JPH0773155B2 - Method of manufacturing circuit parts - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a circuit component in which a circuit pattern is formed on an injection molded member.

[0002]

2. Description of the Related Art Conventionally, there are mainly the following two methods for forming a typical circuit pattern of an injection molded circuit component formed of high performance engineering plastic or the like. One is the one-shot mold method,
As shown in FIG. 11, first, in the step of FIG.
Using a highly heat-resistant resin that can withstand the high temperature of soldering as a raw material, a substantially flat plate-shaped substrate 30 is formed by injection molding. Next, in the step of FIG. As a treatment, an etching treatment, a catalyst treatment or the like is performed, and then an electroless copper plating 31 is applied to the entire surface.

Further, in the process shown in FIG.
Masking 32 is performed with a masking resist, an etching resist, or the like, and then the whole is electroplated in the step of FIG. After that, the resist is stripped off unnecessary portions and copper etching is performed to form a predetermined circuit pattern 33 on the surface of the substrate 30.

Another circuit forming method is the two-shot molding method shown in FIG. 12, in which the primary-side molded part 34 having a desired shape is first formed in the step shown in FIG.
In this step, as a pretreatment, an etching treatment, a catalyst treatment, etc. 35 is performed. Next, in the step of FIG.
The primary-side molded part 34 is put in a mold, and the secondary-side material is injected onto the mold, and the secondary-side material 36 is used to form the primary-side molded part 3
After forming a double structure in which only the predetermined portion 34a of No. 4 is exposed and covered, a plating process is performed in the step of FIG. 4D so that only the exposed predetermined portion 34a of the primary-side molded part 34 is made of metal. This is a method of forming the film 37.

[0005]

However, the one-shot molding method involves many production steps and is expensive because copper etching is required, and a masking step is included. It is difficult to make a solid because there are various restrictions such as rounding is required, workability is poor, and the rising angle of the surface of the molded part is within about 60 degrees and the step is about 8 mm or less. There is a problem such as.

On the other hand, the above-mentioned two-shot molding method is suitable for forming a three-dimensional circuit, but since it is a double molding method, it is difficult to align the primary-side molded part 25 within the frame and the work efficiency is poor. Also, there are various problems that the cost is high because electroless plating is the basis.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and is low cost and simple for a component forming a relatively simple circuit. It is an object of the present invention to provide a device capable of forming a circuit pattern on a substrate, and the gist thereof is a first plateable injection in which a convex portion for a conductive pattern is formed on the surface and a through hole is formed in a part thereof. When a non-platable second injection-molded member having the same cross-section as the first injection-molded member with the convex portion cut off is fitted on the upper surface of the molded member, electroless plating is applied to the entire fitting body. After the treatment, an electroplating treatment is performed to form a conductive pattern on the exposed surface of the first injection-molded member, and the peripheral portion of the through hole on the back surface of the first injection-molded member is cut off. Of the circuit component characterized by forming the insulating portion In the production method.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail based on the embodiments shown in FIGS. 1 is an exploded perspective view of constituent members of the circuit component according to the present invention, FIG. 2 is an overall perspective view of the circuit component formed by the method of the present invention, FIG. 3 is a partially enlarged perspective view of the circuit component, and FIG. 3 is an explanatory view of a portion of FIG. 3, (a) is a sectional view taken along line III-III in FIG. 3 before processing, (b) is the same explanatory drawing after processing, (c) is a bottom view of (b),
FIG. 5 is a cross-sectional view corresponding to FIG. 4 of another embodiment, in which (a) is a plan view before processing, (b) is the same cross-sectional view, (c) is a plan view after processing, and (d) is the same cross-sectional view. FIG. 6 is a perspective view of a conventional multipolar connector, FIGS. 7 to 9 are explanatory views of forming the multipolar connector shown in FIG. 6 by the method of the present invention, and FIG. 10 is a portion showing another embodiment of the method of the present invention. It is a perspective view.

