JPH0760959B2 - Assembly equipment for electronic components - Google Patents

Description

TECHNICAL FIELD The present invention relates to an electronic component assembling apparatus for applying an adhesive on a printed circuit board or mounting an electronic component.

(B) Conventional technology Applying an adhesive on a printed circuit board by working means,
In order to speed up the work when mounting electronic parts, a method has been devised in which two work means are synchronized and work is performed on two substrates at a time, as shown in FIG.

However, in the method of simultaneously performing work on a plurality of printed circuit boards, a dimensional error for each board, that is, a so-called outer shape reference for sandwiching and supporting both end surfaces of the board when positioning the board, There is a so-called hole diameter reference in which positioning pins are inserted and supported in insertion holes formed in a plurality of positions on the substrate transfer reference surface side, but in the case of external reference, it depends on the shape of the end surface of the substrate and the substrate support. Due to the assembling and assembling accuracy of the parts and the accuracy of the insertion holes of the boards and the positioning pins even when the hole diameter is used as a reference, the plurality of boards are displaced relative to each other.

Therefore, ignoring them, if you apply adhesive to multiple substrates at the same time, or if you mount electronic components, for example, the adhesive applied to each substrate and the mounted electronic components will be removed from the desired position. There were times when they were out of alignment.

(C) Problems to be Solved by the Invention Therefore, according to the present invention, a plurality of printed circuit boards are placed on a workbench and desired work is performed by each work means provided corresponding to each board. In this regard, it is an object of the present invention to make it possible to accurately perform the work on each board even if there is a dimensional error for each board or an assembly or assembly error of the device itself for positioning the board.

(D) Means for Solving the Problem Therefore, the present invention provides an electronic component assembling apparatus for performing a predetermined work by a work unit corresponding to each of a plurality of printed circuit boards placed on a workbench. Recognizing means for recognizing the respective substrate positioning marks of the plurality of substrates on the workbench, means for determining the work timing of the work unit for slightly shifting the work timing of each of the work units for each of the plurality of substrates, and The relative positional relationship between the board and the working unit is corrected based on the recognition result by each of the recognizing means before the predetermined work is performed on the board corresponding to the working unit to be first worked by the timing means. At the same time, the relative positional relationship between the next board to be worked at the next timing after the work on the board and the working unit corresponding to the next board is described as follows. A correction means for correcting the substrate before performing the work is provided.

(E) Operation With the above configuration, the recognizing means recognizes the positioning marks of the plurality of substrates on the workbench. Next, based on the recognition result by the recognition means by the correction means before the predetermined work is performed on the board corresponding to the unit in the work unit that first performs the work by the means for setting the work timing of the work unit, the board The relative positional relationship between the work unit and the work unit is corrected. Then, after the predetermined work is performed on the substrate, the relative positional relationship between the next substrate to be worked at the next timing and the working unit corresponding to the next substrate is determined by the correction means to be It is corrected before working on the substrate.

(F) Embodiment One embodiment of the present invention will be described in detail below with reference to FIGS. 1 to 7.

(1) is a workbench on which two printed circuit boards (2A) and (2B) are placed, and an X-axis motor (4) rotated by an X-axis motor drive circuit (3) and a Y-axis motor drive circuit The XY table is moved horizontally by a Y-axis motor (6) which is rotated by (5).

(7) applies the adhesive (8) to each of the two printed circuit boards (2A) and (2B) placed on the XY table (1) 2
A dispenser unit having a book application head (9) (10).

Hereinafter, the dispenser unit (7) will be described in detail with reference to FIG. (For the sake of convenience, only one coating head (9) is shown in this figure.) The coating head (9) is provided with a tank (11) filled with an adhesive (8) at the upper part thereof, and an air hose. (12)
Air is sent through the.

Reference numeral (13) is a vertical movement lever pivotally supported by a support member (15) via a support shaft (14), and has a roller (16) at one end.
Is fitted between a pair of locking portions (17) and (17) provided on the coating head (9), and the roller (18) at the other end is pressed against the drive cam (20A) by a spring (19). Is urged to.

The drive cam (20A) is rotated by a motor (23) which is rotated by a drive cam drive circuit (22).

Therefore, when the drive cam (20A) is rotated by the motor (23), the vertical movement lever (13) is rotated, so that the coating head (9) moves up and down.

The drive cam (20A) for the coating head (9) and the drive cam (20B) for the coating head (10) have a phase difference and are attached to the coaxial (21) so as to be displaced by a time θ ₁ .

The application head (9) is fitted in the gear (24) and meshed with the gear (27) rotated by the pulse motor (26) rotated by the gear drive circuit (25). The pulse motor (26) and gear (27) are fixed and do not move up and down. Gear (24)
And plays the role of a spline between the gears (27).

(28) and (29) are mounted on the XY table (1) and are provided with a board positioning recognition mark (not shown) provided on each of the printed boards (2A) and (2B) illuminated by the illumination unit. It is a recognition camera that captures images.

(30) and (31) are recognition units that compare a pre-programmed board position with the board position obtained from the recognition marks imaged by the recognition cameras (28) and (29) to calculate and store the deviation. is there.

(32) is a CRT that displays the image captured by the recognition camera
Is.

(33) and (34) are supply and discharge conveyors that convey the printed circuit boards.

(35) is a printed circuit board transfer unit, which sends the board (2A) on the supply conveyor (33) to the XY table (1) and discharges the board (2B) (2C) on the XY table (1). Move in the direction of the conveyor (34).

