JPH0746693B2 - Prober device - Google Patents

Description

Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a prober device for making a test by bringing a probe needle into contact with an input / output terminal (pad) of an object to be measured, and particularly, to improve measurement accuracy. The present invention relates to a prober device for high speed device measurement.

[Technical Background and Problems of the Invention] Conventionally, in this type of prober, a probe card 20 having a probe needle to be brought into contact with a pad formed on a wafer as shown in FIG. 7 and FIG. It is attached to the ring insert portion 21 provided in the head plate, and is connected to the test head 23 via the wiring-board 24-pogo pin-25-board 26-wiring-board 27, and the wafer on the chuck top 29. The θ (horizontal angle) adjustment with 30 was configured by the θ rotation mechanism of the ring insert portion 21. By providing the θ rotation mechanism in the head plate / ring insert part in this way, the head plate / ring insert part needs to have a thickness of about 50 mm. Therefore, the input / output line of the probe card is connected to the tester high frequency test head. It required a length of around 80 mm. However, from the viewpoint of test accuracy, the longer the signal line, the worse the various characteristics due to the increase in measurement timing and capacitive load and the worse the actual element performance. Short number for example
It was desired to be within cm.

[Object of the Invention] The present invention has been made in view of the above-mentioned problems of the related art. The ring insert mechanism is abolished, and a probe card is directly attached to the tester high frequency test head to measure the shortening of the measurement cable, thereby improving the measurement accuracy. It is intended to provide a prober device aiming at the above.

[Summary of the Invention] In order to achieve such an object, a prober apparatus of the present invention is a prober apparatus of a test head mounting type, in which a probe card for testing an object to be measured, for example, a chip of a semiconductor wafer is fixed to the test head. Characterized by
As a result, the conventional head plate and ring insert mechanism are eliminated, and the measurement cable between the test head and the probe card is greatly shortened. Further, in the prober device of the present invention, since the probe card is fixed to the test head, it is achieved by performing the adjustment in the angular direction between the probe card and the wafer on the chuck stage side on which the wafer is mounted. it can.

Further, since it is not necessary to provide the ring insert mechanism, there is an effect that the test head and the wafer can be relatively close to each other in the vertical direction.

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 shows an example of a prober device according to the present invention, which mainly comprises a loader unit 1, a prober unit 2 and a test head 3. The prober unit 2 is taken out one by one from a carrier carried into the loader unit 1. It comprises a chuck top 4 as a mounting table on which a measured object to be conveyed, for example, a semiconductor wafer is mounted, an alignment stage (not shown) as a positioning mechanism, and a chuck stage 5 for horizontally (XY) driving the chuck top 4. . The test head 3 rotates about the hinge portion 6 and is installed on the chuck stage 5. A probe card 8 is fixed to the performance board 7 of the test head 3 with screws 9 as shown in FIG. A prober needle 12 that contacts a pad (not shown) formed on the wafer 11 is implanted in the probe card 8. The probe card 8 and the performance board 7 are connected by a wire rod 10 or pogo pins.

Next, the alignment of the probe card 8 and the wafer 11 on the chuck top 4 in this embodiment will be described.

First, since the distance between the probe card 8 and the wafer 10 in the vertical (Z) direction (the direction of the arrow in the drawing) is longer than that in the conventional prober device by the ring insert mechanism, that amount (about 20mm or more) Z of chuck top 4
Stroke is extended, needle 12 of probe card 8 and wafer
Allows 10 contacts. Alternatively, as shown in FIG.
A hinge portion 6 between the test head 3 and the prober portion 2 is provided below the uppermost portion 2a of the prober portion 2 so that the probe card 8 is located at a conventional contact point when the test head 3 is set. Alternatively, as shown in FIG. 4, the cylindrical hole for the microscope provided in the conventional test head 3 is abolished, the pin electronics is arranged in this portion 13, and this portion is formed into the convex shape 13a, and the prober portion is formed. Alternatively, the distance to the chuck top 4 may be shortened by projecting the inside of the chuck 2. In this case, the alignment of the probe card 8 and the wafer 10 is imaged by a TV camera, input to the CRT, and adjusted while visually observing the CRT.

Next, the probe card 8 is used for alignment in the angle (θ) direction.
Is fixed to the test head 3, so this is done on the side of the prober unit 2 on which the wafer is mounted. That is, as shown in FIG. 5, when the X and Y axes of the probe card 8 and the chuck stage 5 are deviated by θ, the chuck top 4 is first adjusted by θ by the alignment stage so that the chip array and the probe card 8 are Match. Then, the deviation (θ) of the chuck top 4 with respect to the XY axes is calculated by a soft wafer by the CPU incorporated in the prober unit to control the XY drive of the chuck stage 5. That is, as shown in FIG. 6, in order to measure the chip C2 after measuring the chip C1, the chuck top is moved in the X-axis direction by x and then in the Y-axis direction by y. However, when the chip width is a, x = acos θ and y = asin θ. Note that θ
The adjustment is not limited to this example, and, for example, the alignment and the XY drive on the chuck stage 5 are performed as usual. It is also possible to rotate the chuck top 4 for each measurement of the chip. In any case, the probe card fixed to the test head is configured to adjust the wafer chip by θ on the prober unit side.

[Effects of the Invention] As is clear from the above description, in the prober device of the present invention, the conventional head plate and ring insert mechanism are abolished, and the probe card is fixed to the test head side. The measurement cable between the two can be greatly shortened, the measurement accuracy can be improved, and the yield of chip products can be improved.

[Brief description of drawings]

FIG. 1 is a front view of an embodiment of a prober device according to the present invention, and FIG. 2 is a view showing a test head of the prober device.
3 and 4 are a front view and a fifth view of another embodiment, respectively.
The figure shows the relationship between the probe card and the X and Y axes.
FIG. 7 is an explanatory view of θ adjustment, and FIGS. 7 and 8 are views showing a conventional prober device. 1 …… loader section 2 …… probe section 3 …… test head 4 …… chuck top (mounting table) 5 …… chuck stage 6 …… hinge section 7 …… performance board 8 …… probe card 11 …… wafer (covered) (Measurement body)

Claims (2)

[Claims] 1. A prober device equipped with a test head for measuring an object to be measured placed on a mounting table so as to face the object to be measured, wherein the probe head is formed on the object to be measured. A probe card having a probe needle capable of contacting the formed pad is fixed, and the probe card is provided with an alignment mechanism for aligning the measured object placed on the placing table. Prober device to do. 2. When aligning the probe card with the object to be measured in the angular direction (θ direction), the alignment mechanism has means for adjusting the mounting table on which the object to be measured is θ. The prober device according to claim 1, wherein: