JPH0749785Y2 - Monolithic ceramic capacitors - Google Patents
Monolithic ceramic capacitorsInfo
- Publication number
- JPH0749785Y2 JPH0749785Y2 JP1989073754U JP7375489U JPH0749785Y2 JP H0749785 Y2 JPH0749785 Y2 JP H0749785Y2 JP 1989073754 U JP1989073754 U JP 1989073754U JP 7375489 U JP7375489 U JP 7375489U JP H0749785 Y2 JPH0749785 Y2 JP H0749785Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- external electrode
- expansion coefficient
- monolithic ceramic
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Ceramic Capacitors (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は積層セラミックコンデンサに関し、特にセラミ
ック積層体と外部電極間の熱応力を緩和し、温度サイク
ルによりセラミックにクラックが生じにくくしたことを
特徴とする積層セラミックコンデンサに関する。[Detailed Description of the Invention] [Industrial application] The present invention relates to a monolithic ceramic capacitor, and in particular, alleviates thermal stress between the ceramic laminate and external electrodes and makes cracks less likely to occur in the ceramic due to temperature cycling. And a laminated ceramic capacitor.
従来の積層セラミックコンデンサは、誘電体セラミック
シートを介して相対する内部電極を交互に積層埋設して
両端に内部電極が交互に露出するよう切断し燒結させて
一体化した後、露出した内部電極と電気的に接続する外
部電極を端部に付設することにより製造される。A conventional monolithic ceramic capacitor has a structure in which opposing internal electrodes are alternately laminated and embedded via dielectric ceramic sheets, and the internal electrodes are alternately exposed at both ends and then sintered and integrated to form an exposed internal electrode. It is manufactured by attaching an external electrode electrically connected to the end.
そしてこれらのコンデンサにおいては、セラミックの膨
張係数が金属の膨張係数より小さい。このような場合
は、いわゆる圧縮歪み型接合体においては、単一界面接
合体の内部に生ずる熱応力により接合面に近いセラミッ
クの外側部に引張り応力を生じ、割れを発生する場合が
ある。And in these capacitors, the expansion coefficient of ceramic is smaller than that of metal. In such a case, in a so-called compression strain type bonded body, thermal stress generated inside the single interface bonded body may cause tensile stress in the outer portion of the ceramic close to the bonded surface to cause cracking.
これを緩和する方法としては、例えば、粉体および粉末
冶金,1989年2月Vo136,P.1に示されているように、セラ
ミックと金属の間にセラミックより膨張係数が小さい中
間金属層を設けて接合することにより、セラミック外側
部に生じる引張り応力を緩和する方法が知られている。As a method of mitigating this, for example, as shown in Powder and Powder Metallurgy, Vo136, P.1, February 1989, an intermediate metal layer having a smaller expansion coefficient than that of ceramic is provided between the ceramic and the metal. It is known that the tensile stress generated in the outer portion of the ceramic is relaxed by joining the ceramics with each other.
〔考案が解決しようとする課題〕 近年、高周波電源に大容量の積層セラミックコンデンサ
チップが使用され始めており、基板へはんだ付けした直
後や、基板にはんだ付けした後の温度サイクルテスト
で、コンデンサの外部電極近傍のセラミック積層体にク
ラックを生じる事故が報告されている。この原因の一つ
と考えられるのが、セラミック積層体と外部電極および
はんだの膨張係数の違いが大きいことである。[Problems to be solved by the invention] In recent years, high-capacity monolithic ceramic capacitor chips have begun to be used in high-frequency power supplies, and they can be tested by a temperature cycle test immediately after or after soldering to the board. An accident has been reported that causes cracks in the ceramic laminate near the electrodes. One of the causes is considered to be a large difference in expansion coefficient between the ceramic laminate, the external electrode, and the solder.
