JPH0747895Y2 - Semiconductor laser transmitter - Google Patents
Semiconductor laser transmitterInfo
- Publication number
- JPH0747895Y2 JPH0747895Y2 JP1987105764U JP10576487U JPH0747895Y2 JP H0747895 Y2 JPH0747895 Y2 JP H0747895Y2 JP 1987105764 U JP1987105764 U JP 1987105764U JP 10576487 U JP10576487 U JP 10576487U JP H0747895 Y2 JPH0747895 Y2 JP H0747895Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- cylinder
- solder
- rod lens
- optical axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Lens Barrels (AREA)
Description
【考案の詳細な説明】 「産業上の利用分野」 本考案は、光通信用に用いる半導体レーザトランスミッ
タに関するものである。DETAILED DESCRIPTION OF THE INVENTION "Industrial Application Field" The present invention relates to a semiconductor laser transmitter used for optical communication.
「従来の技術および考案が解決しようとする問題点」 従来のトランスミッタでは、筒体内に半導体レーザとグ
リーンロッドレンズ（一般に商品名でセルフォクレンズ
と言われている）と挿入される光コネクタフエルール内
に取付（固定）された光ファイバとの三者を同一光軸上
に配置しているが、同一光軸上に配置するのが複雑な構
成となり、その上精度が出にくいものであった。"Problems to be solved by the conventional technology and device" In the conventional transmitter, an optical connector ferrule in which a semiconductor laser and a green rod lens (generally called as SELFOC lens) are inserted in a cylinder Although the optical fiber mounted (fixed) inside is arranged on the same optical axis, it is complicated to arrange on the same optical axis, and it is difficult to obtain accuracy. .
また、半導体レーザを半田を用いて固定するものとして
特開昭62-71909号「光半導体結合器」があるが、これは
半田内に半導体レーザを埋設して半導体レーザを固体物
に当接してなくて精度がでにくい欠点がある。Further, as a device for fixing a semiconductor laser with solder, there is Japanese Patent Laid-Open No. 62-71909 "Optical Semiconductor Coupler", which embeds a semiconductor laser in solder and contacts the semiconductor laser with a solid object. There is a drawback that it is difficult to obtain accuracy because it is not used.
「考案が解決しようとする手段」 本考案は、上記の事情に鑑み、グリーンロッドレンズを
半田で筒体に光軸上に固定し、半導体レーザを調整座金
を介して光軸上に調整して半導体レーザを筒体に、筒体
をフエルールを受入れる受入れ体にそれぞれ半田を用い
て固定したものである。"Means to be solved by the invention" In view of the above situation, the present invention is to fix the green rod lens on the optical axis to the cylinder with solder and adjust the semiconductor laser on the optical axis via the adjustment washer. The semiconductor laser is fixed to a cylindrical body, and the cylindrical body is fixed to a receiving body that receives a ferrule by using solder.
「作用」 半田を用いグリーンロッドレンズを筒体に、半導体レー
ザを筒体内に収容し、筒体を受入れ体にそれぞれ固定す
る。[Operation] The green rod lens and the semiconductor laser are housed in the cylindrical body and the cylindrical body, respectively, using solder, and the cylindrical body is fixed to the receiving body.
「実施例」 筒体１先端の位置決め筒２内にグリーンロッドレンズ３
を隙間なく嵌入して光軸方向に設け筒体１側壁に穿設し
た固定用孔４に半田５を充填して固定する。[Example] The green rod lens 3 in the positioning cylinder 2 at the tip of the cylinder 1
Are fitted in without gaps and provided in the optical axis direction, and fixing holes 4 formed in the side wall of the cylindrical body 1 are filled with solder 5 and fixed.
受入れ体11の筒部12を前記位置決め筒２に遊嵌状に外嵌
めし、筒部12と位置決め筒２との空間には筒状半田13を
収容する。The tubular portion 12 of the receiving body 11 is loosely fitted onto the positioning barrel 2 and the tubular solder 13 is housed in the space between the tubular portion 12 and the positioning barrel 2.
筒体１基端の段部21に調整座金22を介して半導体レーザ
23を嵌入し当接させて収容し1/100mm間隔で厚さの異な
る調整座金22を入れ換えて半導体レーザ23から図示のＬ
だけ隔たった位置でレーザビーム径が最小になるよう、
すなわち焦点が合った状態に調整しナット24で螺締し、
前記筒状半田13および筒体１側壁に穿設した固定用孔25
内の半田26により固定する。半田は低温半田を用いる。
筒状半田13は高周波加熱ですればよく、また、半田５・
26については溶融した半田を流し込んでもよい。Semiconductor laser with adjusting washer 22 on the step 21 at the base end of the cylinder 1.
