JPH0773754A - Manufacturing method of conductive member and manufacturing method of electronic circuit board - Google Patents

Abstract

(57) [Abstract] [Object] The present invention relates to an improvement in a method for manufacturing a conductive member and a method for manufacturing an electronic circuit board, which depends on a fluid adhesive when bonding a repair member and a board. Instead, it aims to implant it with good insulation and conductivity. A method of manufacturing a conductive member includes a step of forming an adhesive layer on one surface of a film substrate, a step of forming a conductive pattern on the other surface of the film substrate, an adhesive layer, a film substrate and a conductive material. And a step of cutting the laminated member on which the pattern is formed, wherein the adhesive layer and the film-shaped substrate are made of a heat-resistant polyimide resin material. The method for manufacturing an electronic circuit board includes a step of removing an existing conductive member, a step of forming a groove by excavating a region where the conductive member is removed, and a step of thermally bonding another conductive member to the groove, The other conductive member includes using an adhesive member in which an adhesive layer, a film substrate and a conductive pattern are laminated in advance.

Description

Detailed Description of the Invention

[Table of Contents] Industrial Application Field of the Prior Art (FIG. 7) Problem to be Solved by the Invention Means for Solving the Problem Action Example (1) Description of First Example (FIGS. 1 to 3) ) (2) Description of the second embodiment (FIGS. 4 and 5) (3) Description of the third embodiment (FIG. 6)

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a conductive member and a method of manufacturing an electronic circuit board, and more specifically, to a thin film multilayer wiring board when a defect or a design change occurs. The present invention relates to improvement of a method for transplanting repair wiring and pads. In recent years, as electronic devices such as computers and image processing devices have become faster and more multifunctional, there has been a demand for mounting electronic components on a circuit board at a high density. Therefore, similar to the multi-layer wiring technology of semiconductor elements, in the circuit board, the multi-layering and wiring miniaturization are progressing. For example, a multi-chip module (MCM) compatible with bare chip mounting has been actively developed, and in a large computer or the like, a thin film multilayer wiring board in which a resin material having a low dielectric constant is laminated has been developed.

According to the development of the substrate by the thin film method, the wiring density increases as the resin used as the insulating film has a lower dielectric constant. In particular, miniaturized chips and I / O
When the pins are mounted at high density, the wiring pads of the circuit board, which plays a role as an interface, are densified due to the miniaturization of the board itself. On the other hand, in order to surely mount the electronic component on the thin-film multilayer wiring board, the loss of the wiring on the surface of the board is never allowed. As a support for the technique of providing high-density and fine wiring, a reliable and simple wiring restoration technique is required in case of loss of wiring or electrodes. In addition, a repair technique that can be applied to a wiring connection change accompanying a design change is required.

Therefore, there is a demand for a manufacturing method capable of removing the surface wiring at a defective portion or a design-changed portion and transplanting and bonding a replacement transplantation wiring prepared in advance.

[0005]

2. Description of the Related Art FIG. 7 is an explanatory diagram according to a conventional example. FIG. 7A is a repair process diagram of a pad according to a conventional example,
FIG. 7B shows a wiring repair process diagram according to the conventional example. For example, in the case of repairing a pad of a thin film multilayer wiring board used for a large computer, FIG.
As shown in (A), first, the defective pad 2 is removed from the substrate 1A. Here, the defective pad 2 is removed by an excimer laser or the like, and the good pad 3 is left as it is on the substrate 1A. A groove is formed in the portion where the defective pad 2 is removed. At this time, the groove portion is a fine one having a depth of several μm and an opening width of several hundred μm.

Thereafter, the epoxy adhesive 4 is filled in the groove. At this time, the epoxy adhesive 4 is an insulating material and is dropped in the groove by a micro dispenser or the like. Then, the repair pad 5 is bonded to the substrate 1A. As a result, the pad of the thin film multilayer wiring board is repaired. In addition, when repairing the wiring of the thin-film multilayer wiring board,
As shown in (B), first, the wiring 7 in the defective portion X is removed from the substrate 6. Here, the wiring 7 of the non-defective portion is left as it is on the substrate 1A, and a groove portion is formed in the portion where the wiring 7 is removed.

After that, an epoxy adhesive 8 is filled in the groove to bond the repair wiring 9 to the substrate 1A. next,
The gap between the existing wiring 7 and the repair wiring 9 is soldered or the like. As a result, the wiring 7 of the thin-film multilayer wiring board is repaired.

[0008]

By the way, according to the conventional example, the groove portion from which the defective pad 2 is removed and the defective portion X are removed.
Epoxy adhesive 4 in the groove from which the wiring 7 of
And 8 are filled. Therefore, there are the following problems. Epoxy adhesives 4 and 8 are heat resistant adhesives, but few can be used in a heating atmosphere of 200 ° C or higher, and it is no exaggeration to say that there is no one that can be used in 300 ° C or higher (industrial materials 1991, July separate volume 39, No. 9).

For this reason, the soldering process cannot be endured during the chip surface mounting after the bonding process, and the repaired part may be thermally destroyed. This is a long time of 300 ° C in the soldering process.
This is because the substrates 1A and 6 are exposed to the above heating atmosphere. As a result, the epoxy adhesives 4 and 8 become unstable. When the thermal decomposition progresses, there is a risk that the adhesive force between the wiring 9 and the substrate 1A will be reduced, or the insulation resistance of the adhesive 4 or 8 will be deteriorated.

In FIGS. 7, (A) and (B), a micro dispenser or the like is used when the epoxy adhesive 4 or 8 is filled in the groove. This is the adhesive 4
This is to apply a small amount of No. 8 to the groove portion having a very small area.
However, when the repairing pad 5 or wiring 9 is transplanted, excess adhesive 4 or 8 may flow out from the groove. This could cause it to coat adjacent wiring. This is due to the high density and miniaturization of the defective portion X.
This is because the distance between the wiring and the adjacent wiring is very short.

In addition, it is preferable that the epoxy adhesive has a high viscosity to some extent in terms of adhesiveness. However, if the viscosity is too high, the needle of the injector will be clogged, making it impossible to supply the adhesive. In FIG. 7B, soldering or the like must be performed in order to establish conduction in the gap between the wiring 7 and the repair wiring 9. However, epoxy-based adhesives (hereinafter referred to as fluid adhesives) 4 and 8 crawl up from the groove, and intervene between both wirings 7 and 9 to increase the contact resistance, which may cause disconnection later. There is a risk that

The present invention was created in view of the problems of the conventional example, and when the repair member and the substrate are adhered to each other, the insulating property and the conductive property do not depend on the fluid adhesive. It is an object of the present invention to provide a method for manufacturing a conductive material and a method for manufacturing an electronic circuit board, which enables good transplantation of the member.

[0013]

A method of manufacturing a conductive member according to the present invention comprises a step of forming an adhesive layer on one surface of a film substrate as shown in FIGS. The method has a step of forming a conductive pattern on the other surface of the film-like substrate, and a step of cutting the laminated member on which the adhesive layer, the film-like substrate and the conductive pattern are formed, wherein the adhesive layer and the film-like substrate are It is characterized by being made of a heat-resistant polyimide resin material.

The first method of manufacturing an electronic circuit board according to the present invention, as shown in FIGS. 1, 3 and 5, respectively, shows a step of removing an existing conductive member and a step of removing the conductive member. The method has a step of forming a groove by excavating the formed region and a step of thermally adhering another conductive member to the groove, and the other conductive member is formed by the method for manufacturing a conductive member of the present invention. The adhesive member is used.

Furthermore, the second method of manufacturing an electronic circuit board of the present invention, as shown in FIG. 6, shows a step of removing an existing conductive member and excavating a region where the conductive member is removed. And a step of forming a double-sided adhesive film in the groove, and a step of thermally adhering another conductive member onto the double-sided adhesive film.