従来の積層セラミックコンデンサは、セラミック積層体
の主成分がBaTiO3で、膨張係数は6×10-6〜7×10-6/
℃(30〜100℃)であり、これに接続する外部電極の第
1層目はAgで同じく19×10-6/℃であり、外部電極の方
が約3倍膨張係数が大きく前述の如くセラミック積層体
にクラックを生じ易い欠点がある。特に自動車などのよ
うに厳しい温度サイクルがくり返される用途では問題で
ある。In the conventional monolithic ceramic capacitor, the main component of the ceramic laminate is BaTiO 3 , and the expansion coefficient is 6 × 10 −6 to 7 × 10 −6 /
℃ (30 ~ 100 ℃), the first layer of the external electrode connected to this is also Ag 19 × 10 -6 / ℃, the external electrode has a large expansion coefficient of about 3 times as described above. There is a defect that cracks are easily generated in the ceramic laminate. This is a problem especially in applications where severe temperature cycles are repeated, such as in automobiles.
本考案の目的は、温度サイクルによる膨張,収縮のスト
レスを緩和でき、クラックが生じにくい積層セラミック
コンデンサを提供することにある。An object of the present invention is to provide a monolithic ceramic capacitor which can alleviate the stress of expansion and contraction due to temperature cycle and is less likely to cause cracks.
本考案の積層セラミックコンデンサは、セラミック積層
体の膨張係数をAとし、これに接続する第1層目の外部
電極の膨張係数をBとする場合、B/A1.5となるように
したことを特徴とする外部電極を有している。In the monolithic ceramic capacitor of the present invention, when the expansion coefficient of the ceramic multilayer body is A and the expansion coefficient of the external electrode of the first layer connected thereto is B, B / A1.5 is obtained. It has a characteristic external electrode.
次に、本考案について図面を参照して説明する。第1図
は本考案の一実施例の縦断面図である。Next, the present invention will be described with reference to the drawings. FIG. 1 is a vertical sectional view of an embodiment of the present invention.
第1図に示すように、セラミック積層体1に第1層外部
電極2が焼き付けられており、この上に第2層外部電極
3,および第n層外部電極4がめっきされている。第1層
外部電極2の膨張係数は、セラミック積層体1の膨張係
数の1.5倍以下としている。たとえばセラミック積層体
1に膨張係数5.5×10-6/℃(60〜150℃),9.9×10-6/
℃(100〜400℃)のPb系セラミック積層体を用い、第1
層外部電極2に膨張係数8×10-6/℃のPt合金などを用
い、第2層外部電極3にめっきされたNi(13×10-6/
℃)を用い、第n層外部電極4にめっきされたはんだを
用いるなどとする。As shown in FIG. 1, a first layer external electrode 2 is baked on a ceramic laminated body 1, and a second layer external electrode is formed thereon.
3, and the nth layer external electrode 4 is plated. The expansion coefficient of the first-layer external electrode 2 is 1.5 times or less than the expansion coefficient of the ceramic laminate 1. For example expansion coefficient to the ceramic laminate 1 5.5 × 10 -6 /℃(60~150℃),9.9×10 -6 /
First, using a Pb-based ceramic laminate at 100 ° C (100-400 ° C)
Etc. with expansion coefficient of 8 × 10 -6 / ℃ of Pt alloy descendent foreign electrode 2, Ni plated in the second descendent foreign electrode 3 (13 × 10 -6 /
(.Degree. C.), and the solder plated on the n-th layer external electrode 4 is used.
本考案の積層セラミックコンデンサ10μF/25V,外形寸法
3.2×4.5×2mmチップを厚さ1.6mmのガラスエポキシPWB
にはんだで表面実装し、−55〜+125℃の温度範囲で100
0サイクルの温度サイクルテストをした結果、試料数50
個全てクラックなどの不具合はなく、自動車のエンジン
ルームにも使用できることが分った。Multilayer ceramic capacitor of the present invention 10μF / 25V, external dimensions
3.2 × 4.5 × 2mm chip with 1.6mm thick glass epoxy PWB
Surface mounted with solder on 100 ° C in the temperature range of -55 to + 125 ° C.
