JPH076638A - Wiring pattern punching method - Google Patents

Abstract

PURPOSE:To attain punching of a wiring pattern by firmly sticking a wiring pattern part, further so that a non-wiring pattern part can be easily separated, in manufacture or the like of a flat wiring body. CONSTITUTION:A conductor foil 10 and a carrier tape 4 with adhesive layer 6 piled together in a nonpressing and nonsticking condition are supplied to a half cut machine 1, to punch the conductor foil 10 by punching blades 27 while pressing only wiring pattern parts 21 of the conductor foil 10 by an elastic pressing material 29. Accordingly, the wiring pattern part 21 is firmly stuck to the carrier tape 4 by pressing force of the elastic pressing material 29, and further, a non-wiring pattern part 22 (except the wiring pattern part 21) of the conductor foil 10 is prevented almost from sticking to the carrier tape 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring pattern punching method used in the manufacture of flat wiring bodies.

[0002]

2. Description of the Related Art In recent years, in automobiles and the like, electronic automatic control has advanced, and it has become necessary to wire a large number of electric wires on doors and the like.

However, as an electric wire to be used, a conductor having a substantially circular cross section such as a copper wire is covered with an insulating layer such as vinyl chloride, and a large number of electric wires are bundled when used. The work of bundling the large number of electric wires must be done manually, which is extremely troublesome and inefficient.

Therefore, in order to efficiently wire a large number of electric wires, a flat wiring body in which a wiring pattern made of a conductor foil is covered with a pair of insulating layers in a sandwich shape has been proposed.

In this flat wiring body, conventionally, a conductor foil is adhered to a carrier tape, and the conductor foil is divided into a wiring pattern portion and a non-wiring pattern portion to be removed by punching,
It was manufactured by peeling and removing only the non-wiring pattern portion of the conductor foil, and transferring and laminating the remaining wiring pattern portion to the insulating layer.

[0006]

However, when the conductive foil is adhered to the carrier tape, it is not easy to peel off the punched non-wiring pattern portion from the carrier tape.

Therefore, in the present invention, in the production of a flat wiring body, the wiring pattern portion is strongly adhered, and
It is an object of the present invention to provide a method for punching a wiring pattern so that the non-wiring pattern portion can be easily peeled off.

[0008]

In order to achieve the above-mentioned object, a method for punching a wiring pattern of the present invention is a half-cutting machine for a conductor foil and a carrier tape with an adhesive layer, which are superposed in an unpressed and unadhered state. The conductive foil is punched out by a punching blade while pressing only the wiring pattern portion of the conductive foil with an elastic pressing material.

Further, a release film is interposed between the carrier tape with an adhesive layer and the conductor foil so as not to adhere to each other, and the left and right edges of the carrier tape and the conductor foil are aligned in the longitudinal direction. Along with the feeding, the release film is removed during the feeding, and the conductor foil and the carrier tape that are superposed in an unpressed and non-adhesive state are supplied to a half-cutting machine, and only the wiring pattern portion of the conductor foil is supplied. The conductor foil is punched by a punching blade while pressing the elastic foil.

[0010]

[Operation] A conductor foil and a carrier tape with an adhesive layer, which are superposed in a non-pressed and non-adhesive state, are supplied to a half-cutting machine, and only a wiring pattern portion of the conductor foil is pressed by an elastic pressing material, and a punching blade By punching through the conductor foil with, the wiring pattern portion is firmly adhered to the carrier tape by the pressing force of the elastic pressing material, and the non-wiring pattern portion (other than the wiring pattern portion) of the conductor foil is the carrier tape. It hardly sticks.

Therefore, the non-wiring pattern portion of the conductor foil can be easily peeled from the carrier tape, leaving the wiring pattern portion.

Further, since a release film is interposed between the carrier tape with the adhesive layer and the conductor foil so that they do not adhere to each other, the left and right edges of the carrier tape and the conductor foil can be easily aligned. Moreover, by removing only the release film during the feeding, it is possible to surely prevent the carrier tape and the conductive foil from sticking to each other before being supplied to the half-cutting machine.

[0013]

The present invention will be described in detail below with reference to the drawings illustrating the embodiments.

FIG. 1 shows a half-cutting machine 1 used in a wiring pattern punching method according to the present invention. The half-cutting machine 1 and the wiring pattern punching method are flat wiring bodies 2 (see FIG. 15). It is used in manufacturing equipment, etc.

In this flat wiring body manufacturing apparatus, as shown in FIGS. 6 and 7, the long carrier tape 4 supplied from the drum 3 is intermittently fed at a predetermined pitch in the longitudinal direction (arrow A direction). Given, surface 4a of carrier tape 4
Then, an adhesive is applied by the adhesive layer forming machine 5 to form the adhesive layer 6.

As shown in FIGS. 6 and 8, on the adhesive layer 6, a silicone-treated release film 8 having no tackiness and no tackiness is supplied from the drum 7 and overlaid thereon.

Further, as shown in FIGS. 6 and 9, a conductive conductor foil 10 such as a copper foil is supplied from the drum 9 onto the release film 8 and is overlaid thereon.

In this state, the carrier tape 4 and the conductor foil 10 do not adhere to each other by the release film 8, and the carrier tape 4 and the conductor foil 10 can freely move (slide) in the width direction.

The carrier tape 4, the conductor foil 10 and the release film 8 are set to have the same width dimension (see FIG. 3).

Next, the polymer 11 in which the carrier tape 4 with the adhesive layer 6, the release film 8 and the conductor foil 10 are laminated,
Just before the half-cutting machine 1, supply it to the sampling machine 12,
As shown in FIGS. 3 to 5, the left and right edges of the carrier tape 4, the release film 8 and the conductor foil 10 are aligned and intermittently fed in the longitudinal direction (direction of arrow A), and during the feeding. The conductor foil 10 and the carrier tape 4 are overlapped in a non-pressed and non-adhered state except for the release film 8.

Specifically, the extractor 12 includes a guide frame 14 having a flat hole 13 through which the polymer 11 can be inserted, and a pair of rolls 15 and 15 for intermittently feeding the polymer 11 in the longitudinal direction. Polymer 11
And a separating member 16 for removing the release film 8 from the guide frame body 14, the rolls 15, 15, and the separating member 16.
Are sequentially arranged from the downstream side to the upstream side.

In FIGS. 3 to 5, the carrier tape 4 is used.
The adhesive layer 6 (see FIG. 9) on the surface 4a of FIG.

The spacing dimension T of the flat holes 13 of the guide frame 14 is set to be slightly larger than the width dimension L of the carrier tape 4, the release film 8 and the conductor foil 10. Therefore, by inserting the polymer 11 into the flat hole 13 and passing it through, the left and right edges (ears) of the carrier tape 4, the release film 8 and the conductor foil 10 can be aligned.

The polymer 11 that has passed through the flat holes 13 is sent to the separating member 16 by the rolls 15 and 15.

The separating member 16 has a flat plate portion 18, and the flat plate portion 18 has one slit 19 penetrating therethrough.
This slit 19 is in the longitudinal direction of the polymer 11 (direction of arrow A).
The inclination angle θ is set to about 45 °.

When the polymer 11 is supplied to the separating member 16,
The conductor foil 10 passes on the upper surface 18a side of the flat plate portion 18, the carrier tape 4 passes on the lower surface 18a side of the flat plate portion 18, and the release film 8 forms the slit 19 from the lower surface 18a side of the flat plate portion 18. The conductor foil 10 and the upper surface 18 are folded back at an angle.
The release film 8 is changed so that the feeding direction of the release film 8 is perpendicular to the longitudinal directions of the carrier tape 4 and the conductor foil 10 after coming out to the space a.

Then, the release film 8 whose feed direction is changed is pulled out by a winding drum or the like (not shown) in accordance with the intermittent feeding by the rolls 15 and 15 and only the release film 8 is released from the polymer 11. Pull out.

When the release film 8 is removed, the conductor foil 10 and the carrier tape 4 are overlapped with each other with their both left and right edges aligned, and in a non-pressed and non-adhered state.

The conductor foil 10 and the carrier tape 4 in this state
6 and 10, the conductor foil 10 is punched out in accordance with the wiring pattern portion 21 composed of a plurality of strip-shaped conductors 20 to obtain the wiring pattern portion 21. And the non-wiring pattern portion 22.

Specifically, as shown in FIGS. 1 and 2, the half-cutting machine 1 is provided with a press 23, and the press 23 has a punching die in which a Victoria blade 24 is fixed to a holder 25. 26
Is installed. The punching die 26 is vertically driven by the press 23.

The Victoria blade 24 is composed of a plurality of loop-shaped punching blades 27, and the (lead 20 of the wiring pattern portion 21 of the punching blade 27.
The strip-shaped gap portion 28 (corresponding to the above) is filled with a tubular elastic pressing member 29 having an annular cross section and elastically held by the punching blade 27.

When the wiring pattern portion 21 is punched, the elastic pressing member 29 (from the pre-punching state shown by the phantom line in FIG.
A part of the elastic pressing member 29 is projected (downward in the drawing) from the tip 30 of the punching blade 27 so as to be compressed and collapsed (as shown by a solid line).

It should be noted that nothing is packed in the narrow strip-shaped gap portion 31 (corresponding to the non-wiring pattern portion 22) of the adjacent punching blades 27, 27, and they are left as they are.

The punching die 26 is lowered, and only the wiring pattern portion 21 of the conductor foil 10 supplied to the half-cutting machine 1 is pressed by the elastic pressing member 29, and the carrier tape 4 is pressed by the punching blade 27. The conductor foil 10 is punched out without penetrating.

As a result, the wiring pattern portion 21 of the conductor foil 10 is
Is firmly adhered to the carrier tape 4 by the pressing force of the elastic pressing member 29, while the non-wiring pattern portion 22 of the conductor foil 10 hardly adheres to the carrier tape 4.

Moreover, since the shape of the cutting edge of the punching blade 27 is inclined, the non-wiring pattern portion 22 becomes curled with the punching, and the adhesion to the carrier tape 4 is further hindered.

On the other hand, in the wiring pattern portion 21, since the elastic pressing member 29 is crushed and spreads at both ends, the wiring pattern portion 21
The (small area) end 32 of 21 is only slightly curled, and is not easily peeled off.

Next, as shown in FIGS. 6 and 11, the non-wiring pattern portion 22 is wound on the winding drum 33.

Then, since the non-wiring pattern portion 22 hardly adheres to the carrier tape 4, the non-wiring pattern portion 22 is easily peeled off from the carrier tape 4, and the wiring pattern portion 21 firmly adheres to the carrier tape 4. Remain on tape 4.

Although not shown, the carrier tape 4 to which the wiring pattern portion 21 is adhered is sucked by, for example, a vacuum suction machine equipped with a suction flat plate, and the non-wiring pattern portion 22 is kept in a flat state. It is preferable to bend and peel off the non-wiring pattern portion 22 more easily.

In this way, the first insulating tape 36 with the adhesive layer 35 is supplied from the supply roll 34 to the carrier tape 4 on which the wiring pattern portion 21 remains, as shown in FIGS. The pattern portion 21 is sandwiched between the adhesive layer 35 and the adhesive layer 6 and overlapped.

In this state, the upper and lower rollers 38a, 38a, 38b, 38b of the first laminating apparatus 37 are passed through, the carrier tape 4 and the first insulating tape 36 are heated and bonded together, and the wiring pattern portion 21 is removed. 1 Adhesive layer 35 of insulating tape 36
Glue to.

As a result, the adhesive force of the adhesive layer 35 exceeds the adhesive force of the adhesive layer 6 to the wiring pattern portion 21.

Next, as shown in FIGS. 6 and 13, the carrier tape 4 is wound around the winding drum 39, and the first insulating tape 36
By separating the carrier tape 4 from, the wiring pattern portion 21 is transferred to the first insulating tape 36 side.

As shown in FIGS. 6 and 14, the supply roll 40 is attached to the first insulating tape 36 having the wiring pattern portion 21 transferred thereto.
The second insulating tape 42 with the adhesive layer 41 is supplied from the above, and the wiring pattern portion 21 is sandwiched between the adhesive layers 41 and 35 and overlapped.

In this state, the upper and lower rollers 44a, 44a, 44b, 44b of the second laminating apparatus 43 are passed through, and the second insulating tape 42 and the first insulating tape 36 are heated and bonded together to form the wiring pattern portion 21. Are adhered to both adhesive layers 41 and 35.

Thus, as shown in FIG. 15, the intermediate laminated body 45 having the wiring pattern portion 21 therein is formed. Although only one wiring pattern portion 21 is drawn in the illustrated example, a plurality of wiring pattern portions 21 are actually provided adjacent to each other.

