JPH07456Y2 - Chip pushing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is capable of picking up a chip by braking a dicing wafer and pushing it up while manufacturing a semiconductor circuit device or the like. The present invention relates to a tip push-up device for making it possible.

[Prior Art] A semiconductor integrated circuit element is manufactured and assembled by bonding a chip formed by braking a dicing wafer to a lead frame and sealing the resin with the chip. Rather than mounting directly on the lead frame from the wafer, first pick up only good chips from the wafer and store them in a state aligned in the chip alignment jig to facilitate bonding work to the lead frame. I am trying to do it.

In order to store this chip in the chip storage jig, dicing is performed with the wafer attached to the adhesive tape, braking is performed along the cutting line by this dicing, and peeling from the adhesive tape is performed. The chip is taken out by the vacuum suction means using the above. In order to perform the breaking of the wafer and the peeling from the adhesive tape in this manner, a chip push-up device is used.

As such a chip pushing-up device, a means for generating tension on the adhesive tape on the outer peripheral portion of the adhesive tape and a needle for pushing up the chip are used. First, tension is applied to the adhesive tape by the tension generating means to brake the wafer. It has been conventionally used that the chip is pushed up from the back surface side of the adhesive tape after being pressed, and the chip is peeled from the adhesive tape. Further, the above-mentioned tension generating means is not specially provided, and the tip is pushed up by the push-up needle while the tip to be pushed up is positioned by pushing the pressing member against the back surface of the adhesive tape. Things are also known.

[Problems to be Solved by the Invention] By the way, if the former of the above-described conventional chip pushing-up devices is configured, the chip is displaced to the outer peripheral side when tension is generated on the adhesive tape. Therefore, when the tip is pushed up by the push-up needle, the posture of the tip may become oblique, which makes it impossible to smoothly suck the tip by the suction collet. There is inconvenience. Also, in the case of the latter configuration, it may not be possible to secure a sufficient clearance between the chip to be picked up and another chip, and this may cause the chip to crack or chip when picked up. And so on. In addition, when pushing up the chip, move the wafer to XY
It is necessary to move the chip in such a way that the chip to be pushed up faces the push-up device, but the pressing member must be kept in contact with the back surface of the adhesive tape even when the wafer is moved. Therefore, there are drawbacks such that the pressing member slides on the adhesive tape, the pressing member is worn, and the load on the driving means for moving the wafer is increased.

Further, when changing the size of the chip formed from the wafer, it is necessary to change the shape, the number of needles, and the lifting stroke of the push-up needle accordingly. Is extremely troublesome,
There is also an inconvenience that it is difficult to perform the control finely.

The present invention has been made in view of the above points, and an object of the present invention is to provide a chip push-up device having a simple structure and capable of pushing up a chip from a wafer extremely smoothly. To do.

[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention is to push a wafer attached to an adhesive tape and having a cross-cutting line up from below to apply tension to the adhesive tape. The push-up piece for braking the chip to be picked up by giving a push-up needle, the push-up needle for peeling the chip braked by the push-up piece from the adhesive tape, and the push-up piece and the push-up needle can be respectively moved up and down. Lifting means for supporting the
Top dead center position setting means for individually adjusting the top dead center of the push-up piece and the push-up needle so that the top dead center position of the push-up needle is higher during the raising operation of the lifting means. The top dead center position setting means adjusts the vertical position adjustable stoppers and the height positions of the respective stoppers in order to regulate the rising stroke ends of the push-up piece and the push-up needle. It is characterized by comprising a position adjusting means.

[Operation] The wafer attached to the adhesive tape is positioned above the push-up device, the wafer is moved in the XY directions, and the push-up needle faces the chip to be pushed up. In this state, the push-up needle is buried inside the push-up piece, and the push-up piece is separated from the adhesive tape. As a result, the above-mentioned movement of the wafer can be smoothly performed.