As a result of 0-cycle temperature cycle test, 50 samples
It was found that all of them had no defects such as cracks and could be used in the engine room of a car.
すなわち、従来の積層セラミックコンデンサでは第1層
目の外部電極の膨張係数Aがセラミック積層体のそれB
に比べて非常に大きかったが、第1層目の外部電極の膨
張係数を出来るだけ小さく、少なくともB/Aを1.5以下に
することにより温度サイクルによるストレスを緩和する
ことができ、クラックを生じにくくすることができるこ
とが判明した。That is, in the conventional monolithic ceramic capacitor, the expansion coefficient A of the external electrode of the first layer is
Although it was much larger than the above, the expansion coefficient of the external electrode of the first layer was made as small as possible, and by making B / A at least 1.5 or less, stress due to temperature cycle can be relieved and cracks are less likely to occur. It turned out to be possible.
以上説明したように本考案は、第1層外部電極の膨張係
数をセラミック積層体の膨張係数の1.5倍以下とするこ
とにより、温度サイクルによる膨張,収縮のストレスを
緩和でき、クラックが生じにくい積層セラミックコンデ
ンサを得ることができる。As described above, according to the present invention, the expansion coefficient of the first-layer external electrode is set to be 1.5 times or less than the expansion coefficient of the ceramic laminated body, so that the stress of expansion and contraction due to the temperature cycle can be relaxed, and the crack is less likely to occur. A ceramic capacitor can be obtained.
第1図は本考案の一実施例の縦断面図である。 1……セラミック積層体、2……第1層外部電極、3…
…第2層外部電極、4……第n層外部電極、5……誘電
体セラミック、6……内部電極。FIG. 1 is a vertical sectional view of an embodiment of the present invention. 1 ... Ceramic laminate, 2 ... 1st layer external electrode, 3 ...
Second layer external electrode, 4th nth layer external electrode, 5 dielectric ceramic, 6 internal electrode.
Claims (1)
る積層セラミックコンデンサにおいて、セラミック積層
体の膨張係数をAとし、これに接続する第1層目の外部
電極の膨張係数をBとする場合、B/A1.5となるように
したことを特徴とする積層セラミックコンデンサ。1. A monolithic ceramic capacitor in which an external electrode is attached to a ceramic laminate, wherein the expansion coefficient of the ceramic laminate is A, and the expansion coefficient of the external electrode of the first layer connected thereto is B. , B / A1.5. A monolithic ceramic capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989073754U JPH0749785Y2 (en) | 1989-06-22 | 1989-06-22 | Monolithic ceramic capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989073754U JPH0749785Y2 (en) | 1989-06-22 | 1989-06-22 | Monolithic ceramic capacitors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0312422U JPH0312422U (en) | 1991-02-07 |
| JPH0749785Y2 true JPH0749785Y2 (en) | 1995-11-13 |
Family
ID=31612840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989073754U Expired - Lifetime JPH0749785Y2 (en) | 1989-06-22 | 1989-06-22 | Monolithic ceramic capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749785Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5740022Y2 (en) * | 1980-02-01 | 1982-09-03 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499962A (en) * | 1978-01-24 | 1979-08-07 | Suwa Seikosha Kk | Capacitor |
| JPS54157296A (en) * | 1978-06-02 | 1979-12-12 | Tdk Corp | Electrode structure and the manufacturing method |
| JPS5885518A (en) * | 1981-11-17 | 1983-05-21 | 日本電気株式会社 | Chip-shaped condenser and method of producing same |
| JPS60195916A (en) * | 1984-03-19 | 1985-10-04 | 松下電器産業株式会社 | Method of foring terminal electrode of laminated ceramic capacitor |
| JPS60246506A (en) * | 1984-05-21 | 1985-12-06 | 株式会社東芝 | Conductive paste |
-
1989
- 1989-06-22 JP JP1989073754U patent/JPH0749785Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312422U (en) | 1991-02-07 |
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