TW526689B - Molded electronic assembly - Google Patents

Abstract

A molded electronic assembly is formed from a first molded plastic portion including a component mounting plane and a plurality of non-coplanar surfaces, and a second molded plastic portion molded around the first molded plastic portion and including openings therein defining selected regions of the first molded plastic portion. Metallization is applied to the selected regions of the first molded plastic portion defining a network of electrically conductive traces and conductive regions providing electrical continuity over at least two of the non-coplanar surfaces. A battery is supported above the component mounting plane by stand-offs formed in the second molded plastic portion, and a circuit protection device is mounted in substantial contact with the battery. A method for assembling an electronic module is also described.

Description

526689 V. Description of the invention (1) The present invention is generally related to electricity: electronic circuit modules in the field of Ming, more circuit modules, and especially electronic component packages that are structured in plastic cover molding. This is directed to a molded electronics Components, and external components, electronic circuit protection, electronic components, connections, etc., are combined into 1 integrated component. Background of the Invention ::: One of the most important products such as mobile phones " Rechargeable batteries (battery :) :: = I line of the road. With the exception of the power supply system, it is not obvious that this: PRODUCT,: = :: Uses the material media. In addition, the integrated component of the surface provides suitable support and accessibility to the keyboard, display, memory module, battery pack and connector. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 2 f: The important characteristics of portable consumer products-generally small size and weight. T Even attracting the main purpose features and functions, low cost and short product life cycle. These features are partially driven by the portable, handheld, and fierce competition due to the size and growth rates of individual markets due to the products themselves, and the continuous improvement of design tools and integration technologies. Manufacturers' suppliers in fast-moving markets must ensure that they provide advantages, motivations, and trends in applicable markets that are compatible with the materials. Generally, some advantages of a ′ should include reduction in size and weight, expansion of characteristics, enhancement of integration level, lower cost, and shorter design cycle. Components such as battery packs limit the reduction in size, but technology also helps reduce size, such as integrated circuit designs that produce higher performance devices with lower power consumption. Reducing the power consumption of portable products can be reduced in turn -4- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) A7

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 526689 V. Description of the invention (2) L-use support ′ ,,, Ό% of the power capacity of the batteries of these units. Because of this test, the driver needs less electric clay, and it can also reduce the current to a negative power. It is a battery capacity (the unit of measurement is, for example, one milliampere for one hour). Private pool specifications. Advances in battery chemistries (ie, clock ions and polylithium ions) have also reduced battery size. It has been noted that improvements in 1C size reduction and integration techniques are related to battery size,% reduction, but all technologies have evolved along similar lines. Housings, interconnections, assembly features, component platforms and connectors have not significantly become smaller, and they have not benefited from Wenliang alternative technologies such as component count or simplicity. Therefore, the battery pack area offers a significant new opportunity in electronics and electromechanical design and manufacturing. The battery of the portable product contains a port: t terminal, the M array must be connected to-sequentially soldered to a == K circuit board, and then inserted-plastic cover. The cover alone contains one or more plastic sheet parts. Therefore, there is a need for an enhanced integration level of electronic modules, especially battery G. These electronic modules include an external electronic component and a connector. SUMMARY OF THE INVENTION These two and their requirements are the molded electronics of the present invention = sub-components, electronic circuit paths, connectors, and housings. In a specific embodiment, the moulded electronic component is lifted out and electrically [two! A circuit protection device is embedded with a contact battery to provide suitable connectivity between subassemblies == applied to many designs and structures, and in manufacturing Reduce assembly size = -5- this standard ^^ 0 National Standard (CNS) A4 specification (210 X 297 mm) (please, please read the precautions on the back and fill in this page) --- I --- -1TII1 --- II »/ 526689 Five invention descriptions (3 books become lower 'and further miniaturize the products they use. Z Benfa month < In one form,-the molded electronic components include-the first 1 Wuzhi : Part t, which contains-component inlay plane and many non-coplanar surfaces-plastic branch part, which surrounds the first molded plastic part: molded and its content defines the first molded plastic part Selected area = metallization of the selected area of the molded plastic part. The selected area of the molded plastic part defines at least two non-ugly: a conductive path network that provides electrical continuity on the surface. And the conductive area are supported by the edge of the branch line formed on the second molded part保 装 装 # #% 池 'and—Electric 4 devices embedded in contact with the battery entity. One of the first and second molded plastic parts is formed from a plastic material that can be electroplated.' ^ 成 童 罘 一 ^ The plastic part is preferably formed by the height of the glass filled with the filler material. The second molded plastic part is preferably formed by plastic plastic. Warm According to the viewpoint of the present invention, the metallization system is a multi-step electroplating process of encapsulating electroplating operation. The pre-treatment process of encapsulation and incision can be applied at the first time. The electric steep% plating plate is implemented in the present invention before it is made—in a specific embodiment, the battery is gas-connected to the molded electronic component, and the battery connection = / = the plastic part of the electrical connection includes metalization on it The conductive formation of the electroplatable electrical connection is best established by means of fusion bonding. "The battery's circuit protection device is described in another embodiment of the present invention-a circuit protection device. Matters needing attention fill in I i again order Φ -6- B 7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (4 Circuit protection device is placed on the inlaid plane ..., also. :: Electrical connection of the protective device of the two molded plastic parts Mosaic. For electrical protection = In the embodiment, many electronic components are placed in the shape of electricity, by means of back-building pads, and the device for these electronic components is preferably a relatively low resistance at normal operating temperature The positive temperature coefficient of the object and its circuit core when the temperature of the electronic device is switched :: (faster. When the temperature drops below the device's switching temperature, the reciprocation is installed back to a relatively low resistance. ：: In another specific embodiment, an electronic component includes a plastic Gan Shixin, a base component and at least one integrated side portion, two Θ plastic cover (the adjacent inner surface defines the internal content of the plastic cover 2: A first pattern of conductive material placed on these adjacent internal surfaces,: placed on the surface of ^-and internally connected to the conductive material. The first round: "electronic components, and-placed at least A plastic cover An outer surface, (the second pattern of electrically conductive material, wherein the second pattern line is connected to the conductive material of the conductive material of the first pattern children. In one form of this embodiment, the second pattern of the conductive material forms an electrical connector. The electrical connector preferably includes non-coplanar conductive portions. Not in another form of this embodiment, a battery is a first pattern electrically connected to a conductive material. The battery is preferably supported adjacent to the electronic components placed on the internal surface, and the battery is essentially enclosed in a plastic cover = volume. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

526689 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and the description of the invention (5 Materials <and-in a specific embodiment, the antenna is formed in a pattern of conductive material. The antenna can be a planar antenna. In another specific embodiment of the invention, a second module for assembling electronic modules is described in the following steps, which is in the shape of a two-shot molding process, ... a plastic cover, of which the second plastic material is at least partly Surrounding a first plastic material, metallize the selected area of the outer cover to define the circuit path and: “Piece inlaid area” will place the electronic component in the component inlaid area, and a reflow soldering system will be built with these electronics. The electrical connection of the components, and the placement and electrical connection of at least another component in a post-reflow attachment process. The step of forming a plastic cover further includes the steps described below, introducing a first plastic material into a mold to form a first One-click molding the component, placing the first mold component into a second mold, and introducing a second plastic material into the second mold to form a plastic cover. Brother-plastic material can be— Plastic material that can be electroplated, and the second plastic material can be a non-platable plastic material. The step of metallizing the selected area is taken as a good step-the step includes the steps described below, between non-electrical and electrolytic deposition Applying a conductive layer sequence 'wherein the selected area of the outer cover includes an area where the first plastic material can be accessed through the opening R in the second plastic material. According to a specific embodiment of the present invention, the conductive layer sequence is applied to the plastic Outer cover (at least one electrical connection is formed on one surface, and one surface of the plastic outer cover is non-coplanar with at least one component inlaid area. The steps for placing electronic components in these 7L inlaid areas further include a through-selection and placement process Place electronic components, the selection and placement system: Position these electronic components on the component inlaying feet formed during metallization. This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 public love); ------- Order --- (Please read the precautions on the back before filling this page) 526689 A7 B7 V. Description of the invention (6: Γ coating is applied to the appropriate mosaic area to be used at T And π pieces are fastened in place. According to yet another specific embodiment of the present invention, the steps of placing and electrically connecting at least one other component at ζ are as follows: in the manufacturing process, by The following steps prepare the component, and then at least another-===: quasi-U through the welding process