JPH0760962A - Ink jet head and manufacture thereof - Google Patents
Ink jet head and manufacture thereofInfo
- Publication number
- JPH0760962A JPH0760962A JP21432493A JP21432493A JPH0760962A JP H0760962 A JPH0760962 A JP H0760962A JP 21432493 A JP21432493 A JP 21432493A JP 21432493 A JP21432493 A JP 21432493A JP H0760962 A JPH0760962 A JP H0760962A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric plate
- substrate
- piezoelectric
- plate
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 238000010008 shearing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 7
- 239000011651 chromium Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/10—Finger type piezoelectric elements
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、せん断駆動型のインク
ジェットヘッド及びその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shear drive type ink jet head and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】インクジェットヘッドのタイプとして種
々のものが知られているが、その１つとしてせん断駆動
型のインクジェットヘッドがある（例えば特開平２−１
５０３５５号）。せん断駆動型のインクジェットヘッド
は、圧電性材からなる基板の上面に複数の平行なインク
流路用の溝部を刻設し、これらの各溝部の両内側面に溝
部の半分の深さまで電極層を形成し、その上面に上蓋を
積層し、両板の対向面にインク流路を構成している。積
層した両板のインク流路の先端部を有する一辺には、イ
ンク流路と対向可能な位置にノズルを有するノズルプレ
ートを当接してある。2. Description of the Related Art Various types of ink jet heads are known, and one of them is a shear drive type ink jet head (for example, Japanese Patent Laid-Open No. 2-1.
50355). A shear drive type ink jet head has a plurality of parallel grooves for ink flow channels formed on the upper surface of a substrate made of a piezoelectric material, and an electrode layer is formed on both inner side surfaces of each of the grooves to a depth half that of the groove. It is formed, an upper lid is laminated on the upper surface thereof, and an ink flow path is formed on the opposing surfaces of both plates. A nozzle plate having a nozzle at a position that can face the ink flow path is in contact with one side of the laminated plates, which has the tip of the ink flow path.
【０００３】このような構成のインクジェットヘッドの
溝部の両内側に形成された電極層に電圧を印加すると、
溝部を作っている両側の壁部が、上部の部分にだけ圧電
効果による変形を生じ、溝の底部には圧電効果を及ぼさ
ないため、溝部の深さの中央部の変形量を最大として溝
部側に変形し、このような変形によって溝部の体積を小
さくし、インク流路内のインクにエネルギーを付与し、
インクをノズルから噴出させるようにしてある。When a voltage is applied to the electrode layers formed on both inner sides of the groove portion of the ink jet head having such a structure,
The walls on both sides that form the groove are deformed by the piezoelectric effect only in the upper part and do not exert the piezoelectric effect in the bottom of the groove.Therefore, the deformation amount at the center of the depth of the groove is maximized. The volume of the groove is reduced by such deformation, energy is applied to the ink in the ink flow path,
Ink is ejected from the nozzle.
【０００４】また、溝部の両内側面に形成された電極層
への導電は、１つの流路が１電極となるように配線し、
その配線を上面に設けられたインク供給用のマニホール
ドの後部に引き込み、その先端部で駆動用ドライバのＩ
Ｃと接続するワイヤボンディングが行なわれる。Further, the electric conduction to the electrode layers formed on both inner side surfaces of the groove is such that one flow path serves as one electrode,
The wiring is drawn into the rear portion of the ink supply manifold provided on the upper surface, and the leading end portion of the wiring I
Wire bonding to connect with C is performed.
【０００５】[0005]
【発明が解決しようとする課題】上記したように、せん
断駆動型のインクジェットヘッドの構成は、圧電性の基
板に溝部を刻設するものであり、圧電性板の厚さも厚く
かつ面積も大きくなるので、高価な圧電性板の使用量が
多くなり、製造コストを高くする原因になっている。As described above, the shear drive type ink jet head has a structure in which a groove is formed in a piezoelectric substrate, and the piezoelectric plate has a large thickness and a large area. Therefore, the amount of expensive piezoelectric plate used is increased, which is a cause of increasing the manufacturing cost.
【０００６】また、溝部の深さの半分の位置までしか圧
電効果による変形を生じさせないようにするためには、
電極層の形成領域を溝部の深さの半分の位置まで区画さ
れるように形成することが必要である。しかし、スパッ
タリングなどの成膜法によって極めて小さい間隔の溝部
の内側面にこのような電極層を形成することは、困難か
つ面倒であるため、製造コストを高くする原因にもなっ
ている。Further, in order to prevent the deformation due to the piezoelectric effect only up to a position half the depth of the groove,
It is necessary to form the electrode layer formation region so as to be divided up to a position half the depth of the groove. However, it is difficult and troublesome to form such an electrode layer on the inner surface of the groove portion having an extremely small interval by a film forming method such as sputtering, which is also a cause of increasing the manufacturing cost.
【０００７】また、電極層への導電手段として、マニホ
ールドの後部へ引き込まれた配線にワイヤボンディング
が行われるが、ヘッドの高密度化によりボンディングピ
ッチも狭くなっているので、高度なボンディング技術が
要求され、それだけ製造コストを高くしている。Further, as a conductive means to the electrode layer, wire bonding is performed on the wiring drawn to the rear part of the manifold, but the bonding pitch is narrowed due to the high density of the head, so a high level bonding technique is required. The manufacturing cost is high.
