JPH0770636B2 - Electronic component container - Google Patents
Electronic component containerInfo
- Publication number
- JPH0770636B2 JPH0770636B2 JP6274088A JP6274088A JPH0770636B2 JP H0770636 B2 JPH0770636 B2 JP H0770636B2 JP 6274088 A JP6274088 A JP 6274088A JP 6274088 A JP6274088 A JP 6274088A JP H0770636 B2 JPH0770636 B2 JP H0770636B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- container
- lead frame
- lid
- opening edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
Description
【発明の詳細な説明】 （発明の技術分野） 本発明は、リード端子を側面から導出した電子部品の容
器に関する。TECHNICAL FIELD OF THE INVENTION The present invention relates to a container for electronic components in which lead terminals are led out from the side surface.
（発明の技術的背景とその問題点） 従来、電子部品を収納するガラス製の容器としては、た
とえば第２図に示すように一対のシェル１、１を向かい
合わせて、その接合部にリードフレーム２を貫通させ
て、この接合部を低融点ガラス３により気密に封止し、
固着したものがある。このようなものでは、上記シェル
１としてはアルミナガラス、ソーダガラス等を用い、封
止に用いる低融点ガラスとしては、酸化鉛（PbO）61％
〜75％、二酸化珪素（SiO2）14％程度を含むものを用い
ている。(Technical background of the invention and its problems) Conventionally, as a glass container for housing electronic components, for example, as shown in FIG. 2, a pair of shells 1 and 1 are opposed to each other, and a lead frame is provided at a joint portion thereof. 2 is penetrated and this joint is hermetically sealed with a low melting point glass 3,
Some are stuck. In such a case, alumina glass, soda glass, or the like is used as the shell 1, and lead oxide (PbO) 61% is used as the low-melting glass used for sealing.
75%, it is used those containing silicon dioxide (SiO 2) approximately 14%.
また、リードフレーム２としては、半田付け性、耐錆性
等を考慮して、42アロイ（Ni42％、Fe58％）あるいは42
6アロイ（Ni42％、Cr6％、Fe52％）を用いるようにして
いる。The lead frame 2 is made of 42 alloy (Ni42%, Fe58%) or 42 in consideration of solderability and rust resistance.
6 alloy (Ni42%, Cr6%, Fe52%) is used.
しかしながら、このようなものでは、封止に用いる低融
点ガラス３に酸化鉛が含まれているために耐酸性が低
く、また低融点ガラス３は耐熱性も低いのでリードフレ
ーム２の半田付け時に封止が損傷し易い問題があった。However, in such a case, since the low-melting glass 3 used for sealing contains lead oxide, the acid resistance is low, and the low-melting glass 3 also has low heat resistance, so that the lead frame 2 is sealed at the time of soldering. There was a problem that the stopper was easily damaged.
また、第３図に示すように、セラミック等の基板４の板
面に、たとえばアルミナの電極５をメタライズして形成
し、この電極５にコバール等の金属板状の蓋体６を半
田、溶接等により固着して封止し、上記電極５に42アロ
イ、コバール等のリードフレーム７を銀ロー付けしたも
のもある。Further, as shown in FIG. 3, an electrode 5 made of, for example, alumina is metallized and formed on the plate surface of the substrate 4 made of ceramic or the like, and a metal plate-shaped lid 6 such as Kovar is soldered or welded to the electrode 5. There is also one in which a lead frame 7 made of 42 alloy, Kovar, or the like is brazed to the above electrode 5 by silver brazing.
しかしながらこのようなものでは、セラミックの基板を
成形するための前処理が複雑で、しかも粉体を固めて焼
成するために寸法精度が低く、コストも高価になる。However, in such a structure, the pretreatment for molding the ceramic substrate is complicated, and since the powder is solidified and fired, the dimensional accuracy is low and the cost is high.
また、ガラスはメタライズをして銀ロー付けはできない
ので、このような基板にガラスを用いることはできない
問題がある。Further, since glass cannot be metallized and silver brazed, glass cannot be used for such a substrate.
（発明の目的） 本発明は、上記の事情に鑑みてなされたもので、確実な
封止を行え、充分な耐酸性を得られ生産性も良好な電子
部品の容器を提供することを目的とするものである。(Object of the Invention) The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a container for electronic components that can perform reliable sealing, obtain sufficient acid resistance, and have good productivity. To do.
（発明の概要） シェル状に成形したガラスからなり内外壁を貫通して側
部から気密にリードフレームを導出した基体の開口縁を
蓋体で気密に封止することを特徴とするものである。(Summary of the Invention) The present invention is characterized in that an opening edge of a base body made of a shell-shaped glass and penetrating inner and outer walls and airtightly leading a lead frame from a side portion is hermetically sealed with a lid. .
（実施例） 以下、本発明の一実施例を第１図に示す側断面図を参照
して詳細に説明する。(Embodiment) An embodiment of the present invention will be described in detail below with reference to the side sectional view shown in FIG.