Therefore, when the wafer is positioned, the lifting means raises the lifting piece together with the lifting needle. As a result, the push-up piece rises to come into contact with the back surface of the adhesive tape, and the chip is pushed up. As a result, tension is applied to the adhesive tape, the chip is braked, and a sufficient gap can be provided at the cleaved part of the chip. In this state, the lifting of the push-up piece stops, but the push-up needle will continue to rise further, and the chip braked as described above will be separated from the adhesive tape by the rise of the push-up needle. . Therefore, the chip thus peeled off by a member such as a suction collet can be taken out and stored in a chip storage jig.

Since the rising stroke ends of the push-up piece and the push-up needle, that is, the top dead center can be individually set by the top dead center setting means, whether the size and shape of the chip and the dicing are due to the half cut. It is possible to optimize the amount of braking extension by the push-up piece depending on whether it is a semi-full cut. Also, when pushing up a chip that has been braked as described above with the push-up needle, it is possible to set the push-up amount arbitrarily, so the push-up amount of the tip is optimal for pickup. You will be able to do it.

Moreover, the top dead center setting means does not individually regulate the top dead center position in the upward stroke of the push-up piece and the push-up needle by the stopper, and the height position of the stopper is set at an arbitrary height by the position adjusting means. Since it can be adjusted to the position, with the device assembled,
By adjusting the height position of each stopper by the position adjusting means, the rising stroke of the push-up piece and push-up needle can be easily and accurately adjusted according to the size and shape of the chip formed on the wafer, the dicing method, etc. You can

[Embodiment] An embodiment of the present invention will be described below in detail with reference to the drawings.

First, FIG. 1 and FIG. 2 show the overall structure of a chip pushing-up device. In the drawing, reference numeral 1 denotes a wafer, the wafer 1 is attached to an adhesive tape 2, and the adhesive tape 2 is supported by a carrier frame (not shown). And
The wafer 1 has a grid-like cutting line 3,3, ...
Is formed, and is divided into a large number of chips 1a by these cutting lines 3. Here, this cutting is a half cut or a semi-full cut with a part left uncut.

A carrier frame that supports the wafer 1 is supported by an XY table (not shown) and is supported so as to be movable in any of front, rear, left and right directions. A push-up device 4 is provided below the wafer 1.

The push-up device 4 includes a push-up piece 5 and a push-up needle 6.
The push-up piece 5 and the push-up needle 6 are connected to the tips of lift rods 8 and 9 provided on the fixed block 6 so as to be lifted and lowered. The push-up piece 5 includes a pressing portion 5a located on the lower surface of the adhesive tape 2,
It has an arm portion 5b connected to the pressing portion 5a, and the arm portion 5b is detachably attached to the tip of a vertical portion of the supporting member 10 fixed to the elevating rod 8 with a screw or the like. On the other hand, the push-up needle 6 is a lifting block which is detachably attached to the tip of the lifting rod 8 by means such as screws.
Attached to 11 by mounting plate piece 12, push-up piece 5
It is inserted in the through hole 13 formed in the pressing portion 5a in the above so as to be retractable.

Thus, the push-up piece 5 and push-up needle 6 described above are used.
In order to move up and down, the operating plates 14 and 15 are connected to the base ends of the lifting rods 8 and 9, respectively, and the springs 16 and 17 are provided between the operating plates 14 and 15 and the fixed block 7, respectively. Is lifted, and the lifting rods 8 and 9 connected to these operating plates 14 and 15 are always urged in a rising direction. Also, the operating plate 14,1
Of the five, the operating plate 14 is disposed below the operating plate 15, and the operating plates 14 and 15 can come into contact with each other. Further, the operating plate 15 is in contact with a roller 20 attached to the tip of a rotating lever 19 which is rotated by a predetermined amount by a drive means 18 including a cam mechanism,
By rotating the rotating lever 19, the action plate 15 can be moved up and down by the action of the spring 17. Further, the operating plate 14 is always operated by the action of the spring 16.
It is in contact with 15 and can be moved up and down by following up and down of the operating plate 15. Therefore, the lifting rod 8 for lifting and lowering the push-up piece 5 and the push-up needle 6,
Elevating means is constituted by 9, the operating plates 14 and 15, the springs 16 and 17, and the driving means 18.

