JPH0766596A - Onboard machine - Google Patents

Abstract

(57) [Abstract] [Purpose] It is an object of the present invention to provide a mounting machine for mounting electronic parts on a solder pattern of a printed circuit board with high accuracy. According to the mounting machine of the present invention, a means 20 for measuring a gap between a desired portion of a substrate 6 on which an electronic component 1 is to be mounted and the electronic component 1 sucked by a mounting nozzle 2 and a measurement result of the measuring means are used. Based on the above, means 11 is provided for moving the mounting nozzle that has sucked the electronic component to the substrate at high speed from the substrate to an arbitrary position and at low speed from the arbitrary position to a desired position on the substrate on which the electronic component is to be mounted. Have

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting machine, and more particularly, to mount an electronic component at a desired position on the printed circuit board by driving a mounting nozzle holding the electronic component onto the printed circuit board and releasing the holding. It is about the onboard machine.

[0002]

2. Description of the Related Art A component mounting section and a control section for controlling the component mounting section in a conventional mounting machine will be described based on an example shown in FIGS.

The component mounting portion includes a mounting nozzle 2 for vacuum-sucking (holding) the electronic component 1, a driving mechanism 3 for driving the mounting nozzle 2, a motor 4 for operating the driving mechanism 3, and a motor 4. It is composed of an encoder 5 and the like mounted on the.
The control unit is composed of a host computer system 10 and a control system 11 managed by the host computer system 10. The command issued from the host computer system 10 is the height of the mounting nozzle 2 above the substrate 6. Position controller 12, a speed controller 13 for controlling the vertical movement speed of the mounting nozzle 2 based on a signal from the position controller 12, and a motor 4 based on a signal from the speed controller 13. Is transmitted to the component mounting portion via a control system 11 including a drive circuit 14 that outputs a signal for driving the component.

Then, as shown in FIG. 11, the distance between the lower surface of the substrate 6 held by the guide 7 at the component mounting position, that is, the upper portion of the guide 7 and the tip of the mounting nozzle 2 that has picked up the electronic component 1 is the distance L1. As a result, it is stored in the host computer system 10. Similarly, the height H1 of the electronic component 1 and the thickness H2 of the substrate 6 are also measured in advance and stored in the host computer system 10, respectively. An upper-level computer that stores the distance L1, height H1, and thickness H2
The system 10 calculates the distance between the upper surface of the substrate 6 and the tip of the electronic component 1 sucked by the mounting nozzle 2 by the following formula,
It is stored as the distance L2.

L2 = L1- (H1 + H2) The distance L2 indicates the maximum approach value of the mounting nozzle 2 to the substrate 6, that is, the maximum value that can be lowered.

Therefore, the host computer system 10 stores a distance L2 indicating the distance between the tip of the electronic component 1 sucked by the mounting nozzle 2 and the substrate 6 as an initial value, and the mounting nozzle 2 stores the distance L2. The descent operation is performed based on.
Specifically, the position control of the mounting nozzle 2 feeds back the signal of the encoder 5 mounted on the motor 4 to the input point of the position controller 12 at the height above the substrate 6. Control by that. The speed control is performed by feeding back the signal of the encoder 5 to the input point of the speed controller 13, and the current signal for driving the motor 4 is applied to the input point of the drive circuit 14 by the current transformer 15. The current is controlled by feedback. In Japanese Patent Laid-Open No. 120897/1989, a control device for changing the descending speed of the mounting nozzle stepwise or steplessly according to the impact resistance of the electronic component is provided to control the speed. It is proposed to prevent damage.

[0007]

The mounting nozzle 2 which has sucked the electronic component 1 descends to mount the electronic component 1 at a desired position on the substrate 6, and when the mounting nozzle 2 descends.
A phenomenon occurs in which the tip vibrates and the sucked electronic component 1 moves in the lead pitch width direction. However, even if the solder paste collapses due to the movement of the electronic component 1 in the lead pitch width direction, the patterns are not in contact with each other because the width of the solder paste is large, and so-called bridges do not occur. It didn't matter. However, since the lead pitch of the electronic component 1 has been narrowed to about 30 μm and the pattern of the solder paste has been formed finer accordingly, the lead 9 of the electronic component 1 adsorbed by the mounting nozzle 2 has become smaller. When the solder contacts the solder paste, it moves in the lead pitch width direction, which causes a problem that a bridge occurs, and the occurrence of a defective substrate due to a decrease in mounting accuracy has become remarkable.

Therefore, in order to mount electronic components on a substrate with high accuracy, it is necessary to reduce vibration in the lead pitch width direction which occurs when the mounting nozzle descends. That is, the descending speed of the mounting nozzle when the lead of the electronic component comes into contact with the solder paste may be set to be slower than when the electronic component having a large lead pitch is mounted. In order to mount the electronic component by controlling the descending speed of the mounting nozzle, it is necessary to accurately grasp the situation of the target substrate and perform the control while feeding back the grasped information.

Factors indicating the condition of the substrate include the amount of warp of the substrate, the width and thickness of the solder paste provided on the substrate, and the like.

Looking at the amount of warp of the substrate, for example,
In the above-described conventional mounting machine, the distance between the tip of the electronic component 1 adsorbed on the tip of the mounting nozzle 2 and the upper surface of the substrate 6 is measured in advance and set as the distance L2. The distance L2 is a flat surface of the substrate 6. This is the theoretical distance when assuming that the board used in the actual manufacturing line has a slight warp, and this warp is not constant depending on the individual board, and even on the same board. It often changes depending on the mounting position. Further, as described in the above-mentioned patent publication, for example, the height H1 of the electronic component 1 is measured in advance according to the impact resistance degree of the component, that is, the type of the component, and is stored in the host computer system 10. When the determination value for switching the operation speed of the mounting nozzle 2 is used, the command value issued from the position controller 12 for instructing the vertical movement of the mounting nozzle 2 has a one-to-one correspondence with the height H1. However, it is not possible to grasp the change in the upper surface of the substrate caused by the warp of the substrate and follow the change to instruct the vertical movement of the mounting nozzle 2.

An object of the present invention is to solve the above problems and to provide a mounting machine for mounting electronic components on a substrate with high accuracy.

[0012]

A feature of the mounting machine of the present invention is that it measures the distance between a predetermined position of a substrate on which an electronic component is to be mounted and the electronic component held by a mounting nozzle, and the measuring means. Based on the measurement result of the means, the mounting nozzle that has sucked the electronic component is driven to the upper surface of the substrate at high speed from the substrate to an arbitrary position, and from the arbitrary position to a desired position on the substrate on which the electronic component is to be mounted. Is to provide a means to move at low speed.

[0013]

According to the present invention, the condition of the board can be grasped by the means for measuring the distance between the desired part of the board on which the electronic component is to be mounted and the electronic part held by the mounting nozzle, and the measurement result of the measuring means can be obtained. That is, based on the condition of the board, the mounting nozzle that picks up the electronic component is driven to the upper surface of the board at a high speed from the board to an arbitrary position, and the predetermined position of the board on which the electronic component is mounted from the arbitrary position. Since the vibration that occurs when the mounting nozzle descends is reduced when the electronic component is mounted by the means that moves to a location at low speed, the solder paste provided on the substrate is not destroyed and a bridge is not generated. It can be mounted with high precision.

[0014]

FIG. 1, FIG. 2 and FIG. 3 show an embodiment of the present invention.

In this embodiment shown in FIG. 1, for example, an ultrasonic sensor is provided below the substrate as a means for measuring the state of the surface of the substrate, and a mounting nozzle on which an electronic component is sucked is rapidly moved from the substrate to an arbitrary position. The low-speed movement is performed from the arbitrary position to a desired position on the board on which the electronic component is to be mounted. The same parts as those of the conventional example shown in FIG.

Similar to the conventional example shown in FIG. 10, the distance between the lower surface of the substrate 6, which the guide 7 holds in advance at the component mounting position, that is, the upper portion of the guide 7, and the tip of the mounting nozzle 2 that has picked up the electronic component 1. Is the distance L1 and the upper computer
It is stored in the computer system 10. Similarly, the height H1 of the mounted component 6 and the thickness H2 of the substrate 6 are also measured in advance and stored in the host computer system 10.

An ultrasonic sensor 20 is provided below the substrate 6 and a position with respect to the substrate 6 is preset. The signal of the amplifier 21 of the ultrasonic sensor 20 passes through the loop 22 and the position controller 12 is provided. And feed back to the drive circuit 14.

FIG. 2 shows a case where the mounting nozzle 2 and the substrate 6 and the ultrasonic sensor 20 are warped in the positional relationship, and the dashed-dotted line below the substrate 6 is
The position of the lower surface of the substrate when the surface is assumed to be flat is shown.

The tip of the ultrasonic sensor 20 provided below the substrate 6 and the substrate 6 held by the guide 7 at the component mounting position.
Let the distance from the lower surface of the substrate be the distance L3 in the case of an ideal substrate whose surface is assumed to be flat, and let the actually measured value be the actually measured distance K3.
The warpage amount J of the substrate 6 can be calculated as J = L3-K3. At this time, the substrate 6 has J> 0.
At this time, the warp is downward with respect to the mounting nozzle 2, and J = 0.
When J <0, it can be determined that there is no warp, and when J <0, the mount nozzle 2 is warped upward.

Further, the electronic component 1 sucked by the mounting nozzle 2
Assuming that the distance between the tip of the lead 9 and the mounting position surface on the substrate 6 is a measured distance K2, the distance K2 is the lower surface of the substrate 6 held by the upper computer system 10 by the guide 7 at the component mounting position, that is, From the distance L1 which is the distance between the upper part of the guide 7 and the tip of the mounting nozzle 2, the warp amount J of the substrate, the height H1 of the electronic component 1 and the substrate thickness H2, K2 = L1- (H1 + H2 + J) is obtained.

The measured distance K2 is the distance L2 shown in the conventional example.
Similarly, the maximum value of the mounting nozzle 2 approaching the substrate 6, that is, the maximum value that can be lowered is shown, and the mounting nozzle 2 performs the lowering operation based on the measured distance K2. Therefore, the host computer system 10 can store the measured distance K2 as an initial value and grasp the drive distance of the mounting nozzle 2, that is, the remaining descent distance.

Now, FIG. 3 shows the relationship between the mounting time and the mounting distance in which the substrate 6 moves from the upper surface to an arbitrary position at a high speed and from the arbitrary position to a mounting position at a low speed.

In FIG. 3, the vertical axis represents the distance from the upper surface of the substrate 6 and the horizontal axis represents the descending time of the mounting nozzle 2, showing the descending stroke of the mounting nozzle 2 during component mounting.

The actually measured distance K2, which indicates the gap between the tip of the lead 9 of the electronic component 1 sucked by the mounting nozzle 2 and the upper surface of the substrate 6, is an arbitrary height from the component mounting position on the upper surface of the substrate 6. By the time when the distance ΔL is reached (time t1), the driving speed of the mounting nozzle 2 is set to the high speed mode 1, and the distance ΔL is set.
From the time until the electronic component 1 is mounted on the solder paste 8 on the substrate 6 (time t2), the mode 2 in which the driving speed of the mounting nozzle 2 is low is set. The time t2 is the time when the descending distance of the mounting nozzle 2 becomes equal to the above-described measured distance K2, and is the time when the descending of the mounting nozzle 2 is stopped. Therefore, by switching the descending speed of the mounting nozzle 2 that has sucked the electronic component 1 between the mode 1 and the mode 2, it is possible to prevent the mounting nozzle 2 from suddenly stopping at the upper portion of the substrate 6. Since the vibration in the lead pitch width direction generated at the tip of the mounting nozzle 2 can be reduced, the solder pattern 8 provided on the substrate 6 is destroyed when the electronic component 1 is mounted, and a so-called bridge is generated. It is possible to prevent the malfunction.

At time t2, the tip of the electronic component 1 comes into contact with the solder paste 8 on the substrate 6 and the upper surface of the substrate 6 is pushed from above by the electronic component 1, so that the actually measured distance K3 is obtained. Considered as the time of change, loop 22
The motor 4 may be stopped by the change of the actually measured distance K3 fed back to the drive circuit 14 through the motor 4 and the mounting nozzle 2 descending in the low speed mode may be stopped immediately.

According to the present embodiment, the ultrasonic sensor provided below the substrate measures the distance between a predetermined portion of the substrate on which the electronic component is to be mounted and the electronic component sucked by the mounting nozzle, Based on the measurement result of the sound wave sensor, the driving of the mounting nozzle that adsorbs the electronic component to the substrate is performed at high speed from the substrate to an arbitrary position, and at a low speed from the arbitrary position to a desired position of the substrate on which the electronic component is to be mounted. By virtue of the provision of the means for moving the mounting nozzle, it is possible to reduce the vibration in the lead pitch width direction at the tip of the mounting nozzle that occurs when the mounting nozzle descends, and it is possible to accurately mount electronic components even on a warped substrate. It can be performed.

The mounting nozzle 2 that has sucked the electronic component 1
In the case where C is lowered in an oblique direction with respect to the substrate 6, the upper computer system 10 can decompose the moving distance of the mounting nozzle 2 in the horizontal and vertical directions for calculation.

FIG. 4, FIG. 5, FIG. 6 and FIG. 7 show another embodiment of the present invention.

In this embodiment, a sensor is provided above the substrate as a means for measuring the condition of the surface of the substrate, and at a high speed from the substrate to an arbitrary position, a desired portion of the substrate on which an electronic component is to be mounted is mounted from the arbitrary position. Is to move at low speed.
Incidentally, the same parts as those of the conventional example shown in FIG.

Similar to the conventional example shown in FIG. 10, the upper computer system 10 previously reaches the upper portion of the guide 7 and the upper portion of the desired portion of the substrate 6 where the electronic component 1 is to be mounted and the electronic component 1 is to be mounted. The distance L from the tip of the mounting nozzle 2 immediately before the descending, the height H1 of the mounting electronic component 1, and the thickness H2 of the substrate 6 are stored.

In this embodiment, as shown in FIG. 4, a motor 30 for rotating the mounting nozzle 2 in the θ-axis direction and sensors 31, 32 for rotating together with the mounting nozzle 2 are provided. The sensors 31 and 32 are provided at arbitrary positions from the tip of the mounting nozzle 2, but the arbitrary position is a position where the electronic component 1 attracted to the mounting nozzle 2 is not contacted and the electronic component 1 is not detected. good. The positional relationship between the electronic component 1, the mounting nozzle 2 and the sensors 31 and 32 at this time will be described with reference to sectional views taken along line AA shown in FIGS. 5 and 6.

As shown in FIG. 5, the mounting nozzle 2 is located at the positions V0 and W0 where the sensors 31 and 32 do not detect the sucked electronic component 1. The motor 30 rotates the mounting nozzle 2 from the positions V0 and W0 by 45 ° in the θ-axis direction as shown in FIG. At this time, since the mounting nozzle 2 rotates together with the sucked electronic component 1 and the sensors 31 and 32, the sensors 31 and 32 do not detect the sucked electronic component 1 by the mounting nozzle 2 and the positions V1 and W1 on the upper surface of the substrate 6 are detected. Measures the distance to and the measured value is the upper computer system 1
Store at 0. Next, the mounting nozzle 2 is further moved in the θ-axis direction by 9
When rotated by 0 °, the sensors 31 and 32 do not detect the electronic component 1 as in the case shown in FIG.
The distance to W2 is measured, and the measured value is stored in the host computer system 10.