The first and second electronic circuit boards of the present invention are provided.
In the manufacturing method described above, there is a step of joining the existing conductive member and another conductive member after the step of thermal bonding, and the above object is achieved.

[0017]

In the method of manufacturing a conductive member of the present invention, as shown in FIG. 2A, an adhesive layer made of a similar material is formed on one surface of a film substrate made of a heat-resistant polyimide resin material. . Therefore, by cutting the laminated member on which the adhesive layer, the film-shaped substrate, and the conductive pattern are formed, it is possible to manufacture an adhesive member such as a repair wiring or pad. Unlike the conventional example, the repair wiring or pad has a form in which an adhesive layer is previously provided under the conductive pattern.

As shown in FIG. 3 (B), the first method of manufacturing an electronic circuit board of the present invention is an adhesive member made of the conductive member of the present invention when the repair conductive member is thermally bonded to the groove. Is used. Therefore, the step of applying the fluid adhesive to the groove portion having a minute area is omitted. Further, it is not necessary to use a micro dispenser or the like as in the conventional example. As a result, as the circuit board becomes denser and finer, for example, even when the distance between the wiring in the defective portion and the adjacent wiring becomes extremely short, excessive adhesive as in the conventional example causes the groove portion There is no possibility that it will flow out from the outside, and there is no fear of covering adjacent wiring.

An adhesive member formed of a polyimide resin material can sufficiently withstand a heating atmosphere of 300 ° C. or higher in a subsequent step. For example, in the soldering process when mounting the surface of a chip, even if the substrate is exposed to a heating atmosphere of 300 ° C. or higher for a relatively long time, the polyimide resin adhesive layer maintains a stable state. Therefore, its adhesive strength is maintained,
The insulation resistance also remains in good condition.

Further, in the second method of manufacturing an electronic circuit board of the present invention, as shown in the embodiment of FIG. 6, for example, a region excluding a defective conductive member is excavated, and a double-sided adhesive film is formed in the groove. To be done. Therefore, similar to the first manufacturing method, it is possible to bond other conductive members such as repair pads and wires on the double-sided adhesive film without adversely affecting the surrounding wires and electrodes. After that, the existing conductive member and the other conductive member are locally heated directly between the two members by, for example, a laser processing method, and are melt-bonded.

As a result, it becomes possible to implant another conductive member with good reproducibility and good insulation and conductivity. In addition, it is possible to reliably and firmly establish conduction between both members.

[0022]

Embodiments of the present invention will now be described with reference to the drawings. 1 to 6 are diagrams illustrating a method of manufacturing a conductive member and a method of manufacturing an electronic circuit board according to each example of the present invention. (1) Description of First Embodiment FIGS. 1A to 1C are explanatory views of a thin film multilayer circuit board according to each embodiment of the present invention, and FIG. 1A is a plan view thereof. Yes, FIG. 1B is a plan view of the non-defective pad, and FIG. 1C is a plan view of the defective pad.

For example, a thin film multilayer wiring board that can be used in a large computer is shown in FIG.
Hundreds to thousands of pads 101 and surface wirings at intervals of several μm 10
2 are provided. The circuit board 100 is made of a ceramic or resin substrate. The pad 101 is an electrode for connecting the mounting component 103, for example, a semiconductor integrated circuit (hereinafter referred to as LSI) device. The surface wiring 102 is connected to the multilayer wiring layer of the circuit board 100.

In FIG. 1B, the non-defective pad 101 is
It consists of a shape obtained by partially dividing the pattern of the numeral "8". The input / output electrodes of the mounting component 103 are joined to the division pattern portion. The octagonal pattern portion is connected to external wiring or a multilayer wiring layer in the circuit board. Note that FIG. 1 (C)
The defective pad 104 indicates a state in which the octagonal pattern portion is missing due to a change in mounting or a mounting defect.

Next, an explanation will be given of such a design change and a transplanting method for repairing a defective portion. Figure 2
3A to 3C are process diagrams of forming a repair pad according to the first embodiment of the present invention, and FIGS. 3A to 3C are related to the first embodiment of the present invention. The transplanting process drawing of the repair pad is shown, respectively. For example, in the case of forming the adhesive repair pad 14A as shown in FIG. 3 (B), in FIG. 2 (A), first, the polyimide adhesive 12 is formed on the glass substrate 11.
Apply. Then, a base film (film-like substrate) 13 is formed on the adhesive layer. Then 130 °
The substrate 11 is heated for about 30 minutes at C, and the polyimide adhesive 12 is temporarily cured.

Here, a polyimide film (made by Toray, DuPont, Kapton) having a thickness of about 7.5 μm is used as the base film 13. For the adhesive 12, a dicryme solution containing 24% of end-added type polyimide (Kanebo N
SC product, trade name IPM-600) is used. Both materials have good heat resistance at 300 ° C. or higher and also have electrical insulation.

Next, referring to FIG. 2B, a metal thin film 14 such as copper or aluminum is formed on the base film 13, and then a repair pad pattern (conductive pattern) 14A is formed.
To form. Next, in FIG. 2C, the laminated member on which the polyimide adhesive 12, the base film 13 and the repair pad pattern 14A are formed is cut. The thickness of this laminated member is about 5 μm. For example, as a cutting method, laser processing is performed through a mask on which a repair pad pattern is formed. The shape of this pattern is a "8" shape in which a regular octagon having a side of 240 μm and a regular octagon having a side of 310 μm are combined. The pattern processing and element separation at this time are performed by a KrF excimer laser.

As a result, the adhesive repair pad 14A composed of the polyimide adhesive 12, the base film 13 and the repair pad pattern 14A can be formed. In addition, when forming the adhesive repair pad 14A with wiring, a processing method by photolithography or the like can be considered in addition to the processing method by the excimer laser using a mask. Next, when replacing the defective pad 104 shown in FIG. 1C with the non-defective pad 101, the defective pad (not shown) is removed from the circuit board 100 in FIG. 3A. After that, the region where the defective pad is removed is excavated to form the groove portion 15. Here, the groove portion 15 has an opening width of about 400 × 400 μm □. As a method of removing the defective pad, etching is performed by an excimer laser or the like using a dielectric mirror mask having an opening to be processed.

Further, in FIG. 3B, the adhesive repair pad 14A is thermally bonded to the groove portion 15. Here, the adhesive repair pad 14A uses the adhesive member formed according to the first embodiment of the present invention. Here, the adhesive repair pad 14A is placed in the groove portion 15 of the circuit board 100, and the pad 14A
From above, a heating device is used to locally apply heat under pressure. The temperature is about 315 ° C. As a result, the repair pad 14
A is temporarily pressed. Then, the substrate 100 is introduced into the heat treatment apparatus. The heating conditions at this time are 170 ° C,
Initial heating for 15 minutes and continuous heating at 250 ° C. for 60 minutes.

Next, referring to FIG. 3C, the repair pad
Wire-bond between 14A and other pads.
As a result, the defective pad 104 shown in FIG. 1C is replaced with the non-defective pad 101. Thus, according to the method for manufacturing a conductive member according to the first embodiment of the present invention, as shown in FIG. 2A, the polyimide adhesive 12 is formed on one surface of the base film 13. ing.

Therefore, when the laminated member on which the polyimide adhesive 12, the base film 13 and the repair pad pattern are formed is cut, the adhesive repair pad 14A can be manufactured. Unlike the conventional example, the repair pad 14A has a form in which the adhesive layer 12 is previously provided under the repair pad 14A. As a result, it becomes possible to perform the adhesive treatment that does not depend on the epoxy adhesive as in the conventional example.

