JPH075645Y2 - フルカラー発光素子 - Google Patents

フルカラー発光素子

Info

Publication number
JPH075645Y2
JPH075645Y2 JP1989087764U JP8776489U JPH075645Y2 JP H075645 Y2 JPH075645 Y2 JP H075645Y2 JP 1989087764 U JP1989087764 U JP 1989087764U JP 8776489 U JP8776489 U JP 8776489U JP H075645 Y2 JPH075645 Y2 JP H075645Y2
Authority
JP
Japan
Prior art keywords
light emitting
color light
full
led chip
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989087764U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0327058U (cs
Inventor
芳紀 桂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989087764U priority Critical patent/JPH075645Y2/ja
Publication of JPH0327058U publication Critical patent/JPH0327058U/ja
Application granted granted Critical
Publication of JPH075645Y2 publication Critical patent/JPH075645Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1989087764U 1989-07-25 1989-07-25 フルカラー発光素子 Expired - Fee Related JPH075645Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989087764U JPH075645Y2 (ja) 1989-07-25 1989-07-25 フルカラー発光素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989087764U JPH075645Y2 (ja) 1989-07-25 1989-07-25 フルカラー発光素子

Publications (2)

Publication Number Publication Date
JPH0327058U JPH0327058U (cs) 1991-03-19
JPH075645Y2 true JPH075645Y2 (ja) 1995-02-08

Family

ID=31637404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989087764U Expired - Fee Related JPH075645Y2 (ja) 1989-07-25 1989-07-25 フルカラー発光素子

Country Status (1)

Country Link
JP (1) JPH075645Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015188B1 (ko) * 2008-07-07 2011-02-17 주식회사 마스테코 휴대용 소화기의 압력공급용 밸브

Also Published As

Publication number Publication date
JPH0327058U (cs) 1991-03-19

Similar Documents

Publication Publication Date Title
US7474681B2 (en) Alternating current light-emitting device
JP4945112B2 (ja) Ｌｅｄ照明装置
TWI556478B (zh) 發光二極體裝置
KR100858319B1 (ko) 교류 발광 소자
TWI307945B (en) A light-emitting semiconductor device packaged with light-emitting diodes and current-driving integrated circuits
CN109314105A (zh) Led显示装置
CN109244102A (zh) 一种led显示单元组及显示面板
CN103824848B (zh) Led显示屏及其制作方法
JP2000349345A (ja) 半導体発光装置
JPH075645Y2 (ja) フルカラー発光素子
CN208460761U (zh) 一种led显示单元组及显示面板
CN206370442U (zh) 显示屏、灯具及其led封装结构
US7102283B2 (en) Full-color light emitting device with four leads
CN218647939U (zh) 一种top型共阴极四合一全彩led封装结构
CN214226910U (zh) 多合一led器件
CN211062719U (zh) 一种叠层芯片键合结构
CN206907379U (zh) Led显示模组及显示屏
CN112992876A (zh) 一种多基色cob器件
CN208923140U (zh) 一种led显示单元组及显示面板
JPH04137772A (ja) ３色発光素子及び表示装置
CN208460334U (zh) 一种led显示单元组及显示面板
CN217816302U (zh) 一种led灯带
JP2004193502A (ja) ３端子半導体発光装置
KR101602861B1 (ko) 발광 소자
CN222692254U (zh) 并联通信的幻彩光电二极管及光电显示屏

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees