JPH077119A - Semiconductor package - Google Patents

Abstract

(57) [Abstract] [Purpose] To obtain a structure of a semiconductor package that facilitates addition / change of wiring even after the semiconductor package is mounted on a printed wiring board. [Structure] One or more lead terminals 2 among a plurality of lead terminals 2 of a semiconductor package 1, and a hole 7 for wiring connection is formed in a flat portion exposed to the outside of the semiconductor package 1.
It is characterized by the provision of.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package mounted on a printed wiring board as a circuit element,
In particular, the present invention relates to the structure of a lead terminal in consideration of easy wiring connection.

[0002]

2. Description of the Related Art A conventional semiconductor package is, for example, as shown in FIG. 5A, a DIP type or flat pack type semiconductor package 1 having lead terminals 2 extending to the outside for signal input / output on both sides. Then, there is a semiconductor package 1 having a lead terminal 2 on only one side as shown in FIG.

Of these conventional semiconductor packages 1,
Referring to a typical DIP type semiconductor package (FIG. 5A), the shape of the lead terminal 2 is tapered because it is inserted into a through hole of a printed wiring board to be mounted and fixed by solder on the back surface. In general, the printed wiring board and the package body 1 are processed and have a flat portion so as to be separated from each other by a predetermined distance for the purpose of heat dissipation.

FIG. 6 shows a state in which the semiconductor package 1 having the lead terminal 2 having such a shape is usually mounted on the printed wiring board 3.

In FIG. 6, the semiconductor package 1 keeps a constant distance between the main body and the printed wiring board 3 by the flat portion of the lead terminal 2, and is inserted into the through hole 3a in the printed wiring board 3 to be the back surface. Then, it is fixed to the printed wiring board 3 by the solder 4.

However, if a wiring addition / change request is made after the mounting of the semiconductor package 1 is completed, or if a lead wire for measurement needs to be attached, the connection as shown in FIG. Both ends of the wire 6 for use were respectively connected to the lead terminals 2 (which have been already soldered) to be connected to the same location by the solder 4.

When an electronic component such as the bypass capacitor 5 is connected between the lead terminals 2, it is fixed on the printed wiring board 3 in the same manner as the semiconductor package 1 and then the wire 6 is soldered again. Due to this (at the same location), they were connected.

[0008]

As described above, in the conventional semiconductor package, when the wiring is added or changed after being mounted on the printed wiring board, or when the lead wire for measurement must be attached, This has been done by soldering a wire for connection to a portion already fixed by solder.

Therefore, there is a problem in that it is troublesome since the same place once soldered has to be soldered again.

Further, since it becomes necessary to connect the same location by soldering several times (even when connecting one wire, the printed wiring board is already soldered to fix the semiconductor package. Therefore, it is necessary to solder at least twice), and there is a problem that the soldering work becomes difficult as the number of wirings increases.

Further, when a plurality of wirings are soldered to the same place as described above, it cannot be denied that there is a problem in connection strength, and if they are detached, a plurality of semiconductor packages are mounted on the printed wiring board. There is a problem that the reliability of the configured circuit is reduced.

The present invention has been made to solve the above problems, and has a structure of a semiconductor package that facilitates addition and change of wiring even after the semiconductor package is mounted on a printed wiring board. The purpose is to provide.

[0013]

A semiconductor package according to the present invention is one or more of a plurality of lead terminals which are led out for signal input / output between a semiconductor device packaged inside and the outside. The lead terminal of
It is characterized in that a hole for wiring connection is provided in a flat portion of the lead terminal drawn out of the semiconductor package.

In particular, the semiconductor package according to the present invention is applicable to a DIP type or a flat pack type in which lead terminals are drawn out from both side surfaces, or a lead terminal is drawn out from only one side, such as a three-terminal regulator. The semiconductor package is a semiconductor package having a lead terminal having a flat portion to the extent that a hole for wiring connection can be provided.

[0015]

In the semiconductor package according to the present invention, holes for wiring connection are provided in the flat portions of any or all lead terminals that are drawn out of the semiconductor package. Therefore, even after the semiconductor package is once mounted on the printed wiring board, connection of electronic components such as a bypass capacitor due to addition / change of wiring is facilitated.

Further, by providing the lead terminal with a hole for wiring connection, reconnection to a once connected portion is avoided.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In the figure, the same parts are designated by the same reference numerals and the description thereof will be omitted.

FIG. 1 is a perspective view showing the whole of a semiconductor package according to the present invention. As a target type of the semiconductor package, for example, in FIG. 1 (a), the semiconductor package is drawn out for signal input / output. A DIP type semiconductor package (may be a flat pack type) having lead terminals 2 on both sides is shown, and FIG. 1B shows a semiconductor package 1 having the lead terminals 2 on only one side.

In particular, the present invention is characterized in that the flat portion of the lead terminals 2 of these semiconductor packages 1 is provided with holes 7 for wiring connection (this wiring connection hole 7 is used for all leads). It is not necessary to provide it on terminal 2.)

Usually, when these semiconductor packages 1 are simply mounted on the printed wiring board 3, the tips of the lead terminals 2 are inserted into the through holes 3a in the printed wiring board 3 as in the conventional semiconductor package (FIG. 5). , The back surface is fixed with solder 4, but when a request for addition / change of wiring occurs after mounting these semiconductor packages 1 (the same applies when a lead wire for measurement is attached), as shown in FIG. Similarly, when connecting the lead terminals 2 with the wiring wires 6 on the front surface side of 3 and connecting the bypass capacitors 5, the lead terminals 2 can be easily connected from the front surface side of the printed wiring board 3. You can

Next, as a method of connecting the lead terminals 2 in these semiconductor packages 1 to the wires 6 or electronic parts (for example, the bypass capacitors 5), as shown in FIG. There is a method in which the wire 6 is entangled as it is in the wiring connection hole 7 provided in the.

Further, as shown in FIG. 3B, the solder 4 may be used for fixing. In this case, since the lead terminal 2 is provided with the hole 7 for connecting the wiring, it is possible to obtain a connection strength much larger than that in the case where it is simply soldered, and at the same place several times as in the conventional case. Since it is not necessary to solder, the soldering work becomes dramatically easier.

In the above embodiment, the shape of the hole 7 for connecting the wiring provided in the lead terminal 2 has been described by showing one circular hole as shown in FIG. 4 (a). The shape of the hole provided in the lead terminal of
It is not particularly limited to the above-mentioned embodiment.

Specifically, as shown in FIG. 4B, a plurality of circular holes may be provided in the flat portion of the lead terminal,
Further, as shown in FIG. 7C, the same effect can be obtained even if one or more square holes are provided. Furthermore, if the strength of the lead terminals can be sufficiently maintained, the shape shown in FIG. 4D can be adopted.

Further, the hole for connecting the wiring described above may be used not only for connecting the wiring but also for hooking the measuring pin of the measuring device.

[0026]

As described above, according to the present invention, since a hole for wiring connection is provided in the flat portion of any or all of the lead terminals drawn out of the semiconductor package, the printed wiring board is temporarily provided. Even after the semiconductor package is mounted on it, there is an effect that an electronic component such as a bypass capacitor can be easily connected due to addition / change of wiring.

Further, by providing the lead terminal with the hole for wiring connection, it is possible to avoid the reconnection to the once connected portion, so that it is possible to sufficiently maintain the connection strength of the connection portion and the semiconductor package. There is an effect that it is possible to prevent a decrease in reliability of the circuit configured by the above.

[Brief description of drawings]

FIG. 1 is a perspective view showing an entire semiconductor package according to the present invention.

FIG. 2 is a cross-sectional view showing a state in which the semiconductor package according to the present invention is connected by wiring on a printed wiring board.

FIG. 3 is a perspective view for explaining a wiring method using a lead terminal included in the semiconductor package according to the present invention.

FIG. 4 is a diagram showing an example of a shape of a hole for wiring connection provided in a lead terminal of a semiconductor package according to the present invention.

FIG. 5 is a diagram showing an overall perspective view of a conventional semiconductor package.

FIG. 6 is a cross-sectional view showing a state in which a conventional semiconductor package is connected to a printed wiring board by wiring.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor package, 2 ... Lead terminal, 3 ... Printed wiring board, 3a ... Through hole, 4 ... Solder, 5 ... Bypass capacitor, 6 ... Wiring wire, 7 ... Wiring connection hole.

Claims (1)

[Claims] 1. A semiconductor package having a plurality of lead terminals drawn out for signal input / output, wherein one or more lead terminals of the plurality of lead terminals are parts drawn out of the semiconductor package. A semiconductor package characterized in that a hole for wiring connection is provided in a flat portion of the semiconductor package.