After the sensors 31 and 32 measure four points on the solder paste 8 at desired positions on the substrate 6 on which the electronic component 1 is mounted, the mounting nozzle 2 is moved by the motor 30 in the θ axis direction. Rotate -135 °. That is, as shown in FIG. 5, the mounting nozzle 2 descends when the sensors 31 and 32 are located at the positions V0 and W0.

The host computer system 10 has the above-mentioned 4
At the point (positions V1, W1, V2, W2), the sensor 3
The minimum value of the distances measured by 1 and 32 is determined and set as the distance K4, which is stored as the descending distance of the mounting nozzle 2. The substrate 6
The height of the solder paste 8 provided above is about several tens of μm, and the exact distance that the mounting nozzle 2 descends to mount the electronic component 1 is from the lower end of the lead 9 of the sucked electronic component 1. Up to the top of the solder paste 8. Therefore, the electronic component 1 adsorbed by the mounting nozzle 2 is solder paste 8
The distance that can be descended without crushing and forming a bridge can be shown as the minimum value of the distances measured by the sensors 31 and 32 at the above four points determined by the host computer system 10.

Based on the distance K4, the relationship between the mounting time and the mounting distance, in which the substrate 6 moves from the upper surface to an arbitrary position at a high speed and from the arbitrary position to a mounting position at a low speed, is shown in FIG. In FIG. 7, the position V by the sensors 31 and 32
The measurement time points of 0 and W0 are time T0, the measurement time points of positions V1 and W1 are time T1, the measurement time points of positions V2 and W2 are time T2.
Then, since the measurement period is between time T0 and time T2, the mounted nozzle 2 is not lowered. The upper-level computer system 10 determines an arbitrary height from the component mounting position on the upper surface of the board based on the stored descent speed (high-speed mode and low-speed mode) of the mounting nozzle 2 and the distance K4 already calculated. The time when the tip of the electronic component 1 attracted to the tip of the mounting nozzle 2 reaches the distance ΔL is time T3, and the substrate 6 is moved from the distance ΔL.
The time when the electronic component 1 is mounted on the upper solder paste 8 is obtained as time T4, and the descending speed is switched from the high speed mode to the low speed mode at time T3, and the electronic component 1 is attracted at time T4. Release and solder paste 8 on board 6
Mount on top.

In this embodiment, the sensors 31 and 32 provided in the mounting nozzle 2 detect the height of the solder paste 8 in the vertical direction for simplification of description, but the sensor 31 is described. , 32 is not limited to the vertical direction.

According to this embodiment, the sensor provided on the upper portion of the substrate precisely measures the gap between the desired portion of the substrate on which the electronic component is to be mounted and the electronic component adsorbed by the mounting nozzle, and the sensor is used. Based on the measurement result, the driving of the mounting nozzle that has sucked the electronic component to the substrate is performed at high speed from the substrate to an arbitrary position, and at low speed from the arbitrary position to a desired position on the substrate on which the electronic component is to be mounted. Since the movement of the mounting nozzle, it is possible to reduce the vibration in the lead pitch width direction of the mounting nozzle tip when the mounting nozzle descends, it is possible to prevent the occurrence of a bridge by the mounted electronic components,
It can be mounted with high accuracy.

In the two embodiments shown in FIGS. 1 to 7, since the high speed mode and the low speed mode are set in advance, the mounting time differs depending on the distance from the upper surface of the substrate of the mounting nozzle. When the mounting time is controlled to be constant, it is possible to secure a highly accurate and accurate tact time.

FIG. 8 shows the downward stroke of the mounting nozzle when the mounting time is constant and the mounting speed is constant.
Shown by comparing.