【０００８】そこで本発明の目的は、高価な圧電性板の
節減を図るとともに、このようなインクジェットヘッド
の製造を容易にすることにより製造コストの引き下げを
図ることにある。Therefore, an object of the present invention is to reduce the cost of the piezoelectric plate and to reduce the manufacturing cost by facilitating the manufacture of such an ink jet head.
【０００９】[0009]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明のインクジェットヘッドは、非圧電性の基
板と、この基板の上面に積層してある圧電性板と、この
圧電性板の上面から基板にかけて板厚方向に、この圧電
性板の厚さの実質的に２倍の深さに、かつそれぞれ平行
に設けてある複数の溝部と、これらの各溝部の両内側面
にそれぞれ形成された電極層と、圧電性板の上面に積層
された上蓋とを備えている。In order to achieve the above object, an ink jet head of the present invention comprises a non-piezoelectric substrate, a piezoelectric plate laminated on the upper surface of the substrate, and the piezoelectric plate. In the plate thickness direction from the upper surface of the substrate to the substrate, at a depth substantially twice the thickness of the piezoelectric plate, and in parallel with each other, and a plurality of groove portions respectively provided on both inner side surfaces of each groove portion. It is provided with the formed electrode layer and an upper lid laminated on the upper surface of the piezoelectric plate.
【００１０】また、基板と圧電性板との対接面に、各電
極層とそれぞれ対応する導電パターンが設けられてお
り、圧電性板は基板よりも小面積であって、基板は圧電
性板積層部と非積層部とに分かれており、非積層部上に
各導電パターンの端子部がそれぞれ設けられている。Further, conductive patterns corresponding to the respective electrode layers are provided on the contact surface between the substrate and the piezoelectric plate, the piezoelectric plate has a smaller area than the substrate, and the substrate is the piezoelectric plate. It is divided into a laminated portion and a non-laminated portion, and the terminal portion of each conductive pattern is provided on the non-laminated portion.
【００１１】そしてこのインクジェットヘッドの製造方
法は、非圧電性の基板の上面に圧電性板を積層する工程
と、圧電性板から基板にかけて板厚方向に、圧電性板の
厚さの実質的に２倍の深さでそれぞれ平行な複数の溝部
を刻設する工程と、刻設された各溝部の両内側面に電極
層を設ける工程と、これらの溝部を塞ぐように圧電性板
の上に上蓋を積層する工程とを含んでいる。In the method of manufacturing the ink jet head, the step of laminating the piezoelectric plate on the upper surface of the non-piezoelectric substrate, and the thickness of the piezoelectric plate substantially in the plate thickness direction from the piezoelectric plate to the substrate. A step of engraving a plurality of parallel grooves at a depth of two times, a step of providing an electrode layer on both inner side surfaces of each engraved groove, and a step of covering the grooves on the piezoelectric plate. Stacking the upper lid.
【００１２】また他の手段におけるインクジェットヘッ
ドの製造方法は、非圧電性の基板の上面に所望の導電パ
ターンを形成する工程と、この基板の導電パターン形成
面に圧電性板を積層する工程と、積層された圧電性板か
ら基板にかけて板厚方向に、圧電性板の厚さの実質的に
２倍の深さでそれぞれ平行な複数の溝部を刻設し、この
時導電パターンの少なくとも一部を上記溝部内側面に露
出させる工程と、各溝部の内側面に、導電パターンの露
出部と接触する電極層を設ける工程と、両内側面に電極
層を有する溝部を塞ぐように圧電性板上に上蓋を積層す
る工程とを含んでいる。According to another method of manufacturing an ink jet head, a step of forming a desired conductive pattern on the upper surface of a non-piezoelectric substrate, a step of laminating a piezoelectric plate on the conductive pattern forming surface of the substrate, A plurality of parallel grooves are formed in the plate thickness direction from the laminated piezoelectric plates to the substrate in a thickness substantially twice the thickness of the piezoelectric plates, and at this time, at least a part of the conductive pattern is formed. The step of exposing to the groove inner surface, the step of providing an electrode layer in contact with the exposed portion of the conductive pattern on the inner surface of each groove, and the piezoelectric plate on the piezoelectric plate so as to close the groove having the electrode layer on both inner surfaces. Stacking the upper lid.
【００１３】[0013]
【作用】非圧電性の基板上に圧電性板を積層し、溝部の
深さを圧電性板の厚さの２倍とし、溝部の内側面におけ
る圧電性板の部分だけ圧電変形可能にしてあるので、溝
部の深さの中央部が最大の変形位置となるインクジェッ
トヘッドを低コストで容易に製造可能になる。A piezoelectric plate is laminated on a non-piezoelectric substrate, the depth of the groove is made twice the thickness of the piezoelectric plate, and only the portion of the piezoelectric plate on the inner surface of the groove can be piezoelectrically deformed. Therefore, it is possible to easily manufacture an inkjet head at a low cost, in which the central portion of the depth of the groove is the maximum deformation position.
【００１４】基板上に積層する圧電性板の大きさは、基
板の大きさよりも小面積であり、かつ厚さが溝部の深さ
の半分であるので、高価な圧電性板の使用量が少なくて
すむ。基板の上面に、溝部の内側面に形成してある電極
層と対応する導電パターンを設け、この導電パターンの
端子部を圧電性板が積層されていない部分に設けると、
ワイヤボンディングが容易になる。The size of the piezoelectric plate to be laminated on the substrate is smaller than the size of the substrate, and the thickness is half the depth of the groove. Therefore, the amount of expensive piezoelectric plate used is small. End When a conductive pattern corresponding to the electrode layer formed on the inner surface of the groove is provided on the upper surface of the substrate, and a terminal portion of this conductive pattern is provided in a portion where the piezoelectric plate is not laminated,
Wire bonding becomes easy.
【００１５】このような本発明のインクジェットヘッド
の製造に際しては、非圧電性の基板上に圧電性板を積層
してから溝部を刻設するので、圧電効果による変形に必
要な部分だけを高価な圧電性板とすることが可能にな
る。電極層を形成する位置が圧電性板の部分から非圧電
性の基板にまたがっても、圧電効果による変形は圧電性
板の部分にしか生じないようにできるので、インクジェ
ットヘッドの製造が容易である。In manufacturing such an ink jet head of the present invention, since the piezoelectric plate is laminated on the non-piezoelectric substrate and then the groove is formed, only the portion necessary for the deformation due to the piezoelectric effect is expensive. It becomes possible to use a piezoelectric plate. Even if the position where the electrode layer is formed extends from the portion of the piezoelectric plate to the non-piezoelectric substrate, the deformation due to the piezoelectric effect can be made to occur only in the portion of the piezoelectric plate, so that the inkjet head can be easily manufactured. .
【００１６】基板上面に導電パターンを形成してから、
この導電パターンの形成面に圧電性板を積層し、圧電性
板の上面から板厚方向に、実質的に圧電性板の２倍の深
さに流路用の溝部を刻設すれば、導電パターンの切断部
が溝部の内側面に露出し、内側面に形成する電極層との
接続が容易となり、基板の露出部に設けられた導電パタ
ーンの端子部との導通が容易になる。After forming a conductive pattern on the upper surface of the substrate,
If a piezoelectric plate is laminated on the surface on which the conductive pattern is formed, and a groove for the flow path is formed in the plate thickness direction from the upper surface of the piezoelectric plate to a depth that is substantially twice the depth of the piezoelectric plate, the conductivity can be improved. The cut portion of the pattern is exposed on the inner side surface of the groove portion, which facilitates connection with the electrode layer formed on the inner side surface and facilitates conduction with the terminal portion of the conductive pattern provided on the exposed portion of the substrate.
【００１７】[0017]
【実施例】次に本発明の実施例について図面を参照して
説明する。図１に本発明に係るインクジェットヘッドの
完成体を示している。基板１の上面にこれより小面積の
圧電性板２が接着剤３を介して積層してある。圧電性板
２は、基板１の前部に積層してあり、この圧電性板積層
部１ａ以外の部分（後部）は非積層部１ｂであって外部
に露出しており、後述の導電パターンの端子部（図示
略）は、基板の非積層部１ｂの上面に露出している。Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 shows a completed inkjet head according to the present invention. A piezoelectric plate 2 having a smaller area than this is laminated on the upper surface of the substrate 1 via an adhesive 3. The piezoelectric plate 2 is laminated on the front portion of the substrate 1, and the portion (rear portion) other than the piezoelectric plate laminated portion 1a is the non-laminated portion 1b and is exposed to the outside, and a conductive pattern described later is formed. The terminal portion (not shown) is exposed on the upper surface of the non-laminated portion 1b of the substrate.
【００１８】圧電性板２の上面には、板厚方向に向けて
複数の流路用の溝部４がそれぞれ平行になるように刻設
してある。各溝部４の深さは、実質的に圧電性板２の厚
さの２倍の深さであり、溝部の内端部は、圧電性板積層
部１ａとの境界近傍に位置している。On the upper surface of the piezoelectric plate 2, a plurality of flow channel grooves 4 are formed in parallel in the plate thickness direction. The depth of each groove portion 4 is substantially twice the thickness of the piezoelectric plate 2, and the inner end portion of the groove portion is located near the boundary with the piezoelectric plate laminated portion 1a.
【００１９】各溝部４の両内側面の圧電性板の部分に
は、クロムからなる電極層５が形成してあり、この電極
層は基板の上面に設けてある端子部（図示略）と電気的
に導通可能である。Electrode layers 5 made of chromium are formed on the piezoelectric plate portions on both inner side surfaces of each groove portion 4, and these electrode layers are electrically connected to terminal portions (not shown) provided on the upper surface of the substrate. Can be electrically conducted.
【００２０】各溝部４の一端部が位置する圧電性板２の
上面には、矩形状のインク供給用のマニホールド６が設
けてある。マニホールド６には図示しないインク供給パ
イプが接続してあり、このパイプからマニホールド６内
のインク溜り（図示略）を介して連通している。A rectangular ink supply manifold 6 is provided on the upper surface of the piezoelectric plate 2 where one end of each groove 4 is located. An ink supply pipe (not shown) is connected to the manifold 6, and communicates from this pipe via an ink reservoir (not shown) in the manifold 6.
【００２１】圧電性板２の上面には、各溝部４の上部を
塞ぐように上蓋７が接着剤８を介して積層してある。上
蓋７の内端辺はマニホールド６の前面と一致しており、
各溝部４の上部を塞ぐことによりインク流路を構成して
いる。An upper lid 7 is laminated on the upper surface of the piezoelectric plate 2 with an adhesive 8 so as to close the upper portions of the respective groove portions 4. The inner end side of the upper lid 7 coincides with the front surface of the manifold 6,
An ink flow path is formed by closing the upper portion of each groove 4.
【００２２】基板１と圧電性板２と上蓋７とによって構
成されるインク流路の先端開口部を有する辺には、ノズ
ルプレート１０が当接接合してある。ノズルプレート１
０には、各インク流路の開口部と対向する位置にノズル
１０ａが設けてあり、インク流路内に供給されたインク
を噴射可能である。A nozzle plate 10 is abuttingly joined to the side of the ink flow path formed by the substrate 1, the piezoelectric plate 2 and the upper lid 7 which has the front end opening. Nozzle plate 1
In No. 0, a nozzle 10a is provided at a position facing the opening of each ink flow path, and the ink supplied into the ink flow path can be ejected.
【００２３】次に動作について説明する。図２は、各電
極層５に無通電時における各溝部４の状態を示してい
る。例えば、左側から３番目のインク流路からインクを
噴射させようとする場合には、溝部４ａの両側面の電極
層５ａ及び電極層５ｃにプラスの電圧を印加するととも
に、隣の溝部４ｂの右側の電極層５ｂ及び隣の溝部４ｃ
の左側の電極層５ｄにマイナスの電圧を印加する。する
と図３に示すように、圧電効果により左側の突起部は右
側に変形し、右側の突起部は左側に変形するため、イン
ク流路の断面は小さくなる。このため、溝部４ａに供給
されているインクは加圧されて、ノズル１０ａ（図１参
照）から前方へ噴射して印字動作を行う。Next, the operation will be described. FIG. 2 shows a state of each groove portion 4 when the electrode layers 5 are not energized. For example, when ink is to be ejected from the third ink channel from the left side, a positive voltage is applied to the electrode layers 5a and 5c on both side surfaces of the groove portion 4a and the right side of the adjacent groove portion 4b. Electrode layer 5b and adjacent groove portion 4c
A negative voltage is applied to the electrode layer 5d on the left side of. Then, as shown in FIG. 3, the protrusion on the left side is deformed to the right side and the protrusion on the right side is deformed to the left side by the piezoelectric effect, so that the cross section of the ink flow path is reduced. Therefore, the ink supplied to the groove portion 4a is pressurized and ejected forward from the nozzle 10a (see FIG. 1) to perform the printing operation.
【００２４】次に本実施例におけるインクジェットヘッ
ドの製造方法について説明する。初めに所定の形状に形
成されたガラス板からなる非圧電性の基板１の上面の前
半部にエポキシ樹脂製の接着剤３を介して圧電性板（Ｐ
ＺＴ）２を接合する（図４参照）。基板１の厚さは、強
度保持上１ｍｍ以上とし、圧電性板２の厚さは５０〜５
００μｍ（特に１５０〜２００μｍ）の範囲のものを選
定する。Next, a method of manufacturing the ink jet head in this embodiment will be described. First, a piezoelectric plate (P) is formed on the front half of the upper surface of a non-piezoelectric substrate 1 made of a glass plate formed into a predetermined shape, with an adhesive 3 made of epoxy resin interposed therebetween.
ZT) 2 is joined (see FIG. 4). The thickness of the substrate 1 is 1 mm or more in order to maintain the strength, and the thickness of the piezoelectric plate 2 is 50 to 5
The range of 00 μm (particularly 150 to 200 μm) is selected.
【００２５】次にスライシングマシンを用いて、圧電性
板２上面から板厚方向にかけて平行で等間隔な溝部４を
刻設する。溝部４の深さは、実質的に圧電性板２の厚さ
の２倍になるように、すなわち、基板１にも圧電性板２
の厚さと同じ深さに切り込んだ深さとする。溝部４のピ
ッチは、圧電性板２の厚さに応じて５０〜１００μｍの
範囲が適当である（図５参照）。Next, using a slicing machine, parallel grooves are formed at equal intervals from the upper surface of the piezoelectric plate 2 in the plate thickness direction. The depth of the groove portion 4 is substantially twice the thickness of the piezoelectric plate 2, that is, the piezoelectric plate 2 is formed on the substrate 1 as well.
The depth should be the same as the thickness of. The pitch of the grooves 4 is appropriately in the range of 50 to 100 μm depending on the thickness of the piezoelectric plate 2 (see FIG. 5).
【００２６】次にスパッタリング法によって圧電性板２
の表面にクロムの電極層５を形成する（図６参照）。電
極層５は上面から溝部４の半分以上の深さの位置まで、
すなわち圧電性板２の部分より深くまで形成されればよ
く、基板１の部分の形成状態には関係がないのでその形
成処理は容易である。実際に電極層５に電圧が印加され
た際に変形を生じるのは圧電性板２の部分のみであり、
非圧電性の基板１の部分は電圧印加の有無にかかわらず
変形はしないため、基板１の部分に電極層５が存在する
か否かは何等問題にならない。従って、電極層形成にあ
たっては、圧電素子板２の部分を覆いさえすればそれ以
上の精度は要求されないため、作業が極めて簡単にな
る。なおこの段階では、電極層５は、溝部４の両側の突
起を被覆した状態になっている。電極層の形成には、ス
パッタリングの他、真空蒸着法や気相メッキ法など他の
金属表面形成手段を用いてもよい。Next, the piezoelectric plate 2 is formed by the sputtering method.
