JPH075635Y2 - 半導体パッケージ - Google Patents

半導体パッケージ

Info

Publication number
JPH075635Y2
JPH075635Y2 JP1988011857U JP1185788U JPH075635Y2 JP H075635 Y2 JPH075635 Y2 JP H075635Y2 JP 1988011857 U JP1988011857 U JP 1988011857U JP 1185788 U JP1185788 U JP 1185788U JP H075635 Y2 JPH075635 Y2 JP H075635Y2
Authority
JP
Japan
Prior art keywords
pattern
semiconductor package
exposed
patterns
index
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988011857U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01116439U (2
Inventor
茂昭 小山
剛久 辻村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1988011857U priority Critical patent/JPH075635Y2/ja
Publication of JPH01116439U publication Critical patent/JPH01116439U/ja
Application granted granted Critical
Publication of JPH075635Y2 publication Critical patent/JPH075635Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Landscapes

  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1988011857U 1988-01-29 1988-01-29 半導体パッケージ Expired - Lifetime JPH075635Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988011857U JPH075635Y2 (ja) 1988-01-29 1988-01-29 半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988011857U JPH075635Y2 (ja) 1988-01-29 1988-01-29 半導体パッケージ

Publications (2)

Publication Number Publication Date
JPH01116439U JPH01116439U (2) 1989-08-07
JPH075635Y2 true JPH075635Y2 (ja) 1995-02-08

Family

ID=31220777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988011857U Expired - Lifetime JPH075635Y2 (ja) 1988-01-29 1988-01-29 半導体パッケージ

Country Status (1)

Country Link
JP (1) JPH075635Y2 (2)

Also Published As

Publication number Publication date
JPH01116439U (2) 1989-08-07

Similar Documents

Publication Publication Date Title
US6278178B1 (en) Integrated device package and fabrication methods thereof
US8043895B2 (en) Method of fabricating stacked assembly including plurality of stacked microelectronic elements
US6281577B1 (en) Chips arranged in plurality of planes and electrically connected to one another
CN100508176C (zh) Tab带子及tab带子的制造方法
TW202125728A (zh) 半導體元件封裝結構
JPS63211660A (ja) 集積回路用高端子数パッケージ
KR20040087501A (ko) 센터 패드 반도체 칩의 패키지 및 그 제조방법
IL115637A (en) Three-dimensional integrated circuit stacking
JPS61101067A (ja) メモリモジユ−ル
TWI432732B (zh) 用於電子組件檢驗裝置之配線基板
EP0023400B1 (en) Leadless packages for semiconductor devices
TW201401481A (zh) 斜坡晶粒堆疊
US20130037945A1 (en) Semiconductor device
JP3854819B2 (ja) 半導体装置の製造方法
JPH06302716A (ja) 多層基板および多層基板の積層ずれ検出方法
JP7815070B2 (ja) 回路基板、及び、半導体装置、並びに、半導体装置の製造方法
CN101609803A (zh) 半导体封装工艺的验证测试方法以及其使用的共用型基板
JPH01258447A (ja) 混成集積回路の積層厚膜基板
JP3765352B2 (ja) パッドの外観検査方法
JPH0691124B2 (ja) Ｉｃパッケージ
KR20170048886A (ko) 센서 패키지용 스트립 및 센서 패키지용 스트립의 제조 방법
JPH0514518Y2 (2)
JPS6222448A (ja) Ｉｃの形成されたウエ−ハ
KR20260045054A (ko) 반도체 패키지 및 그 제조 방법
TW200522283A (en) Substrate strip for increasing yield and method for fabricating the same