2.0mol)、アセトン400mlの混合物
を撹拌しながら、これに36%塩酸203gを反応混合
物の温度が40℃以下に保ちつつ徐々に滴下した。この
反応混合物を50℃油浴上6時間加熱撹拌した。室温ま
で放冷後、反応混合物にメチルエチルケトン2.5l、
蒸留水1.1lを加えて振とうし、有機層を分離した。
この有機層を5%炭酸水素ナトルウム水溶液で中和し、
さらに蒸留水500mlで2回洗浄した。有機層にさら
にメチルエチルケトンを2lを加え、蒸留水500ml
で洗浄した。溶媒を留去し、得られた固形物を粉砕した
後これを減圧加熱乾燥した。360gの固体が得られ
た。その一部を少量のアセトンに溶解し、大量のジクロ
ロメタン中に投じた。得られた沈澱物を濾別、粉砕し、
乾燥した。この物質の1H NMRスペクトルを図2に
示した。ポリp−ビニルフェノールのフェノール1個当
り、0.9個の構造式(1)(但しRは水素)で示され
る官能基が導入されていた。[Example 2] Poly p-vinylphenol (manufactured by Maruzen Petrochemical Co., Ltd., trade name Marca Linker MS-2P) 24
0 g (2.0 equivalents), N-methylol acrylamide 2
While stirring a mixture of 02 g (2.0 mol) and 400 ml of acetone, 203 g of 36% hydrochloric acid was gradually added dropwise thereto while keeping the temperature of the reaction mixture at 40 ° C or lower. The reaction mixture was heated and stirred on a 50 ° C. oil bath for 6 hours. After allowing to cool to room temperature, 2.5 l of methyl ethyl ketone was added to the reaction mixture,
Distilled water (1.1 L) was added and the mixture was shaken to separate the organic layer.
This organic layer was neutralized with a 5% aqueous sodium hydrogen carbonate solution,
Further, it was washed twice with 500 ml of distilled water. Add 2 l of methyl ethyl ketone to the organic layer and add 500 ml of distilled water.
Washed with. The solvent was distilled off, and the obtained solid substance was crushed and then dried under reduced pressure. 360 g of solid was obtained. A part of it was dissolved in a small amount of acetone and poured into a large amount of dichloromethane. The precipitate obtained is filtered off and ground,
Dried. The 1H NMR spectrum of this material is shown in FIG. 0.9 functional groups represented by structural formula (1) (where R is hydrogen) were introduced per one phenol of poly-p-vinylphenol.
【0019】[0019]
【実施例3】実施例2と同じポリp−ビニルフェノール
120g(1.0当量)、N−メチロールアクリルアミ
ド202g(2.0mol)、アセトン250mlの混
合物を撹拌しながら、これに36%塩酸101gを反応
混合物の温度が40℃以下に保ちつつ徐々に滴下した。
この反応混合物を50℃油浴上4時間加熱撹拌した。室
温まで放冷後、反応混合物にメチルエチルケトン1.5
l、蒸留水300mlを加えて振とうし、有機層を分離
した。この有機層を5%炭酸水素ナトルウム水溶液で中
和した。これにメチルエチルケトン600ml、蒸留水
300mlを加えて有機層を分離した。この操作を3回
繰り返した。溶媒を留去し、得られた固形物を粉砕した
後これを減圧加熱乾燥した。218gの固体が得られ
た。その1H NMRスペクトルを測定したところポリ
p−ビニルフェノールのフェノール1個当り、1.9個
の構造式(1)(但しRは水素)で示される官能基が導
入されていた。Example 3 A mixture of 120 g (1.0 equivalent) of poly-p-vinylphenol, 202 g (2.0 mol) of N-methylolacrylamide and 250 ml of acetone, which was the same as in Example 2, was stirred, while 101 g of 36% hydrochloric acid was added thereto. The reaction mixture was gradually added dropwise while keeping the temperature at 40 ° C or lower.
The reaction mixture was heated with stirring on a 50 ° C. oil bath for 4 hours. After cooling to room temperature, methyl ethyl ketone 1.5 was added to the reaction mixture.
1, and 300 ml of distilled water were added and shaken to separate the organic layer. This organic layer was neutralized with a 5% aqueous sodium hydrogencarbonate solution. To this, 600 ml of methyl ethyl ketone and 300 ml of distilled water were added to separate the organic layer. This operation was repeated 3 times. The solvent was distilled off, and the obtained solid substance was crushed and then dried under reduced pressure. 218 g of solid was obtained. When its 1H NMR spectrum was measured, 1.9 functional groups represented by Structural Formula (1) (where R is hydrogen) were introduced per one phenol of poly-p-vinylphenol.
【0020】[0020]
【発明の効果】活性エネルギー線硬化性樹脂原料として
有用な新規フェノール含有重合性オリゴマーが得られ
た。EFFECT OF THE INVENTION A novel phenol-containing polymerizable oligomer useful as a raw material for an active energy ray-curable resin was obtained.
【図1】N−メチルールアクリルアミドが導入されたフ
ェノールノボラック樹脂のNMRスペクトルである。FIG. 1 is an NMR spectrum of a phenol novolac resin into which N-methyl acrylamide has been introduced.
【図2】N−メチルアクリルアミドが導入されたポリp
−ビニルフェノール樹脂である。FIG. 2 shows poly-p having N-methyl acrylamide introduced.
-Vinylphenol resin.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01L 21/027 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H01L 21/027
Claims (4)
ェノール樹脂のフェノールの芳香環1個当りに、以下の
構造式(1)に示される官能基が0.1から1個導入さ
れた(メタ)アクリルアミド基導入フェノール含有オリ
ゴマー。 【化1】 (式中Rは水素またはメチル基を表わす。)1. 0.1 to 1 functional group represented by the following structural formula (1) is introduced per one aromatic ring of phenol of a phenol resin having a molecular weight of 300 to 10,000 (meta). ) An acrylamide group-introduced phenol-containing oligomer. [Chemical 1] (In the formula, R represents hydrogen or a methyl group.)
ニルフェノール(共)重合体のフェノールの芳香環1個
当りに、構造式(1)に示される官能基が0.1から2
個導入された(メタ)アクリルアミド基導入フェノール
含有オリゴマー。2. The functional group represented by the structural formula (1) is from 0.1 to 2 per aromatic ring of phenol of a vinylphenol (co) polymer having a molecular weight of 300 to 50,000.
An individually introduced (meth) acrylamide group-introduced phenol-containing oligomer.
るオリゴマーを含有することを特徴とする活性エネルギ
ー線硬化性樹脂組成物。3. An active energy ray curable resin composition comprising the oligomer shown in claim 1 and / or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18776893A JPH0743902A (en) | 1993-07-29 | 1993-07-29 | (meth)acrylamide group introduced phenol-containing oligomer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18776893A JPH0743902A (en) | 1993-07-29 | 1993-07-29 | (meth)acrylamide group introduced phenol-containing oligomer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0743902A true JPH0743902A (en) | 1995-02-14 |
Family
ID=16211876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18776893A Pending JPH0743902A (en) | 1993-07-29 | 1993-07-29 | (meth)acrylamide group introduced phenol-containing oligomer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0743902A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006117890A (en) * | 2004-10-25 | 2006-05-11 | Showa Highpolymer Co Ltd | Curable resin composition and separator for fuel cell using the same |
| WO2017204165A1 (en) * | 2016-05-25 | 2017-11-30 | 東レ株式会社 | Resin composition |
| WO2019049721A1 (en) * | 2017-09-08 | 2019-03-14 | Dic株式会社 | Acid group-containing (meth)acrylate resin, curable resin composition, resin material for solder resist, and resist member |
-
1993
- 1993-07-29 JP JP18776893A patent/JPH0743902A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006117890A (en) * | 2004-10-25 | 2006-05-11 | Showa Highpolymer Co Ltd | Curable resin composition and separator for fuel cell using the same |
| WO2017204165A1 (en) * | 2016-05-25 | 2017-11-30 | 東レ株式会社 | Resin composition |
| CN109153841A (en) * | 2016-05-25 | 2019-01-04 | 东丽株式会社 | Resin combination |
| KR20190011745A (en) * | 2016-05-25 | 2019-02-07 | 도레이 카부시키가이샤 | Resin composition |
| US10990008B2 (en) | 2016-05-25 | 2021-04-27 | Toray Industries, Inc. | Resin composition |
| CN109153841B (en) * | 2016-05-25 | 2021-12-31 | 东丽株式会社 | Resin composition |
| WO2019049721A1 (en) * | 2017-09-08 | 2019-03-14 | Dic株式会社 | Acid group-containing (meth)acrylate resin, curable resin composition, resin material for solder resist, and resist member |
| JPWO2019049721A1 (en) * | 2017-09-08 | 2020-06-11 | Dic株式会社 | Acid group-containing (meth)acrylate resin, curable resin composition, resin material for solder resist, and resist member |
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