Further, stoppers 21 and 22 are attached to the fixed block 7 as the top dead center setting means for setting the rising stroke ends of the above-mentioned operation plates 14 and 15, that is, the top dead center position, and the operation plates 14 and 15 are Can be raised up to the position where they abut against the stoppers 21 and 22, respectively. The positions where the operating plates 14 and 15 come into contact with the stoppers 21 and 22, respectively, are the push-up piece 5 and the push-up needle 6. It becomes the top dead center. These stoppers 21, 22 are formed with long grooves 21a, 22a in the vertical direction, and set screws 23, 24 are attached to the respective long grooves 21a, 22a. The stoppers 21 and 22 can be moved up and down by a predetermined amount in a state in which is loosened, whereby the top dead center of the operating plates 14 and 15 can be adjusted. Here, in order to strictly set and adjust the top dead center of the push-up piece 5 and the push-up needle 6, the micrometers 25 and 26 are attached to the fixed block 7, and the respective micrometers 25 and 26 are attached.
Are engaged with the stoppers 21 and 22, respectively, and the stopper 2 is operated by operating these respective micrometers 25 and 26.
The top dead center of the push-up piece 5 and the push-up needle 6 can be adjusted individually and finely by the methods 1, 22.

The present embodiment is configured as described above, and its operation will be described next.

First, the rotary lever 19 pushes down the operating plate 15 against the spring 17 to position the push-up needle 6 at the bottom dead center.
At this time, the operating plate 14 is pressed by the operating plate 15 and moved down, whereby the push-up piece 5 is also positioned at the bottom dead center. At this time, the push-up piece 5 is in a state of being separated from the adhesive tape 2 to which the wafer 1 is attached,
The push-up needle 6 is a through hole in the push-up piece 5.
It is in a state of being immersed inside 13.

Therefore, the carrier frame that supports the adhesive tape 2 of the wafer 1 is moved, and the chip 1a of the wafer 1 to be pushed up is displaced to the position facing the push-up piece 5, and the positioning is performed. Therefore, when the turning lever 19 is turned in the ascending direction, the actuating plates 14 and 15 ascend by the action of the springs 16 and 17 in a state where the two act in synchronization with each other. By contacting and pushing up the adhesive tape 2,
It will be tensioned as shown. As a result, the chip 1a is braked and cleaved from the adjacent chips, and the cleaved portions are separated from each other. As a result, when the chip 1a is picked up, there is no possibility that the cleaved surface of the chip 1a collides with the cleaved part of the adjacent chip to cause cracking or chipping.

In this way, when the tip 1a is braked, the operating plate 14 comes into contact with the stopper 21, and the operating plate 14
Stops and the thrusting piece 5 becomes the top dead center. However, when the rotation lever 19 continues to rotate further, only the actuation plate 15 rises apart from the actuation plate 14. As a result, only the push-up needle 6 rises, the push-up needle 6 projects from the through hole 13, and further pushes up the adhesive tape 2 as shown in FIG. Adhesive tape 2 excluding the abutting part
Will be peeled from. When the tip 1a is peeled off in this manner, the operating plate 15 comes into contact with the stopper 22 and stops, and becomes the top dead center of the push-up needle 6.

Therefore, the chip 1a is in a state of being largely separated from the push-up needle 6 in this way, and is sucked and taken out by the suction collet 27 as shown in FIG. 4, and aligned in a chip storing jig (not shown). It will be stored in the state. Here, since the push-up piece 5 stretches the adhesive tape 2 around the chip 1a to be picked up, the positional deviation between the chip 1a and the push-up piece 5 does not occur. In this state, since the tip 1a is peeled off from the adhesive tape 2 by the push-up needle 6, there is no inconvenience that the posture of the pushed-up tip 1a is inclined, and the suction of the tip 1a by the suction collet 27 described above is smoothly performed. It can be carried out.