Reference numeral (36) is a RAM that stores a reference value that is a position to be applied on the printed circuit board.

(37) contains programs related to dispensing operation
ROM.

(38) is a CPU, and (39) (40) is an interface.

The operation will be described in detail below.

By the transfer unit (35), the two printed circuit boards (2B) and (2C) are sequentially placed on the XY table (1) from the supply conveyor (33) as shown in FIG.

Here, the printed circuit board (2B) with the recognition camera (28) (29)
The recognition mark of (2C) is imaged, and the CPU (38)
B) The actual position of (2C) (the hatched portion in FIG. 9) and the preset design position (shown by the alternate long and short dash line in FIG. 9) are recognized through the recognition units (30) (31). Comparing them, calculating the positional deviation and writing it in the RAM (36) (For example, the positional deviation between each board (2B) (2C) and the designed position is (x1, y1) (x2,
y2).

Then, first, the RAM (3) is set so that the first adhesive application position on the printed circuit board (2B) is located below the application head (9).
The XY table (1) is moved in consideration of the positional deviation (x1, y1) of the substrate (2B) stored in 6) (see FIG. 10). If necessary, apply the application head (9) to the gears (24) (27).
Rotate to correct the angle of the coating position. At this time, it is assumed that both heads (9) and (10) have been rotated in advance at an angle corresponding to the coating position.

Next, rotation of the motor (23) causes both drive cams (20A) (2
0B) rotates, and since both cams (20A) and (20B) have a phase difference as described above, the application head (9) first starts descending as shown in FIG. 7, and the time θ ₁ minute The application head (10) begins to descend after a delay.

Then, the application head (9) reaches the first adhesive application position on the substrate (2B) and applies the adhesive (8).

Then, shortly after the application head (9) started to rise, the CP
The U (38) controls the X-axis motor (4) and the Y-axis motor (6) to cause a positional deviation (x2) of the board (2C) with respect to the board (2B).
-X1, y2-y1) move XY table (1) (first
(See Figure 1). If necessary, the angle of the coating position can be corrected by the amount of positional deviation as described above. These corrections are performed within the time θ ₂ shown in FIG.

Then, similarly, the adhesive (8) is applied to the first adhesive application position on the substrate (2C) by the application head (10).

The above operation is performed on all the coating positions of the respective substrates (2B) and (2C).

Other embodiments of the present invention are disclosed in FIG. 5 and FIG. (For the sake of convenience, the same components are designated by the same reference numerals.) FIG. 5 shows an example of a mount unit for mounting electronic components on a printed circuit board instead of the dispenser unit of the embodiment.

Reference numerals (41) and (41) denote electronic component supply means in which the electronic components (42) are stored.

The reference numeral (43) has two suction chucks (44) (45) which move the electronic components (42) ... From the electronic component supply means (41) (41) in parallel and in the vertical direction and take them out one by one. It is a mount unit.

Further, in FIG. 6, one of the two working units is a dispenser unit (7) and the other is a mount unit (43).
Is an example.

Although the XY table (1) is moved to correct the relative position between the substrate and the working unit in the present embodiment, the working unit may be moved instead.

Of course, during the coating operation and the mounting operation, the work unit and the work table move relative to each other.

(G) Effect of the Invention According to the present invention, the work timing of each work unit that works on a plurality of printed circuit boards on a workbench is gradually shifted for each board, and each board is moved within the deviation time. Since the relative position between the substrate and the working unit corresponding to the board is corrected, it is possible to cope with the positional deviation of each board positioned on the workbench, and the work can be performed accurately. It can also handle assembly and assembly errors.

[Brief description of drawings]

FIG. 1 is a diagram showing an outline of an electronic component assembling apparatus according to an embodiment of the present invention, and FIG. 2 is two printed circuit boards on an XY table.
The figure which shows the positional relationship of a coating head and a recognition unit, 3rd
FIG. 4 is a detailed explanatory view of a dispenser unit, FIG. 4 is a schematic circuit diagram of this device, FIG. 5 is a diagram in which the present invention is applied to a mounting device for electronic parts, and FIG. 6 is a device in which a dispenser and a mounter are also combined. FIG. 7 is a diagram showing the movement timing of the XY table between the vertical movements of the two coating heads, and FIG. 8 is a diagram showing the movement timing of the XY table during the vertical movements of the conventional coating heads. 9, FIG. 10, and FIG. 11 are diagrams showing the positional relationship between the designed board position and the actual board position at each timing. (1) …… XY table, (2) …… printed circuit board,
(7) …… Dispenser unit, (9) (10) ……
Dispensing head, (13) ... Vertical movement lever, (20A) (20B)
...... Drive cam, (28) (29) …… Recognition camera, (30)
(31) …… Recognition unit.

Claims (1)

[Claims] 1. An electronic component assembling apparatus for performing a predetermined work by a work unit corresponding to each of a plurality of printed circuit boards placed on a workbench, wherein each of the plurality of boards on the workbench is Recognizing means for recognizing the board positioning mark, means for setting the work timing of the work unit for slightly shifting the work timing of each work unit for each of the plurality of boards, and first performing work by the means for setting the timing. Before the predetermined work is performed on the board corresponding to the work unit, the relative positional relationship between the board and the work unit is corrected based on the recognition result by each recognizing unit, and the work is performed on the board. A correction hand for correcting the relative positional relationship between the next board to be worked at the timing of and the working unit corresponding to the next board before carrying out the work on the next board. Assembling apparatus of electronic components, characterized in that a and.