An electrode layer 5 of chrome is formed on the surface of the (see FIG. 6). The electrode layer 5 extends from the upper surface to a position where the depth is more than half of the groove portion 4,
That is, it is only necessary to form the piezoelectric plate 2 deeper than the portion thereof, and the forming process is easy because it has nothing to do with the formation state of the portion of the substrate 1. It is only the piezoelectric plate 2 that is deformed when a voltage is actually applied to the electrode layer 5,
Since the portion of the non-piezoelectric substrate 1 is not deformed regardless of whether or not a voltage is applied, it does not matter whether the electrode layer 5 is present in the portion of the substrate 1 or not. Therefore, when forming the electrode layer, no further precision is required as long as it covers the portion of the piezoelectric element plate 2, and the work is extremely simple. At this stage, the electrode layer 5 is in a state of covering the protrusions on both sides of the groove portion 4. In addition to sputtering, other metal surface forming means such as a vacuum vapor deposition method or a vapor phase plating method may be used for forming the electrode layer.
【００２７】次に、圧電性板２の上面を研磨して上面に
形成してある電極層を除去し、溝部４の両側に形成され
た電極層５をそれぞれ独立したものにする（図７参
照）。Next, the upper surface of the piezoelectric plate 2 is polished to remove the electrode layer formed on the upper surface, and the electrode layers 5 formed on both sides of the groove 4 are made independent (see FIG. 7). ).
【００２８】次に上蓋７の下面にエポキシ樹脂の接着剤
８を塗布し、この接着剤を介して、上蓋を圧電性基板２
の上面に積層して溝部４を塞ぐ。上蓋７の一辺は、各溝
部４の先端が開口する一辺と一致し、その対向辺は、マ
ニホールド６の前面と一致している。各溝部４は、上蓋
の下面と溝部の底面および両側内側面に囲まれ、それぞ
れインク流路を構成する（図２参照）。Next, an epoxy resin adhesive 8 is applied to the lower surface of the upper lid 7, and the upper lid is covered with the piezoelectric substrate 2 through this adhesive.
The groove portion 4 is closed by stacking on the upper surface of the. One side of the upper lid 7 coincides with one side where the tip of each groove 4 opens, and the opposite side thereof coincides with the front surface of the manifold 6. Each groove portion 4 is surrounded by the lower surface of the upper lid, the bottom surface of the groove portion, and the inner side surfaces on both sides, and each constitutes an ink flow path (see FIG. 2).
【００２９】次に圧電性板２の一端部に沿って、その上
面にインク供給用のマニホールド６を対接し、各溝部４
の内端部を覆い、マニホールドのインク供給孔と各溝部
とを連通させる（図１参照）。最後に各インク流路の開
口端と各ノズル１０ａとが対向するようにノズルプレー
ト１０を基板等の前端部に接合することによりインクジ
ェットヘッドができ上る。Next, along the one end of the piezoelectric plate 2, an ink supply manifold 6 is abutted on the upper surface thereof, and each groove 4 is formed.
To cover the inner end of each of the manifolds and connect the ink supply holes of the manifold to the respective groove portions (see FIG. 1). Finally, the ink jet head is completed by joining the nozzle plate 10 to the front end portion of the substrate or the like so that the opening end of each ink flow path faces each nozzle 10a.
【００３０】次に他の実施例について説明する。図８に
示すように、基板１１の上面に多数の導電パターン１２
が設けてあり、これらの導電パターン１２は、基板の右
側に位置する圧電性板積層部１１ａの部分は、２点鎖線
で示してある流路用の溝部１３と平行で、それよりも幅
広の接続部１２ａとなっている。基板１１の左側に位置
する非積層部１１ｂの導電パターンの部分は、接続部１
２ａから延長し、かつ幅を狭くして間隔を広くした延長
部１２ｂとなっている。延長部１２ｂの各先端部には、
ワイヤボンディングなどが行なわれる端子部１２ｃが設
けてある。Next, another embodiment will be described. As shown in FIG. 8, a large number of conductive patterns 12 are formed on the upper surface of the substrate 11.
In the conductive pattern 12, the portion of the piezoelectric plate laminated portion 11a located on the right side of the substrate is parallel to the channel groove portion 13 shown by the chain double-dashed line and wider than that. It is the connecting portion 12a. The conductive pattern portion of the non-laminated portion 11b located on the left side of the substrate 11 is the connection portion 1
The extension 12b extends from 2a and has a narrow width and a wide interval. At each tip of the extension 12b,
A terminal portion 12c for performing wire bonding or the like is provided.
【００３１】図１４に示すように、基板の圧電性板積層
部１１ａ（図８参照）の上面には、接着剤１４を介して
圧電性板１５が積層してある。圧電性板１５の上面から
板厚方向に向けて、圧電性板の実質的に２倍の深さの溝
部１３が設けてある。As shown in FIG. 14, a piezoelectric plate 15 is laminated with an adhesive 14 on the upper surface of the piezoelectric plate laminating portion 11a (see FIG. 8) of the substrate. A groove portion 13 having a depth substantially double that of the piezoelectric plate is provided from the upper surface of the piezoelectric plate 15 in the plate thickness direction.
【００３２】各溝部１５の深さの中間位置の内側面に
は、切断された導電パターン１２の一部である露出部１
２ｄが露出した状態となっている。そして、各溝部１３
の内側面の上部から、これらの露出部１２ｄにかけて、
Ｃｒからなる電極層１６が形成してあり、導電パターン
１２とこれらの電極層とは電気的に接続されている（図
１２〜１４参照）。The exposed portion 1 which is a part of the cut conductive pattern 12 is formed on the inner surface of the groove 15 at an intermediate position of the depth.