According to the method of manufacturing a thin film multilayer circuit board according to the first embodiment of the present invention, when the defective pad 104 is removed and the non-defective pad 101 is transplanted, as shown in FIG. 3B. Further, the adhesive repair pad 14A according to the first embodiment of the present invention is used. Therefore, the groove 15 having a small area
The step of applying an epoxy-based adhesive to is omitted. Further, it is not necessary to use a micro dispenser or the like as in the conventional example. As a result, as the circuit board 100 becomes higher in density and finer, for example, even if the distance between the pad at the defective portion and the adjacent pad becomes extremely short, an excessive adhesive as in the conventional example will not be applied. There is no possibility of flowing out of the groove to the outside, and there is no fear of covering the adjacent pad.

The adhesive repair pad 14A made of a polyimide resin material can sufficiently withstand a heating atmosphere of 300 ° C. or higher in the subsequent step. For example, in the soldering process at the time of chip surface mounting, the polyimide adhesive 12 maintains a stable state even if the substrate 100 is exposed to a heating atmosphere of 300 ° C. or higher for a relatively long time. Therefore, the adhesive force (100 kgf / cm ² or more) is maintained and the insulation resistance is maintained in a good state.

As a result, even if the pad 101 is lost or if the wiring connection is changed due to other design changes, the adhesive repair pad 14A can be repaired reliably and easily. Become. (2) Description of Second Embodiment FIGS. 4A to 4C are process diagrams of forming a repair wiring according to a second embodiment of the present invention, and FIGS. Is
The transplanting process drawing of the repair wiring which concerns on the 2nd Example of this invention is each shown.

For example, in the case of forming adhesive repair wiring (hereinafter referred to as a fine wiring unit) 24A as shown in FIG. 5 (B), in FIG. 4 (A), first, as in the first embodiment, the glass substrate is used. Polyimide adhesive 22 is applied onto 21. Next, the base film 23 is formed on the adhesive layer. Then, the substrate 21 is heated at 130 ° C. for about 30 minutes to temporarily cure the polyimide adhesive 22.

Here, the base film 23 has a thickness of 1
Use a polyimide film of about 2.5 μm. As the adhesive 22, a dicryme solution containing 24% of end-added type polyimide is used. The thickness of the adhesive 22 is about 10 μm. Product names and the like are the same as those in the first embodiment. Next, FIG.
In (B), a metal thin film such as copper or aluminum is formed on the base film 23, and then a repair wiring pattern (conductive pattern) 24A is formed.

Next, referring to FIG. 4C, the polyimide adhesive 22, the base film 23 and the repair wiring pattern are formed.
The laminated member on which 24A is formed is cut. The thickness of this laminated member is about 42.5 μm. The cutting method is performed by a KrF excimer laser through a mask. Thereby, the fine wiring unit 24A including the polyimide adhesive 22, the base film 23 and the repair wiring pattern 24 can be formed.

Next, in the case where the wiring 7 of the defective portion X as shown in FIG. 7B is replaced with a non-defective wiring, FIG.
At, the defective wiring (not shown) is removed from the circuit board 100. After that, excavating the area where the defective wiring is removed, the groove 2
5 is formed. Here, as in the first embodiment, the method for removing the defective wiring uses a mask in which the processed portion is opened,
Etching is performed with an excimer laser or the like.

Further, in FIG. 5B, the fine wiring unit 24A is thermally bonded to the groove portion 25. Here, the unit 24A uses the adhesive repair wiring formed according to the second embodiment of the present invention. For example, in FIG. 5C, the fine wiring unit 24A is placed in the groove 25 of the circuit board 100, and the wiring 24A is locally pressurized and heat-bonded by a heating device. The temperature is about 315 ° C. As a result, the repair wiring 24A is temporarily pressed. afterwards,
The substrate 100 is introduced into a heat treatment device. The heating conditions at this time are the same as those in the first embodiment.