23 are inserted and brought into contact with each other to be accommodated, and adjustment washers 22 having different thicknesses are exchanged at intervals of 1/100 mm to replace the semiconductor laser 23 with L shown in the figure.
To minimize the laser beam diameter at positions separated by
That is, adjust to a focused state and screw with the nut 24,
Fixing holes 25 formed in the side wall of the cylindrical solder 13 and the cylindrical body 1.
Fix with the solder 26 inside. Low temperature solder is used as the solder.
The cylindrical solder 13 may be heated by high frequency, and the solder 5
For 26, molten solder may be poured.
なお、符号27は半導体レーザ23のリード線、31は受入れ
体11のフエルールのガイドで、32はフエルールの停止
面、33は取付ネジ、34は取付フランジである。Reference numeral 27 is a lead wire of the semiconductor laser 23, 31 is a ferrule guide of the receiving body 11, 32 is a stop surface of the ferrule, 33 is a mounting screw, and 34 is a mounting flange.
「考案の効果」 本考案は、上述のように、グリーンロッドレンズと半導
体レーザと受入れ体とを一個の筒体のみを介在させて精
度よく取付けられる。また、固定に半田を用いるので歪
むことなく取付けられ、しかも固体物に当接させて固定
するので取付け精度がよい。[Advantage of the Invention] As described above, the present invention allows the green rod lens, the semiconductor laser, and the receiving body to be accurately mounted with only one cylindrical body interposed. Further, since the solder is used for fixing, it can be mounted without distortion, and since it is fixed by contacting with a solid object, the mounting accuracy is good.
第１図は本考案の具体的一実施例の縦断面図、第２図は
第１図の左側面図である。 １……筒体 ２……位置決め筒 ３……グリーンロッドレンズ ４……固定用孔 ５……半田 11……受入れ体 12……筒部 13……筒状半田 21……段部 22……調整座金 23……半導体レーザ 25……固定用孔 26……半田FIG. 1 is a vertical sectional view of a specific embodiment of the present invention, and FIG. 2 is a left side view of FIG. 1 …… Cylinder 2 …… Positioning cylinder 3 …… Green rod lens 4 …… Fixing hole 5 …… Solder 11 …… Receptor 12 …… Cylinder 13 …… Cylindrical solder 21 …… Step 22 …… Adjustment washer 23 …… Semiconductor laser 25 …… Fixing hole 26 …… Solder
Claims (1)
固定してなり、上記筒体の位置決め筒内にグリーンロッ
ドレンズを光軸方向に嵌入し、筒体基端の段部に光軸上
の所定位置でレーザビーム径が最小となるように位置設
定するための調整座金を介して半導体レーザを嵌入し当
接させ、かつ上記筒体側壁に穿設してある固定用孔内に
半田を充填して上記グリーンロッドレンズおよび半導体
レーザを各々固定してなる半導体レーザトランスミッ
タ。1. A positioning cylinder at the tip of a cylinder is fixed to a cylinder of a receiving body, a green rod lens is fitted in the positioning cylinder of the cylinder in the direction of the optical axis, and the green rod lens is fitted to a step at the base end of the cylinder. In a fixing hole formed by inserting and abutting a semiconductor laser through an adjustment washer for setting a position such that the laser beam diameter is minimized at a predetermined position on the optical axis, and which is formed in the side wall of the cylindrical body. A semiconductor laser transmitter in which the above-mentioned green rod lens and the semiconductor laser are fixed by filling solder into the solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987105764U JPH0747895Y2 (en) | 1987-07-09 | 1987-07-09 | Semiconductor laser transmitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987105764U JPH0747895Y2 (en) | 1987-07-09 | 1987-07-09 | Semiconductor laser transmitter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6411564U JPS6411564U (en) | 1989-01-20 |
| JPH0747895Y2 true JPH0747895Y2 (en) | 1995-11-01 |
Family
ID=31338674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987105764U Expired - Lifetime JPH0747895Y2 (en) | 1987-07-09 | 1987-07-09 | Semiconductor laser transmitter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747895Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6172210A (en) * | 1984-09-17 | 1986-04-14 | Oki Electric Ind Co Ltd | Lens soldering method of optical semiconductor coupler |
-
1987
- 1987-07-09 JP JP1987105764U patent/JPH0747895Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6411564U (en) | 1989-01-20 |
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