2d is exposed. And each groove 13
From the upper part of the inner surface of the to these exposed parts 12d,
An electrode layer 16 made of Cr is formed, and the conductive pattern 12 and these electrode layers are electrically connected (see FIGS. 12 to 14).
【００３３】圧電性板１５の上面には、接着剤１７を介
して上蓋１８が積層してあり、溝部１３を塞いでインク
流路を構成している（図１４参照）。An upper lid 18 is laminated on the upper surface of the piezoelectric plate 15 via an adhesive 17 to close the groove 13 to form an ink flow path (see FIG. 14).
【００３４】次に本実施例におけるインクジェットヘッ
ドの製造法について説明する。図９に示すように、初め
に非圧電性の基板１１の上面に導電パターン１２を形成
する。これらの各導電パターン１２には、溝部１３が設
けられる接続部１２ａを所定幅で平行に設けてあり、そ
の内端部から幅を狭くし、非積層部１１ｂ上でさらに後
方に延長し、かつ間隔を広げた延長部１２ｂを設け、そ
の後端部を端子部１２ｃとしてある（図８参照）。Next, a method for manufacturing the ink jet head in this embodiment will be described. As shown in FIG. 9, first, the conductive pattern 12 is formed on the upper surface of the non-piezoelectric substrate 11. In each of these conductive patterns 12, a connecting portion 12a provided with a groove portion 13 is provided in parallel with a predetermined width, the width is narrowed from the inner end portion thereof, and further extended rearward on the non-laminated portion 11b, and An extended portion 12b having a wider space is provided, and its rear end portion is used as a terminal portion 12c (see FIG. 8).
【００３５】次に、導電パターン１２の周囲にエポキシ
樹脂からなる接着剤１４を介して、その上面に圧電性板
１５を積層する（図１０参照）。続いて各導電パターン
の接続部１２ａの溝部を設ける位置の中央部をスライシ
ングマシンで加工し、流路をなす溝部１３を刻設する。
溝部の幅や深さ及びピッチ等は上記実施例と同様である
（図１１参照）。溝部１３の刻設により導電パターン１
２の一部も溝部の形状に切断され、基板１１と圧電性板
１５との間に切断された露出部１２ｄが露出した状態に
なる。Next, a piezoelectric plate 15 is laminated on the upper surface of the conductive pattern 12 with an adhesive 14 made of an epoxy resin interposed therebetween (see FIG. 10). Subsequently, the central portion of the position where the groove portion of the connection portion 12a of each conductive pattern is provided is processed by a slicing machine to engrave the groove portion 13 forming a flow path.
The width, depth, pitch, etc. of the groove portions are the same as those in the above embodiment (see FIG. 11). The conductive pattern 1 is formed by engraving the groove portion 13.
Part of 2 is also cut into the shape of a groove, and the exposed portion 12d cut between the substrate 11 and the piezoelectric plate 15 is exposed.
【００３６】次に、圧電性板１５の上面にＣｒの電極層
１６をスパッタリングによって形成し（図１２参照）、
圧電性板１５の上面に形成された電極層を研磨して除去
する（図１３参照）。最後に接着剤１７を介して上蓋１
８を被せて溝部を塞げば、インク流路ができる（図１４
参照）。その後、図１と同様にノズルプレート（図示
略）を固着する。Next, a Cr electrode layer 16 is formed on the upper surface of the piezoelectric plate 15 by sputtering (see FIG. 12).
The electrode layer formed on the upper surface of the piezoelectric plate 15 is removed by polishing (see FIG. 13). Finally, the upper lid 1 is attached via the adhesive 17.
If the groove is covered with 8 to form an ink flow path (see FIG. 14).
reference). Then, the nozzle plate (not shown) is fixed similarly to FIG.
【００３７】本実施例では、予め基板の上面に導電パタ
ーンを形成しておくことにより、ワイヤボンディング部
の間隔を容易に広く設けることができるので、ワイヤの
接続が容易となる利点がある。なお、非圧電性の基板と
しては、ガラス板の他、セラミック、フレキシブル配線
板などを採用してもよく、電極層もクロムの他にもニッ
ケルなどの金属も用いられる。In this embodiment, by forming the conductive pattern on the upper surface of the substrate in advance, it is possible to easily provide a wide space between the wire bonding portions, which has an advantage of facilitating the wire connection. As the non-piezoelectric substrate, a glass plate, a ceramic, a flexible wiring board, or the like may be adopted, and a metal such as nickel may be used in addition to chromium for the electrode layer.
【００３８】[0038]
【発明の効果】本発明によれば、圧電性板の厚さは実質
的に溝部の深さの半分の厚さでよく、大きさは、基板の
圧電性板積層部に相当する大きさにすればよく、高価な
圧電性板の使用量をきわめて少なくすることができるの
で、せん断駆動型インクジェットヘッドの製造コストの
節減に寄与する。According to the present invention, the thickness of the piezoelectric plate may be substantially half the depth of the groove, and the size of the piezoelectric plate corresponds to the piezoelectric plate laminated portion of the substrate. Since the amount of the expensive piezoelectric plate used can be extremely reduced, the manufacturing cost of the shear drive type inkjet head can be reduced.