Next, referring to FIG. 5D, the repair wiring 24
Thermal fusion is performed between A and the other wiring 102 and the like. At this time, the YAG laser is focused on the joint portion of the wiring metal, the wiring metal itself is melted, and the circuit connection between them is performed. As a result, the wiring 7 in the defective portion X as shown in FIG. 7B becomes the non-defective wiring 102. In this way, according to the method for manufacturing a conductive member according to the second embodiment of the present invention, the polyimide adhesive 22 is formed on one surface of the base film 23 as shown in FIG. 4 (A). ing.

Therefore, by cutting the polyimide adhesive 22, the base film 23, and the laminated member on which the repair wiring pattern is formed, the fine wiring unit 24A can be manufactured. As a result, it becomes possible to perform a wiring transplantation process that does not depend on the epoxy adhesive as in the conventional example. Further, according to the method of manufacturing a thin film multilayer circuit board according to the second embodiment of the present invention, the fine wiring unit 24A is used as shown in FIG. 5 (B).

Therefore, the step of applying the epoxy adhesive to the groove 25 having a small area as in the conventional example is omitted. In addition, as the circuit board 100 becomes higher in density and finer, for example, even if the distance between the wiring in the defective portion and the adjacent wiring becomes very short, excessive adhesive as in the conventional example may cause the groove portion to be damaged. There is no possibility that it will flow out from the outside, and there is no fear of covering adjacent wiring. In addition, according to the embodiment of the present invention, it is possible to transplant a fine wiring of 100 μm or less.

Further, in the fine wiring unit 24A formed of a polyimide resin material, as in the first embodiment,
In the soldering process when mounting the surface of a chip, it can withstand a heating atmosphere of 300 ° C or higher and its adhesive strength (100 kgf
/ Cm ² or more) was maintained, and the conductivity at the transplanted site was also good. As a result, even if the wiring 102 is lost or the wiring connection is changed due to other design changes, the fine wiring unit 24A can repair the wiring reliably and easily.

(3) Description of the Third Embodiment FIG. 6 is a process drawing of the repair pad implantation according to the third embodiment of the present invention. The third embodiment is different from the first and second embodiments in that the repair pad and the adhesive layer are integrally formed in the groove. For example, when replacing the defective pad 104 as shown in FIG.
In FIG. 6A, a defective pad (not shown) is removed from the circuit board 100. After that, the region where the defective pad is removed is excavated to form the groove 35. Here, the groove portion 35 has an opening width of about 400 × 400 μm □. As a method of removing the defective pad, etching is performed by an excimer laser or the like using a dielectric mirror mask having an opening to be processed.

Further, in FIG. 6B, a double-sided adhesive film 36 is placed in the groove 35. Here, the film 36 is a base polyimide film 36B on which polyimide adhesive layers 36A are formed on both sides. The size is cut so that it is smaller than the opening width of the groove 35. After that, the repair pad 3 is placed on the double-sided adhesive film 36.
Place 7.

Next, as shown in FIG. 6C, the repair pad 37 and the substrate 100 are thermally bonded together via the double-sided adhesive film 36. At this point, pressure is locally applied to the repair pad 37 by a heating device. The temperature is about 315 ° C. As a result, the repair pad 37 is temporarily pressed. Then, the substrate 100 is introduced into the heat treatment apparatus. The heating conditions at this time are the same as those in the first embodiment.

After that, the repair pad 37 and other pads or the like are joined by a gold wire 38 or the like. The gold wire 38 is formed by a wire bonding method or the like. As a result, FIG. 1 (C)
The defective pad 104 as shown in FIG. Thus, according to the method for manufacturing a thin-film multilayer circuit board according to the third embodiment of the present invention, the area excluding the defective pad is excavated in FIG. 36 is formed.