When the descending speed is set in advance and is descended by the distance X, the time when the mounting nozzle 2 reaches the predetermined distance ΔL from the substrate 6 is time t1a, and the electronic component 1 is mounted on the substrate 6.
The time when the device is mounted is time t1b (case A). Further, when the descending speed is the same as the case A but the descending distance is shorter than the case A by the distance α, the time when the mounting nozzle 2 reaches the predetermined distance ΔL from the substrate 6 is time t2a, the substrate 6 is.
The time when the electronic component 1 is mounted on the top is time t2b (case B). In FIG. 8, the descending stroke of the mounting nozzle 2 in the case A is shown by a dotted line and a solid line A, and the descending stroke of the mounting nozzle 2 in the case B is shown by a solid line B.

Comparing the case A and the case B,
As shown in FIG. 8, the difference in mounting time when the electronic component 1 is mounted on the solder paste 8 on the substrate 6 is time t1b-time t.
2b. Therefore, when the mounting speed is set in advance, the descending distance corresponding to the distance α changes depending on the condition of the board, that is, the warp amount of the board 6 and the width and thickness of the solder pattern on which the electronic component 1 is mounted. It can be seen that the mounting time also changes according to the descent distance.

The time required for the mounting nozzle 2 to reach the predetermined distance .DELTA.L from the substrate 6 is the time t similar to the case A.
1a and the descending distance is the same distance X-α as case B (case C), the host computer system 10
Is the time t until the predetermined distance ΔL from the substrate 6 is reached.
The descending speed in the high speed mode 1a is calculated from 1a and the distance X-α indicating the descending distance of the mounting nozzle 2 to descend the mounting nozzle 2. In FIG. 8, the inclination of the solid line C indicates the descending speed of the mounting nozzle 2, which is slower than the solid line B and is low. In case C, the time required to reach the predetermined distance .DELTA.L on the substrate is the same as in case A. Therefore, in mode 1b, the descending stroke indicated by the solid line A is the same as in case A. Become.

In the case C in which the mounting time is constant, the electronic parts are always kept constant for a fixed time in consideration of the condition of the board which varies depending on the warp amount of the board 6 and the width and thickness of the solder pattern. It is possible to secure the tact time with no variation because it can be equipped with.

FIG. 9 shows still another embodiment of the present invention. In this embodiment, as a means for measuring the height position of the mounting position on the substrate with respect to the electronic component sucked by the mounting nozzle, a contactor that descends together with the mounting nozzle and contacts the upper surface of the substrate, and a pressure sensor provided on the contactor And an amplifier for feeding back the electric signal output from the pressure sensor to the control means. In the embodiment shown in FIG. 9, the same parts as those in the conventional example shown in FIG.

Similar to the conventional example shown in FIG. 10, the upper computer system 10 previously reaches the upper portion of the guide 7 and the desired portion of the substrate 6 where the electronic component 1 is to be mounted and where the electronic component 1 is to be mounted. The distance L from the tip of the mounting nozzle 2 immediately before descending, the height H1 of the mounting component 6, and the thickness H2 of the substrate 6 are stored.

In this embodiment, a stopper 40 is provided at a predetermined height from the tip of the mounting nozzle 2, and the stopper 40 supports the contactor 41. At this time, the contactor 41 can freely move to the upper part with respect to the mounting nozzle 2, but with respect to the tip direction of the mounting nozzle 2, the lower end of the contactor 41 is moved to the mounting nozzle 2 by the stopper 40. The limit is that it is located a distance ΔL below the tip of the sucked electronic component 1. Further, the mounting nozzle 2 has a spring 42, and the pressure sensor 43 held by the spring 42 is in contact with the upper portion of the contactor 41.

That is, in the mounting nozzle 2, the contactor 41 supported by the stopper 40 is in contact with the pressure sensor 43, whose upper portion is held by the spring 42, when the pressing value is zero.