【００３９】また、非圧電性の基板の上面に圧電性板を
積層し、圧電性板の厚さの実質的に２倍の深さの溝部を
刻設してから、その両内側面に電極層を形成するため、
溝部の深さの半分の深さの部分で最大変形可能なインク
ジェットヘッドを容易に製造可能となる。また、基板の
上面に予め導電パターンを設けて、溝部の内側面に設け
られた電極層に導電可能にすれば、導電パターンの端子
部を介して溝部の内側面の電極層への導電が容易な構成
にすることができる効果がある。Further, a piezoelectric plate is laminated on the upper surface of a non-piezoelectric substrate, and a groove portion having a depth substantially twice the thickness of the piezoelectric plate is engraved, and then electrodes are formed on both inner side surfaces thereof. To form a layer
It is possible to easily manufacture an inkjet head that is capable of maximum deformation in a portion that is half the depth of the groove. Further, by providing a conductive pattern on the upper surface of the substrate in advance so that the electrode layer provided on the inner side surface of the groove can be electrically conducted, it is easy to conduct the electrode layer on the inner side surface of the groove via the terminal portion of the conductive pattern. There is an effect that it can be made into a different structure.
【図１】本発明のインクジェットヘッドの一実施例を示
す一部切欠斜視図である。FIG. 1 is a partially cutaway perspective view showing an embodiment of an inkjet head of the present invention.
【図２】同実施例の要部拡大断面図である。FIG. 2 is an enlarged sectional view of a main part of the embodiment.
【図３】同実施例のインク流路が変形した状態を示す拡
大断面図である。FIG. 3 is an enlarged cross-sectional view showing a state where the ink flow path of the embodiment is deformed.
【図４】本発明に係るインクジェットヘッド製造方法の
一実施例の第１工程を示す要部拡大断面図である。FIG. 4 is an enlarged cross-sectional view of a main part showing a first step of an embodiment of the inkjet head manufacturing method according to the present invention.
【図５】同実施例の第２工程を示す要部拡大断面図であ
る。FIG. 5 is an enlarged sectional view of an essential part showing a second step of the embodiment.
【図６】同実施例の第３工程を示す要部拡大断面図であ
る。FIG. 6 is an enlarged sectional view of an essential part showing a third step of the same example.
【図７】同実施例の第４工程を示す要部拡大断面図であ
る。FIG. 7 is an enlarged sectional view of an essential part showing a fourth step of the embodiment.
【図８】インクジェットヘッドの他の実施例において、
基板上面に導電パターンを形成した状態を示す平面図で
ある。FIG. 8 is another example of the inkjet head,
It is a plan view showing a state in which a conductive pattern is formed on the upper surface of the substrate.
【図９】インクジェットヘッド製造方法の他の実施例に
おける第１工程を示す要部拡大断面図である。FIG. 9 is an enlarged sectional view of an essential part showing a first step in another embodiment of the method for manufacturing an inkjet head.
【図１０】同実施例の第２工程を示す要部拡大断面図で
ある。FIG. 10 is an enlarged cross-sectional view of a main part showing a second step of the same example.
【図１１】同実施例の第３工程を示す要部拡大断面図で
ある。FIG. 11 is an enlarged sectional view of an essential part showing a third step of the same example.
【図１２】同実施例の第４工程を示す要部拡大断面図で
ある。FIG. 12 is an enlarged sectional view of an essential part showing a fourth step of the same example.
【図１３】同実施例の第５工程を示す要部拡大断面図で
ある。FIG. 13 is an enlarged sectional view of an essential part showing a fifth step of the same example.
【図１４】図８に示すインクジェットヘッドの要部拡大
断面図である。14 is an enlarged cross-sectional view of a main part of the inkjet head shown in FIG.
１，１１ 基板 ２，１５ 圧電性板 ４，１３ 溝部 ５，１６ 電極層 ７，１８ 上蓋 １１ａ 圧電性板積層部 １１ｂ 非積層部 １２ 導電パターン １２ｂ 端子部 １２ｄ 露出部 1,11 Substrate 2,15 Piezoelectric plate 4,13 Groove 5,16 Electrode layer 7,18 Upper lid 11a Piezoelectric plate laminated portion 11b Non-laminated portion 12 Conductive pattern 12b Terminal portion 12d Exposed portion
フロントページの続き (72)発明者 神田 泰成 東京都墨田区太平四丁目１番１号 株式会 社精工舎内Front Page Continuation (72) Inventor Yasunari Kanda 4-1-1 Taihei, Sumida-ku, Tokyo Inside Stock Company Seikosha
Claims (4)
この圧電性板の厚さの実質的に２倍の深さにかつそれぞ
れ平行に設けてある複数の溝部と、 上記各溝部の両内側面に形成された電極層と、 上記圧電性板の上面に積層された上蓋とを備えているこ
とを特徴とするインクジェットヘッド。1. A non-piezoelectric substrate, a piezoelectric plate laminated on the upper surface of the substrate, and a plate thickness direction from the upper surface of the piezoelectric plate to the substrate,
A plurality of grooves provided in parallel to each other at a depth substantially twice the thickness of the piezoelectric plate, electrode layers formed on both inner side surfaces of each groove, and an upper surface of the piezoelectric plate. An inkjet head, comprising: an upper lid laminated on the.