Therefore, as in the first embodiment, the repair pad 37 can be adhered onto the double-sided adhesive film 36 without adversely affecting the peripheral wiring and electrodes. After that, the existing pad and the repair pad 37 are, for example,
It is soldered by the wire bonding method. This makes it possible to implant the repair pad with good reproducibility and good insulation and conductivity. In addition, it is possible to reliably and firmly establish conduction between both members. In addition,
Unlike the conventional example, the creeping-up of the adhesive or the like does not occur from the groove portion 35 to the outside. This makes it possible to manufacture a reliable thin-film multilayer wiring board and to improve the production yield.

[0049]

As described above, according to the method for manufacturing a conductive member of the present invention, a similar resin adhesive layer is formed on one surface of a heat-resistant polyimide resin film substrate. For this reason, it is possible to manufacture adhesive members such as repair wiring and pads that are miniaturized, and a fluid adhesive is not required at the time of bonding.

Further, according to the method of manufacturing the electronic circuit board of the present invention, the adhesive member produced by the method of the present invention is used when the conductive member for repair is thermally bonded. Therefore, in the unlikely event that the wiring, the electrode, or the like is lost, or the design is changed, it becomes possible to easily repair the member. Also,
Even if the member pitch becomes extremely short due to the high density and miniaturization of the circuit board, the adhesive member can be transplanted with good reproducibility.

Furthermore, according to another method of manufacturing an electronic circuit board of the present invention, the area of the defective portion excluding the conductive member is excavated, and the double-sided adhesive film is formed in the groove. For this reason, it becomes possible to transplant a conductive member such as wiring or electrodes without adversely affecting the wiring or electrodes in the periphery. It should be noted that the polyimide resin adhesive member can sufficiently withstand a heating atmosphere of 300 ° C. or higher, is excellent in adhesiveness and insulation, and can secure good conductivity of the joint portion.

This greatly contributes to the production of a reliable thin film multilayer wiring board and the improvement of the production yield.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a thin film multilayer circuit board according to each embodiment of the present invention.

FIG. 2 is a process drawing of forming a repair pad according to the first embodiment of the present invention.

FIG. 3 is a process diagram of implanting the repair pad according to the first embodiment of the present invention.

FIG. 4 is a process drawing of the repair wiring according to the second embodiment of the present invention.

FIG. 5 is a process drawing of the repair wiring according to the second embodiment of the present invention.

FIG. 6 is a transplant process drawing of a repair pad according to a third embodiment of the present invention.

FIG. 7 is an explanatory diagram of a method of repairing a fine circuit board according to a conventional example.

[Explanation of symbols]

 11, 21 ... Glass substrate, 12, 22 ... Polyimide adhesive, 13, 23 ... Base film, 14, 24 ... Metal thin film, 14A ... Adhesive repair pad, 37 ... Repair pad 24A ... Adhesive repair wiring (Fine wiring unit), 15, 25, 35 ... Groove portion, 36 ... Double-sided adhesive film.

Claims (4)

[Claims] 1. A step of forming an adhesive layer on one surface of a film substrate, a step of forming a conductive pattern on the other surface of the film substrate, and forming the adhesive layer, the film substrate and a conductive pattern. And a step of cutting the formed laminated member, wherein the adhesive layer and the film-shaped substrate are made of a heat-resistant polyimide resin-based material. 2. A step of removing an existing conductive member, a step of excavating a region where the conductive member is removed to form a groove portion, and a step of thermally adhering another conductive member to the groove portion, The method for manufacturing an electronic circuit board, wherein the adhesive member formed by the method for manufacturing a conductive member according to claim 1 is used as the other conductive member. 3. A step of removing an existing conductive member, a step of excavating a region where the conductive member is removed to form a groove, a step of forming a double-sided adhesive film in the groove, and a step of forming the double-sided adhesive film on the double-sided adhesive film. And a step of thermally adhering another conductive member to the electronic circuit board. 4. The method of manufacturing an electronic circuit board according to claim 2, further comprising a step of joining the existing conductive member and another conductive member after the step of thermally bonding. Electronic circuit board manufacturing method.