JPH01155698A - Electronic component mounting equipment - Google Patents

Abstract

PURPOSE:To enable accurate positioning of a vacuum sucking position and realize an electronic component packaging high in reliability by a method wherein even if the position of an electronic component deviates from a vacuum sucking position, the position of an electronic component is recognized so as to perform a positional correction. CONSTITUTION:A recognizing means 16 is provided to a position which is constant for a vacuum sucking position and nearly above an electronic component 1 of a part cassette. A positional data processing means 17. finds a theoretical positional difference between a position of a component and a vacuum sucking position and obtains a correction data which drives a positioning means 15. A positioning means 15a of the means 15 makes two or more arranged cassettes 1 move in an X direction using a screw mechanism and performs an X directional correction, and a positioning means 15b executes a Y directional correction. Vacuum sucking means 5 are provided on the circle of a flange 6 at a constant space between adjacent means 5, where the flange 6 rotates intermittently, and hold a component 3 as sucking it through a vacuum at a vacuum sucking and holding position, and package a component on a specified position on a substrate 8. By these processes, an electronic component packaging high in reliability can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components on a printed circuit board.

Background of the Invention In recent years, electronic component mounting methods have required high-density packaging of electronic components, and as a result, electronic components have been made into chips.
Also, their size is becoming smaller and smaller.

An example of the above-mentioned conventional electronic component mounting apparatus will be described below with reference to the drawings. FIG. 3 shows a schematic configuration of a conventional electronic component mounting method, in which 1 is a parts cassette for pitch-feeding electronic components 3 taped and stored on a reel 2, and 4 is a parts cassette that carries a plurality of parts cassettes 1. This is a positioning means that mounts various electronic components and sequentially positions them at vacuum suction positions in the X direction. Reference numeral 5 denotes vacuum suction means, which are provided at equal intervals on the circumference of the 7-lunge 6 that performs intermittent rotation, and hold the electronic component 3 by vacuum suction at the vacuum suction position, and position and hold it on the XY table. It is mounted at a predetermined position on the printed circuit board 8. During the process of mounting the electronic component 3 from the vacuum suction position to a predetermined position on the printed circuit board 8, the electronic component 3 is corrected to the correct posture by the regulating means 9 provided on the periphery of the flange that rotates near the vacuum suction means. 1o and set at a predetermined angle, the inspection means 1
After checking its posture in step 1, it is mounted on a printed circuit board 8.

Problems to be Solved by the Invention However, with the above configuration, there is a dimensional problem between the tape 12 and the electronic component 3, as shown in FIG. That is, variations occur between the feed holes 13 and the cavities 14 that house the electronic components 3 in the feed holes 12, such as m, m, . . ., q, qa, . Furthermore, since there is a clearance between the electronic component 3 and the cavity 14, the center position has an error of δ and λ as shown in Q with respect to 0 of the cavity 14.

For this reason, as shown in FIG. 6, the electronic component 3 within the tape 12 is attracted at a position that is biased with respect to the predetermined position of the vacuum suction means 5, resulting in a problem of lack of reliability. There is. In particular, the dimensions of the chip components are 111nl
When it is miniaturized like O.5zw, it is microscopic.

In view of the above problems, the present invention provides a highly reliable electronic component mounting method that accurately vacuum-chucks electronic components within a tape.

Means for Solving the Problems In order to solve the above-mentioned problems, the electronic component mounting method of the present invention includes a component supply unit for pitch-feeding taped electronic components, and two or more component supply units mounted on a horizontal surface. A positioning means that is movable on the top and positions the electronic component at a predetermined position is provided, and a recognition means that recognizes the position of the electronic component within the component supply section.

With the above-described configuration, the present invention recognizes the position of the electronic component even if the position of the electronic component housed in the tape is biased with respect to the vacuum suction position, and corrects the position to make it accurate. It is positioned at a vacuum suction position, thereby realizing reliable electronic component mounting.

Embodiment Hereinafter, an electronic component mounting method according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows a conceptual diagram of an electronic component mounting method in an embodiment of the present invention. 1 is taped and reel 2
15 is a parts cassette for pitch-feeding the electronic parts 3 stored in the parts cassette 1, and 15 carries a plurality of parts cassettes 1 with various electronic parts and sequentially positions them in the vacuum suction position in the X direction,
Furthermore, it is a positioning means that can also be positioned in the Y direction. Reference numeral 16 denotes a recognition means provided at a constant position with respect to the vacuum suction position and almost directly above the electronic component 3 of the parts cassette 1, and a means for processing position data of the electronic component 3 obtained by the recognition means 1e. 17, the difference from the theoretical vacuum suction position is determined and used as correction data when driving the positioning means 15. At this time, the positioning means 16&
1sb performs pitch feeding and correction in the X direction of a plurality of cassettes 1 lined up in a row, and 1sb performs correction in the Y direction.

5 is a vacuum suction means, which is provided at equal intervals on the circumference of the flange 60 which rotates intermittently, holds the electronic component 3 by vacuum suction at a vacuum suction position, and is positioned and held on the XY tape/l/7. The printed circuit board 8 is then mounted at a predetermined position.

During the process of mounting the electronic component 3 from the vacuum suction position to a predetermined position on the printed circuit board 8, the electronic component 3 is corrected to the correct orientation by the regulating means 9 provided on the periphery of the flange that rotates near the vacuum suction means, and rotated. After being set at a predetermined angle by means 1o and having its orientation checked by inspection means 11, it is mounted on printed circuit board 8.

The second part about the electronic component mounting method configured as above.
The operation will be explained using diagrams. FIG. 2 shows the recognition area V, the vacuum suction position S, and the mounting position M in a plan view. The mounting position of the recognition means is at a position that is an integral multiple of the pinch point when the cassette 1 is mounted relative to the vacuum suction position, and its visual field area is V. The position of the electronic component 3 to be vacuum-suctioned for a long time is deviated from the theoretical position by δ, λ. Give instructions ↓δ and λ to move to the correct vacuum suction position S. Thereafter, vacuum suction is performed, and the mounting position M is mounted on the printed circuit board 8 through the process described above.

As described above, according to this embodiment, a parts cassette for pitch-feeding taped electronic parts and two or more parts cassettes are mounted, and
a positioning means for positioning the electronic component in the parts cassette; a recognition means provided at a fixed position with respect to the vacuum suction position for recognizing the position of the electronic component in the parts cassette; and a processing means therefor; This method uses vacuum suction means to sequentially mount electronic components onto printed circuit boards positioned on an By recognizing the position and correcting the position, it is positioned at an accurate vacuum suction position, and as a result, reliable electronic component mounting is realized.

Effects of the Invention As described above, even if the position of the electronic component housed in the tape is biased with respect to the vacuum suction position, the present invention recognizes the position of the electronic component and corrects the position to make it accurate. It is positioned at a vacuum suction position, thereby realizing reliable electronic component mounting.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is an explanatory diagram for mounting components, FIG. 3 is a perspective view of a conventional electronic component mounting apparatus, and FIG. 4 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 5 is a plan view of the tape explaining the dimensional error of the tape for electronic parts, and a sectional view of a conventional vacuum suction means. 1...Parts cassette, 3...Electronic components, 5...Vacuum suction means, 7...X-
Y table, 8... Printed circuit board, 12...
... tape, 15 ... positioning means, 16.
...Recognition means, 17...Processing means.

Claims (2)

[Claims] (1) A component supply unit that pitch-feeds taped electronic components, a positioning means that is equipped with two or more of these component supply units, is movable on a horizontal plane, and is positioned at a predetermined position, and said component supply unit. recognition means for recognizing the position of the electronic component in the part, and the electronic component recognized by the recognition means is placed in advance at the vacuum suction position.
An electronic component mounting apparatus characterized in that the component supply section is configured to be moved by a positioning means. (2) The electronic component mounting apparatus according to claim 1, wherein the recognition means is provided at a constant position with respect to the vacuum suction position.