When the mounting nozzle 2 descends and the tip of the contactor 41 comes into contact with the substrate 6 (time t1), the pressure sensor 43 detects the pressing force, and the descending speed is increased via the amplifier 44. The signal is fed back to the speed controller 11 for controlling and the driving circuit 14 for driving the motor 4 via the loop 45. At this point, the electronic component 1 is located above the substrate 6 by a distance ΔL. Upper computer system 1
The mounting speed is switched to a low speed by 0, and the mounting nozzle 2 further descends by a distance ΔL. At this time, the mounting nozzle 2
Even if is further lowered, only the contactor 41 is pushed upward by the spring 42, so that the contactor 41 does not push the substrate 6 further and only the mounting nozzle 2 can be lowered, and the suction is released when the lowering is stopped. The electronic component 1 is mounted on the board 6.

According to the present embodiment, the time when the electronic component sucked by the mounting nozzle is located at an arbitrary height from the substrate can be detected by the contactor provided on the mounting nozzle, and the electronic component can be quickly moved to the arbitrary position. Since it moves at a low speed from an arbitrary position to a desired position on the substrate on which the electronic component is to be mounted, vibration in the lead pitch width direction at the tip of the mounting nozzle, which occurs when the mounting nozzle descends, can be reduced, and the mounting is performed. Since it is possible to prevent the solder paste from being crushed by the electronic component to generate a bridge, the component can be mounted with high accuracy.

[0050]

According to the present invention, since the vibration of the tip of the mounting nozzle in the lead pitch width direction, which occurs when the mounting nozzle descends, can be reduced, the solder paste provided on the substrate can be electrically charged. It is possible to prevent a bridge from occurring when mounting components, and it is possible to obtain a mounting machine that mounts components with high accuracy.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is an enlarged view of the vicinity of the tip of the mounting nozzle in the embodiment shown in FIG.

FIG. 3 is a diagram showing a descending stroke of the mounting nozzle in the embodiment shown in FIG.

FIG. 4 is a diagram showing another embodiment of the present invention.

5 is a sectional view taken along the line AA of the embodiment shown in FIG.

6 is a cross-sectional view taken along the line AA when the mounting nozzle is rotated by 45 ° in the θ-axis direction in the embodiment shown in FIG.

7 is a diagram showing a descending stroke of the mounting nozzle in the embodiment shown in FIG.

FIG. 8 is a diagram showing a descending stroke of the mounting nozzle when the mounting time is constant.

FIG. 9 is a diagram showing still another embodiment of the present invention.

FIG. 10 is a diagram showing a conventional mounting machine.

11 is an enlarged view of the vicinity of the tip of the mounting nozzle in the mounting machine shown in FIG.

[Explanation of symbols]

1 ... Electronic component, 2 ... Mounting nozzle, 3 ... Driving mechanism,
4 ... Motor, 5 ... Encoder, 6 ... Board, 7 ... Guide, 8 ... Solder paste, 9 ... Lead, 10 ... High-end computer system, 11 ... Control system, 12 ...
Position controller, 13 ... Speed controller, 14 ... Driving circuit, 15
... current transformer, 20 ... ultrasonic sensor, 21 ... amplifier, 22 ...
Loop, 30 ... Motor, 31, 32 ... Sensor, 40 ... Stopper, 41 ... Contact, 42 ... Spring, 43 ... Pressure sensor, 44 ... Amplifier, 45 ... Loop

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tadayuki Saito 5-2 Koyodai, Ryugasaki, Ibaraki Hitachi Techno Engineering Co., Ltd. R & D Laboratory (72) Kohei Yabino 5-2 Koyodai, Ryugasaki, Ibaraki Hitachi (72) Inventor Haruo Mikai 5-2, Koyodai, Ryugasaki-shi, Ibaraki Hitachi Techno-Engineering Co., Ltd.

Claims (1)

[Claims] Claim: What is claimed is: 1. A mounting nozzle holding an electronic component is driven on the upper surface of the substrate and the holding is released to mount the electronic component on the substrate. Means for measuring the distance to the held electronic component and driving of the mounting nozzle holding the electronic component to the substrate based on the measurement result of the measuring unit are performed at high speed from the substrate to an arbitrary position and at the arbitrary position. A mounting machine provided with means for moving the electronic parts from a predetermined position of the board on which the electronic parts are mounted at a low speed.