to electrically connect the electrical contact of the at least another component = the part inlaid area. Attach the other-in the post-reflow process- Further objectives, features and advantages will be described by the following description and attached drawings. Brief description of the printed diagrams of the employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 1 is a cutaway perspective view of a molded electronic component according to the present invention; Drawing! Sectional view of section line 2 _ 2; Figure 3 is a perspective view of a simplified form of a substrate used in the present invention, which depicts a pattern of conductive circuit paths formed on the substrate; Figure 4 is a section taken along Figure 3 A cross-sectional view of line 4-4; FIG. 5 is a perspective view of the first shot molding part of the electronic% part of FIG. 1; FIG. 6 is a perspective view depicting the feature, which is added to FIG. 5 by the second shot molding process Figure; Figure 7 is a section along the line 7 · 7 of Figure 6 Fig. 8 is a perspective view of the molded electronic component of Fig. 1; Fig. 9 depicts the details of the connector and the insert of the molded electronic component of Fig. 1; Circuit protection binding # -9-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 526689 V. Description of the invention (7) A cutaway perspective view; Figure η is a molded lightning + 钿, a figure 12 series-according to the present invention: another side 717 figure; body view; stand-up embodiment of a branch sub-assembly-a schematic diagram describing the application of a circuit protection device;]-a simplified block of electronic circuit protection According to the present invention, the process diagram of the specific embodiment of the molded electronic component is a detailed detailed description of the manufacturing steps of the manufacturing process of the molded electronic component of FIG. 1 to illustrate the invention. The comparative advantages are clearer. Parts: Figure 1 is a planting diagram of a molded electronic component according to the present invention, which is generally labeled with the number 100, and the position of the electronic component is partially cut out. Molded Leizitian Electronics, and the piece 100 is shaped A with a double-click molding process. The double-click molding process can be introduced by two plastics to mold an integrated component. The two plastics have similar but different molding characteristics. . Then it will: • Explain the manufacturing process in detail. The battery 101 is a prominent feature of the module 100, and the battery i 00i is not only formed by the integration of the module 1, 00, but also mechanically supported and electrically connected, such as the foot piece 102 and the support support insulator. 201 (Figure 2). The electrical connection is made to the battery via the gold battery connection support plate 105, and the metal battery connection support plate 105 is preferably fused to the contacts on the battery and the battery connection piece 103 at the same time. The welding process will be explained in more detail below. 10- This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) 526689

V. Description of the invention (8 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs: The battery connection sheet 103 is formed during the double-click molding process, and is provided with a gold = dagger-conducting path. The conductive path is formed by each piece. 3 to here = a suitable part of the milk circuit path or path 106 and the component mounting foot pad 2 formed on the substrate 104 between the manufacturing king j, the 1-cell connection sheet 103, and the battery positioning sheet 102 It is a molded electronic component 100 (the side surface formed by the integration of a few plastic covers). These side portions, within the 03 &quot; 卩 surface 2 0 3, 2 0 4 and adjacent to these side portions The ▲ surface 1 0 4 shares the internal volume of the foot component 100. Figure 2 is particularly obvious = the different dashed line 20 2 connects the sides of the side portions 2 0 and 2 4 and points the person. The negative system is included in the internal volume thus defined. In fact, the finished molded electronic component is measured from the outer surface of a cover 205 to the plane 2 defined by the end points A, B of these sides. The total thickness of 2 is preferably not more than twice the thickness of the battery 100 itself. In a specific embodiment, the molded electronic component i 00 has no cover, but has a cover portion that is approximately co-expanded with the dashed line 202 of FIG. 2. 7 FIG. 3 and FIG. 4 describe a path containing conductive circuits. The substrate was made of double-sided molding using double-click molding. Figure 3 shows a pattern with conductive circuit paths 302. The pattern of the conductive circuit paths 302 was placed on the substrate 3101. Figure 4 &lt; The cross-sectional view more clearly shows that the substrate 3 in FIG. 3 is actually a composite of a first-stroke conversion and a substrate portion 401, a second-stroke molding portion 402, and a metallization process. The second-stroke-molded part 4 〇2 is a part containing or mounting the first-stroke-molded base part 4 〇 丨 and the metallization process generates an electrical circuit path 3 0. The first-stroke and the second-stroke mould Both the 401 and 402 parts of the system are applicable by one. -11-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) I --------------- -^ --------- (Please read the notes on the back before filling out this page) 526689 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (9 High-temperature thermoplastics for electronic applications. High-temperature thermoplastics for this application. II. Crystalline polymerization even if there are others.) In order to make the first = the most stealth molding process; LCP preferably contains ^% Degree is used for the purpose of m etiquette, and is a kind of non-object particles, such as exemption 2: 2: make ... plate system ... 402 does not have an antecedent effect, and is used for the second shot molding part to give property attribute filler, under The reason will be explained. Without this kind of gold In order to make the molded plastic parts suitable for reflow bonding operations, the plastic materials used for the first and the second :: = should have-high heat deviation: horse reinforced- The second and second impact of the mechanical properties of plastic materials and reduce the anisotropic effect of V non-period red LCPS, the first and second: both of the best impact plastics are reinforced with non-metallic fibers, such as glass. An appropriate fiber filling percentage falls between 20% and 40%. ^ ^ During the manufacturing process, a first shot plastic material is introduced to form the first shot to form the base portion 401. Next, the first shot-molded base portion is placed in a first face mold, wherein the first shot-molded base portion forms a portion of the mold volume for the second mold. The second die-casting mold system is designed to place the second die-casting plastic material 402, as shown in FIG. 4, so the second die-casting mold system is effectively used as a mask for forming the conductive path 302. Of course, it is technically possible to reverse the order in which these materials are molded, that is, the first shot-molded plastic is made into a mirrorless plastic and the second shot-molded plastic is made into an electroplatable plastic. Most of these process variations are specified by specific applications. When preparing the exposed surface of the first-stroke molding material, a series of clean-ups are performed. This paper size applies to China National Standard (CNS) A4 (21 × 297 mm). (Please read the precautions on the back before filling (This page) Binding ----------- #-526689 A7 V. Description of the invention (1〇) The washing, swelling and etching steps, as known by those in the bank, fully activate the plastic materials of the electron microscope. Table ^ may = for the negative impact of the surface of the glue. Non-keyable plastics 2 are inert and drainable. Surface system The electroplating process that leads to the formation of the conductive path 302 is a combination of non-electrical and sexual equipment. First, 'non-electric copper is deposited with a severity in the range of 2 to 4 micrometers' on the prepared area of the first-stroke molded plastic, and a sub-system is electrolyzed at a thickness of 30 to 40 micrometers. Above the copper, the private secretary> Several nickel layers deposited on the non-electrical layer ^ thickness ranging from 2 to 6 micrometers are then used-non-electrical process on copper f, if the Wang acts as a diffusion barrier, but its effect on wear Hardness and resistance are also the reasons. Next, a non-thin gold immersion layer with a thickness ranging from 0.001 to 025 microns is applied to ensure low contact resistance, especially when used in connector applications. Part of the component 100 is 00. It also indicates that it is ready to provide a conductive hole (plated via hole (piat "gh holes)). These conductive holes 108 will provide conductive material from the -side to the other-side of the substrate ι04. In this example, these conductive holes 108 provide conductive paths to the opposite side of the substrate 104, and the conductive path of the electric rolling connector 109 from the train. The component-embedded foot pad 110 is also shown in FIG. 5. As mentioned previously, the plastic material selected for constructing the molded electronic component 100 is compatible with a reflow soldering process. When populating the component inlay area of the substrate 104, traditional selection and placement techniques are used to place the electronic components 107, such as surface-adhesive integrated circuit package and chip components, such as the resistance -13 MW standard applicable to Chinese national standards (CNS) A4 specifications (210 X 297 mm_ C, please read the notes on the back before filling out this page) Packing — ^ --------- Printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economic Affairs 526689 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (devices and capacitors. As known by the Institute of Electrical and Electronics Technology, solder is deposited on the component before the heart is placed on the component.) And the components themselves are fixed by the use of adhesive deposition before being put in place. The components are then guided to the column / valley point temperature by the reflow furnace used to heat the solder. Wait for the electrical connection of electronic components 1 () 7. Some electrical and electronic components should be exposed-reflow furnace. When the electronic component 100 is molded, the battery 100 is not subject to one, two, and four passes. Instead, the battery is connected The plate 105 is connected to the two or seven and two by welding, and the connection support plate 105 is connected to the battery slice 1 by a welding operation that occurs after reflow. The welding is known as ultrasonic, which is based on being welded. Minimize the thermal stress of these connected components when an electrical connection of 2 is created between the two metals. 