JPH0779096A - Electronic component suction position correction method - Google Patents

Abstract

PURPOSE:To correct a position accurately by measuring and storing all the positions of component sealing holes and feeding them back and by always making the deviation between a suction nozzle and a component the minimum. CONSTITUTION:This equipment is constituted of a component posture recognition camera 1, a component supplying table 2, a component supplying t ape 3, and a camera 4. The camera 4 measures the position of a component sealing hole 21 of the component supplying tape. After taking a component from the component supplying tape 3 at a component sucking position A, the deviation in position of the component sealing hole 21 is measured by the camera using a reflecting mirror 7 and is stored. While wheel pins to carry the component supplying tape 3 turn one cycle, the deviation in position of all the wheel pins is measured. From the second cycle of the wheel pins, the suction nozzle or the component supplying tale 2 is moved by the deviation corresponding to the one measured in the first cycle. By this method, correct feedback can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for correcting an electronic component suction position in an electronic component mounting apparatus for mounting electronic components on a board.

[0002]

2. Description of the Related Art In recent years, mounting devices for electronic parts have been widely used,
With miniaturization and diversification of components, it is important to secure reliability in the component supply part of the mounting device from the viewpoint of how to maintain high reliability of the device.

An electronic component picking method in a conventional electronic component mounting apparatus will be described below with reference to FIGS. 3 to 7.

FIG. 3 is an external perspective view of a general electronic component mounting apparatus, and 8 is a component supply table, which is a suction head provided on a rotary head 9 such that chip components 14 arranged on a component supply tape are vertically movable. Tape feeding mechanism 11 that feeds the nozzle 10
Is installed. Reference numeral 12 is a printed circuit board held on the XY table 13, on which chip components 14 and the like are mounted by the suction nozzle 10. Reference numeral 15 is a camera for measuring the component posture.

FIG. 4 is a schematic plan view of the electronic component mounting apparatus of FIG. 3, in which the chip component 14 is sent to the component suction position A by the tape feeding mechanism 11, and the rotation of the rotary head 9 first measures the component posture. The position and orientation are measured by the camera 15. Next, the chip parts, etc. 14 are mounted on the camera 15 at a predetermined rotation angle.
The θ is rotated by the θ rotation unit 16 by adding the correction angle measured by, and the printed circuit board 12 is mounted at a predetermined component mounting position B. If the accuracy of the component feed position at the component pickup position A is not good, some component pickup errors occur and the reliability of the apparatus is reduced. For this purpose, conventionally, the camera 15 measures the deviation amount of the component sucked at the component suction position A,
A method of feeding back a rough deviation of the suction position is adopted, and a method of intentionally shifting the position of the suction nozzle 10 to a position matching a component is adopted. In addition, a method of intentionally moving the component supply table 8 by the amount of deviation of the component suction position A can be considered.

[0006]

However, in any of the above methods, highly accurate correction cannot be performed. One of the reasons is that the posture of a component that has already been sucked has a gap due to a clearance in the component sealing hole of the component supply tape and a shift due to instability of the behavior at the suction instant. This is because feedback does not lead to reliable correction.

FIG. 5 is an external perspective view of a general conventional component supply device. The feed position of the chip component 14 or the like is inserted into the tape feed hole 20, and the wheel pin 18 is set to 1 by the relative position deviation between the wheel pin 18 that feeds the component supply tape 17 and the ratchet teeth 19 that intermittently rotate the wheel pin 18.
During the circumference, the component sealing hole 21 of the component supply tape 17 is opened as shown in FIG.
As shown in the plan view of Fig. 1, it shifts back and forth with respect to the feeding direction (arrow a) as shown by the dashed line.
8 and ratchet teeth 19 are fixed). Therefore, even if it is attempted to recognize and correct the already picked-up component posture, it is possible that the chip components and the like being sent at that time may deviate from the correction direction.

The second reason is that, as described above, the chip component 14 and the like freely vibrate within the component sealing hole 21 within a certain clearance. This state is shown in the external perspective view (a) and the plan view (b) of FIG.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a suction position correction method for electronic components, which enables highly accurate position correction when picking up components.

[0010]

In order to achieve the above object, the present invention recognizes all component feeding hole feed positions of a component feeding tape having component feeding holes arranged and formed at equal pitch intervals for each component feeding device. -Characterized by storing and correcting the amount of deviation from the correct position when picking up a component.

[0011]

According to the present invention, it is possible to measure, store and feed back all feed positions of the component sealing holes of each component supply device, and it is possible to minimize the amount of deviation between the suction nozzle and the component. Become.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be described with reference to. FIG. 1 is a schematic plan view of an electronic component mounting apparatus for carrying out the method of the present invention, and FIG. 2 is an external perspective view showing the arrangement of a camera for measuring the component sealing position in FIG. In FIGS. 1 and 2, 1 is a component attitude recognition camera, 2 is a component supply table, 3 is a component supply tape, 4 is a camera, and the position of the component enclosure hole 21 of the component supply tape is measured. Reference numeral 5 is a printed circuit board, 6 is a θ rotation unit, and 7 is a reflecting mirror.

The operation of this embodiment will now be described. At the component suction position A, after the component is taken out from the component supply tape 3, the position shift amount of the component sealing hole 21 is measured by the camera 4 using the reflecting mirror 7 and stored. I'll do it. As described in FIG. 5, while the wheel pin 18 for sending the component supply tape 3 makes one round,
Measure all deviations for each wheel pin. From the second lap of the wheel pin 18, depending on whether the suction nozzle 10 is moved or the component supply table 2 is moved, a deviation corresponding to the deviation measured in the first lap can be given to provide correct feedback. Become. In general, it is difficult to view the area directly below the component supply position with a camera due to physical restrictions. Therefore, using the reflecting mirror 7 as shown in FIG.
It is preferable to measure the position of.

In the present embodiment, the component sealing hole is measured immediately after the component is taken out, but this is for easy position measurement.

When such a suction position correction method is used,
The suction position can be adjusted with extremely high accuracy, and the reliability of the equipment can be improved. In particular, the effect of the position correction method of the present invention is high at the time of adsorbing a miniaturized component.

[0016]

As described above, in the electronic component suction position correcting method of the present invention, since all component feeding position deviations of each supply device are fed back by measuring the component sealing holes, high accuracy is achieved. The position can be corrected, and highly reliable suction is realized.

[Brief description of drawings]

FIG. 1 is a schematic plan view of an electronic component mounting apparatus that implements the method of the present invention.

FIG. 2 is an external perspective view showing the arrangement of cameras for measuring the component sealing position in FIG.

FIG. 3 is an external perspective view of a conventional electronic component mounting apparatus.

FIG. 4 is a schematic plan view of the electronic component mounting apparatus of FIG.

FIG. 5 is an external perspective view of a conventional component supply device.

FIG. 6 is a plan view showing a deviation of a component enclosing hole.

FIG. 7 is an external perspective view (a) of the component supply tape and its plan view.
It is (b).

[Explanation of symbols]

1 ... Parts attitude recognition camera, 2 ... Parts supply table,
3 ... Component supply tape, 4 ... Camera, 5 ... Printed circuit board, 6 ... Theta rotation part, 7 ... Reflector.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuhiko Narisei 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A component supply hole feed position of a component supply tape having component containment holes arranged and formed at equal pitch intervals is recognized and stored for each component supply device, and a deviation amount from a correct position when a component is adsorbed is detected. A method for correcting a suction position of an electronic component, which comprises performing position correction. 2. The electronic component suction position correction method according to claim 1, wherein the position of the component sealing hole immediately after the component is taken out is recognized by a camera in the component supply device. 3. The electronic component according to claim 1, wherein the positional deviation of the component sealing hole is measured and stored for one cycle for each component supply device, and after one cycle, the positional deviation is corrected based on the stored positional deviation amount. Adsorption position correction method.