In the figure, reference numeral 1 is a platable first injection-molded component, which is made of a highly heat-resistant resin, such as polyetherimide (PEI), which can withstand the high temperatures of soldering. A plurality of protrusions 3 having the same shape as the circuit pattern to be formed are formed on the upper surface 2a. Four
Is a through hole formed at both ends of the ridge 3, and the through hole 4
Penetrates from the upper surface 2a of the base 2 to the back surface 2b. When the first injection-molded component 1 is molded with a resin containing a plating catalyst, the molded component as it is is used, and when it is molded with a general high heat-resistant resin,
Pre-plating treatment such as etching treatment and catalyst treatment is applied to the entire surface.

Reference numeral 5 denotes a non-platable second injection-molded part made of a high heat-resistant resin such as polyphenylene sulfide (PPS), and its base 6 has the same size as the plateable first injection-molded part 1. As shown in FIG. 1, the upper surface 2 of the first injection molded part 1 is
It is formed in the same shape in cross section so that it can be fitted to a. Then, a through groove 7 that penetrates vertically is formed on the base 6 so that the surface 3a of the ridge 3 of the first injection-molded component 1 is exposed when fitted to the plateable first injection-molded component 1. Has been formed.

Then, as shown in FIG. 1, the injection-moldable first injection-molded part 1 and the non-platable second injection-molded part 5 having the above-described constructions are fitted to each other to form both injection-molded parts 1 and 5. Are fixed to form one fitting body A. This fixing can be performed only by press fitting at the time of fitting, but depending on the shape, it may be partially fixed by adhesion with an adhesive.

Then, the fitting body A is subjected to electroless plating to form a thin plating layer, and then electroplating is applied, whereby the first injection exposed from the through groove 7 of the second injection molded part 5. The plating layers 8a, 8 are formed on the front surface 3a of the ridge 3 of the molded part 1, the inner peripheral surface of the through hole 4, and the rear surface 2b.
b and 8c are respectively formed, and the plating layer 8a formed on the surface 3a of the ridge 3 becomes a circuit pattern. in this case,
Since the front surface 3a and the back surface 2b of the ridge 3 are communicated with each other through the through hole 4, it is possible to perform the electroplating process on each of the above portions.

Next, as shown in FIG. 4A, the plating layer 8a formed on the front surface 3a of the ridge 3 of the first injection molded part 1 and the plating layer 8c formed on the back surface 2b are Since it is continued by the plating layer 8b formed on the inner peripheral surface of the through hole 4, as shown in FIG. 4B, the periphery of the through hole 4 on the back surface 2b side of the base 2 of the first injection molded component 1 is formed. As shown in FIG. 3C, a chamfering process is performed to form an insulating portion 9a to separate the circuit pattern 8a from the plating layer 8c on the back surface 2b of the substrate 2, and the plating layer on the back surface 2b of the substrate 2. 8
Let c be the earth part.

The through holes 4 are shown in FIGS.
Is an example of a stepped hole formed by a combination of a large diameter hole 4a and a small diameter hole 4b. In this case, as shown in FIG. The hole 4b is punched out and an insulating portion 9b is formed to separate the circuit pattern 8a from the ground portion 8c on the back surface 2b of the substrate 2.

FIG. 6 shows an embodiment in which the present invention is applied to a conventional multipolar connector 10 provided with a noise removing filter. In a connector with a filter equipped with a chip capacitor 11, its connector pin 12 is shown.
In forming a conductive pattern for connecting the chip capacitor 11 and the chip capacitor 11, the pattern portion can be easily formed by applying the present invention.

That is, in FIG. 7, reference numeral 13 denotes a resin shield case, a front surface 13a of which is formed with a convex portion 14 serving as a conductive pattern portion, and a through hole for inserting the connector pin 12 into the central portion of the convex portion 14. When the hole 15 is formed,
The surface of the shield case 13 is subjected to pre-plating treatment such as etching treatment or catalyst treatment. And the convex portion 1
4 and the insulating frame member 16 corresponding to the second injection-molded component having the through hole 16a fitted therein is fitted. On this occasion,
An adhesive or the like may be applied to the mating surface 16b of the insulating frame member 16 and fixed by adhesion.