上記各電極層とそれぞれ対応する導電パターンが設けら
れており、 上記圧電性板は上記基板よりも小面積であって、上記基
板は上記圧電性板積層部と非積層部とに分かれており、
上記非積層部上に上記各導電パターンの端子部がそれぞ
れ設けられていることを特徴とする請求項１に記載のイ
ンクジェットヘッド。2. A contact surface between the substrate and the piezoelectric plate,
A conductive pattern corresponding to each of the electrode layers is provided, the piezoelectric plate has a smaller area than the substrate, and the substrate is divided into the piezoelectric plate laminated portion and the non-laminated portion,
The inkjet head according to claim 1, wherein terminal portions of each of the conductive patterns are provided on the non-laminated portion.
する工程と、 上記圧電性板から上記基板にかけて板厚方向に、上記圧
電性板の厚さの実質的に２倍の深さでそれぞれ平行な複
数の溝部を刻設する工程と、 上記各溝部の両内側面に電極層を設ける工程と、 上記溝部を塞ぐように上記圧電性板上に上蓋を積層する
工程とを含むことを特徴とするインクジェットヘッドの
製造方法。3. A step of laminating a piezoelectric plate on the upper surface of a non-piezoelectric substrate, and a depth substantially twice the thickness of the piezoelectric plate in the plate thickness direction from the piezoelectric plate to the substrate. Then, a step of engraving a plurality of parallel groove portions, a step of providing electrode layers on both inner side surfaces of each groove portion, and a step of laminating an upper lid on the piezoelectric plate so as to block the groove portions are included. A method for manufacturing an inkjet head, comprising:
ーンを形成する工程と、 上記基板の上記導電パターン形成面に圧電性板を積層す
る工程と、 上記圧電性板から上記基板にかけて板厚方向に、上記圧
電性板の厚さの実質的に２倍の深さでそれぞれ平行な複
数の溝部を刻設し、この時上記導電パターンの少なくと
も一部を上記溝部の内側面に露出させる工程と、 上記各溝部の内側面に、上記導電パターンの上記露出部
と接触する電極層を設ける工程と、 上記溝部を塞ぐように上記圧電性板上に上蓋を積層する
工程とを含むことを特徴とするインクジェットヘッドの
製造方法。4. A step of forming a desired conductive pattern on the upper surface of a non-piezoelectric substrate, a step of laminating a piezoelectric plate on the conductive pattern forming surface of the substrate, and a plate from the piezoelectric plate to the substrate. A plurality of parallel groove portions are formed in the thickness direction so as to have a depth substantially twice the thickness of the piezoelectric plate, and at this time, at least a part of the conductive pattern is exposed on the inner surface of the groove portion. A step of providing an electrode layer in contact with the exposed portion of the conductive pattern on the inner side surface of each groove, and a step of laminating an upper lid on the piezoelectric plate so as to close the groove. A method for manufacturing an ink jet head, which is characterized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05214324A JP3081737B2 (en) | 1993-08-30 | 1993-08-30 | Method of manufacturing inkjet head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05214324A JP3081737B2 (en) | 1993-08-30 | 1993-08-30 | Method of manufacturing inkjet head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0760962A true JPH0760962A (en) | 1995-03-07 |
| JP3081737B2 JP3081737B2 (en) | 2000-08-28 |
Family
ID=16653875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05214324A Expired - Fee Related JP3081737B2 (en) | 1993-08-30 | 1993-08-30 | Method of manufacturing inkjet head |
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| Country | Link |
|---|---|
| JP (1) | JP3081737B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011245768A (en) * | 2010-05-27 | 2011-12-08 | Sii Printek Inc | Liquid jet head, liquid jet apparatus, and manufacturing method for the liquid jet head |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04363250A (en) * | 1991-03-19 | 1992-12-16 | Tokyo Electric Co Ltd | Inkjet printer head and its manufacturing method |
| JPH04366640A (en) * | 1991-06-14 | 1992-12-18 | Tokyo Electric Co Ltd | inkjet printer head |
| JPH04369542A (en) * | 1991-06-19 | 1992-12-22 | Tokyo Electric Co Ltd | How to drive an inkjet printer head |
| JPH0564893A (en) * | 1991-07-08 | 1993-03-19 | Tokyo Electric Co Ltd | Production of ink jet printer head |
-
1993
- 1993-08-30 JP JP05214324A patent/JP3081737B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04363250A (en) * | 1991-03-19 | 1992-12-16 | Tokyo Electric Co Ltd | Inkjet printer head and its manufacturing method |
| JPH04366640A (en) * | 1991-06-14 | 1992-12-18 | Tokyo Electric Co Ltd | inkjet printer head |
| JPH04369542A (en) * | 1991-06-19 | 1992-12-22 | Tokyo Electric Co Ltd | How to drive an inkjet printer head |
| JPH0564893A (en) * | 1991-07-08 | 1993-03-19 | Tokyo Electric Co Ltd | Production of ink jet printer head |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011245768A (en) * | 2010-05-27 | 2011-12-08 | Sii Printek Inc | Liquid jet head, liquid jet apparatus, and manufacturing method for the liquid jet head |
| CN102294897A (en) * | 2010-05-27 | 2011-12-28 | 精工电子打印科技有限公司 | Liquid jet head, liquid jet apparatus, and manufacturing method for the liquid jet head |
| CN102294897B (en) * | 2010-05-27 | 2015-09-30 | 精工电子打印科技有限公司 | The manufacture method of jet head liquid, liquid injection apparatus and jet head liquid |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3081737B2 (en) | 2000-08-28 |
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