22 = The connection process can also be hot, because localized and time-limited suitable thermal valleys are connected to road money sensing. The temperature stress of the element is less than the temperature stress of reflow. It is recognized that tq is ready, and even there is a soldering process that can be performed after reflow, which is suitable for sensing elements. W Formed in the preferred embodiment of the electrical connector 10 The 9 series is constructed without = any metallic duo mold inserts, which is the best method of constructing Lian Zhai in the previous art. It has been confirmed that the electrical connector 1 09 of the present invention meets the electrical requirements, and is connected to Γ% sub-mechanical requirements without It is necessary to insert the contact element into the mold and the molded plastic of the contact elements such as% I. In fact, the electrical connection 109 of the present invention includes a three-dimensional characteristic in the form of an extended conductive portion 901, which extends out of the component 100. Edge of 〇02, -14 The Zhang scale is applicable to Zhongguanmu ^^^ grid (2ig χ Norwegian public -i ----------------- ^ __ w— (Please read the precautions on the back before filling in this (Page) 526689 A7 V. Description of the invention (12) and beyond the plane, in which the remaining part of the conductive surface of the connector 109 falls on this plane. Because the extended part 901 of the connector 109 is formed of a keyable adhesive material, it can be These extensions 901 are charged over the entire surface area. "Ensure that these connectors i 09 are mechanically and electrically connected to the mating connections. Extension two of connector 109 is provided in two dimensions. The characteristic means that the molded electronic component 100 of the present invention conforms to the definition of MID only, or a three-dimensional molded cross-linking device. The first is' FIG. 6 describes the molded electronic component formed during the _stamping process 1 00 = 5 Shao: 2 after the first—the molding process is completed—the—the molding plastic part is entered—the second die Wherein, the 500th shape of the first-stroke molding part = 7 # knife ~ mold volume. This process has been matched with Figure 3 and Tudun Ming on the top and introduced-the second plastic material. This second plastic material: S, Zhong 4 has become "the area of the molded component 100 is not required #: belongs to, as described above, the second non-keyable material family is used as a mold cover, the process shadow plastic Has been ... (hunted by a thin hood) to avoid subsequent metallization :. "Region and domain" where the finished product does not want to hit: manufacturing: leaching = double-thickness guarantee of relatively thin materials and low-profile structural details. The second hitting process provides surface details in the first die to confirm the material. The flow channel and important position in the surface of the branch == the die-casting branch is filled with nothing. Of course 'these filler channels and welding 15- this paper rule money (eNS) A4 ^^ 297 public love) 526689 A7 V. Description of the invention (13 B7 holes are precisely placed at the location of most of the introduction points and the most serious The specific plastic used for the catty, and the relatively thin product of centimeters in the second shot mold are specified. For the grade to be! The pattern is to ensure that the second is good: a filler channel and the welding hole must be carefully passed. The resulting filler. Small shape. The mold used in the present invention can obtain a phase of 25. Micron narrow circuit. 甬: The gas electronic component 100 series has been constructed with a distance between the two diameters ^ Γ, The dimensions are as small as 250 microns. The structure of the finished product is shown in Qiu. The &amp; ', y of these areas are formed in the second die, as shown in Figure 6. The insulator 2 (^, U = j contains the battery positioning sheet). Electronic components on 102 and support stand 104 ^ ^ Insulator 2G1 is supported and installed on the substrate. It can be seen that the second 丄; = battery 1〇1 (see the figure ... formed by the plastic material system shown in Figure 6 and at least partially deposited between the rings). In, Figure 7 series-Figure 6 ^ 二 敏 #Wu manufacturing process of plastic materials 50 0. &amp; A cross-sectional view of the component, and it helps to identify the part of the component formed in the mother-moulding step. A first part; 0 material is formed in the first shot molding :, 701 section, or required The metallized protrusion J 1% takes the appropriate mold cover within the final piece to the subsequent gold — Ma Lian Ling Zhi-Qiu Ba 7ft9 @ ^ formed in the second-stroke molding process period one: h702 tends to encapsulate or Surrounding part 7〇ι. 4 structured thin shao, such as used for battery-, mouthpieces 2101, ... support for bite 102 (Figure 8), as in 201, by the second brother It is formed by 702. Figure 9 depicts the molded electronic component shown on the 10J side. These are from the base ... guide and connector 'such as &amp; υ 4 ^% pattern 106 is electrically connected to the external Liantian Ruchu 1 Series Department # 间 的 反反 -16 scale applies Chinese National Standard (CNS) A4 specifications (210 X 297 ^ &quot; 526689

Description of the Invention (14 The conductive hole 108 (Figure 5) printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs = 109 has been plated through during the process described above with reference to Figures 3 and 4. In the same metallization process, electricity The area is established on the battery connection piece 103, and the appropriate electrical connection is established on the conductive path 106 network on several inlaid surfaces 401. The conductive channels are integrated to provide non-co-planar surfaces. Electrical seams, such as cell 103 and conductive path 106. As shown, electrical connectivity can be established with or without conductive hole 108. The non-plated plastic part of the second impact molding process 7〇2 It is also used to provide the electrical insulation required for such connector contacts ι〇ξ, as well as provide structural characteristics. The perspective view of FIG. 10 depicts a battery slice 1002 containing another row of electrically-connected electric oil 1001 to terminate the battery The metal battery connection support plate 1003 on the slice 1002 is easier to switch on. The battery slice 1002 is placed on the opposite side of the battery 1000. The cut-off also indicates a circuit located close to the battery ιιι. Protection device 1004 (As shown in Figure 11). The circuit protection device 1004 is preferably in direct physical contact with the battery 1001, but if the device is within a range of about 0.01 cm of the battery, it will still function correctly. Of course, if the circuit protection device It is a traditional fuse instead of a temperature response device, so it does not need to be close to the battery. Therefore, the circuit protection device · 1004 is placed as close to the battery as possible to respond to the battery temperature. Due to the double-click molding process, a mosaic support insulator is formed. 