Then, as shown in FIGS. 6 and 15, the intermediate punch 45 is punched into a predetermined outer shape by the outer shape punching machine 46 to form the flat wiring body 2.

The present invention is not limited to the above-mentioned embodiments, and the design can be freely changed without departing from the gist of the present invention. For example, instead of the slit 19 shown in FIG. 3, as shown in FIG. 16, the flat plate portion 18 of the separating member 16 is formed with a window portion 47 having a substantially triangular shape in plan view, and the release film 8 is formed from the window portion 47. Feel free to pull it out.

[0050]

Since the present invention is configured as described above, it has the following effects.

Conductor foil 10 stacked in an unpressed and non-adhesive state
And the carrier tape 4 with the adhesive layer 6 on the half-cutting machine 1
When the punching blade 27 punches through the conductor foil 10 while pressing only the wiring pattern portion 21 of the conductor foil 10 with the elastic pushing member 29, the wiring pattern portion 21 pushes the elastic pushing member 29. It strongly adheres to the carrier tape 4 under pressure, and the non-wiring pattern portion 22 (other than the wiring pattern portion 21) of the conductor foil 10 hardly adheres to the carrier tape 4.

Therefore, it is possible to easily and surely remove only the non-wiring pattern portion 22 from the carrier tape 4 while leaving the wiring pattern portion 21.

Further, since the release film 8 is interposed between the carrier tape 4 and the conductor foil 10 so as not to stick to each other, the left and right edges of the carrier tape 4 and the conductor foil 10 are aligned. By easily removing the release film 8 during the feeding, it is possible to reliably prevent the carrier tape 4 and the conductive foil 10 from adhering to each other before being supplied to the half-cutting machine 1.

[Brief description of drawings]

FIG. 1 is a sectional view of a main part of a half-cutting machine used in a wiring pattern punching method according to the present invention.

FIG. 2 is an enlarged sectional view of an essential part showing a punched state.

FIG. 3 is a simplified plan view of the extractor.

FIG. 4 is a cross-sectional view of the extractor.

FIG. 5 is a cross-sectional view of a guide frame body showing a state in which a polymer is inserted.

FIG. 6 is an overall simplified diagram of a flat wiring body manufacturing apparatus.

FIG. 7 is an enlarged cross-sectional view showing a state where an adhesive layer is formed on a carrier tape.

FIG. 8 is an enlarged cross-sectional view showing a state in which an adhesive layer is covered with a release film.

FIG. 9 is an enlarged cross-sectional view of a state in which a carrier tape, a release film and a conductor foil are superposed.

FIG. 10 is a simplified plan view in which a conductor foil is punched out.

FIG. 11 is an enlarged cross-sectional view of a state in which the non-wiring pattern portion is peeled off from the carrier tape.

FIG. 12 is an enlarged cross-sectional view of a state where the first insulating tape and the carrier tape are overlapped with each other.

FIG. 13 is an enlarged cross-sectional view showing a state where the first insulating tape and the carrier tape are separated.

FIG. 14 is an enlarged cross-sectional view of an intermediate laminated body.

FIG. 15 is a simplified plan view showing a punched state of the outer shape of the intermediate laminate.

FIG. 16 is a simplified plan view showing a modified example of the separation member.

[Explanation of symbols]

 1 Half-cutting machine 4 Carrier tape 6 Adhesive layer 8 Release film 10 Conductor foil 21 Wiring pattern part 27 Punching blade 29 Elastic pressing material

Claims (2)

[Claims] 1. A conductor foil and a carrier tape with an adhesive layer, which are superposed in an unpressed and non-adhesive state, are supplied to a half-cutting machine, and only the wiring pattern portion of the conductor foil is pressed by an elastic pressing material while being pressed. A method for punching a wiring pattern, comprising punching the conductor foil with a punching blade. 2. A carrier tape with an adhesive layer and a conductor foil are interposed with a release film so as not to adhere to each other, and the left and right edges of the carrier tape and the conductor foil are aligned in the longitudinal direction. Along with the feeding, the release film is removed during the feeding, and the conductor foil and the carrier tape that are superposed in an unpressed and non-adhesive state are supplied to a half-cutting machine, and only the wiring pattern portion of the conductor foil is supplied. A method for punching a wiring pattern, characterized in that the conductor foil is punched with a punching blade while pressing the sheet with an elastic pressing material.