Next, as shown in FIG. 8, the insulating frame member 16
Is integrally fixed to the shield case 13, and then electroless plating is applied to the whole in this state to form a thin plating layer. Further, as shown in FIG. 9, the plating layer 17 is formed on the entire surface of the shield case 13 except the surface covered with the insulating frame member 16 by performing the electroplating process. In the case of the present embodiment, since the conductive pattern portion 17a and the shield portion 17c are integrated through the plated layer 17b of the through hole 13 through the through hole 15 for inserting the connector pin 12, the insulating frame member after the plating process is performed. On the side opposite to the mating side with 16 (on the rear surface 13b side of the shield case 13), an insulating portion (not shown) is formed by chamfering the periphery of the through hole 15 in the same manner as in the above embodiment, and the conductive pattern portion is formed. 17a and the shield part 17c side are separated.

FIG. 10 shows another embodiment of the method for forming the insulating portion, in which an annular convex portion 18 is formed around the through hole 15 on the side opposite to the fitting side of the insulating frame member 16. Then
If an insulating member 20 having a hole 19 to be fitted therein is fixed to the outside of the annular convex portion 18 by fitting and then plated, an insulating portion is formed on the outer periphery of the annular convex portion 18, so that chamfering is performed. Processing can be omitted. But in this case
Since the plating process is all electroless plating, the cost increases.

[0019]

As described above, the method of manufacturing a circuit component according to the present invention provides a plateable first injection molding member having a projection for a conductive pattern on the surface and a through hole formed in a part thereof. When the non-platable second injection-molded member having the same cross section as the first injection-molded member with the convex portion cut off is fitted on the upper surface, the entire fitting body is subjected to electroless plating. Then, an electroplating process is performed to form a conductive pattern on the exposed surface of the first injection-molded member, and at the same time, the peripheral portion of the through-hole on the back surface of the first injection-molded member is cut off to form an insulating portion. Because it is characterized by forming
Since the number of production steps is small and the electroplating process is possible, it is possible to produce at low cost, and there are various effects such that a three-dimensional circuit pattern can be freely formed.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of constituent members of a circuit component according to the present invention.

FIG. 2 is an overall perspective view of a circuit component formed by the method of the present invention.

FIG. 3 is a partially enlarged perspective view of the same circuit component.

4 is a cross-sectional view taken along the line III-III of FIG.

FIG. 5 is a cross-sectional explanatory view corresponding to FIG. 4 of another embodiment.

FIG. 6 is a perspective view of a conventional multipolar connector.

FIG. 7 is a first explanatory view of forming the multipolar connector shown in FIG. 6 by the method of the present invention.

FIG. 8 is a second explanatory view of forming the multipolar connector shown in FIG. 6 by the method of the present invention.

9 is a perspective view of the multipolar connector shown in FIG. 6 formed by the method of the present invention.

FIG. 10 is a partial perspective view of another embodiment.

FIG. 11 is an explanatory diagram of a conventional one-shot molding method.

FIG. 12 is an explanatory diagram of a conventional two-shot molding method.

[Explanation of symbols]

 1 First Injection Molded Component 2 Substrate 2a Upper Surface 2b Back Side 3 Convex Strip 3a Same Surface 4 Through Hole 5 Second Injection Molded Component 6 Base 7 Through Groove 8 Plating Layer 9a Insulating Section 9b Insulating Section 10 Multipolar Connector 11 Chip Capacitor 12 Connector Pin 13 Shield case 14 Convex portion 15 Through hole 16 Insulating frame member 17 Plating layer 18 Annular convex portion 19 Fitting hole 20 Insulating member

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H05K 1/02 N 3/42 B 7511-4E // B29L 31:34

Claims (1)

[Claims] 1. A projection having a conductive pattern on the surface thereof
Plateable first injection molding member having a through hole partially formed
The first injection-molded member with the convex portion cut off on the upper surface of the
A non-plating second injection molding member with the same cross section
When mated, the entire mating body is electroless plated
And then electroplating the first injection molding
When a conductive pattern is formed on the exposed surface of a member,
1 Cut the peripheral edge of the through hole on the back surface of the injection molded member.
Manufacturing circuit parts characterized by removing the insulation part
Build method.