By the way, depending on the size and shape of the chip 1a formed on the wafer 1, the dicing method, etc., the top dead center position of the push-up piece 5 and the push-up needle 6 may be adjusted, and the shape of the push-up piece 5 and the number of push-up needles 6 may be adjusted. Etc. need to be changed. However, in the push-up device 4 according to the present invention, the lifting strokes of the push-up piece 5 and the push-up needle 6 can be individually set by the stoppers 21 and 22, respectively, and the stoppers 21 and 22 can be used to set the stoppers. Since the height position of 21,22 can be strictly adjusted, the top dead center position of the push-up piece 5 and the push-up needle 6 can be respectively changed according to the size and shape of the chip 1a and the dicing method. It becomes possible to easily and optimally set. Further, since the push-up piece 5 is detachably attached to the support member 10, the push-up piece 5 can be exchanged, and if the attachment plate piece 12 is detached from the elevating block 11, the push-up needles 6 can be exchanged and the number of the push-up needles can be changed. Can be done arbitrarily. Therefore, the push-up can be performed under the optimum condition according to the chip 1a on the wafer 1.

[Effects of the Invention] As described in detail above, according to the present invention, the pushing-up piece and the pushing-up needle are provided, and the pushing-up piece pushes up the wafer from the back surface of the adhesive tape to extend the braking, and then push up. Since the tip is pushed up by the needle, and the top dead center of these push-up pieces and the push-up needle can be set separately, braking and tip pickup can be performed under good conditions. It is possible to reliably prevent the chip from cracking or chipping.
In addition, the device is assembled because the stopper and the height adjusting means of the stopper are provided in order to set the top dead center position of the push-up piece and push-up needle without causing the chip pickup failure. In this state, by operating the height position adjusting means, it is possible to arbitrarily set the top dead center position of each of the push-up needles provided that the top dead center position is at a higher position. According to the size and shape of the chip to be formed, the dicing method, etc., various effects can be obtained such that the lifting stroke of the push-up piece and the push-up needle can be easily and accurately adjusted so as to be in an optimum state.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a structural explanatory view of a tip pushing device, FIG. 2 is a left side view of FIG. 1, and FIG. 3 and FIG. FIG. 7 is an operation explanatory view of the tip pushing-up device showing the above. 1: Wafer, 1a: Chip, 2: Adhesive tape, 3: Cutting line, 4: Pushing device, 5: Pushing piece, 5a: Pushing part, 6: Pushing needle, 7: Fixed block, 8, 9: Lifting rod , 10: support member, 11: lifting block, 14, 15: operating plate,
16, 17: Spring, 21, 22: Stopper, 21a, 22a: Long groove, 23, 24: Set screw, 25, 26: Micrometer.

Claims (2)

[Scope of utility model registration request] 1. A push-up piece for braking a chip to be picked up by pushing up a wafer attached to an adhesive tape and having a grid-like cutting line from below and applying tension to the adhesive tape, A push-up needle for peeling a chip braked by the push-up piece from the adhesive tape, an elevating means for respectively supporting the push-up piece and the push-up needle so as to be able to move up and down, and the push-up piece when the elevating means is raised. And the top dead center of the push-up needle so that the top dead center of the push-up needle is higher, and has top dead center position setting means for individually adjusting each.
The top dead center position setting means controls the rising stroke ends of the push-up piece and the push-up needle,
A chip pushing-up device comprising a stopper whose position can be adjusted in the vertical direction and position adjusting means for adjusting the height position of each stopper. 2. The elevating means is connected to each of the push-up pieces and the push-up needles, an ascending / descending rod, an operating member connected to each of the ascending / descending rods, and each of the ascending / descending rods or an actuating member. An urging means for urging the push-up needle in the ascending direction and an actuating member of the two actuating members, which is connected to the push-up piece, is brought into contact with an actuating member of the push-up needle, and the push-up needle is pushed up. The pushing member that moves up and down in an engaged state so that a force acts in a direction against the spring with respect to the actuating member connected to the needle. Tip pushing device.