図中、11はコバールガラスからなるシェル状の基体で、
溶融したガラスを鋳型に注入して固化させ、所望の形状
に成形したものである。また、この固化時に側壁を貫通
するようにリードフレーム12を配設し、上記基体11に一
体に固化させるようにしている。In the figure, 11 is a shell-shaped substrate made of Kovar glass,
The molten glass is poured into a mold to be solidified and shaped into a desired shape. Further, the lead frame 12 is arranged so as to penetrate the side wall at the time of this solidification so as to be solidified integrally with the base body 11.
この、リードフレーム12は、たとえばコバール金属（Ni
29％、Co17％）である。The lead frame 12 is made of, for example, Kovar metal (Ni
29%, Co17%).
そして、基体11の開口縁に、たとえばコバールガラス
（SiO2 65％、B2O3 20％）からなる板状の蓋体13を低融
点ガラス14等により気密に固着するようにしている。Then, a plate-like lid 13 made of, for example, Kovar glass (SiO2 65%, B2O3 20%) is airtightly fixed to the opening edge of the base 11 by a low melting point glass 14 or the like.
このようにすれば、低融点ガラス14は蓋体13の封止にの
み用いているので、リードフレームの貫通部位のような
応力が作用したり、あるいは半田付け時の高い温度にさ
らされることもなく、耐熱性が格別問題になることもな
い。By doing so, since the low-melting glass 14 is used only for sealing the lid body 13, stress such as a penetrating portion of the lead frame may act, or it may be exposed to a high temperature during soldering. Moreover, heat resistance does not become a particular problem.
そして、コバールガラスは容器として充分な耐熱性を有
し、リードフレーム12は、基体11の成形時に一体に成形
しているので、その半田付け時に、貫通部位が損傷する
こともない。The Kovar glass has sufficient heat resistance as a container, and since the lead frame 12 is integrally formed when the base body 11 is formed, the penetration portion is not damaged during the soldering.
そして、セラミック製の容器の場合は、1400℃程度の焼
成温度を必要とするのに比して、ガラスの場合は、900
℃ないし1000℃程度の温度で成形が可能で加工も容易で
ある。And in the case of a ceramic container, a firing temperature of about 1400 ° C is required, while in the case of glass, it is 900
It can be molded at temperatures of ℃ to 1000 ℃ and is easy to process.
なお、本発明は上記実施例に限定されるものではなく、
たとえば基体11の固化時に開口縁に金属性のリングを固
着し、このリングにコバール等の金属薄板をシーム溶接
して封止するようにしてもよい。The present invention is not limited to the above embodiment,
For example, a metal ring may be fixed to the opening edge when the substrate 11 is solidified, and a metal thin plate such as Kovar may be seam-welded to the ring for sealing.
（発明の効果） 以上詳述したように、本発明によれば基体にガラスを用
いて耐熱性が良好で、かつ確実な封止が可能な電子部品
の容器を提供することができる。(Effects of the Invention) As described in detail above, according to the present invention, it is possible to provide a container for an electronic component which uses glass as a substrate, has good heat resistance, and can be reliably sealed.
第１図は本発明の一実施例を示す側断面図、 第２図、第３図は各別の従来の電子部品の容器の側断面
図である。 11……基体 12……リードフレーム 13……蓋体 14……低融点ガラスFIG. 1 is a side sectional view showing an embodiment of the present invention, and FIGS. 2 and 3 are side sectional views of a container of another conventional electronic component. 11 ... Base 12 ... Lead frame 13 ... Lid 14 ... Low melting glass
Claims (3)
を貫通して側部から気密にリードフレームを導出した基
体と、 この基体の開口縁を気密に封止する蓋体と、を具備する
ことを特徴とする電子部品の容器。1. A base body which is made of glass molded into a shell shape and which penetrates the inner and outer walls and airtightly leads a lead frame from a side portion, and a lid body which hermetically seals an opening edge of the base body. A container for electronic parts, which is characterized in that
て、基体の開口縁に金属リングを固着しここに金属板状
の蓋体を溶接することを特徴とする電子部品の容器。2. A container for electronic parts according to claim 1, wherein a metal ring is fixed to the opening edge of the base and a metal plate-shaped lid is welded thereto.
て、基体の開口縁に板状ガラスの蓋体を溶着して封止し
たことを特徴とする電子部品の容器。3. A container for electronic parts according to claim 1, wherein a lid made of plate glass is welded and sealed to the opening edge of the base body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6274088A JPH0770636B2 (en) | 1988-03-16 | 1988-03-16 | Electronic component container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6274088A JPH0770636B2 (en) | 1988-03-16 | 1988-03-16 | Electronic component container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01240450A JPH01240450A (en) | 1989-09-26 |
| JPH0770636B2 true JPH0770636B2 (en) | 1995-07-31 |
Family
ID=13209089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6274088A Expired - Lifetime JPH0770636B2 (en) | 1988-03-16 | 1988-03-16 | Electronic component container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0770636B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0427617U (en) * | 1990-06-27 | 1992-03-05 |
-
1988
- 1988-03-16 JP JP6274088A patent/JPH0770636B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01240450A (en) | 1989-09-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
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