1102, the purpose is to ensure that the circuit protection device 1004 is properly arranged in accordance with the battery 100 1. The circuit protection device 1004 will be described in more detail later. In order to expose to the high temperature caused by the welding back mud process The possibility of damage to the circuit protection device 1004 is minimized. The circuit protection device 1004 is best welded and positioned after the reflow operation. The reflow operation-17 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ---- 1 -------- install ----- (Please read the precautions on the back before filling this page) Order i 526689 A7

V. Description of the invention (15) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs It is used to mold electronic components of most electronic components. Figure 12 depicts another molded electronic component. 19 Π ^ ^ ^ 1 / / version of the infringement, generally referred to as Mori Ding to indicate 'the characteristic material department connection contact coffee system is placed against the In the plane of the substrate 1203, the conductive circuit path 1202 and several soldering pads 1204 are placed on the substrate portion 1203. Therefore, the other component 1200 is L-shaped. The electrical contact paths i202 and UN are grounded on at least two non-coplanar surfaces in this embodiment to provide electrical connection. ^; The circuit protection device 1004 described with reference to FIG. 10 and FIG. 11 is preferably a polymer positive temperature coefficient (p T C) device made of a conductive polymer mixture of plastic and conductive particles. These devices are well known in the art. For example, U.S. Patent No. 6,002,008 issued to Hogge. However, other devices that display rapid resistance changes at a critical temperature are also applicable. As mentioned before, the polymer ρ τ c device inlay is very close to or in contact with the private cell 'and the resistance of the device is heated to above its switching temperature and becomes very high. This heating can occur due to the increase of room temperature or battery temperature, or it can be caused by the resistance heating of the machine. Incremental resistance is reduced to a minimum level that can be used to protect the battery and equipment in the circuit. Figure 13 depicts a voltage source 1301 'that provides a current I 1303 to a load RL 1302, which can be a battery. The protection device 1004 installed due to contact with the battery, the device 1004 will quickly respond to a temperature increase exceeding its device switching temperature. As the resistance of the device increases, the current 1303 supplied to the load 1302 decreases rapidly, thereby protecting the voltage source 1301 and the load 1302. Polymer PTC device 1004 visible -18- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -------------- I 1 I 1 Order --I ------ (Please read the notes on the back before filling out this page} Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 526689 A7 ---- B7 V. Invention Description (16) is-settable fuse, Because-once the device temperature drops below the device switching temperature, its resistance will return to a normal low level. The electronic circuit protection provided by the electronic component according to the present invention extends beyond the circuit protection device as described above. It is placed on the conductive path. Electronic components 107 (Figure 1) can provide additional protection to a lithium-ion or polymer lithium-ion battery 'as shown in the simplified block diagram of Figure 14. A safety 1C 1401, as manufactured by Philips Semiconductors The SAA1504T device 'controls the maximum normal charge and discharge levels of the battery, and provides a secondary protection level to allow overcharge and overdischarge. A pair of metal-oxide half-field-effect transistor packages 1402 series architecture in the safety IC 14〇1 Interrupts the charge and discharge paths under the control of the IC. Safety IC 14〇1 continuously monitors the battery pressure, and compares it with an accurate internal reference voltage to measure, as shown in Figure M :, the electronic circuit protection provided includes a circuit protection device ι〇〇 4. As mentioned in the rain, it provides a quick response to the errors suggested by the increased battery temperature. Figure 15 is a perspective view of another specific embodiment of the molded electronic component, which is generally labeled with the number 15GG. This descriptive specific embodiment Has the characteristics of the external connector contact 1501 'These external connector contacts ΐ5 () ι are placed in a plane perpendicular to the base Chen 150 points 3, of which the conductive circuit path and electrical foot pad 1504 series It is placed on the base portion 1503. The electrical contact position 1505 provides electrical connection on at least two non-coplanar surfaces. In addition, FIG. 15 shows a detailed embodiment of a spiral sigh antenna 15 implemented in a conductive circuit path layout. 〇6. Such an antenna &quot; 〇6 can be a useful feature of an electronic group ^ The design of the electronic components is included in a communication table such as a cellular phone. Of course, other antenna shapes, such as various-- --------- -—----- II · -------- · (Please read the notes on the back before filling this page) -19-

526689 A7

