JPH075680Y2 - Flattening jig for terminal pins - Google Patents

Description

[Detailed Description of the Invention] [Outline] A jig for planarizing a terminal pin provided in a pin grid array type LSI (hereinafter referred to as an LSI), which can efficiently planarize an LSI. And a container portion having an LSI insertion hole for holding the LSI in an insertable and removable manner, and an insertable and removable member formed in the LSI insertion hole,
And a positioning portion equipped with a protrusion having a positioning surface for abutting the terminal pin and flattening the terminal pin.

[Industrial application field]

The present invention relates to a jig for flattening terminal pins of an LSI to which preliminary soldering has been applied (an operation of eliminating the length difference between terminal pins and aligning the tips of the respective terminal pins on one plane). .

[Conventional technology]

FIGS. 3 (a) and 3 (b) are schematic side views showing the shape of the LSI before mounting, FIG. 3 (a) shows the state before the preliminary soldering, and FIG. 3 (b) shows the preliminary soldering. The state after application is shown.

As shown in FIG. 3 (a), this type of LSI 1 is equipped with a plurality of terminal pins 2, and the terminal pins 2 are positioned on a wiring pad (not shown) of a printed board and mounted. It is mounted on a printed board by heating. Incidentally, in preparation for this mounting, each terminal pin 2 is preliminarily soldered 3 as shown in FIG. 3 (b).

[Problems to be solved by the device]

Preliminary soldering 3 to the terminal pins 2 is an indispensable measure for joining the terminal pins 2 to the wiring pads on the printed board side.
Since the terminal pin 2 is dipped in a molten solder (not shown) in a solder bath, the terminal pin 2 has a difference in length Δ after preliminary soldering (FIG. 3 (b)). reference). When this difference Δ is large, when the LSI 1 is mounted on the printed board, the terminal pin 2 which is not connected to the pad of the printed board is formed.

The present invention is a device made to prevent the occurrence of the above disorders.

[Means for Solving the Problems]

As shown in FIG. 1, a flattening jig for a terminal pin according to the present invention (hereinafter referred to as a flattening jig) has a container portion 5 having an LSI insertion hole 6 for holding the LSI 1 so that the LSI 1 can be inserted and removed, and an LSI. It is formed so that it can be inserted into the insertion hole 6 and has the LSI 1
And a positioning portion 10 equipped with a protruding portion 9 having a positioning surface 8 that comes into contact with the terminal pin 2 to be planarized.

[Action]

In this flat surface setting jig, the protrusion 9 on the positioning portion 10 side is formed so as to be able to be inserted into the LSI insertion hole 6 on the container portion 5, so that the protrusion 9 is inserted into the LSI insertion hole 6. By doing so, the flattening jig is constructed. Then, the LSI 1 is inserted into the LSI insertion hole 6 of the flattening jig and heated to melt the preliminary solder 3 on the terminal pin 2,
The terminal pin 2 comes into contact with the positioning surface 8 on the jig side to flatten the terminal pin 2.

〔Example〕

 The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a diagram showing an embodiment of a flattening jig according to the present invention, wherein (a) and (b) are a side sectional view and a plan view showing the structure of a container portion constituting the jig, (c) ) And (d) are a side sectional view and a plan view showing the structure of the positioning portion. In these figures, the same parts as those in FIG. 3 are designated by the same reference numerals.

As shown in FIGS. 1 (a) and 1 (b), the flattening jig according to the present invention includes a container portion 5 having a plurality of LSI insertion holes 6 for holding the LSI 1 so that the LSI 1 can be inserted, and FIG. As shown in (c) and (d), it has a plurality of protrusions 9 which are formed so as to be capable of being inserted into the LSI insertion holes 6 and each of which has a positioning surface 8 at the tip thereof. And the positioning portion 10 that is formed. The container portion 5 and the positioning portion 10 are made of a metal material such as aluminum or stainless steel, which does not easily attach solder.

In this flat surface setting jig, the protrusion 9 on the positioning portion 10 side is inserted into the LSI insertion hole 6 on the container portion 5 side to make the container portion 5
The lower surface 5a and the upper surface 10a of the positioning portion 10 are brought into contact with each other to function as a jig.

The operation of this flattening jig will be described below with reference to FIGS. 2 (a), (b) and (c).

． First, the flux 20 is applied to the positioning surface 8 provided on the protrusion 9 on the positioning portion 10 side.

． When the application of the flux 20 is finished, the protrusion 9 on the positioning portion 10 side is inserted into the LSI insertion hole 6 on the container portion 5 side as shown in FIG. At this time, the positioning unit 1
The upper surface 10a of 0 and the lower surface 5a of the container portion 5 need to be in contact with each other.

． Next, as shown in FIG.
Store in 50 and heat. By this heating, the preliminary solder 3 on the terminal pin 2 of the LSI 1 is melted, and the terminal pin 2 comes into contact with the positioning surface 8 due to the weight of the LSI 1 to flatten the terminal pin 2.

． In this state, the flattening jig is taken out of the vapor tank 50 and cooled.

． After cooling, the LSI1 removed from the flattening jig is the second
As shown in FIG. 3C, the preliminary solder 3 attached to the terminal pin 2 is melted, and the tip end of the terminal pin 2 is flattened out by the positioning surface 8 to have a shape.

In addition, this flat jig is used as a delivery container for LSI1 (not shown).
If it is manufactured correspondingly, it is convenient because a plurality of LSIs 1 accommodated in the delivery container can be transferred to the flattening jig by a single operation.

[Effect of device]

As is apparent from the above description, the flattening jig according to the present invention can easily and surely flatten the terminal pins of the LSI, so that the flattening work of the LSI is remarkably efficient.

[Brief description of drawings]

1 (a), (b), (c) and (d) are side sectional views and a plan view showing an embodiment of the present invention, and FIGS. 2 (a), (b) and (c) are books. FIG. 3 (a) and FIG. 3 (b) are side views showing the shape of the LSI before mounting, which is an explanatory view of the operation of the device. In the figure, 1 is an LSI (pin grid array type LSI), 2
Is terminal pin, 3 is extra solder, 5 is container, 6 is LS
I is a through hole, 8 is a positioning surface, 9 is a protruding portion, 10 is a positioning portion, 20 is a flux, 50 is a vapor tank, and Δ is a difference in length between terminal pins.

Claims (1)

[Scope of utility model registration request] 1. A jig for flattening out terminal pins (2) mounted on a pin grid array type LSI (1), which is an LSI insert through which the pin grid array type LSI (1) is detachably held. Container part (5) with holes (6)
And a projecting portion which is formed so as to be capable of being inserted into the LSI insertion hole (6) and has a positioning surface (8) at its tip end that abuts against the terminal pin (2) and flattens it out. A flattening jig for terminal pins, which comprises a positioning part (10) equipped with (9).