The printed antennas printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs can also be implemented. Design Tianyanyan # A, to achieve a desired radiation pattern described in the flat form. The U-plane surface, or antenna, can be, for example: 16 series, a description of the manufacture of molded electronic materials according to the present invention "601): One of them-electroplatable encapsulation:" the plastic material shall be at least partially surrounded or provided In the process step_2, the user performs selective metallization to improve the circuit path of the package and the electronic component inlaying pad. After the metallization, use the selection and placement technology known in the art to place the electrical components in On the plastic cover (step just), in order to keep these electronic parts in the desired position, it can also be used-adhesive coating step. And the plastic cover with electronic components is then passed through the τ_ process step. The reflow * furnace is wound. Because some components may be adversely affected by the reflow process, certain components, such as batteries, can be handled individually, and they can be attached to the component by other methods (step 605). When attaching a battery, you can first choose to prepare the battery by attaching a suitable electrical contact to the battery, then place the battery in the appropriate position inside the plastic cover and reflow the electrical process after the domain connection method. As mentioned above, a similar post-reflow process can also be used to choose to attach other sensing components, such as circuit protection devices. Here has been described a molded electronic component that has more significant advantages than previous techniques. It is obvious to those skilled in the art that Modifications can be made without departing from the spirit of the present invention and Fan Qi's. Therefore, the present invention does not want to be limited except for the scope of patent application in the annex. -20- This paper size applies to Chinese national standards (CNS) A4 specification (210 X 297 mm) Γ ^ -------- ^ --------- (Please read the precautions on the back before filling this page)

Claims (1)

Printed clothing by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 526689 ___g_____ VI. Patent Application Scope-i A molded electronic component comprising: a first molded plastic part, the first molded plastic part including a component Mosaic planes and many non-coplanar surfaces; a soil that surrounds the first moulded plastic part and a second moulded plastic part of the mould and contains openings therein which define the first moulded plastic Part of the selected area; The metallization is applied to the selected area of the first molded plastic part, defining a network of conductive paths and conductive areas, the network being on at least two non-coplanar surfaces Electrical continuity is provided on the top; a battery supported by a support insulator formed in the second molded plastic part above the component mounting plane; and a circuit protection device embedded in substantial contact with the battery. 2. The molded electronic component as described in item 2 of the patent scope, wherein one of the first and first molded plastic parts is formed of an electroplatable plastic material. 3. If the molded electronic component of item 丨 of the patent application scope, wherein the first molded plastic part is formed of high-temperature thermoplastic plastic filled with $ electric filler material / glass. 4. The molded electronic component according to the scope of the patent application, wherein the second molded plastic part is formed by a high-temperature plastic plastic filled with glass. -5. If the molded electronic component of item i of the patent application scope, wherein the metallization is a multiple step of the electroplating process, the electroplating process includes both electroless and electrolytic electroplating operations. -21-Lai Jin Guanjia County (CNS) A 21Q χ 297 public love on this paper scale —, ---------------- Order ----- 1— (please first Read the notes on the back and fill in the essence) 526689 Printed A8 B8 C8 D8 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, and applied for a patent scope of 6. 6. Molded electronic components for the application of the fifth patent park, including _ included; 1 L: The processing process before the expansion and etching operations is performed before the first electroless plating operation. 7 'Π: The molded electronic component of item 1 of the patent scope, in which the battery is a 2% battery connection piece to be electrically connected to the molded electronic component, the person: the battery connection piece is formed on a plateable plastic part and The upper part is covered with a metalized conductive area. ‘口 8. == The molded electronic component of item 7 of the range, wherein the battery pack milk connection is established by welding. I Π :: The molded electronic component of the first item of the scope, where the circuit == is in contact with the battery entity and is inlaid by the first-inlaid plane on the inlaid plane by the brother and brother Molded plastic parts are formed. 1〇.: = Γ molded electronic component of item 1, wherein the electrical connection to the circuit protection device is constructed by welding in the molded electronic component of item 2 of the benefit range ;; placed in the formation On the conductive feet in the component mounting plane, the electrical connection to the sub-component is established by reflow soldering. 12 .: Two; the molded electronic component of the first item in the scope '# 中 此 电路 卢; ϊί =: Polymer positive temperature coefficient device' The polymer positive temperature and coefficient device has—at normal operating temperature—relatively Low — and: and: the resistance is increasing relatively quickly when a device switches temperature: 13. If the molded electronic component of item 12 of the patent scope is known, the resistance of the circuit-breaker protection device will drop when the temperature drops to Device switching temperature = -22- 'The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21〇χ 297mm —.---------------- Order · ---- ---- (Please read the notes on the back before filling in this page) 526689 The scope of the patent application wherein the conductive material wherein the electrical connection further includes: return to a relatively low resistance 値. 14. An electronic component, comprising: a plastic outer body, which has a base portion and at least one person, (side β points, where the plastic case is adjacent to the internal volume of the plastic case; The electronic components placed on the adjacent internal surfaces of the conductive material, and the electrical components placed on at least one of the internal surfaces, such as 7 ', on the first pattern of the conductive material; ,: At least one conductive material on the outer surface of the plastic shell &lt; a pattern of the younger brother, wherein the guide Raisila + the first pattern of the conductive material is cut. Feiyun then 15. Rushen μ patent scope The second pattern of the electronic component of item 1 &amp; forms an electrical connector. 16. As in the scope of the patent application! The electronic component device of item 5 includes a non-coplanar conductive part. Item of electronic components, ----a battery that is electrically connected to the first pattern of the conductive material '18. 18 such as the scope of the patent application No. 17 ^^, &lt; Private components, where the battery is placed adjacent to the surface of the temple Electronic components And the battery is enclosed in the internal volume of the plastic case. For the electronic component of the scope of application for patent No. 14, one of the antennas is formed in the first pattern of the conductive material. The electronic component of item 14 in the material range, where the antenna is a flat antenna. • 23- This paper size applies to China National Standard (CNS) A4 specifications (210 X —_-------- ^- ------ Order --------- (Please read the phonetic on the back? Matters before filling out this page} Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 526689 6. Scope of patent application 21. A method for assembling an electronic module, a) The following steps are followed by double-clicking a double-stroke die-sword to form a plastic shell, where--at least part of the ring key of the plastic material branch-the first-plastic material branch · (Brother) to implement all genus and component inlaid areas in the redundant and selected areas; externalizing the circuit path by placing the electronic components in the component inlaid area; d) establishing a bathroom connection through a reflow soldering process, and ，、 Electrical components of S temple private element e) After the reflow attachment system Element. The animal husbandry table is placed peacefully and electrically connected to at least one other 22. Such as the application of the 21st item in the scope of the patent application, the negative and negative methods, in which forming a plastic foot v lift K (a) further includes the following steps: ^ The office also al) introduces a first plastic material into the component; Qi Qi to form a one-shot mold a2) puts the first: one-shot molded component into a second mold; and J / 3) Zhidi a plastic The material is introduced into the second mold to form a plastic peripheral. 23. The method according to item 22 of the patent application, wherein the first plastic is an electroplatable plastic material. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 24. If the application for the 22nd item of the patent scope is Ganshan, 〆Wanwanfa, the second plastic material is a non-platable plastic material. · 25 · Where is the scope of patent application? Shi, 圏 罘 21 and 10,000 methods, in which the step of applying metallization to the selected area (hi; 隹 _, κ .. K (b) further includes the steps described below, both non-electrical and electrolytic deposition Less ρη, A &gt; Beitian 宥 also implemented a conductive layer sequence, and the outer shell of -24- x 297 mm) This paper size applies the Chinese national standard 526689 A8 Βδ C8 D8, the scope of the patent application has been selected including the second area Plastic material area of the first plastic material. Qiaokou was able to be connected. 26. The method described in item 25 of the patent application, and aa, is for the purpose of crying on one of the surfaces of the plastic case. But the electrical connection is: = External break-the surface is less than the element (one is non-coplanar.% Bajiatu 27. If the method of the scope of patent application No. 21, the middle of the middle-mind release early-from a soil ^ at 70 The step of placing electronic parts in the part inlaying area: further packaging process to place electronic components, the selection and placement process will be; the part is located on the component inlaying foot formed during the metallization., Shen :: Range 27 The method of item, in which the 'selection' method is used (apply the adhesive to the appropriate inlay area to fasten the electronic component in place before the eye-flow soldering.) Modification :: Please patent the method of item 21 'The step (e) of placing and electrically connecting at least another component in a post-reflow attachment process further includes the following steps: el) The at least another component is an attachment process by fixing the electrical contact to the component Element; e2) the at least one other element Placed in a suitable position on a plastic housing; and e3) electrically connecting the electrical contacts of the at least another component to the selected component mounting area by a welding process. 30. The method of claim 29, wherein the at least one other component includes a battery. -25- X 297 mm) I —I— ^. T —-------- (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs